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ASIC- · PDF file CMOS VLSI DesignCMOS VLSI Design 4th Ed. 36 Diffusion Capacitance C sb, C db Undesirable, called parasitic capacitance Arise from p-n junctions between drain/source

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  • 1VLSI Design: CMOS Technology

    VLSI Design The MOS Transistor

    Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 2

    Outline  Introduction  MOS Capacitor  nMOS I-V Characteristics  pMOS I-V Characteristics  Gate and Diffusion Capacitance  Body–effect  Process corners

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 3

    Introduction  So far, we have treated transistors as ideal switches  An ON transistor passes a finite amount of current

    – Depends on terminal voltages – Derive current-voltage (I-V) relationships

     Transistor gate, source, drain all have capacitance – I = C (∆V/∆t) -> ∆t = (C/I) ∆V – Capacitance and current determine speed

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.3: CMOS Transistor Theory 4

    MOS Capacitor  Gate and body form MOS capacitor

     Operating modes – Accumulation – Depletion – Inversion

    polysilicon gate silicon dioxide insulator

    p-type body

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.3: CMOS Transistor Theory 5

    MOS Cap - Accumulation

    polysilicon gate

    (a)

    silicon dioxide insulator

    p-type body + -

    Vg < 0

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.3: CMOS Transistor Theory 6

    MOS Cap - Depletion

    (b)

    + -

    0 < Vg < Vt depletion region

    vt - Threshold voltage: characteristic parameter of a transistor

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.3: CMOS Transistor Theory 7

    MOS Cap - Inversion

    (c)

    + -

    Vg > Vt

    depletion region inversion region

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 8

    Terminal Voltages  Mode of operation depends on Vg, Vd, Vs

    – Vgs = Vg – Vs – Vgd = Vg – Vd – Vds = Vd – Vs = Vgs - Vgd

     Source and drain are symmetric diffusion terminals – By convention, source is terminal at lower voltage – Hence Vds ≥ 0

     nMOS body is grounded. First assume source is 0 too.  Three regions of operation

    – Cutoff – Linear – Saturation

    Vg

    Vs Vd

    VgdVgs

    Vds

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 9

    nMOS Cutoff  No channel  Ids ≈ 0

    + -

    Vgs = 0

    n+ n+

    + -

    Vgd

    p-type body

    b

    g

    s d

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 10

    nMOS Linear  Channel forms

    + -

    Vgs > Vt

    n+ n+

    + -

    Vgd = Vgs

    Vds = 0

    p-type body

    b

    g

    s d

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 11

    nMOS Linear  If 0 < Vds < Vgs - vt

    – Current flows from drain to source (e- from s to d) – Ids increases with Vds – Similar to linear resistor

    + -

    Vgs > Vt

    n+ n+

    + -

    Vgs > Vgd > Vt

    0 < Vds < Vgs-Vt p-type body

    b

    g

    s d Ids

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 12

    nMOS Saturation  Channel pinches off (e- still flow due to drift)  Ids independent of Vds  We say current saturates  Similar to current source

    + -

    Vgs > Vt

    n+ n+

    + -

    Vgd < Vt

    Vds > Vgs-Vt p-type body

    b

    g

    s d Ids

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 13

    nMOS Saturation cont’d  Drift depends on electric field Edrift between drain and

    pinch-off  Edrift ∝ Vds/Ldrift (Ldrift = Distance between drain and

    pinch-off)  If Vds increases → Ldrift increases → Edrift stays

    constant  → Equilibrium between Vds, Ldrift and Edrift

    n+ n+

    p-type body

    Ldrift

    pinch-off

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.

    nMOS I-V Curve

    MOS Transistor Theory 14

    Linear Region

    Saturation Region

    Drain to Source Voltage Vds

    G at

    e to

    S ou

    rc e

    Vo lta

    ge V

    gsVgs - vt

    D ra

    in C

    ur re

    nt I d

    s (lo

    g sc

    al e)

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.

    Quiz  In which transistor operating region a channel is formed?

    A. Cut-off B. Linear C. Saturation D. Accumulation

     Under which condition a channel is formed? A. Vgs < Vth, 0 < Vds B. Vgs > Vth, 0 = Vds C. Vgs > Vth, Vds > Vgs D. Vgs < Vth, 0 < Vds

    MOS Transistor Theory 15

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.

    Quiz  In which transistor operating region a channel is formed?

    A. Cut-off B. Linear C. Saturation D. Accumulation

     Under which condition a channel is formed? A. Vgs < Vth, 0 < Vds B. Vgs > Vth, 0 = Vds C. Vgs > Vth, Vds > Vgs D. Vgs < Vth, 0 < Vds

    MOS Transistor Theory 16

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 17

    I-V Characteristics  In Linear region, Ids depends on

    – How much charge is in the channel? – How fast is the charge moving?

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 18

    Channel Charge  MOS structure looks like parallel plate capacitor

    while operating in inversion (Gate – oxide – channel)

     Qchannel = CV

     C = Cg = kox*ε0WL/tox

    = CoxWL

     Cox = kox*ε0 = εox / tox n+ n+

    p-type body

    W

    L

    tox

    polysilicon gate

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.

    Channel Charge cont’d  V = Vgc – vt (voltage attracting charge to channel

    beyond min. required to invert p to n)

     Vc = (Vs + Vd)/2 (average voltage between Vs and Vd)

    = Vs + Vds/2

     Vgc = Vg – Vc = Vgs – Vds/2

     V = (Vgs + Vgd)/2 - vt

    = (Vgs – Vds/2) - vt

     Qchannel = CoxWL * [(Vgs - Vds/2) - vt]

    n+ n+

    p-type body

    +

    Vgd

    gate

    + + source

    -

    Vgs -

    drain

    Vds channel-

    Vg

    Vs Vd

    Cg

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed.

    Channel Charge cont’d  Why V = Vgc – vt?

    – vt is required for inverting the channel → related charge Q’ = Cg * vt not available for current, i.e. not inside channel

    MOS Transistor Theory 20

    n+ n+

    p-type body

    +

    Vgd

    gate

    + + source

    -

    Vgs -

    drain

    Vds channel-

    Vg

    Vs Vd

    Cg

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 21

    Carrier velocity  Charge is carried by e- (nMOS)  Electrons are propelled by the lateral electric field

    between source and drain – E = Vds/L

     Carrier velocity v proportional to lateral E-field – v = µE µ called mobility

     Time for carrier to cross channel: – t = L / v

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 22

    nMOS Linear I-V  Now we know

    – How much charge Qchannel is in the channel – How much time t each carrier takes to cross

    channel

    ox 2

    2

    ds

    ds gs t ds

    ds gs t ds

    QI t

    W VC V v V L

    VV v V

    µ

    β

    =

     = − −   

     = − −    ox

    = WC L

    β µ

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 23

    nMOS Saturation I-V  If Vgd < vt, channel pinches off near drain

    – When Vds > vdsat with vdsat= Vgs – vt  Now drain voltage no longer increases current

    ( )2 2

    2

    dsat ds gs t dsat

    gs t

    vI V v v

    V v

    β

    β

     = − −   

    = −

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 24

    nMOS I-V Summary

    ( )2

    cutoff

    linear

    saturatio

    0

    2

    2 n

    gs t

    ds ds gs t ds ds dsat

    gs t ds dsat

    V v VI V v V V v

    V v V v

    β

    β

      <    = − − 

     Shockley 1st order transistor models (long channels > 2 µm)

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 25

    Example  AMI Semiconductor 0.6 µm process

    – tox = 100 Å – µ = 350 cm2/V*s – vt = 0.7 V – εox = 3.9 * 8.85 * 10-14 F/cm

     Plot Ids vs. Vds – Vgs = 0, 1, 2, 3, 4, 5 – Use W/L = 4/2 λ

    ( ) 14

    2 8

    3.9 8.85 10350 120 μA/V 100 10ox

    W W WC L L L

    β µ −

     × ⋅  = = =  ⋅   

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 26

    Example  AMI Semiconductor 0.6 µm process

    0 1 2 3 4 5 0

    0.5

    1

    1.5

    2

    2.5

    Vds

    I ds (m

    A )

    Vgs = 5

    Vgs = 4

    Vgs = 3

    Vgs = 2 Vgs = 1

  • CMOS VLSI DesignCMOS VLSI Design 4th Ed. 27

    pMOS I-V  All dopings and voltages are inverted for pMOS

    – Source is the more positive terminal  Mobility µp is determined by holes

    – Typically 2-3x lower than that of electrons µn – 120 cm2/V•s in AMI 0.6 µm process

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