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332:479 Concepts in VLSI Design Lecture 6 CMOS Transistor Theory David Harris and Michael Bushnell Harvey Mudd College and Rutgers University Spring 2004

Lecture 6 CMOS Transistor Theory Devices... · Lecture 6 CMOS Transistor Theory David Harris and Michael Bushnell Harvey Mudd College and Rutgers University Spring 2004. ... JFET

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332:479 Concepts in VLSIDesign

Lecture 6 CMOS Transistor Theory

David Harris and Michael Bushnell

Harvey Mudd College and Rutgers UniversitySpring 2004

Concepts in VLSI Des. Lec. 6 Slide 212/4/2009

Outline Introduction MOS Capacitor nMOS I-V Characteristics pMOS I-V Characteristics Gate and Diffusion Capacitance Pass Transistors RC Delay Models Adjustments for non-ideal 2nd-order effects Small-signal MOSFET model

Material from:Material from: CMOS VLSI DesignCMOS VLSI Design,,by Weste and Harris, Addisonby Weste and Harris, Addison--Wesley, 2005Wesley, 2005

Concepts in VLSI Des. Lec. 6 Slide 312/4/2009

Introduction So far, we have treated transistors as ideal switches An ON transistor passes a finite amount of current

– Depends on terminal voltages– Derive current-voltage (I-V) relationships

Transistor gate, source, drain all have capacitance– I = C (V/t) -> t = (C/I) V– Capacitance and current determine speed

Also explore what a “degraded level” really means

Concepts in VLSI Des. Lec. 6 Slide 412/4/2009

MOS CharacteristicsMOS – majority carrier device Carriers: e-- in nMOS, holes in pMOS Vt – channel threshold voltage (cuts off for

voltages < Vt)

Concepts in VLSI Des. Lec. 6 Slide 512/4/2009

nMOS Enhancement Transistor

Moderately doped p type Si substrate 2 Heavily doped n+ regions

Concepts in VLSI Des. Lec. 6 Slide 612/4/2009

I vs. V Plots

Enhancement and depletiontransistors– CMOS – uses

only enhancement transistors

– nMOS – uses both

Concepts in VLSI Des. Lec. 6 Slide 712/4/2009

Materials and Dopants

SiO2 – low loss, high dielectric strength – High gate fields are possible

n type impurities: P, As, Sb p type impurities: B, Al, Ga, In

Concepts in VLSI Des. Lec. 6 Slide 812/4/2009

Bipolar vs. MOS Bipolar – p-n junction – metallurgicalMOS

– Inversion layer / substrate junction field-induced– Voltage-controlled switch, conducts when Vgs Vt

– e-- swept along channel when Vds > 0 by horizontal component ofE

– Pinch-off – conduction by e–- drift mechanism caused by positive drain voltage

– Pinched-off channel voltage: Vgs – Vt (saturated)– Reverse-biased p-n junction insulates from the substrate

Concepts in VLSI Des. Lec. 6 Slide 912/4/2009

JFET vs. FET Transistors Junction FET (JFET) – channel is deep in

semiconductorMOSFET – For given Vds & Vgs, Ids controlled by:

– Distance between source & drain L– Channel width W– Vt– Gate oxide thickness tox– gate oxide– Carrier mobility

Concepts in VLSI Des. Lec. 6 Slide 1012/4/2009

JFET Transistor

Concepts in VLSI Des. Lec. 6 Slide 1112/4/2009

MOS Capacitor Gate and body form MOS capacitor Operating modes

– Accumulation– Depletion– Inversion

polysilicon gate

(a)

silicon dioxide insulator

p-type body+-

Vg < 0

(b)

+-

0 < Vg < Vt

depletion region

(c)

+-

Vg > Vt

depletion regioninversion region

Concepts in VLSI Des. Lec. 6 Slide 1212/4/2009

Terminal Voltages Mode of operation depends on Vg, Vd, Vs

– Vgs = Vg – Vs

– Vgd = Vg – Vd

– Vds = Vd – Vs = Vgs - Vgd

Source and drain are symmetric diffusion terminals– By convention, source is terminal at lower voltage– Hence Vds 0

nMOS body is grounded. First assume source is 0 too. Three regions of operation

– Cutoff– Linear– Saturation

Vg

Vs Vd

VgdVgs

Vds+-

+

-

+

-

Concepts in VLSI Des. Lec. 6 Slide 1312/4/2009

nMOS Cutoff No channel Ids = 0

+-

Vgs = 0

n+ n+

+-

Vgd

p-type body

b

g

s d

Concepts in VLSI Des. Lec. 6 Slide 1412/4/2009

nMOS Linear Channel forms Current flows from d to

s – e- from s to d

Ids increases with Vds

Similar to linear resistor At drain end of channel,

only difference between gate & drain voltages effective for channel creation

+-

Vgs > Vt

n+ n+

+-

Vgd = Vgs

+-

Vgs > Vt

n+ n+

+-

Vgs > Vgd > Vt

Vds = 0

0 < Vds < Vgs-Vt

p-type body

p-type body

b

g

s d

b

g

s d Ids

Concepts in VLSI Des. Lec. 6 Slide 1512/4/2009

nMOS Saturation Channel pinches off Ids independent of Vds

We say current saturates Similar to current source

+-

Vgs > Vt

n+ n+

+-

Vgd < Vt

Vds > Vgs-Vt

p-type bodyb

g

s d Ids

Concepts in VLSI Des. Lec. 6 Slide 1612/4/2009

I-V Characteristics In Linear region, Ids depends on

– How much charge is in the channel?– How fast is the charge moving?

Concepts in VLSI Des. Lec. 6 Slide 1712/4/2009

Channel Charge MOS structure looks like parallel plate capacitor

while operating in inversion– Gate – oxide – channel

Qchannel =

n+ n+

p-type body

+

Vgd

gate

+ +source

-

Vgs

-drain

Vds

channel-

Vg

Vs Vd

Cg

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.9)

polysilicongate

Concepts in VLSI Des. Lec. 6 Slide 1812/4/2009

Channel Charge MOS structure looks like parallel plate capacitor

while operating in inversion– Gate – oxide – channel

Qchannel = CV C =

n+ n+

p-type body

+

Vgd

gate

+ +source

-

Vgs

-drain

Vds

channel-

Vg

Vs Vd

Cg

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.9)

polysilicongate

Concepts in VLSI Des. Lec. 6 Slide 1912/4/2009

Channel Charge MOS structure looks like parallel plate capacitor

while operating in inversion– Gate – oxide – channel

Qchannel = CV C = Cg = oxWL/tox = CoxWL V =

n+ n+

p-type body

+

Vgd

gate

+ +source

-

Vgs

-drain

Vds

channel-

Vg

Vs Vd

Cg

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.9)

polysilicongate

Cox = ox / tox

Concepts in VLSI Des. Lec. 6 Slide 2012/4/2009

Channel Charge MOS structure looks like parallel plate capacitor

while operating in inversion– Gate – oxide – channel

Qchannel = CV C = Cg = oxWL/tox = CoxWL V = Vgc – Vt = (Vgs – Vds/2) – Vt

n+ n+

p-type body

+

Vgd

gate

+ +source

-

Vgs

-drain

Vds

channel-

Vg

Vs Vd

Cg

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.9)

polysilicongate

Cox = ox / tox

Concepts in VLSI Des. Lec. 6 Slide 2112/4/2009

Carrier velocity Charge is carried by e- Carrier velocity v proportional to lateral E-field

between source and drain v =

Concepts in VLSI Des. Lec. 6 Slide 2212/4/2009

Carrier Velocity Charge is carried by e- Carrier velocity v proportional to lateral E-field

between source and drain v = E called mobility E =

Concepts in VLSI Des. Lec. 6 Slide 2312/4/2009

Carrier Velocity Charge is carried by e- Carrier velocity v proportional to lateral E-field

between source and drain v = E called mobility E = Vds/L Time for carrier to cross channel:

– t =

Concepts in VLSI Des. Lec. 6 Slide 2412/4/2009

Carrier Velocity Charge is carried by e- Carrier velocity v proportional to lateral E-field

between source and drain v = E called mobility E = Vds/L Time for carrier to cross channel:

– t = L / v

Concepts in VLSI Des. Lec. 6 Slide 2512/4/2009

nMOS Linear I-V Now we know

– How much charge Qchannel is in the channel– How much time t each carrier takes to cross

dsI

Concepts in VLSI Des. Lec. 6 Slide 2612/4/2009

nMOS Linear I-V Now we know

– How much charge Qchannel is in the channel– How much time t each carrier takes to cross

channelds

QIt

Concepts in VLSI Des. Lec. 6 Slide 2712/4/2009

nMOS Linear I-V Now we know

– How much charge Qchannel is in the channel– How much time t each carrier takes to cross

channel

ox 2

2

ds

dsgs t ds

dsgs t ds

QIt

W VC V V VL

VV V V

ox = WCL

Concepts in VLSI Des. Lec. 6 Slide 2812/4/2009

nMOS Saturation I-V If Vgd < Vt, channel pinches off near drain

– When Vds > Vdsat = Vgs – Vt

Now drain voltage no longer increases current

dsI

Concepts in VLSI Des. Lec. 6 Slide 2912/4/2009

nMOS Saturation I-V If Vgd < Vt, channel pinches off near drain

– When Vds > Vdsat = Vgs – Vt

Now drain voltage no longer increases current

2dsat

ds gs t dsatVI V V V

Concepts in VLSI Des. Lec. 6 Slide 3012/4/2009

nMOS Saturation I-V If Vgd < Vt, channel pinches off near drain

– When Vds > Vdsat = Vgs – Vt

Now drain voltage no longer increases current

2

2

2

dsatds gs t dsat

gs t

VI V V V

V V

Concepts in VLSI Des. Lec. 6 Slide 3112/4/2009

nMOS I-V Summary

2

cutoff

linear

saturatio

0

2

2n

gs t

dsds gs t ds ds dsat

gs t ds dsat

V VVI V V V V V

V V V V

Shockley 1st order transistor models

Concepts in VLSI Des. Lec. 6 Slide 3212/4/2009

Example We will be using a 0.6 m process for your project

– From AMI Semiconductor– tox = 100 Å– = 350 cm2/V*s– Vt = 0.7 V

Plot Ids vs. Vds

– Vgs = 0, 1, 2, 3, 4, 5– Use W/L = 4/2

14

28

3.9 8.85 10350 120 /100 10ox

W W WC A VL L L

0 1 2 3 4 50

0.5

1

1.5

2

2.5

Vds

I ds (m

A)

Vgs = 5

Vgs = 4

Vgs = 3

Vgs = 2Vgs = 1

Concepts in VLSI Des. Lec. 6 Slide 3312/4/2009

pMOS I-V All dopings and voltages are inverted for pMOS Mobility p is determined by holes

– Typically 2-3x lower than that of electrons n

– 120 cm2/V*s in AMI 0.6 m process Thus pMOS must be wider to provide same current

– In this class, assume n / p = 2

Concepts in VLSI Des. Lec. 6 Slide 3412/4/2009

Summary Current Characteristics of MOSFET Calculation of Vt and Important 2nd-Order Effects Small-Signal MOSFET ModelModels in this lecture

– For pedagogical purposes only– Obsolete for deep-submicron technology– Real transistor parameter differences:

• Much higher transistor current leakage• Body effect less significant than predicted• Vt is lower than predicted