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Page 146 Third International Symposium on Space Terahertz Technology Superlattice Barrier Varactors* C. Raman, J. P. Sun, W. L. Chen, G. Munns, J. East and G. Haddad Solid State Electronics Laboratory University of Michigan, Ann Arbor, Michigan Abstract SBV (Single Carrier Varactor) diodes have been proposed as alternatives to Schottky barrier diodes for harmonic multiplier applications. However these show a higher current than expected. The excess current is due to X valley transport in the barrier. We will present experimental results showing that the use of a superlattice barrier and doping spikes in the GaAs depletion regions on either side of the barrier can reduce the excess current and improve the control of the capacitance vs. voltage characteristic. The experimental results consist of data taken from two types of device structures. The first test structure was used to study the performance of AlAs/GaAs superlattice barriers. The wafer was fabricated into 90 micron diameter mesa diodes and the resulting current vs. voltage characteristics were measured. A 10 period superlattice structure with a total thickness of approximately 400 A worked well as an electron barrier. The structure had a current density of about one A/cm 2 at one volt at room temperature. The capacitance variation of these structures was small because of the design of the GaAs cladding layers. The second test structure was used to study cladding layer designs. These wafers were InGaAs and InAlAs layers lattice matched to an InP substrate. The layers have n + doping spikes near the barrier to increase the zero bias capacitance and control the shape of the capacitance vs. voltage characteristic. These structures have a capacitance ratio of 5:1 and an abrupt change from maximum to minimum capacitance. The measurements were made at 80 K. Based on the information obtained from these two structures, we have designed a structure that combines the low current density barrier with the improved cladding layers. The capacitance and current-voltage characteristics from this structure are presented. - "This work was supported by the Center for Space Terahertz Technology under NASA Contract No. NAGW-1334 and by the URI-ARO Program Contract No. DAAL03-87-K-0007. https://ntrs.nasa.gov/search.jsp?R=19930018549 2018-06-27T09:43:32+00:00Z

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Page 1: Superlattice Barrier Varactors* - NASA ·  · 2013-08-30The capacitance and current-voltage characteristics ... Schottky varactor diode is the conduction ... solution for the charge

Page 146 Third International Symposium on Space Terahertz Technology

Superlattice Barrier Varactors*

C. Raman, J. P. Sun, W. L. Chen, G. Munns,J. East and G. Haddad

Solid State Electronics LaboratoryUniversity of Michigan, Ann Arbor, Michigan

Abstract

SBV (Single Carrier Varactor) diodes have been proposed as alternatives to Schottkybarrier diodes for harmonic multiplier applications. However these show a higher currentthan expected. The excess current is due to X valley transport in the barrier. We willpresent experimental results showing that the use of a superlattice barrier and dopingspikes in the GaAs depletion regions on either side of the barrier can reduce the excesscurrent and improve the control of the capacitance vs. voltage characteristic.

The experimental results consist of data taken from two types of device structures.The first test structure was used to study the performance of AlAs/GaAs superlatticebarriers. The wafer was fabricated into 90 micron diameter mesa diodes and the resultingcurrent vs. voltage characteristics were measured. A 10 period superlattice structurewith a total thickness of approximately 400 A worked well as an electron barrier. Thestructure had a current density of about one A/cm2 at one volt at room temperature. Thecapacitance variation of these structures was small because of the design of the GaAscladding layers. The second test structure was used to study cladding layer designs.These wafers were InGaAs and InAlAs layers lattice matched to an InP substrate. Thelayers have n+ doping spikes near the barrier to increase the zero bias capacitance andcontrol the shape of the capacitance vs. voltage characteristic. These structures have acapacitance ratio of 5:1 and an abrupt change from maximum to minimum capacitance.The measurements were made at 80 K. Based on the information obtained from these twostructures, we have designed a structure that combines the low current density barrierwith the improved cladding layers. The capacitance and current-voltage characteristicsfrom this structure are presented.

- "This work was supported by the Center for Space Terahertz Technology under NASA Contract No.NAGW-1334 and by the URI-ARO Program Contract No. DAAL03-87-K-0007.

https://ntrs.nasa.gov/search.jsp?R=19930018549 2018-06-27T09:43:32+00:00Z

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Introduction

Varactor diodes are an important component of harmonic multipliers operating above100 GHz. These multipliers are the primary source of power in the submillimeter wavefrequency range, where the diode predominantly used is a Schottky barrier device. How-ever, a multiplier based on Schottky diodes suffers certain disadvantages. The circuit iscomplex, with higher order conversion requiring matching at all frequencies-the input,the output, as well as idler frequencies. The varactor must also be biased to increase thevoltage swing and prevent current flow over the barrier in the forward direction. Theseproblems can be overcome by using heteroj unction based varactor structures. Implemen-tation of such novel diode structures is motivated by the symmetry of their capacitancevs. voltage characteristic which permits odd harmonic conversion without the addedcomplexity of even harmonic idlers and bias circuitry .

The Single Barrier Varactor

One possible structure is the single barrier varactor, shown in Figure la. The cor-responding energy band diagrams under thermal equilibrium and bias are shown in Iband Ic. The analogue of the metal-semiconductor electron energy barrier found in theSchottky varactor diode is the conduction band offset between the GaAs region and thewider bandgap AlrGai_rAs layer. This energy barrier acts to inhibit electron transportthrough the structure and ideally should be as large as possible for the device impedanceto be purely reactive. When one side is biased relative to the other, the GaAs regionon the anode side is depleted of electrons and becomes positively charged, similar to thesemiconductor region of a Schottky varactor under reverse bias. Electrons accumulateon the cathode side of the structure, forming a charge separation across the AlxGai_ rAsregion. The relationship between the stored charge and the applied voltage is non-linear,resulting in a non-constant device capacitance. Moreover, since the structure is symmet-ric, reversing the sign of the applied voltage merely interchanges the roles of depletionand accumulation regions and does not affect the device capacitance. Therefore thecapacitance-voltage characteristic has even symmetry. Early attempts at implementingsuch varactors were limited in efficiency by high leakage current densities *. Details ofthe leakage current analysis are described elsewhere in these proceedings 2.

By replacing the single heterostructure by a superlattice barrier, we propose to reducethe carrier transport through the device by increasing the effective barrier height seen

Rydberg, Hans Gronqvist, and Erik Kollberg, Millimeter and Sub- Millimeter Wave Multi-pliers Using Quantum Barrier Varactor (QBV) Diodes, IEEE Electron Device Letters, Vol. 11, No. 9.Sept. 1990, pp. 373-375.

2H. Hjelmgren, J. East and E. Kollberg, "Thermionic Emission Current in a Single Barrier Varactor,",these proceedings.

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Page 148 Third International Symposium on Space Terahertz Technology

by an electron. A doping profile modification can improve the capacitance vs. voltagecharacteristic; however, a trade-off is seen between maintaining a high barrier height anda good C-V profile.

The Superlattice Barrier Varactor

Although the SBV presents a symmetric C-V characteristic, its efficiency is degradeddue to the high leakage current associated with the device because a purely reactivemultiplier is more efficient than a resistive one. The true thermionic emission energybarrier seen by an electron in the GaAs regions is not the F to F energy level offset butthe considerably lower F to X energy level difference, as seen in Figure 2a. By means ofa scattering process an electron incident on the barrier can pass through the AlTGai_xAsregion into the X valley of the barrier material. Thermionic emission over this X levelrequires less kinetic energy than emission over the F level and consequently a smallerbias voltage is needed to turn on the current.

The X valley transport can be suppressed by replacing the single heterojunctionby a series of barriers interspersed with quantum wells, i.e., a superlattice. Such asuperlattice appears in Figure 2b. The well regions are thin, resulting in quantummechanical confinement. The energy mini-bands are shifted upward considerably withrespect to the F point in bulk GaAs. A simple calculation indicates that the energyincrease can be on the order of an electron volt. Unlike the SBV, there is no longer acontinuous X valley current path since the well energies are higher than the X levels.The superlattice structure achieves a larger effective barrier than that of the SBV andsuppresses the leakage current.

A thin, highly doped layer between the superlattice and each adjacent N~ region canbe used to modify the capacitance. The so-called 5-doped regions (see Figure 3) are thinand contain a large amount of charge so that at zero bias they remain mostly undepleted.Flat band effects are minimized and the zero bias capacitance is increased. Varying thebias slightly causes almost no change in the depletion width and the capacitance remainsconstant. However, beyond a threshold voltage, the entire 8 region becomes depletedand the lightly doped N~ region begins to deplete rapidly, causing a sharp drop in thecapacitance from its zero bias value.

Advantages and Disadvantages

In designing superlattice varactors, two material systems were considered: GaAs/AlAsand InGaAs/InAlAs lattice matched to InP. Structure I, seen in Figure 4, shows a 10 pe-riod, 20 A / 20 A GaAs/AlAs superlattice barrier varactor chosen for examination of thebarrier properties. The MBE grown wafer was processed on the front side by photolithog-raphy. Contacts were made to the front and back by evaporating a Ni/Ge/Au/Ti/Au

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sequence and annealing at 405 degrees Celsius. Mesa diameters of 5 to 90 //m were thenchemically etched. The measured room temperature I-V curve in Figure 5 demonstratesthe effectiveness of the superlattice in keeping the current to a minimum. At a bias of1 volt the current density is about 1 A/cm2, compared with about 150 A/cm2 for the

•single barrier varactor. However, the ratio of maximum to minimum capacitance isinsufficient for any significant harmonic conversion.

The second structure, a 40 A / 40 A InGaAs/InAlAs superlattice, was designed withdoping spikes added, as outlined in Figure 6a. Figure 6b shows the C-V data, taken at80 K to reduce the parallel conduction current 3. A close agreement is observed with thecapacitance characteristic predicted by a self-consistent quantum mechanical and Poissonsolution for the charge and potential distribution throughout the superlattice varactor.When a voltage of approximately 0.2 volts is applied, the capacitance drops sharply toabout one-fifth of its zero bias value, corroborating the theoretical expectation. Thusdoping profile modifications allow good control of the capacitance-voltage characteristic.

The final structure utilized the low leakage properties of the GaAs/AlAs superlatticeand incorporated the doping modifications that had been tested in the InGaAs/InAlAssystem. In structure III the same superlattice as Structure I (with one well layer removedfrom the end for symmetry) was grown on a new varactor wafer which incorporated adoping spike of sheet density IxlO12 cm~2 and a more lightly doped N~ region than theprevious GaAs/AlAs wafer. Figures 7 and 8 present the room temperature I-V and C-Vdata from 90 micron diameter mesas fabricated on this wafer. Compared with structureI, the leakage current density has increased. This current degradation can be attributedto the following mechanism: the effective electron thermionic emission barrier is reducedby band bending at the barrier edge due to the high electron density in the doping spike.The capacitance and parallel device conductance were simultaneously measured on aHP4275A LCR meter, where the bias was varied until the conductance exceeded themeasurement capability of the machine. As seen in Figure 8, the C-V profile exhibits aswing ratio of close to 4. However, the zero bias capacitance was larger than the valuepredicted by the quantum mechanical analysis by about a factor of 2. The reason forthis is not clearly understood at the present time.

Despite the fact that the current levels in the final structure were higher than ex-pected, the superlattice varactor represents improvement over the single barrier varactor.Figure 9 compares the current densities for the two devices at low and high voltages andtemperatures. For operation at low temperature or for small voltages the superlatticebarrier fares better than the SBV.

3J. P. Sun, W. L. Chen, J. East and G. Haddad, C-V Characteristics of Quantum Well Varactors,Proceedings of the 1991 International Semiconductor Devices Research Symposium.

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Page 150 Third. International Symposium on Space Terahertz Technology

Conclusions

We have demonstrated a superlattice barrier varactor in the GaAs/AlAs system whichpromises to be useful in odd harmonic generation due to its reduced leakage propertieswhen compared with the SBV. Moreover, modification of the capacitance by means ofan appropriate doping profile has been demonstrated in the InGaAs/InAlAs materialsystem. A compromise appears, however, between minimizing leakage current levels inthe device and achieving a large maximum to minimum capacitance swing ratio. Wehope to begin RF testing of the superlattice barrier varactors in the near future.

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Third International Symposium on Space Terahertz Technology Page 151

a) N+ GaAs N- GaAs N- GaAs N+ GaAs

Ti Al rGai_TAs

b)

c)

FIGURE (1): (a) Single Barrier Varactor , (b) band diagram underequilibrium, (c) band diagram under bias.

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Page 152 Third International Symposium on Space Terahertz Technology

a)

GammaLevel

XLevel

Electron seeslower barrier

Electron

Confined Gamma Energy LevelsIn The Well Regions

b)

X XElectron

FIGURE (2): (a) X valley transport in Single Barrier Varactor,(b) Suppression of X transport by superlattice.

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Third International Symposium on Space Terahertz Technology Page 353

SPACERLAYER

SUPER-LATTICE

DOPINGSPIKE

N+

FIGURE (3): Super-lattice with doping spikes

3000 A 3000 A 3000 A 3000 A

5 X 1 0GaAs

2 X 1 0GaAs

\<0

2 X 1 0GaAs

16 5 X 10GaAs

13

20 A/20 ATen PeriodSuperlattice

FIGURE (4): Structure I: GaAs/AlAs super-lattice varactor

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Page 154 Third International Symposium on Space Terahertz Technology

IF(uA)

200 .0_

40.00/div

0

-200.0-2.000

GRAPHICS PLOTSL I-V 90JJ DIAM.

VF0 2.000.4000/div ( V)

FIGURE (5): Structure I: I-V characteristic

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Third International Symposium on Space Terahertz Technology Page 155

4000 A 1000 A 1000 A 4000 A

1-75 X 10InGaAs

• ^*

1 X 10InGaAs

"1 X 10InGaAs

175 X 10InGaAs

Delta dopingInGaAs 5 E17per cm"3 80 Athick

I Undoped 100 AInGaAs SpacerLayer

Three Barrier/Two Well40 A InGaAs/ 40 A InAlAsSuperlattice

0.0-05-0.4-0.3-0.2-0.1 0-0 0.1 0.2

Voltage (V)0.4 0.5

FIGURE (6): (a) Structure II: InGaAs/InAlAs superlattice varactor withdoping spikes, (b) Structure II: G-V characteristic

Page 11: Superlattice Barrier Varactors* - NASA ·  · 2013-08-30The capacitance and current-voltage characteristics ... Schottky varactor diode is the conduction ... solution for the charge

Page 156 Third International Symposium on Space Terahertz Technology

u

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SUFERUTTICE IV (DELTA-DOPED

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FIGURE (7): Structure III: I-V characteristic

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FIGURE (8): Structure III: C-V characteristic

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Third International Symposium on Space Terahertz Technology Page 157

J (Amps/sqcm)

AtV = 0.1 volts At V = 0.4 volts

SBV 1.1 @ 3 0 0 K0.2 @ 100 K

9.4 @ 300 K1.8 @ 100 K

AlAs/GaAs S/L

0.7 @ 294 Knegligible@ 9 0 K

16.5 @ 294 K0.2 @ 90 K

FIGURE (9): Comparison of improvements