Vision and Roadmaps

on More than Moore

Pietro Palella

STMicroelectronics Italy, CEO

26th September 2013

Agenda 2

Welcome to STMicroelectronics MEMS’s home

Main technology pillars

ST MEMS Facilities: CAST, AGR, CTA

Vision and Roadmaps on More than Moore

Conclusion

• A global semiconductor leader

• The largest European semiconductor company

• 2012 revenues of $8.49B(1)

• Approx. 48,000 employees worldwide(1)

• Approx. 11,500(1) people working in R&D

• 12 manufacturing sites

• Listed on New York Stock Exchange, Euronext Paris

and Borsa Italiana, Milano

Who we are 3

(1) Including ST-Ericsson, a 50:50 joint venture with Ericsson

STMicroelectronics Castelletto

• The site has been settled on 1968 as Technology Innovation Hub

• Castelletto has been home of breakthrough “more than Moore”

technologies like RF, Smart Power, BCD and …MEMS (started on

2006).

• 900 full time employees, fully devoted to Advanced Design and R&D

Fab facility.

• Fact sheet of the 85,500 m2 Industrial area: • Reliability lab/EWS/FT 2600 m2 clean rooms

• Office and Labs 19,400 m2

• Facilities and Services 10,000 m2

4

STMicroelectronics in Italy 5

Agrate : Design, Technology

R&D,Manufacturing

Marketing

Work force: 4199

Arzano: Design

Work force: 96

Catania: Design, Technolgy

R&D,Manufacturing,

Marketing

Work force: 3888

Castelletto: Design, R&D,

Marketing, Sales

Work force: 943

Where you find us

Our MEMS & Sensors

are augmenting

the consumer experience

6

Our automotive products

are making driving safer,

greener and more

entertaining

Our smart power products

are making more of our energy resources

Our Microcontrollers

are everywhere

making everything smarter

and more secure

Our digital consumer products

are powering the augmented

digital lifestyle

ST’s main pillars 7

Sense & Power

and Automotive

Products

Embedded

Processing

Solutions

Source : WSTS

2013 – ST SAM $140B

$73B

CAGR ‘12-’15: +4.8%

$67B

CAGR ‘12-’15: +4.4%

A strong, more focused product portfolio 8

• General Purpose MCUs and Secure MCUs

• Application Processors and Digital Consumer products

• Imaging ICs and Modules

• Digital ASICs

Sense & Power

and Automotive

Products

• MEMS and Sensors

• Power Discrete and Modules

• Advanced Analog, Power Management

and Standard ICs

• Automotive products

Embedded

Processing

Solutions

Sense & Power and Automotive Products

9

Automotive

Car Infotainment

Smart Power

Power Microcontrollers

Power

Discrete

Power MOSFET, IGBT & Modules

Rectifiers, Protection, ASD & IPAD

Analog, MEMS

and Sensors

MEMS and Sensors

Advanced Analog

Power Management & Standard IC

Leading the Global MEMS Sales 2012 10

ST is first to reach $1,000M revenue on MEMS!

Source: Yole développement, Feb. 2013

MEMS Technologies • THELMA process: thick epitaxial layer for Inertial sensors

• 3 axis accelerometers & gyroscopes

• Anisotropic Magnetic Resistance (e.g. permalloy) • integrated compass

• PZT thin film for piezo-electric transducers • Ink-jet printheads, energy scavengers, solid state microphones, pressure

• Micro-Optical MEMS: micro-mirrors on large cavity (e.g. 4x2 mm);

electrostatic or piezo actuated. • Pico-projectors (HD resolution 1280x720)

• 3D micro-scanner (HMI for consumer, HUD for assisted driving)

• Environmental sensors • Temperature, Baro-pressure, Moisture, …

• 3D packaging and SiP technology • cost effective Combo smart systems, high reliability, tiny form factor

11

Sources: IHS iSuppli January 2013, Yole Development

MEMS key facts

•ST #1 in MEMS Motion Sensors for consumer electronics and mobile handset market

•ST #1 in Accelerometers, Market Share ~50%

2006 2012

•ST #1 in Gyroscope

•Market Share 90% in 2012

60%

$1000M Gyroscope Market Share ST’s MEMS revenue

$30M

12

3 Axes Gyroscope

Drive mode

FCoriolis = -2mΩz Λ v

x

y

z

v

Ωz

FCoriolis

Single driving

Mass

Yaw mode

Pitch mode

Roll mode

Leadership through Innovation & time2market: > 650 patents

13

MEMS Sensors in Portable Devices

Target Markets • Mobile & Consumer

• HUBS • Motion

• Environmental

• Acoustic

• Expanding use of sensors

• FingerTip revolution

• Personal projection

ST

Strengths

15

• #1 in revenue for MEMS for mobile and consumer

• Enlarging product portfolio to cover existing and new

applications with a complete portfolio for motion,

environment, audio and touchscreen controllers

• Internal dual-source manufacturing on 200mm

• Wide and flexible technology portfolio

• ST’s iNEMO family: unrivalled ability to integrate sensors

with ARM-based MCU

$5.6B TAM in 2016

CAGR 2013-16: +18%

Source: IHS iSuppli, January

2013

MEMS Sensors: Expanding to New

Markets

Target Markets • Automotive

• Addressing a new market for

Assisted guidance, Personal safety &

Comfort

• Emerging new markets • Fitness & Wearable

• Internet of Things

ST

Strengths

16

• #1 in revenue for accelerometers and gyroscopes in 2012 for all markets

• Entering production for Automotive MEMS now; internal manufacturing is

key for automotive customers

• Numerous flagship product wins in fitness and wearable

• ST MEMS complimented by ST’s Ultra-Low Power RF and Ultra-Low Power

MCUs

• As smartphones dissolve into devices around the body ST captures

opportunities

• Providing smallest Smart Systems to enable Internet of Things

Source: Strategy Analytics, January 2013

>$23B TAM in 2016

CAGR 2013-16: +10% Automotive Sensor TAM

MEMS Around the Body MEMS Pressure Sensors on Flexible Plastic Substrate

close to Eyes for Glaucoma Detection

24-hour disposable contact lens with pressure

sensor – ST and Sensimed

Disposable Insulin Pump

Source: Debiotech,

www.jewelpump.com

Body Gateway

17

Almost One ST’s MEMS shipped

per Person in the World 18

Outstanding Global Manufacturing Capability with Dual Sourcing

3.3 Billion units

of Sensors

3.2 Billion units of

Inkjet Printheads

+

Accelerometers, Gyroscopes,

Compasses,Microphones and

Pressure Sensors

Crolles (France)

Rousset

(France) Agrate (Italy)

Catania (Italy)

Kirkop

(Malta)

Singapore

Calamba

(Philippines)

Sensors (8” and 6” MEMS dedicated line)

ASIC Front-end

Assembly & Testing

BCD Technologies

• Baseline Voltage : 40V

• BCD Off line: 600V with roadmap to >1000V

• Transition of Al metal wires to thick Copper wires • Allowing the interconnect current to upscale from milli Ampere to Amperes!

• Innovative magnetic material: Cobalt based alloy • to enhance the magnetic field sensitivity

• Scaling the logic gate feature • BCD9s: 160 nm (up to 60V)

• BCD10 90 nm (up to 60V)

• BCD* 65 nm (up to 40V)

• FE Manufacturing to move from 200 mm to 300 mm wafer size

19

Immense business potential for industrial

and power discrete: some examples 20

Portable

$9B TAM in 2016

CAGR 13-16:

+7.4%

Key Applications:

Smartphone, Tablet, Handheld Consumer, Fitness, Consumer

Medical

Automation

$8B TAM in 2016

CAGR 13-16:

+7.5%

Key Applications:

Factory Automation, Industrial Motor Drives,

Home & Building Automation, Networking,

Security

Smart Grid

$6B TAM in 2016

CAGR 13-16:

+14.2%

Key Applications:

Smart Metering, Renewable Energy,

Energy Saving, Power Conversion, HEV-EV,

LED Lighting

Source: IHS iSuppli, Semicast, ST

High voltage Noise immunity Analog, Digital

Co-design

Design challenges:

System validation

Smart Environments

Target Markets • Renewable energy generation

• Smart metering

• Power conversion

ST

Strengths

21

$6B TAM in 2016

CAGR 2013-16:

+14.2% Smart Grid TAM

• >80% market share in Smart Metering powerline

modem

• Complete solution for smart energy management

• Mdmesh II Plus: leading position in superjunction

transistors

• Leading technologies for Smart Grid

• STarGrid™ platform for Power Line Communication

• High voltage power discrete and Smart Power for

energy management Source: IHS iSuppli, Semicast, ST

Automotive – A New World of Applications 22

0

2

4

6

8

2011 2013 2015 2017 2019

PowertrainChassis

Safety

Security

Car Efficiency & Safety 23

Target Markets • Engine control

• Braking, steering

• Airbag

• Active safety systems

ST

Strengths

Semiconductor Demand ($B)

• #1 in revenue in Smart Power, ASIC and Active Safety

• 32-bit MCU portfolio growing fast

• Cooperation agreements with leading OEMs: Audi and

Hyundai Autron

• Fully controlled automotive-qualified supply chain

• New intelligent switches: 7th generation of VIPower family

deliver improvements for reliability and precision

Ultrasound image diagnostics 24

txCtrl rxSAP txSAP

The PROBE: From 3000 to 8000 Ch for 4D Images

• The Console:

• Large volume

• Few Channel per Chip

• Open Market

• 4D Images for Endoscopic

Tools: • Trans Esophagus Echo

(TEE)

• Intra Cardiac Echo (ICE)

•Record of Integration &

Low Power Design

•2500 HV RX-TX ch in a

single chip

• Smart Probe

• A fully portable echography probe

• USB pluggable on display products like tablet, PC or Smart Phone

KET & Smart Systems Integration 25

KET:

Nanoelectronics, Bio-Nanotech,

Advanced Materials

Electronic Components (Microcontrollers, ASSP, SiP, Power Modules, MEMS) & SW IPs

Smart System

Integration

High End

Manufacturing

Innovative & Complex

Electronic Design

Cyber Physical Systems

Cars, Planes,

Trains

Medical &

Health

Equipment

Security

Systems

Energy

Networks

& Efficiency

Home

Appliances

Conclusion

• More than Moore technology is business critical

and challenging to innovation • Sustainable path for semiconductor industry

• application driven market

• lateral thinking and innovation-intensive solutions

• Breaking the envelope of so-called established technologies

• EU KET strategy: beyond business as usual • Coordinated R&D investments at EU level

• To reverse the trend of declining high-tech industry in EU

• Priority to EU’s strength (i.e. semiconductor, smart systems,

cyber physical systems)

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