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Applied Materials Confidential
The Challenge and Opportunity of
More-Than-Moore (MTM)
Technology Transitions
Rossella MininniStrategic Marketing Manager, 200mm Equipment Product Group
Semicon Europe, November 15th, 2017
| Applied Materials Confidential
Outline
Changing Semiconductor Landscape
Applied Materials ≤200mm MTM Portfolio
Manufacturing Challenges
Example 200mm/300mm Transition Technologies
Conclusion
2
| Applied Materials Confidential
www
3
Semiconductor Market Evolution
PC + Internet
Mobile +
Social Media
Artificial Intelligence
+ Visual Computing
VR / AR
IoT / Smart devices
Big Data
AI / Machine learning
Smart vehicles
Industry 4.0
Additive manufacturing
* 2000 – 2009 ** 2010 – 2016
2000 2010 2016
Av. WFE = $25.5B* Av. WFE = $32.3B** Av. WFE =
External Use
| Applied Materials Confidential
Semiconductor Market Outlook
4
Gartner Forecast; Dec 2016
► Smart Phone: rising units number and need for new
technologies – despite overall growth slow down
► Automotive: ADAS, Electrification, Telematics (4G/5G),
Infotainment, miniaturization key factors
► Datacenter/Server: IoT / Increased ‘Cloud’ presence -
onset of photonic technology inflection
► Communication Infrastructure: 5G at the Base Station
& the Node
► Industrial: Industry 4.0, Building Automation and Control,
Robotics & Drones for industrial applications
► Consumer: IoT, 4G/5G, Virtual & Augmented Reality
(VR/AR), Artificial Intelligence (AI), Drones & Robotics,
Wireless Charging
► Markets post-2021: Automotive; 5G; Mobile Health; Next
generation Virtual and Augmented Reality; Robotics &
Drones
2016
Semi rev
($B)
CAGR 2016-20
$0
$20
$40
$60
$80
$100
-2% 0% 2% 4% 6% 8% 10% 12%
Smart Phone PC
Consumer Comm. Infras.
Industrial Auto
Server Tablets
| Applied Materials Confidential
Emerging/MTM Application Technologies on 200mm
Smartphone, Tablet & PC
Automotive(Safety, Navigation, ECM, Etc.)
Consumer
Industrial Applications
5
Today ≤200mm represent > 70% of all IC content across all major market segments
End Market Drivers
Communication
• Advanced Logic
• Advanced Memory
• Packaging : Fan-out
• Image Sensor (28nm - 180nm)
• Analog Device (90nm - 180nm)
• Power IC (130nm - 350nm)
• MEMS, Sensors, RF (0.5μm - 5μm)
• Packaging Fan-in
Enabling Devices (Nodes)
| Applied Materials Confidential
Emerging/MTM Application Technologies on 200mm
Smartphone, Tablet & PC
Automotive(Safety, Navigation, ECM, Etc.)
Consumer
Industrial Applications
6
Today ≤200mm represent > 70% of all IC content across all major market segments
End Market Drivers
Communication
• Advanced Logic
• Advanced Memory
• Packaging : Fan-out
• Image Sensor (28nm - 180nm)
• Analog Device (90nm - 180nm)
• Power IC (130nm - 350nm)
• MEMS, Sensors, RF (0.5μm - 5μm)
• Packaging Fan-in
Enabling Devices (Nodes)
| Applied Materials Confidential
Additional
tools Productivity
On wafer
performance
New
materials &
Technologies
MTM Device Technologies: Opportunities for ≤200mm
State of the Art Manufacturing
Facility for New and
Refurbished Tools
Service Solutionsto Enhance
Tool Capability & Improve
Fab Efficiency
Product Development and Customer Demo Center
Spare Solutions for guaranteed
Quality,Value and Parts
supply
Extending Tool Lifetimes & Enabling New Technologies
| Applied Materials Confidential
200mm
Equipment
Availability
Supply ChainImprove
Performance
New HW and
Process
Development
MTM Device Technologies: Challenges for ≤200mm
Core Availability
Core Cost
PartAvailability
Qualified Supplier
New ToolsBuilt
PartCost
Obsolescence PartQuality
Process CIP
UpgradesNew
Material
New HW
Extending Tool Lifetimes & Enabling New Technologies
Technology Inflection
| Applied Materials Confidential
≤200mm Infrastructure
9
Implant - Gloucester &
Newburyport, MA
ViiSion, ViiSta,
z
Xi’an, China Demo & Development Lab - 6 systems
Endura® PVD Mirra Mesa®
CMPEtch CenturaProducer® CVDEndura® PVD Epi Centura
PDC - Rehovot, Israel
Multiple systems
CD/DR/WI Tools
PPC – Kalispell, MO
Multiple systems
z
Manufacturing Facility – Austin, TX
| Applied Materials Confidential
≤ 200mm Manufacturing Facility - Austin, TX
92,000 sq ft. of manufacturing and warehouse , with 22 Test Bays (full final test)
In-house component repairs/testing
Capability to ramp up to 50 tools / quarter
Manufacturing services for all Applied Materials product lines
Supply chain and direct materials management, Obsolescence Protection
10 External Use
| Applied Materials Confidential
≤200mm Equipment Portfolio
ImplantE220/500
Kestrel
VIISion 80/200
ThermalCentura
RTP
Epi (ATM/RP)
LPCVD
Gate
Inspection
& MetrologySEMVision
Compass
Complus
VeraSEM
NanoSEM
VeritySEM
PVD
Endura®
Al (Slab/Fill)
Liner/Barrier
iLB
CuBS
ALPS Al / Co
CleanW™
SIP TTN
CVD
Centura®
Producer®
DxZ Silane
DxZ TEOS
DxZ SACVD
Gigafill SACVD
Ultima HDP
WxZ and WEB
Etch
Centura
MxP®
Super-E
Metal/Poly DPS
ASP+
eMAX
CMP
Mirra®
Mirra Mesa
Oxide
Tungsten
STI / Poly
Copper
11
Supporting the MTM evolution with innovative ≤200mm platform technologies
External Use
| Applied Materials Confidential12
Key 200mm Upgrades
CVD Ultima to Ultima Plus Ceramic Clean Gas Manifold Slit Valve Door Vita™ Controller (Centura & Producer)
Etch Ceramic and EP E-chucks Black jacket turbo pump High temp. throttling gate valve Y2O3 Kit coating Slit Valve Door
PVD Source Magnet Tachometer EZ LCF (Local Center Finder) MCA E-chuck
Implant E2/E5: 1GHz Control System
Productivity PlusThin Wafer
VIISion: Memory Upgrade
Thermal Motorized lift Radiance WRLD Upgrade High growth rate Epi
PDC SEMVision “Plus” Upgrades ComPlus Generation Upgrades
EPG WF 150916
CMP Multi-Zone Heads EZ UPA PM Reduction Kit Distributed Slurry Delivery Arm
| Applied Materials Confidential
MTM Product Demo & DevelopmentXi’an, China based Customer Demo and Product Development Facility
c-Si/TF Solar
Labs
AGS Semi Lab
12 KW TF Solar
Array
B1
B2
AGS Training
Center
56KW c-Si Solar
Array
LED LabScreen Printer
Mfg
Located in Xi’an China
New products and applications development, customer demos
Product enhancements, material & software testing and qual
R&D Testing
13 External Use
| Applied Materials Confidential
Ch
am
be
r
Te
ch
no
log
y
Key Market Opportunities based on Technology Inflections
14
De
vic
e
Ap
pli
ca
tio
n
On
Wa
fer
Te
ch
no
log
y
Soliton™ Pronto™ HDR Al Altum™
Fingerprint
Sensor RF Filter
Next Gen
MicrophoneIGBT / SJMPower Device
EPI WafersPower / MEMS
AlN / ScAlN / PZT ATM Blanket Epi ≤12µm Al Critical Etch For MEMS
High Power MOSFETsNext Generation
MEMS Gyroscopes
| Applied Materials Confidential
Committed to New Product Development Execution
15
R&DMFG
Deliverables:
Pilot capability
Producibility engineering
Low cost sourcing
Testing strategies
Lead time reduction
DFX
Deliverables:
Meet Customer needs
New product designs
Prototypes
Mfg support
New Products
Revised HW Designs
Customer
Performance Feedback
Clear ownership
with strong ties
to Business Unit
Increased new products customization drives need to rapidly commercialize through manufacturing
External Use
| Applied Materials Confidential
AGS Service & Spares Portfolio
On Demand Comprehensive ServicesPerformance ServiceKPI: On wafer specs
UNIT
PROCESS
ValuePerformance service with advanced service
technologies and Equipment specific
performance commitmentsManaged ServiceKPI: Supplier Dependent Uptime
OUTPUT
ValueIncreased Uptime at a predictable cost for
greater Equipment availability. Preventive Maintenance1
KPI: First Time rightOUTPUT
Included to meet KPI‒ Shift coverage as required
‒ Response Time as required‒ Corrective Maintenance labor‒ All PM labor, Wet Cleans
‒ Consumables‒ TKM (All Cleaning), Swap Kits
‒ DPY parts
‒ Non Consumables2
‒ Access to Experts for escalations
‒ Proprietary Service Technologies (FSS)‒ Fab Vantage
‒ Software: Enhancements, Upgrades
SUPPLY CHAIN ASSURANCEValuePreventive maintenance done right
TransactionalTotal Kit ManagementKPI: Kit to qualify
Included to meet KPI‒ Response Time: Scheduled – On Time‒ Shift coverage ≤7X12‒ All PM labor, Wet Cleans included
‒ Consumables‒ TKM( All Cleaning), Swap Kits
Included if required to meet KPI‒ DPY parts
‒ Access to Experts for escalations
‒ Proprietary Service Technologies (FSS)‒ Fab Vantage3
ValueApplied Certified
ValueKit availability on time
‒ Kit management for chamber process kits.
‒ Paid Service‒ Transactional Spares, Repair
Standard ServiceKPI: Response Time
OUTPUT
Forecast Parts ManagementKPI: On Time to Schedule
ValueExpert response to Equipment downs for
corrective maintenanceValueSupply Chain management Included to meet KPI
‒ 5x8 coverage, Response time: 8 covered hrs.
‒ Access to Experts for escalations‒ Corrective maintenance labor‒ ≥ Quarterly PM labor, Wet Cleans excluded
‒ Consumables b illable‒ Non consumables2
‒ Software Bug fixes
Included to meet KPI‒ Shift Coverage, Response time as required
‒ Corrective maintenance labor‒ All PM labor, Wet Cleans ‒ Consumables,
‒ TKM ( All Cleaning), Swap Kits
‒ Non Consumables2
‒ Software Bug fixes
Included to meet KPI ‒ Scheduled:>97% within 24hrs of schedule, remaining within 7
days of schedule.
‒ Unscheduled: >90% within 7 business days of request,
remaining within 14 business days of request.
1Attachable to Warranty, Post Warranty & Standard Service. Not sold separately2Some parts exclusions apply.
3One FV project included if>12Tools covered.
For additional Service products, get in touch with your Account Sales ManagerV 4.2 01/27/17
What We Offer - Service
► Flexible portfolio for custom
solutions
► Advanced predictive and
diagnostic technologies
► Innovative technology
extension and conversion
► World-class expertise and
knowledge-base systems
What We Offer - Spares
► Broad portfolio with focus on
value and parts availability
► Steady stream of available parts including CIP
► Solution to refurbishment and quality issues
► Performance guaranteed on new or refurbished parts
Work with customers to boost Fab operational excellence
| Applied Materials Confidential
Manufacturing ChallengesOvercoming The Supply Chain For ≤200mm
17
| Applied Materials Confidential18
200mm Used Open Market Inventory Overview
External Use
Cores scarcity on the open market driving up the cost of used 200mm equipment
EPG building more 200mm new tools to be able to fulfill customer demand
Revenue Quarters
Q1'12 Q2'12 Q3'12 Q4'12 Q1'13 Q2'13 Q3'13 Q4'13 Q1'14 Q2'14 Q3'14 Q4'14 Q1'15 Q2'15Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17
Nu
mb
er
of
Ite
ms
200mm Core Quarterly ActivityCores OUT Cores IN Net Open Market Items
| Applied Materials Confidential
150mm/200mm Core Market ASP Trends
Scarcity of cores on the open market increasing ASP pressure for specific tool or chamber
19
Revenue Quarters
External Use
Ave
rag
e S
ale
s P
rice (
AS
P)
0
100
200
300
400
500
600
Q1'15 Q2'15 Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17 Q4'17 Q1'18Proj
150/200mm Core Market Price Changes
Mirra Mesa
Mirra Stand Alone
Producer Split
Centura DxZ
CII DPS+ Metal Etch
CII Oxide Etch
TPCC Xe+ (3 CH)
Endura iLB
Endura PVD / Al
SEMVision G3
| Applied Materials Confidential
Refurbished vs. New Tool Builds
Increasing percentage of new tools adding pricing challenges AND parts supply issues
20 External Use
Revenue Quarters
Nu
mb
er
of
Syste
ms
0%
10%
20%
30%
40%
50%
60%
70%
Q1'14 Q2'14 Q3'14 Q4'14 Q1'15 Q2'15 Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17 Q4'17 Q1'18(Proj)
Core Refurb vs. New Mainframe BuildsCore Refurb New Mainframe Builds % of New Mainframe Builds
| Applied Materials Confidential
Used vs. New Content Utilization
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
Q2'14 Q3'14 Q4'14 Q1'15 Q2'15 Q3'15 Q4'15 Q1'16 Q2'16 Q3'16 Q4'16 Q1'17 Q2'17 Q3'17
QoQ Material Utilization
From Core Value Used Content Value New
21
Mate
rial
| Applied Materials Confidential
Example 200mm/300mm Transition
TechnologiesMTM Defined As ≥45nm Technology Node
22
| Applied Materials Confidential
200mm to 300mm Transition
The 200mm/300mm transition will occur in MTM on an opportunistic basis23 External Use
Drivers for
300mm transition
Available Depreciated300mm Line
OpportunityFor
Disruption
Technology Existing on
300mm
WLCSPRequired
More Sophisticated
ASIC
Volume / ASP Pressure
Examples of device transitioned to 300mm
Analog
RF AlN / ScAlN
Based Devices
Disruptive Technologies
MCUCIS
Examples of device that may transition to 300mm
| Applied Materials Confidential
Smart Phone Consumer* Automotive Industrial Communication
Infrastructures
Server Other
2016 2020 2016 2020 2016 2020 2016 2020 2016 2020 2016 2020 2016 2020
End User Application Market IC Revenue - by Wafer Size
24
4337
1915
4
27
161616
504755
49
6
4
159
8
510
1311
17
13
1113
44
1515141317
13
2727
2323
62
72
58
2
1
2
4
49
41
1616
21
13
35
2120
63
26
300mm Legacy 300mm Leading Edge200mm Legacy
Source EPG marketing, Gartner 2016, Yole Developpement 2016;, Data Beans Est. (TI, 2013)
* Consumer includes PC and Tablets
300mm IC Revenue increasing in all application markets through 2020 and representing ~70% of the total IC revenue 300mm legacy IC revenue growing ~3x faster than 300mm leading edge IC revenue driven
200mm IC Revenue flat to slightly up through 2020 in application markets reflecting increased wafer starts and capacity adds
Eroding ASPs and profits shifting up the supply chain negatively impacting 200mm IC Revenue despite increased wafer demand
CMOS: Memory 300mm & 30% of total CMOS revenue; Logic revenue @ 200mm 30% of total logic
CIS, Analog and Power revenue would be either 200mm or 300mm (legacy ), MEMS all 200mm
YoY % of 300mm revenue +2% for CMOS and CIS / +6% for Analog and 9% Power 1% 300mm revenue by 2020 for MEMS
IC Revenue ($B) 2016 2020 CAGR 2016-2020
200mm 108 111 0.5%
300mm Legacy 47 71 10.8%
300mm Leading Edge 184 211 3.5%
Total IC Revenue 340 393 3.7%
| Applied Materials Confidential25
Advanced RF/pDC PVD Chamber For MTM Films
Soliton serves a broad variety of PVD films : Piezo-Films, AlN, Sc:AlN, VOx, Mag. Aligned Films, Others (Al2O3, Ta)
Application segments include MEMS & Sensors , Power Device & LEDs (e.g., GaN on Si)
External Use
Next Generation
RF/pDC PVD
| Applied Materials Confidential26
Advanced RF/pDC PVD Chamber For MTM Films
Soliton serves a broad variety of PVD films : Piezo-Films, AlN, Sc:AlN, VOx, Mag. Aligned Films, Others (Al2O3, Ta)
Application segments include MEMS & Sensors , Power Device & LEDs (e.g., GaN on Si)
External Use
300mm pDC PVD
(Wafer Carrier 2”, 4”,6”,8”)
200mm Next Generation
RF/pDC PVD
Key Challenge: Transfer High Temp
(800°C) capability
| Applied Materials Confidential
High Deposition Rate Thick Aluminum (Al) For Applications In Power and MEMS Devices
27
200mm HDR Al
External Use
Single pass solution for ≤12µm films
High productivity <3µm/min deposition rate
(2x) productivity of standard Al chamber
> 50% improvement compared to the available solutions in
marketplace
Defect free films, no whiskers, hillocks
Production proven at an automotive customer site
Lowest CoO – available as an upgrade or chamber add to
existing platforms, no need to introduce a new platform
Thick Aluminum
(400°C )
Thermal Grooving Aluminum Whisker Hillock Formation
| Applied Materials Confidential
High Deposition Rate Thick Aluminum (Al) 200mm/300mm Transition
28
200mm HDR Al 300mm Alexandria
External Use
key challenge: match power density
and wafer temperature
control
| Applied Materials Confidential
Advanced Deep Reactive Ion Etch (DRIE)DRIE for Power, MEMS and Packaging Technologies
New Etch Processes for SiC
and GaN Applications
GaN Etch SiC Etch
DPS-DTM
(≤200mm)
DPS II – Silvia / Silvia-N
(200mm/300mm)
Transitioning MTM Technologies to
200mm/300mm Capable Tools
High Aspect Ratio
(>110:1)
Sub-Micron CD
(<< 200nm)
High Etch Rate
(>25µ/min)
29 External Use
| Applied Materials Confidential
Improved Productivity
Tighter Process Control
New Software Capability
Hardware
Thickness Profile (nu. <0 .7%) Resistivity Profile (nu. < 2.0%)
Growth Rate Profile
0
1
2
3
4
5
6
7
8
0 5 10 15 20 25 30
Gro
wth
Rate
(u
m/m
in)
TCS Flow (slm)
STD Chamber GR (um/min) HGR GR (um/min)
95
969798
99100101102
103104105
-100 -75 -50 -25 0 25 50 75 100
Th
ick
ne
ss
Distance from center [mm]
Y Axis X Axis
37
38
39
40
41
42
43
44
45
-100 -75 -50 -25 0 25 50 75 100
Rs
Distance from center [mm]
Y Axis X Axis
HGR Epi Chamber
High Growth Rate Epi-SiliconPower Device, MEMS & Wafering Applications
External Use30
| Applied Materials Confidential
Summary: MTM Opportunities & Challenges
MTM applications are growing surely driving up demand for ≤200mm
and potentially boosting legacy 300mm (≥45nm tech node) production
technologies
There are both HW and process challenges fostered by this
increasing demand at 200mm and below …. and migrating even
existing MTM processes from 200mm to 300mm will pose additional
one
Refurbished tool market slowly drying up leading to increasing ASPs
of the legacy tools and higher percentage of new tool builds
31 External Use
| Applied Materials Confidential
Conclusion
Applied Materials Supports MTM Device Technologies by:
Continued Investments to enhance productivity and develop new
materials and process addressing the latest requirement and inflections in MEMS,
Power, Analog, CIS, Packaging & CMOS
Working with leading R&D organizations to ensure our film and
technologies are demonstrated at the device level
Constantly looking for new ways to grow our portfolio of advanced tools
and comprehensive service— we're eager to collaborate with you!
Applied Materials - Your trusted Partner for
≤200mm and 300mm Technology and Equipment
32 External Use