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www.EVGroup.com

Enabling More-than-Moore Devices

Manufacturing with leading edge equipment

EV Group (EVG)

Markus Wimplinger, Corporate Technology Development & IP Director

Prepared for and presented at Semicon Europe, TechARENA2

www.EVGroup.com EV Group Confidential and Proprietary

EV Group at a glance

2

Founded in 1980

Installed base in excess of 2,200 tools world wide

in High Volume Production and R&D

Corporate headquarters in Austria

Subsidiaries in the US, Japan, South Korea, China and Taiwan

More than 750 employees worldwide

World wide sales and customer support organization

R&D investment: 20 % of sales revenue


EV Group at a glance

3

EV Group (EVG) is a global supplier of

Wafer Bonders

Aligners

Coaters / Developers

Temporary Bonders / Debonders (Laminator)

Cleaners

Inspection Systems

EV Group (EVG) is a global supplier to

Advanced Packaging, 3D Interconnect

MEMS (MicroElectroMechanical Systems)

SOI (Silicon-On-Insulator)

Compound Semiconductor and Silicon based Power Devices

Nanotechnology

EV Group holds the dominant share of the market for wafer bonding

equipment and is a leader in lithography for

advanced packaging and nanotechnology.


Manufacturing Solutions for More-than-Moore

Device Manufacturing Solutions

4 4

3D IC CMOS Image Sensors High Brightness LEDs

Logic / Memory MEMS Devices Microfluidics

SAW Devices SOI Wafers Photonics


Diversity as Strategy or Necessity?

5

Organic Growth & Technical

Leadership

Vision / Mission

Diversity of Customer Types &

Diversity of Market

Segments

Diversity Stability

Diversity

cannot be an

isolated

choice

Diversity

need to be in

the DNA of a

company


Our Vision

6

Our vision of “being the first in exploring new techniques and serving next

generation applications of micro and nano fabrication technologies” enables our

customers to successfully commercialize their new product ideas.

This ensures continuous effective development and

economic stability.


Our Philosophy: Triple i®

invent With our equipment and processes, we constantly bring to market emerging

applications and develop new technologies in partnership with our customers.

innovate Faster than others, we develop new technologies and processes through

constant innovation and continuous improvement. Achieving the shortest time

lapse between R&D and small-scale production is among our targets.

implement Our equipment is designed for high volume industrial production. We

implement cost efficient large-scale manufacturing technologies for new value-

added products to supply our customers’ industries.

7


Order Intake by Type of Account

Order Value Percentage

8

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2008 2009 2010 2011 2012 2013 2014

50% 59%

69%

81%

70% 72% 73%

26% 10%

6%

8%

10% 16% 15% 10%

18% 16%

8%

11%

9% 4% 14% 13% 9%

3% 9%

4% 8%

Research of Universities / Institutes

Industry Research

Small to Midscale Production

High Volume Manufacturing

Fiscal Year


Account Type vs Wafer Size

9

Research of Universities / Institutes 200mm

6“

4“

Industry Research 300mm

200mm

150mm

Small to Midscale Production 200mm

150mm

High Volume Manufacturing 300mm

200mm

…dependent on market &

technology


EV Group at a Glance

10


Wafer Bonders

Aligners



Cleaners

Inspection Systems






Nanotechnology





EV Group at a Glance

11


Wafer Bonders

Aligners



Cleaners

Inspection Systems






Nanotechnology





Markets, Products & Wafer Sizes

12

Market Products Wafer Size

Advanced Packaging,

3D Interconnect

- Lithography

- Bonders

300mm

200mm

MEMS - Lithography

- Bonders

- Nanoimprint

200mm

6“

SOI & Engineered

Substrates

- Bonders

300mm 200mm

6“ 4“

Compound

Semiconductor and

Silicon based Power

Devices

- Bonders

- Lithography

- Nanoimprint

200mm 6“

4“ 3“

2“

Nanotechnology - Nanoimpint

- Bonders

200mm 6“, 4“

G2, G5 & G8 display


Strategies for Dealing with Diversity

13

Understand the Technology early on.

Start in R&D (iii- Mission)

Supporting R&D also creates diversity!

Modular equipment design / platform strategy

Vertially integrated business model

Understand the entire picture

Engage in process dev. & process support


Platform Strategy

14

Unique

Config.

Requirement

Unique

Config.

Requirement

Unique

Config.

Requirement

300mm

Platform

200mm

Platform

Variety of

process

modules

Variety of

process

modules

Software Platform identical between 200 and 300mm

Same automation features available on 200mm as for 300mm!


300 mm Lithography Systems


15

EVG®150

Automated

Resist Processing

System

IQ Aligner ®

Automated

Mask Alignment

System

EVG®40

Automated

Measurement System

EVG®770

Automated

NIL Stepper


200 mm Lithography Systems

MEMS

SOI

Compound Semiconductor

Power Devices

16

EVG®150

Automated Resist

Processing System

EVG®40

Automated

Measurement

System

EVG®120

Automated Resist

Processing System

EVG®6200

Automated Mask

Alignment System

EVG®620HBL

Automated Mask

Alignment System


200 mm Systems – EVG®150 Layouts

Exemplified configuration layout


300 mm Systems – EVG®150 Layout

18


EVG®150XT – High Throughput Configuration (exemplified)


300 mm Systems – EVG®150XT

Up to 8 process modules (200 mm / 300 mm)

Fully automated two robot handling

Up to 8 process modules

customizable in kind and number

EFEM - advanced FOUP-handling

and buffer storage

Independent user interface

for highest process control

Achieves highest throughput

More than 100 uph


World Class Facility for…

Customer demonstrations

Process development

Joint R&D with partners

Small volume pilot line production

Process training

IP management

Process technology licenses

Process Support & Development


Our Process Portfolio

22

EVG Process Expertise

Most complete equipment portfolio for semiconductor

and MEMS processes on a wafer level up to 300 mm!


Summary

23

Supporting More-than-Moore and diversity

cannot be an isolated choice inside an

organization

The entire business model has to be aligned

with this strategy

Diversity can be managed by a solid platform

strategy, solid understanding of the

technology and a high degree of vertical

integration

At EVG, 200mm equipment is NOT secondary

equipment

Leading edge technology and automation

available


Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to

change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof,

as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpinTM, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®,

HERCULES®, HyperIntegration®, IQ Aligner®, LowTempTM, NanoAlign®, NanoFillTM, NanoSprayTM, NIL-COM®, NILPhotonicsTM, OmniSpray®, SmartEdge®, SmartView®, The Triple "i" Company Invent-

Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.

File: EV Group Corporate Profile.pptx / Status: 21 JUL 2016

Thank you!

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Enabling More-than-Moore Devices Manufacturing with ...semieurope.omnibooksonline.com/2016/semicon_europa/SEMICON... · Enabling More-than-Moore Devices Manufacturing with leading