c1 integrated circuit

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INTRODUCTION TO INTEGRATED CIRCUIT

CHAPTER 1

By : Pn.Puteri Nadia Dayanie Bt Megat Sabri

Pn Puteri Nadia Dayanie Bt Megat Sabri

Learning Outcome

Understand integrated circuit technology

Know the classification of integrated

circuit


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Revolution of handphone


1.1.1 - What is Integrated Circuit

is a miniaturized electronic circuit

(consisting mainly of semiconductor

devices, as well as passive components)

that has been manufactured in the

surface of a thin substrate of

semiconductor material

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1.1.2 Function of IC Miniaturization - is to replace many separate electronic

components to be a single component that can

perform high - level tasks such as amplification, signal

processing, or even sophisticated digital calculations as

in the case of microprocessors.

cost reduction- to provide a relatively cheap

alternative to gathering a huge amount of

semiconductor parts and electrical parts, and mounting

on a circuit board and soldered.

performance - is the lowered power consumption

which brings higher power efficiency.


1.1.2 Application of Integrated Circuit

Missile system

Television / radio / video

Computer

Work station

Server

Toys

Hand phone

Telecommunication

Robotic

Digital watch

Aerospace

Medical

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1.1.2 - Function of IC packages

PURPOSE

to cover the entire IC built by plastic containers, ceramic and metal

FUNCTIONS

i. allows the IC is connected and easy to use with an electronic board

ii. provide physical protection to the IC internal structure such as gold wires, silicon chips and circuits from damage or scratches

iii. provide protection against moisture, gas and chemicals that exist in the environment

iv. ensure that IC is in a form that can be marketed

v. ensure that the IC in the form of an easy to use

1.1.3 - Comparison between IC and

discrete circuit


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Why silicon Semiconductor devices are of two forms

(i)Discrete Units

(ii)Integrated Units

Discrete Units can be diodes,transistors,etc.

Integrated Circuits uses these discrete units to make one

device.

Integrated Circuits can be of two forms

(i)Monolithic-where transistors,diodes,resistors are

fabricated and interconnected on the same chip.

(ii)Hybrid-in these circuits, elements are discrete form

and others are connected on the chip with discrete

elements externally to those formed on the chip


What is the main purpose of Integrated Circuit?

Make things become smaller

Advantages: Easy to carry, save power, save cost,

number of discrete parts can be reduced, Circuit

boards can be smaller, less power, and cost less to

produce-increase performance.

Take Note!!

CMOS = Complementary Metal Oxide Semiconductor


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1.1.3 - Advantages of using IC over

Discrete component (cont)

i. Size: Sub-micron vs. millimeter/centimeter.

ii. Speed and Power:

Smaller size of IC higher speed and lower power = smaller parasitic resistances, capacitances and inductances = less heat cheaper power supplies (reduced system cost)

iii. Integrated circuit manufacturing is versatile Simply change the mask to change the design.

iv. Light and easily replaceable

Introduction

My name is

Gordon Moore..

Intels co finder..

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Moores Law

Moores Law The maximum number of transistors on a chip doubles every 18 months. This implies the chip on the transistor has increase one million times in three decades and has reached 30 million transistors (in microprocessors)

1.1.5 Figure 1.1: Moores law of scaling. The number of transistors on a chip has been increasing exponentially

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IC chip size and circuit complexity


1.2 - Classification of Integrated

Circuits

An integrated circuit (IC) consists of several interconnected

transistors, resistors, capacitors etc.,

All contained in one small package with external connecting

terminals.

The circuit may be entirely self-contained, requiring only

input and output connections and supply voltage to function.

Alternatively, a few external components may have to be

connected to make the circuit operative.

On the basis of fabrication techniques used, the ICs can be

divided into following three classes.

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1.2.1 - Classification of Integrated

Circuits

Fabrication Technique

1.2.1 - Classification of Integrated Circuits

Thin film technology and thick film technology -

offer greater design freedom with respect to physical realization of passive components, resistors and capacitors, in the sense that greater range of component values, closer tolerances and lower temperature coefficients can be achieved.

Monolithic

integrated circuits, all circuit components, both active and passive elements and their interconnections are manufactured into or on top of a single chip of silicon.

identical circuits are required in very large quantities and hence provides lowest per-unit cost and highest order of reliability.

Hybrid

separate component parts are attached to a ceramic substrate and interconnected by means of either metallization pattern or wire bonds. This technology is more adaptable to small quantity custom circuits.


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HYBRID Hybrid - Multichip IC

the circuit is fabricated by interconnecting a number of individual chips.

The active components are diffused transistors or diodes. The passive components may be group of diffused resistors or capacitors on a single chip, or they may be thin-film components. Wiring or a metalized pattern provides connections between chips

widely used for high power audio amplifier applications from 5 W to more than 50 W

. The structure of a hybrid Like thin- and thick-film ICs, hybrids ICs usually have better performance than monolithic ICs.

Although the process is too expensive for mass production, multi-chip techniques are quite economical for small quantity production and are more often used as prototypes for monolithic ICs.

Based upon the active devices employed the ICs can be classified as bipolar ICs using bipolar active devices (BJT) and unipolar ICs using unipolar active devices like FET.


Monolithic The word monolithic is derived from the Greek monos,

meaning single and lithos, meaning stone.

Thus monolithic circuit is built into a single stone or single crystal i.e. in monolithic ICs, all circuit components, (both active and passive) and their interconnections are formed into or on the top of a single chip of silicon.

This type of technology is ideal for manufacturing identical ICs in large quantities and, therefore, provides lowest per unit cost and highest order of reliability.

Monolithic ICs are by far the most common type of ICs used in practice, because of mass production, lower cost and higher reliability.


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THIN- FILM These devices are larger than monolithic ICs but smaller than discrete circuits.

These ICs can be used when power requirement is comparatively higher. With a

thin-or thick-film IC, the passive components like resistors and capacitors are

integrated, but the transistors and diodes are connected as discrete components to

form a complete circuit. Therefore, commercially available thin- and thick-film

circuits are combination of integrated and discrete components. The essential

difference between the thin- and thick-film ICs is not their relative thickness but the

method of deposition of film. Both have similar appearance, properties and general

characteristics.

Thin-film ICs -are fabricated by depositing films of conducting material on the

surface of a glass or ceramic base. By controlling the width and thickness of the

films, and by using different materials selected for their resistivity, resistors and

conductors are fabricated.

Thick-film ICs - referred to as printed thin-film circuits. In their manufacturing process

silk-screen printing techniques are used to create the desired circuit pattern on a

ceramic substrate. The screens are actually made of fine stainless steel wire mesh,

and the inks are pastes having conductive, resistive, or dielectric properties. After

printing, the circuits are high temperature-fired in a furnace to fuse the films to the

substrate. Thick-film passive components are fabricated in the same way as those in

thin-film circuits. As with thin-film circuits, active components are added as separate

devices . A portion of thick-film circuit is given in figure. ICs produced by thin-or thick

film techniques have the advantages of forming passive components with wider

range and better tolerances, better isolation between their components, greater

flexibility in circuit design and of providing better high-frequency performance than

monolithic ICs. However, such ICs suffer from the drawbacks of larger physical size,

comparatively higher cost and incapability of fabrication of active components.


1.2.2 Comparison on integrated

circuit fabrication method

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1.2.3 Monolithic Fabrication Method

1. Silicon wafer (substrate) preparation

2. Epitaxial growth

3. Oxidation

4. Photolithography

5. Diffusion

6. Ion implantation

7. Isolation technique

8. Metallization

9. Assembly processing & packaging

1.2.4 - Comparison between

different types of transistor

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n P+

p

n+

1.2.6 (characteristics) Bipolar high power and speed faster but high

cost and requires more area.

CMOS high density but low power and slower.

BiCMOS is the combination between Bipolar and

MOS transistor.

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1.2.6 (Explaination)

CMOS circuits utilize complementary MOSFETs, i.e; NMOS and PMOS devices together in various patterns to create functional blocks like AND or OR gates.

However the problem with these types of CMOS circuits is that they are inherently low power circuits. They cannot handle large currents.

So when your block needs to have a large fan out (need to drive a large no of outputs, i.e; more current required) which CMOS circuits fail.

That is why we use BiCMOS. They are very similar to CMOS circuits except for the BJT(Bipolar Junction Transistor) output stage.

BJTs are capable of carrying large currents, hence BiCMOS circuits are used in cases of large current requirements

Advantages of CMOS over Bipolar Since CMOS device consumes less power than bipolar

counterpart, CMOS devices enables to pack more functions in the same wafer using the same manufacturing technology, thus reducing the manufacturing cost and running at faster speed.

easier to design

high noise immunity and low static power consumption.


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Advantages of Bipolar over

CMOS

Switching speed

Noise perfomance

Analog capability

Input/output speed


Advantages of BiCMOS

Technology

Improved speed over CMOS

Lower power dissipation than Bipolar

Flexible input/outputs

High performance analog

Latch up immunity


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1.2.7- IC Classification There are two types of integrated circuit :-

i. Analog (linear) filled with continuous analog signals used in amplifiers, timers and oscillators such as light, temperature,

sound, electrical fields, and magnetic fields. Because analog signals are continuous and represent far more values that

their digital counterparts they are more susceptible to being altered by external forces (called noise)

ii. Digital (logic)

used in microprocessors and memories Use binary mathematics to process "one" and "zero" signals through logic

gates, flip-flops, and multiplexers. Digital ICs can be generally be classified into three types

1) Processor (microprocessor, microcontroller, or DSP) 2) Logic Gates 3) Random Access Memory (RAM)

1.2.8 Analog IC Operational Amplifier.

An operational amplifier is a direct coupled high gain amplifier

consisting of one or more differential amplifiers, followed by a level

translator and an output stage.

It is a versatile device that can be used to amplify ac as well as dc

input signals & designed for computing mathematical functions such

as addition, subtraction, multiplication, integration & differentiation

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Op-amp symbol

Non-inverting input

inverting input

0utput

+5v

-5v

2

3

6 7

4

1.2.8 Analog IC (contd)

555 Timer

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1.2.8 Analog IC (contd)

The 555 timer is an integrated circuit specifically designed to

perform signal generation and timing functions.

Application of 555 timer

1. astable multivibrator

2. monostable multivibrator

3. Missing pulse detector

4. Linear ramp generator

5. Frequency divider

6. Pulse width modulation

7. FSK generator

8. Pulse position modulator

9. Schmitt trigger

555 Timer

1.2.9 - Digital IC Determination

IC chips can be categorized into 2 main groups; Memory

Microprocessor

Memory

Stored data in term of electric charge

Two types of memory ( Volatile and Non-Volatile)

Volatile memory

- Dynamic Random Access Memory, DRAM

- S Random Access Memory, SRAM

Non Volatile Memory

- Erasable Programmable Read Only Memory, EPROM

- FLASH

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1.2.9 - Digital IC Determination (contd)

Also called central processing unit (CPU) consists of 2 components;

a controller

arithmetic logic unit (ALU).

CPU is the brain of computers and other control system.

2 types of architecture;

complete instruction set computer (CISC) IBM compatible

reduced intruction set computer (RISC) Apple

The END..thAnK YOU

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c1 integrated circuit