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1
Cosmic dust Reflectron for Isotopic Analysis
CRIA
LAMA
(A cria is a baby llama)
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Dust in Space!
Space dust provides important clues on the formation and composition of our solar system as well as other stars.
Several instruments have been launched on past missions to analyze the flux and composition of space dust in-situ.
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Time-Of-Flight (TOF) Mass Spectrometers• Dust is ionized against a target and accelerated through an
electric field to a detector.
• Ion mass is inferred from Time-Of-Flight.
CDA CIDA
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Time-Of-Flight (TOF) Mass Spectrometers
CDA CIDA
• Large target area• Low mass resolution
• High mass resolution• Small target area
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Large Area Mass Analyzer
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Large Area Mass Analyzer
• TOF Mass Spectrometer
• Large target area comparable to CDA.
• High mass resolution comparable to CIDA.
• Lab prototype constructed and tested.
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LAMA: What is still needed for dust astronomy?
Several tasks have yet to be completed:
• Create a dust triggering system
• Create a decontamination system
• Show instrument can survive in space
DTS
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How does a TOF mass spec work?
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CRIA: Mass Analyzer Primary Subsystems
IONIZER
Target
Loren Chang 10
CRIA: Mass Analyzer Primary Subsystems
Ring Electrodes
Annular Grid Electrodes
Target
ANALYZER (Ion Optics)
Grounded Grid
Loren Chang 11
CRIA: Mass Analyzer Primary Subsystems
DETECTOR
Detector
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CRIA Concept: Operationincoming dust particle
Example Dust Composition
Species-1
Species-2
Species-3
Target
Key
Increasing mass
Example Spectrum
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CRIA Concept: Operation
dust impacts target and ionizes (trigger t0)
negative ions and electrons accelerated to target
target material also ionizes
Example Spectrum
t0
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CRIA Concept: Operationpositive ions accelerated towards grounded grid (trigger t1)
Example Spectrum
t1t0 t1t0
Ions of Species-1, Species-2, Species-3, and Target Material
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CRIA Concept: Operation
Example Spectrum
t1t0
Positively charged particles focused towards detector
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CRIA Concept: Operation
Species-1 arrives at detector
Example Spectrum
t1t0 t2
Species-1 ions arrive at detector
Ions of the same species arrive at the detector at the same time with some spread
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CRIA Concept: OperationSpecies-2 ions arrive at detector
Species-2 arrives at detector
Example Spectrum
t1t0 t2 t3
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CRIA Concept: OperationSpecies-3 ions arrive at detector
Species-3 arrives at detector
Example Spectrum
t1t0 t2 t3 t4
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CRIA Concept: OperationTarget material ions arrive at detector
Example Spectrum
t1t0 t2 t3 t4 t5
Target material has characteristic peak
m/Δm: mass resolution
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CRIA Project Phases
Design
Build, Assembly, & Integration
Testing
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2
3
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CRIA Design
IonizerDetector
Analyzer Thermal
Electronics/CDH
Structures
Design is complete for all subsystems.
However, certain design elements will need to be revisited during the
build/assembly/integration phase.
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Project Motivation
Scale down LAMA to a size better suited for inclusion on missions of opportunity.
Improve the Technological Readiness Level (TRL) of the LAMA concept from TRL 4 to TRL 5. LAMA
CRIA
Dan Baker
(~6ft tall man)
CRIA modelsLAMA (struc support)
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Structure: Main Assembly
Detector Assembly
Target Assembly
Main Housing Assembly
Annular Electrode Assembly
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Structure: Parts SummaryAnnular Electrode Support
Target
Grounded Grid
Hexagonal Base Detector
Ring Electrode Standoffs
Target Electrodes
Ring Electrodes
Annular Electrodes
Annular Electrode Mount
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Structure: Main Housing Assembly
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DET
CRIA
Oscilloscope (500 MHz)
HV Supply 1(+20kV)
Target
Ring Electrodes
Annuli Electrodes
Detector(-1~2 kV and -100V)
Lab Supporting Electronics
Decontam. Heater (11.5 V, 24W)
Electrical Block Diagram (Preflight Design)
CSA
CSA
CSA
CSA
Amplifier Box
HV Supply 2(-3 kV)
DividerBox
(+6kV)
Inside Electronics
VoltageSupply
CSA(6V, 14mW)
0.15W
0.6pW
~24W
POWERMax: <25 W
Coax Coax
Coax
HV wire
HV wire
HV wire
HV wire
HV wire
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CRIA Build, Assembly, & Integration
Machining: • All ring electrodes
• All of Detector Assembly
• Electronics boxes
• All Insulator pieces
• Adapter plate for testing
Electronics work: • Component testing
• Voltage divider assembly
• CSA and VD testing
Mechanical Assembly: • Test Plan for assembly testing
• Wire harnessing
• Solder connection from electronics assembly to electrodes
• Pre-test cleanliness requirements met
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Cable Layout
Heater/CSA High Voltage – Ion Optics
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Cable Layout: Solder Access
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Mechanical Ground Support Equipment Interfaces
• Remove-before-flight cover• Thermal Vacuum/Vibration Adapter Plate
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CRIA Testing
Two test will be performed by December:• Vacuum Chamber
• Thermal Vacuum Chamber (TVAC)
• Vibration Testing (potentially done by LASP)
Pre-Test Work:• Test Plan for TVAC includes setup of laser in chamber
• Potentially use Bakeout chamber at LASP
• Acquire necessary hardware
• Data acquisition / data reduction
Testing Work:
• Man hours testing in both Vac and TVAC tests
• Acquire data
• Write report
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Schedule
Machining Testing
Test Plan / Documentation
Assembly
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Organizational StructureCustomer
Z. Sternovsky
Customer Z. Sternovsky
AdministrationAdministration System EngineerSystem Engineer
ElectronicsElectronicsThermalThermalStructuresStructures
Project Manager L. Brower
CU Advisors X. Li
S. Palo
Student Lead D. Turner
Professional S. Steg (LASP)
Student Lead L. Brower
Professional B. Lamprecht
(LASP)
Student Lead W. Tu
Professional V. Hoxie (LASP)
Student Lead D. Turner
Professional M. Lankton (LASP)
Professional M. Rhode (CU)
Student Lead D. Lee
Professional G. Drake (LASP)
MaterialsMaterials
Student Lead L. Chang
Experienced Graduate K. Amyx (CU)
Ion OpticsIon Optics
Student Lead D. Turner
DetectorDetector
ManufacturingManufacturing
Professional G. Drake (LASP)
Professional P. Graf
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