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Cosmic dust Reflectron for Isotopic Analysis

CRIA

LAMA

(A cria is a baby llama)

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Dust in Space!

Space dust provides important clues on the formation and composition of our solar system as well as other stars.

Several instruments have been launched on past missions to analyze the flux and composition of space dust in-situ.

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Time-Of-Flight (TOF) Mass Spectrometers• Dust is ionized against a target and accelerated through an

electric field to a detector.

• Ion mass is inferred from Time-Of-Flight.

CDA CIDA

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Time-Of-Flight (TOF) Mass Spectrometers

CDA CIDA

• Large target area• Low mass resolution

• High mass resolution• Small target area

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Large Area Mass Analyzer

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Large Area Mass Analyzer

• TOF Mass Spectrometer

• Large target area comparable to CDA.

• High mass resolution comparable to CIDA.

• Lab prototype constructed and tested.

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LAMA: What is still needed for dust astronomy?

Several tasks have yet to be completed:

• Create a dust triggering system

• Create a decontamination system

• Show instrument can survive in space

DTS

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How does a TOF mass spec work?

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CRIA: Mass Analyzer Primary Subsystems

IONIZER

Target

Loren Chang 10

CRIA: Mass Analyzer Primary Subsystems

Ring Electrodes

Annular Grid Electrodes

Target

ANALYZER (Ion Optics)

Grounded Grid

Loren Chang 11

CRIA: Mass Analyzer Primary Subsystems

DETECTOR

Detector

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CRIA Concept: Operationincoming dust particle

Example Dust Composition

Species-1

Species-2

Species-3

Target

Key

Increasing mass

Example Spectrum

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CRIA Concept: Operation

dust impacts target and ionizes (trigger t0)

negative ions and electrons accelerated to target

target material also ionizes

Example Spectrum

t0

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CRIA Concept: Operationpositive ions accelerated towards grounded grid (trigger t1)

Example Spectrum

t1t0 t1t0

Ions of Species-1, Species-2, Species-3, and Target Material

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CRIA Concept: Operation

Example Spectrum

t1t0

Positively charged particles focused towards detector

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CRIA Concept: Operation

Species-1 arrives at detector

Example Spectrum

t1t0 t2

Species-1 ions arrive at detector

Ions of the same species arrive at the detector at the same time with some spread

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CRIA Concept: OperationSpecies-2 ions arrive at detector

Species-2 arrives at detector

Example Spectrum

t1t0 t2 t3

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CRIA Concept: OperationSpecies-3 ions arrive at detector

Species-3 arrives at detector

Example Spectrum

t1t0 t2 t3 t4

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CRIA Concept: OperationTarget material ions arrive at detector

Example Spectrum

t1t0 t2 t3 t4 t5

Target material has characteristic peak

m/Δm: mass resolution

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CRIA Project Phases

Design

Build, Assembly, & Integration

Testing

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2

3

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CRIA Design

IonizerDetector

Analyzer Thermal

Electronics/CDH

Structures

Design is complete for all subsystems.

However, certain design elements will need to be revisited during the

build/assembly/integration phase.

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Project Motivation

Scale down LAMA to a size better suited for inclusion on missions of opportunity.

Improve the Technological Readiness Level (TRL) of the LAMA concept from TRL 4 to TRL 5. LAMA

CRIA

Dan Baker

(~6ft tall man)

CRIA modelsLAMA (struc support)

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Structure: Main Assembly

Detector Assembly

Target Assembly

Main Housing Assembly

Annular Electrode Assembly

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Structure: Parts SummaryAnnular Electrode Support

Target

Grounded Grid

Hexagonal Base Detector

Ring Electrode Standoffs

Target Electrodes

Ring Electrodes

Annular Electrodes

Annular Electrode Mount

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Structure: Main Housing Assembly

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DET

CRIA

Oscilloscope (500 MHz)

HV Supply 1(+20kV)

Target

Ring Electrodes

Annuli Electrodes

Detector(-1~2 kV and -100V)

Lab Supporting Electronics

Decontam. Heater (11.5 V, 24W)

Electrical Block Diagram (Preflight Design)

CSA

CSA

CSA

CSA

Amplifier Box

HV Supply 2(-3 kV)

DividerBox

(+6kV)

Inside Electronics

VoltageSupply

CSA(6V, 14mW)

0.15W

0.6pW

~24W

POWERMax: <25 W

Coax Coax

Coax

HV wire

HV wire

HV wire

HV wire

HV wire

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CRIA Build, Assembly, & Integration

Machining: • All ring electrodes

• All of Detector Assembly

• Electronics boxes

• All Insulator pieces

• Adapter plate for testing

Electronics work: • Component testing

• Voltage divider assembly

• CSA and VD testing

Mechanical Assembly: • Test Plan for assembly testing

• Wire harnessing

• Solder connection from electronics assembly to electrodes

• Pre-test cleanliness requirements met

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Cable Layout

Heater/CSA High Voltage – Ion Optics

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Cable Layout: Solder Access

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Mechanical Ground Support Equipment Interfaces

• Remove-before-flight cover• Thermal Vacuum/Vibration Adapter Plate

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CRIA Testing

Two test will be performed by December:• Vacuum Chamber

• Thermal Vacuum Chamber (TVAC)

• Vibration Testing (potentially done by LASP)

Pre-Test Work:• Test Plan for TVAC includes setup of laser in chamber

• Potentially use Bakeout chamber at LASP

• Acquire necessary hardware

• Data acquisition / data reduction

Testing Work:

• Man hours testing in both Vac and TVAC tests

• Acquire data

• Write report

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Schedule

Machining Testing

Test Plan / Documentation

Assembly

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Organizational StructureCustomer

Z. Sternovsky

Customer Z. Sternovsky

AdministrationAdministration System EngineerSystem Engineer

ElectronicsElectronicsThermalThermalStructuresStructures

Project Manager L. Brower

CU Advisors X. Li

S. Palo

Student Lead D. Turner

Professional S. Steg (LASP)

Student Lead L. Brower

Professional B. Lamprecht

(LASP)

Student Lead W. Tu

Professional V. Hoxie (LASP)

Student Lead D. Turner

Professional M. Lankton (LASP)

Professional M. Rhode (CU)

Student Lead D. Lee

Professional G. Drake (LASP)

MaterialsMaterials

Student Lead L. Chang

Experienced Graduate K. Amyx (CU)

Ion OpticsIon Optics

Student Lead D. Turner

DetectorDetector

ManufacturingManufacturing

Professional G. Drake (LASP)

Professional P. Graf

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