1

Cosmic dust Reflectron for Isotopic Analysis (CRIA)

Critical Design Review

September 26, 2007

Laura Brower: Project ManagerDrew Turner: Systems EngineerLoren ChangDongwon LeeWeichao Tu

2

Agenda

• Organization

• System Design & Requirements

• Subsystem Design

• Test Plan

• Project Management Plan

3

Professional B. Lamprecht

(LASP)

Professional S. Steg (LASP)

Professional M. Rhode (CU)

Organizational StructureCustomer

Z. Sternovsky

Customer Z. Sternovsky

AdministrationAdministration System EngineerSystem Engineer

ElectronicsElectronicsThermalThermalStructuresStructures

Project Manager L. Brower

CU Advisors X. Li

S. Palo

Student Lead D. Turner

Student Lead L. Brower

Student Lead W. Tu

Professional V. Hoxie (LASP)

Student Lead D. Turner

Professional M. Lankton (LASP)

P. Graf

Student Lead B. Hodgkinson

N. Little

Student Lead D. Lee

Professional G. Drake (LASP)

MaterialsMaterials

Student Lead L. Chang

Experienced Graduate K. Amyx (CU)

Ion OpticsIon Optics

Student Lead D. Turner

DetectorDetector

ManufacturingManufacturing

Professional G. Drake (LASP)

4

Agenda

• Organization

• System Design & Requirements

• Subsystem Design

• Test Plan

• Project Management Plan

5

System Level DiagramSupporting Electronics

Instrument Electronics

Structure

Thermal Control

Mass Analyzer

DetectorAnalyzerIonizer

•High voltage supply

•Oscilloscopes

•Computer

•Power source

•Charge Sensitive Amplifier

•Voltage dividers

•Heaters

•Thermocouples

(Gray area)

(Target) •Annular electrodes

•Ring electrodes

•Grounded grids

Line Key Power

High Voltage

Heat

Data

6

Minimum Success Criteria• Achieve working instrument with mass resolution of

at least 100 m/Δm (Req: 1.TR2)

• Achieve TRL-5: Working prototype tested in relevant environments (Req: 1.TR4)

2. Hardware budget < $30k

3. Cleanliness reqs for Vac chambers

1. Meet assembly tolerances

4. Electronics accuracy

Key Build/Test Phase Requirements

Flowdown?

7

Agenda

• Organization

• Background

• System Design & Requirements

• Subsystem Design

• Project Management Plan

8

IonizerDetector

AnalyzerStructures

Structural Design

Fabrication Plan

Thermal

Electronics/CDH

Structures SubsystemLead: Drew Turner

Speakers: Drew Turner, Dongwon Lee

Assembly Plan

9

Structure: Requirements Overview

Req No. Description Req Met? Verification Method

3.4DC1 Scaling of Ion optics by 5/8th of LAMA ion optics

Yes CAD design

3.4DC6, 3.4DC7, 3.4DC8

Electrically isolate high voltages CAD design, electronics potting, functional test

3.4DC5 Structure mass < 15 kg Yes CAD estimate 11.7 kg

3.4DC10, 3.4DC11

Light cannot enter instrument except at aperture

Yes CAD design

2.DC2 Minimize outgassing Vac test with Noryl insulators

1010

Hexagonal Structure: Overall CharacteristicsUnique Parts 29

Total No. of Mnf. Parts

96

Mass 11.64 kg

Fasteners <300*

*Not including instrument-spacecraft interface

*All blind fasteners will be vented

1111

Structure: Parts Summary

1212

Structure: Parts Summary

13

AssembliesAnnular Electrode Assembly

Target Assembly

Main Housing Assembly

Detector Assembly

1414

Main Housing Assembly

1515

Main Housing Assembly

1616

Main Assembly

17

Structure Materials

Noryl Delrin

Dielectric strength 500 V/mil 380 V/mil

Density 0.039 lb/in3 0.051 lb/in3

H2O absorption (in 24 hours) 0.07 % 0.25 %

H2O saturation 0.20 % 0.90 %

Total material cost ~$150 ~$110

• Al T-6061 used for all metal parts• Noryl used for all insulator parts• Stainless steel fastners used with helicoils for small holes

18

Annular Electrode Assembly

Annular Electrodes (BeCu 17200)

Annular Electrode Mount

Wiring Channel (Noryl)

Annular Electrode Standoff (Noryl)

19

Annular Electrode Assembly

20

Target AssemblyGrounded GridInner/Outer Target Electrode Standoffs

(Noryl)

Inner/Outer Target ElectrodesHexagonal Base

Silver Coated Target

21

Target Assembly

22

Detector AssemblyTop/Bottom Detector Grid Clamp

Detector Grid Detector Housing Cylinder

Detector

Detector Lid

(Insulation)Del Mar

23

Main Assembly

Detector Assembly

Target Assembly

Main Housing Assembly

Annular Electrode Assembly

24

Cable Layout

Heater/CSA High Voltage – Ion Optics

25

Cable Layout: Target Electrodes

26

Mechanical Ground Support Equipment Interfaces

• Remove-before-flight cover• Thermal Vacuum/Vibration Adapter Plate

Put CRIA on its side in TVAC

27

Integration &Testing Features• Removal of Detector Assembly for Storage• Electrical / Soldering Access• Reconnecting the CSA• Panel removal for internal access

28

Fabrication/Assembly Schedule

Assembly

Built In-House

Outsourced

29

In-House Manufacturing Schedule

• 5 new undergraduates recently recruited• 2 new undergraduate machinists hired

(UROP funding)

• Working with DANDE to avoid conflicts in ASEN shop

30

Status of Outsourced Parts

Part Vendor Cost Expect to Receive Status

Hex Base LASP ~ $2700 -- Received

Annular Electrode Mount

LASP ~$2700 Mid-Oct Currently being built

Annular Electrode Grid

FotoFab $800 Mid-Oct Order processing with vendor

Grounded Grid FotoFab ~$1300 Mid-Oct Order processing with vendor

Target Substrate

AnoPlate $250 Early-Oct Currently being silver plated

31

Assembly Plan

32

IonizerDetector

AnalyzerStructures

Voltage Divider Design

Thermal

Electronics/CDH

Analyzer SubsystemLead: Loren Chang

Speakers: Loren Chang

33

Analyzer: Requirements

Requirement Description3.4.DC1 Scaling of Ion optics by 5/8th of LAMA ion optics

3.2.PR2 - PR4 Electrode voltages shall be within +/- 10 V of the specified values from SIMION simulation.

3.5.IR2 A voltage divider box shall provide the necessary voltages to the various subsystems.

3.5.PR2 All electronics shall maintain a voltage accuracy of 0.5% on the electrodes.

Updates?

34

Voltage Dividers (VD)

• Converts 6 kV input ( µA) to voltages required for each electrode, as well as the target.

• Precise values assembled from discrete resistors. Electrodes must be held at 0.5% prescribed values.

• Design leaves space for additional corrector resistors.

35

VD PCB Design• Dimensions: 6.8 x 5.55”.

• 2 layer FR4 board with 20 mil traces. 93 mil thickness (no breakdown issues).

• Total power draw: 0.78 W.

• Minimum component separation of 100 mils (larger for most components).

• Wires to resistors to be connected via terminal posts.

• PCB to be outsourced for etching. Soldering will be performed by team.

• Entire board will be potted once assembly is complete.

Pot with EN-4 and EN-11, potentially get

from LASP?

36

VD Enclosure Design

• VD system uses DC. Shielding is not necessary.

• Dimensions approx.: 7 x 5.75”.

• Will be manufactured in house.

Aluminum box with cutouts on sides to allow wire passage

Board mounted to enclosure using 4 x 0.118” screws on standoffs

37

Electronics Schedule

IssueCompletion

DateNotes

VD PCB component testing. 10/9/2007Measuring ordered components to determine attainable precision.

CSA testing. 9/31/2007 Testing CSA impulse response at STP.

VD PCB etching.9/28/2007

(Submission)

To be outsourced to Sunstone. Current quote is ~$400 for two boards with 1 week manufacture time.

VD PCB assembly. 10/19/2007 All soldering in-house.

VD testing (non thermovac) 10/29/2007VDs to be run at lower voltages at STP to determine possible voltage drift. Correctors added if required.

Integration with main CRIA instrument.

11/5/2007

Electronics testing (thermovac)

11/2007 CRIA tested in relevant environment.

Put into excel

38

Electronics/CDH SubsystemLead: Weichao Tu

Speakers: Weichao Tu

IonizerDetector

AnalyzerStructures

Electronics Design

Thermal

Electronics/CDH

CSA Layout/ Assembly

Testing

39

Electronics: Requirements (key pre-flight ones)

Requirement Description

3.5.PR3All electronics used in design shall operate in a vacuum environment without failure

3.5.PR2All electronics shall maintain a voltage accuracy of 0.5% on all the electrodes

3.5.PR1The voltage ripple on any of the electrodes shall not exceed [0.1%] of the applied voltage

3.5.PR4The instrument shall be able to detect charge signals on the target and grounded grid for data triggering

4.5.DC2The voltage divider box shall be located outside of the instrument body

4.5.DC3 The CSA box shall be located close to the charge detector

40

DET

CRIA

Oscilloscope (500 MHz)

HV Supply 1(+20kV)

Target

Ring Electrodes

Annuli Electrodes

Detector(-1~2 kV and -100V)

Lab Supporting Electronics

Decontam. Heater (11.5 V, 24W)

Electrical Block Diagram (Preflight Design)

CSA

CSA

Amplifier Box

HV Supply 2(-3 kV)

DividerBox

(+6kV)

Inside Electronics

VoltageSupply

CSA(6V, 14mW)

0.15W

0.6pW

~24W

POWERMax: <25 W

Coax Coax

Coax

HV wire

HV wire

HV wire

HV wire

HV wire

41

CSA SubsystemAssembly– CSA: A250F/NF (2)– FET: SK152 (2)– Board: PC250F (2)

A250F/NF ConnectionPC250F Layout

42

Functional Test• Soldering A250F/NF, FET• Function-test with

– A pulser• Transition time < 20 ns• Step: 22 mV

– A test capacitor• 2 pF

– 22 mV step into 2 pF simulates the charge generated in a silicon detector by a particle losing 1MeV

– Measure the output• Noise Measurement

– Test with• A post amplifier• MCA or RMS Voltmeter

Test Circuit

43

Signal Input

Coax

SMA

SMA

Signal Output

Power Input

Twisted wire pair(+6V& ground)

Coax

A250

Dimensions: 1 X 2 X 3 inches

Assemble into CSA Box

Updates?

44

Triggering Test• Object: To test the combined triggering

signals from the target and the grounded grid • Test Procedure

– Connect one CSA to the target, the other CSA to the grounded grid

– CSA Noise Floor Test • Connect the output signal to a Post-Amp and MCA/RMS

voltmeter• Record the change of noise with temperature

– Triggering Test • Laser-simulated impact• To determine whether resulting signals are detectable

above the noise floor • Record the S/N and its change with temperature

45

IonizerDetector

AnalyzerStructures

Target Heater Design

Thermal

Electronics/CDH

Heater Locations

Thermal SubsystemLead: Laura Brower

Speakers: Laura Brower

46

Requirement Description

3.6.FR1 Power allocation is 20 W

3.6.PR1 Target shall be heated to 100oC

3.6.IR1 Target heater shall be electrically insulated from the target

3.6.IR3 Target heater shall be thermally insulated from the instrument

4.6.IR1, 4.6.IR2 The backside of the target heater shall be covered in a low emissivity material

???? Electronics (CSA/VD?) must be maintained between -25 C and 100 C??

Thermal Requirements

Updates?

47

Target Heater Configuration

• The heater is wrapped in a thin Kapton coating• An additional layer DuPont Kapton FN (Kapton

type: 150FN019) provides the electrical insulation sufficient to shield the heater from the target at 5 kV.

Minco Heater

0.5 mm Target Kapton FN (Kapton type: 150FN019)

0.1” Al target substrate

Where purchase from/cost?

48

Heater Locations• Heater location on electronics has not been analyzed

Location 1:

underneath target substrateLocation 2:

on Voltage Divider box

49

Agenda

• Organization

• Background

• System Design & Requirements

• Subsystem Design

• Test Plan

• Project Management Plan

50

Meeting Requirements through Testing

TRL 5: test CRIA in a relevant environment

• Performance reqs• Analysis (thermal, ion optics, electronics)• Test Plan/ Verification

51

How to Reach TRL 5

Required for TRL 5:• Vacuum Testing

– Test performance of CRIA (measure m/Δm) using laser ablation of target to simulate dust impacts

• Thermal Vacuum Testing– Monitor temperature response of structure, detector,

voltage divider electronics, etc. during Thermal Balance Test and Thermal Cycle Test

• UV Testing– Test signal response of detector exposed to UV

Additional Testing• Vibration Testing

– Shake/vibe based on NASA criteria for launch

TRL 5: test CRIA in a relevant environment

52

Pre-testing Tasks:

•Instrument checkout (test resistors, etc.)

Vacuum Testing

Location: CU campus, Z. Sternovsky’s lab

Operating Pressure: 10^-5 Torr

Cost: $0 to operate vacuum

Schedule: expect 1 week of testing in Oct, budget 1 month of testing

Test Type Component Description Measure/ Record

Functional Target Heater

Heat target to 100C

Target substrate temp

Performance Instrument Simulate dust w/laser ablation

Obtain spectra, monitor voltages

Test Matrix

Lab Support Equipment:

•2 HV Supplies (power detector)

•Oscilloscope

53

Pre-testing Tasks:

•Instrument checkout

•Clean Room practices during assembly

•RGA, TQCM, possibly BOT

Thermal Vacuum TestingTest Type Component Description Measure/

Record

Functional Target Heater

Heat target to 100C during -50C thermal balance test

Target substrate temp

Thermal Balance

Instrument Steady state at

-50C, +40C

Monitor instr temps

Thermal Cycle

Instrument Cycle between

-50C, +40C

Monitor instr temps

Location: LASP (MOBI or BEMCO)

Operating Pressure: <10^-5 Torr

Cost: Budgeting $1000 for oper equip / personnel time

Schedule: expect 2-3 days of testing in Nov, budget 1 month of testing

Test Matrix

Lab Support Equipment:

•Low voltage power supply

54

Test Schedule

55

Agenda

• Organization

• Background

• System Design & Requirements

• Subsystem Design

• Test Plan

• Project Management Plan

56

Cost Budget

Insert Details of Big items

57

Risk Assessment

???????

58

Special Thanks:• LASP for providing internal Funding and Support• CU Aerospace Engineering Sciences Dept. Funding and Support• Keegan Amyx• Chelsey Bryant• Josh Colwell• Ginger Drake• Paul Graf• Vaughn Hoxie• Bret Lamprecht• Mark Lankton• Mike McGrath• Matt Rhode• Steve Steg• The Heidelberg dust group

And of course: Xinlin Li, Scott Palo, and Zoltan Sternovsky

59

Questions?

60

Backup Slides

61

Structure: Upcoming Work

• Complete Finite Elements Structural Analysis– Fundamental mode– Ultimate and Yield Stresses– Fastener pull-out strength

• Review Design and Produce Mechanical Drawings