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Professor Mike Danilovic, Halmstad University, Sweden presented this seminar "Managing Complex Systems" as part of a Scandinavian Insights on International Entrepreneurship and Innovation session at the Whitaker Institute on the 23rd August 2012.
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MANAGING COMPLEX SYSTEMS
Mike Danilovic
Professor of Industrial Management at Halmstad University, Sweden
UNDERSTANDING COMPLEXITY
• Complexity is basically about … – variation among elements and systems – interdependencies and – relations between items, functions, people and
activities.
MASTERING THE DYNAMICS!
THREE MAJOR DOMAINS
• The structure of products reflects the logic of technology!
• The structure of processes and manufacturing reflects the logic of products!
• The structure of organizations reflects traditions and the logics of (old) products and processes!!!
TECHNOLOGY AND HUMAN-MACHINE-INTERFACE – EARLY CARS AND AIRPLANES
Spirit of St.Louis Cockpit 1927
BMW 328 MM Cockpit 1938
Ignition
Lights Control Switches Dashboard
Turn Signals
Starter
Control Switches Steering Column
Distributer
Radio
Standard Equipment
Optional Equipment
THE ONBOARD NETWORK OF 1957
BMW 740 i Cockpit 1994
Boeing 747 Cockpit 1989
TECHNOLOGY AND HUMAN-MACHINE-INTERFACE – MODERN CARS AND AIRPLANES
BMW 745 i Cockpit 2001
Boeing 777 Cockpit 1995
TECHNOLOGY AND HUMAN-MACHINE-INTERFACE – LATEST CARS AND AIRPLANES
Airbus A380 Cockpit 2006
Anti-theft System
Tire Pressure Control
Rain Sensor
Light Switching Module
Heating Control
Heating Control (Rear)
1 Axle Air Suspension
Control Center Mid-Console
Trailer Module
Instrument Cluster
Car Access System
Security and Information Module
Automobile Center
Door Module Passenger‘s Side
Human Machine Interface
Parking Distance Control
Digital Diesel Engine Electronic 1
Active Cruise Control
Central Switches Steering Column
Door Module Driver’s Side Left A Pillar
Left B Pillar
Right A Pillar
Right B Pillar
Door Front Left
Driver‘s Seat
Audio System Kontroller
Door Front Right
Rear Seat
Aktive Roll Stabiliser
Dynamic Stability Control
Electronic Transmission Control
Passenger‘s Seat
Door Module Driver‘s Side Rear
Door Module Passenger’s Side Rear
Seating Module Driver
Seating Module Passenger
Antenna Tuner Multi Media Changer
Audio-CD Changer Video Module
Control Center Mid- Console Rear
Adaptive Light Control
Electronic Damper Control
Electromech. Parking Brake
Wheel Speed Sensor
Seating Module Passenger’s Side Rear
Powermodul
Digital Diesel Engine Elektronik 2
Sun Roof
Chassis Integration Module
Amplifier
Navigation System
Telephone Interface
Voice Recognition System
Headset Interface
Rear Door Lift
Seating Module Driver’s Side Rear
Auxiliary / Additional Heater
Controller
Wiper Module
Standard Equipment
Optional Equipment
Diagnosis Access
Central Gateway Module
K-CAN System MOST K-CAN Peripherie byteflight PT-CAN
E/E-PLATFORM - THE ONBOARD NETWORK OF 2001
Connectivity due to basic functionalities a single control unit ... connectivity realized in and
between two seperate control units ... ... connectivity realized
in a total vehicle platform
IN VEHICLE CONNECTIVITY - FUNCTIONAL CONNECTIVITY
Car2X - CONNECTIVITY SCENARIOS
Car2X Car2Home
Car2Enterprise
Car2CustomerPortal
Car2MobileDevice
Car2Tag
Car2TrafficInfrastructure
Car2Car
THREE APPROACHES TO MANAGING COMPLEX SYSTEMS
PLANNING
INTEGRATION
SELF-ORGANIZING
BARRIERS TO INTEGRATION
ManagingIntegration
Structure:Work Breakdown Structure
(WBS)Work Packages (WP)
Work Flow:Processes
Task DefinitionOrganizational Routines
People:Psychological and social boundaries
The logic of decomposition - Divergent proces
The logic of integration - Simultanious convergent and divergent
processes
Product level
Systems level
Sub-systems level
Elements level
System chunks level
System teams level
Managing Complexity - The Traditional Approach to Decomposition and Integration
The logic of decomposition - Divergent proces
The logic of integration - Simultanious convergent and divergent
processes
Product level
Systems level
Sub-systems level
Elements level
System chunks level
System teams level
Managing Complexity - The Information Driven Management Approach to
Decomposition and Integration
•Identity •Political •Authority •Tasks
ManagingIntegration
People:Managing Social Rooms
Product & OrganizationalStructures:
Work Breakdown Structure (WBS) Work Packages (WP)
Proceses & Work Flow: Participatipatory Approach Task Definition Organizational Routines
MANAGING COMPLEXITY THROUGH INTEGRATION IN PRODUCT DEVELOPMENT
The Concept of Social Rooms
THE AESTHETICAL ROOM
THE COGNITIVE ROOM THE POLITICAL ROOM
TheNonsense
Zone
ThePlay Zone
The
Naive Z
one
The
Task Z
one
TheW
ar Zone
TheRelationalZone
MULTIPROJECT/PORTFOLIO MANAGEMENT
CASE: SAAB AEROSPACE
PART OF THE BUSINESS PORTFOLIO
MULTIPROJECT/PROGRAM/PORTFOLIO MANAGEMENT IN
HELTH CARE
11 15 19 7 27 23 5 6 4 3 2 1 29 21 17 13 9 25 26 22 30 14 18 10 24 28 20 16 8 12
NPÖ Halland WORKSHOP Programstruktur via beroendematris, 29/2 2012, output och återföring 14/3 Rader = projekt och delprojekt för NPÖ, Kolumner = berörda organisationer i Halland, Markera i varje fält 0,1,2 eller 3 plus ev. kommentar, 0= inget beroende, 1= information, 2= kommunikation, 3= gemensam utveckling rev 15/3 och den 16/3 RG, ML
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13 TEKNIK-SITHS 1 1 1 1 1 1 1 1 1 1 1 1 1
14 TEKNIK-DRIFTSUPPORT-INERA NAT.SUPPORT 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1
37 ANSLUTNING-API 3
36 ANSLUTNING-BRYGGA JOURNAL NPÖ 3
15 TEKNIK-DRIFTSUPPORT-REGIONAL SUPPORT 3
19 TEKNIK-LOGGTJÄNSTER 1 1 1 1 1 1 1
11 TEKNIK-SJUNET 3 1 1 1
16 TEKNIK-TGP 3 3 3 3 3 3 3
1 ÅTKOMST-INFRASTRUKTUR (IT) 3 3 3 3 3 3 3 1 2 1 1 1 1 1 2 2 2 2 2 2 2
3 ÅTKOMST-HSA 2 2 2 2 2 2 2 2 1 1 1 1 3 3 3 3 3 3 2 2 3 3 3 3 1
2 ÅTKOMST-DRIFTSUPPORT 3 3 3 3 3 3 3 2 1 1 1 1 3 3 3 3 3 2 2 3 3 3 3 3 1 1 1 1 1 1
8 ÅTKOMST-SÄK-LOGG 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
21 VERKSAMHET-ARBETSFLÖDEN-NYA PROCESSER 1 1 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 3 3 3 3 3 3
25 VERKSAMHET-UPPFÖLJNING 'LOGGANALYS' 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
20 VERKSAMHET-ARBETSFLÖDEN-NYA RUTINER 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1
7 ÅTKOMST-SÄK-TGP 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
10 ÅTKOMST-PDL 1 3 1 1 1 1 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
6 ÅTKOMST-SÄK-BIF 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
9 ÅTKOMST-SÄK-SPÄRR 2 3 3 3 3
22 VERKSAMHET-TERMER & BEGREPP 1 2 2 2 2 2 1 1 1 2
23 VERKSAMHET-UTBILDNING 3 1 3 3 3 1 1 1 1 1 1 2 2 2 2 2 2 2 1 1 1 1 1
24 VERKSAMHET-INFORMATIONSKAMPANJER 2 3 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1
17 TEKNIK-INTEGRATIONSPLATFORM-VAS 3 3
18 TEKNIK-INTEGRATIONSPLATFORM-TIETO 3 3
38 ANSLUTNING-MAPPNING 3 2 2 2
39 ANSLUTNING-KVALITETSKONTROLL 3 2 2 2
40 ANSLUTNING-UTDATA-INNEHÅLL 3 2 2 2
41 ANSLUTNING-INNEHÅLL-LÄSBARHET 3 2 2 2 2 2 2 2 2 2
26 ANSLUTNING- IM-Uppgifter om vård- och omsorgstagaren 3 1 1 1 1
27 ANSLUTNING-IM-Diagnos 3 1 1 1 1
28 ANSLUTNING-IM-Ordinerade och förskrivna läkemedel 3 1 1 1 1
29 ANSLUTNING-IM-Genomförda och inbokade vård- och omsorgskontakter 3 1 1 1 1
30 ANSLUTNING-IM-Vård- och omsorgsdokument 3 1 1 1 1
31 ANSLUTNING-IM-Undersökningsresultat 3 1 1 1 1
5 ÅTKOMST-SITHS-SUPPORT 2 2
4 ÅTKOMST-SITHS-UTFÄRDANDE 2
12 TEKNIK-HSA
32 ANSLUTNING-IM-Uppmärksamhetssignal
33 ANSLUTNING-IM-Patientens funktionstillstånd
34 ANSLUTNING-IM-Vård- och omsorgsplaner
35 ANSLUTNING-IM-Vård- och omsorgstjänst
A1ALLA IT/DP 14
A2 ALLA KOMMUN SÄK
VÅRD/DP 14
B ALLA KOMMUN IT
OCH RH IT/DP 16, 1, 3, 2 C2 ALLA KOMMUN, SÄK OCH
FÖRVALTNING/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6
D REGIONKONTORET, ALLA
KOMMUN FÖRVALTNING, OCH VÅRD / DP 23, 24
E REGIONSERVICE, ALLA KOMMUN VÅRDPERSONAL/
DP 41, 26, 27, 28, 29, 30, 31
C1 ALLA RH OCH ALLA KOMMUN, SÄK
OCH VÅRD/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6
11 15 19 7 27 23 5 6 4 3 2 1 29 21 17 13 9 25 26 22 30 14 18 10 24 28 20 16 8 12NPÖ Halland WORKSHOP Programstruktur via beroendematris, 29/2 2012, output och återföring 14/3 Rader = projekt och delprojekt för NPÖ, Kolumner = berörda organisationer i Halland, Markera i varje fält 0,1,2 eller 3 plus ev. kommentar, 0= inget beroende, 1= information, 2= kommunikation, 3= gemensam utveckling rev 15/3 och den 16/3 RG, ML
HY
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13 TEKNIK-SITHS 1 1 1 1 1 1 1 1 1 1 1 1 1
14 TEKNIK-DRIFTSUPPORT-INERA NAT.SUPPORT 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1
37 ANSLUTNING-API 3
36 ANSLUTNING-BRYGGA JOURNAL NPÖ 3
15 TEKNIK-DRIFTSUPPORT-REGIONAL SUPPORT 3
19 TEKNIK-LOGGTJÄNSTER 1 1 1 1 1 1 1
11 TEKNIK-SJUNET 3 1 1 1
16 TEKNIK-TGP 3 3 3 3 3 3 3
1 ÅTKOMST-INFRASTRUKTUR (IT) 3 3 3 3 3 3 3 1 2 1 1 1 1 1 2 2 2 2 2 2 2
3 ÅTKOMST-HSA 2 2 2 2 2 2 2 2 1 1 1 1 3 3 3 3 3 3 2 2 3 3 3 3 1
2 ÅTKOMST-DRIFTSUPPORT 3 3 3 3 3 3 3 2 1 1 1 1 3 3 3 3 3 2 2 3 3 3 3 3 1 1 1 1 1 1
8 ÅTKOMST-SÄK-LOGG 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
21 VERKSAMHET-ARBETSFLÖDEN-NYA PROCESSER 1 1 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 3 3 3 3 3 3
25 VERKSAMHET-UPPFÖLJNING 'LOGGANALYS' 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
20 VERKSAMHET-ARBETSFLÖDEN-NYA RUTINER 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1
7 ÅTKOMST-SÄK-TGP 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
10 ÅTKOMST-PDL 1 3 1 1 1 1 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
6 ÅTKOMST-SÄK-BIF 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1
9 ÅTKOMST-SÄK-SPÄRR 2 3 3 3 3
22 VERKSAMHET-TERMER & BEGREPP 1 2 2 2 2 2 1 1 1 2
23 VERKSAMHET-UTBILDNING 3 1 3 3 3 1 1 1 1 1 1 2 2 2 2 2 2 2 1 1 1 1 1
24 VERKSAMHET-INFORMATIONSKAMPANJER 2 3 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1
17 TEKNIK-INTEGRATIONSPLATFORM-VAS 3 3
18 TEKNIK-INTEGRATIONSPLATFORM-TIETO 3 3
38 ANSLUTNING-MAPPNING 3 2 2 2
39 ANSLUTNING-KVALITETSKONTROLL 3 2 2 2
40 ANSLUTNING-UTDATA-INNEHÅLL 3 2 2 2
41 ANSLUTNING-INNEHÅLL-LÄSBARHET 3 2 2 2 2 2 2 2 2 2
26 ANSLUTNING- IM-Uppgifter om vård- och omsorgstagaren 3 1 1 1 1
27 ANSLUTNING-IM-Diagnos 3 1 1 1 1
28 ANSLUTNING-IM-Ordinerade och förskrivna läkemedel 3 1 1 1 1
29 ANSLUTNING-IM-Genomförda och inbokade vård- och omsorgskontakter 3 1 1 1 1
30 ANSLUTNING-IM-Vård- och omsorgsdokument 3 1 1 1 1
31 ANSLUTNING-IM-Undersökningsresultat 3 1 1 1 1
5 ÅTKOMST-SITHS-SUPPORT 2 2
4 ÅTKOMST-SITHS-UTFÄRDANDE 2
12 TEKNIK-HSA
32 ANSLUTNING-IM-Uppmärksamhetssignal
33 ANSLUTNING-IM-Patientens funktionstillstånd
34 ANSLUTNING-IM-Vård- och omsorgsplaner
35 ANSLUTNING-IM-Vård- och omsorgstjänst
A1ALLA
IT/DP 14
A2 ALLA KOMMU
VÅRD/DP 14
B ALLA KOMMUN IT OCH
RH IT/DP 16, 1, 3, 2 C2 ALLA KOMMUN, SÄK OCH
FÖRVALTNING/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6
D REGIONKONTORET, ALLA KOMMUN
FÖRVALTNING, OCH VÅRD / DP 23, 24
E REGIONSERVICE, ALLA KOMMUN VÅRDPERSONAL/ DP
41, 26, 27, 28, 29, 30, 31
C1 ALLA RH OCH ALLA KOMMUN, SÄK
OCH VÅRD/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6
DMM metodik tillämpat på NPÖ som program
De 7 programgrupperna • A1 Driftssupport Teknik: Samtliga ITverksamheter har samarbete
runt teknisk support mot Inera/nationella NPÖ • A2 Driftssupport Användare: Alla kommuner, säk + vårdpersonal +
It har samarbete runt användarsupport support för NPÖ • B Åtkomst Teknik: IT i RH och kommuner har samarbete runt
tekniska lösningar för att personalen skall ha Åtkomst till patientens information.
• C1 Åtkomst Regelverk: Säk och Vård i RH och kommuner har ett förberedande samarbete runt regler och rutiner för att personalen skall ha Åtkomst till patientens information.
• C2 Åtkomst Drift: Säk och Förvaltning i kommunerna har samarbete runt regler och rutiner för att personalen skall ha Åtkomst till patientens information..
• D Information och Utbildning: Regionkontoret info, Vård och IT samt kommuners förvaltning och Vård, har samarbete runt Information och utbildning.
• E Informationsmängder Läsbarhet: Regionens IT och vård, kommunernas Vård samarbetar om läsbarheten av informationsmängderna.
CORE COMPETENCE ANALYSIS –
STRATEGIC COMPENTENCIES AND PRODUCTS IN KNOWLEDGE
INTENSIVE ENTERPRISE
IDENTIFICATION OF COMPETENCIES ON
FOUR LEVELS
Table 1: Competence areas with subdivision on three levels Level 1 Level 2 Level 3 Level 4 High frequency (GHz) Design Circuit Design Integrated Components Substrate Lumped Distributed Chip CMOS SiGe Antenna Interconnect Electronic System Design Circuit Design Radar System Radio Transceiver Embedded Electronic FPGA Programming Analog Digital Thermal Management Software C++ Labview Internal Substrate Processing Mask production MCM-D (BCB,Cu/Ti/Al) MCM-D embedded
passives MIM
Resistor (SiCr,NiCr) Flex Wafer back-etching External Substrate Processing MOM-C PCB Flex Substrate Design PCB/MCM-L MCM-D LTCC/HTCC Internal Prototype Assembly Flip Chip Mounting Bumping Stud bumping Electroplated Wire ball bond Au Wedge/Ribbon bond
Au/Cu/Al
SMT Encapsulation Electroplating Electroforming Characterization HF Measurement
Techniques On-chip
On-substrate (SMA) Radar System Radio Transceiver Antenna 2-26GHz 26-80GHz Thermal Thermomechanical Environmental EMC Material Analysis
IDENTIFYING CORE COMPETENCIES
THAT ARE RELATED TO STRATEGIC
PRODUCTS
21 22 12 14 15 13 11 19 9 20 16 18 17 3 2 1 7 8 5 4 6 24 10 25 23
DMM Output
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38 HF measurement on-chip 2 0 0 0 0 0 0 0 0 0 2 0 0 0 1 2 2 2 0 2 2 1 0 0 0 0
15 Software C++ 2 0 0 1 1 0 1 1 2 2 1 0 1 1 1 1 1 1 2 1 1 1 1 2 1 0
16 Software Labview 2 0 0 1 1 0 1 1 2 2 1 0 1 1 1 1 1 1 2 1 1 1 2 2 2 0
28 Substrate design LTCC/HTCC 0 1 0 2 2 0 2 2 2 2 1 0 0 0 2 1 1 2 1 2 1 1 0 1 0 0
48 Material Analysis 2 0 2 2 3 1 2 2 0 2 1 1 1 1 0 1 1 0 0 1 1 0 0 0 0 0
22 Wafer back-etching 0 0 0 3 3 0 0 0 1 0 3 0 0 0 0 2 2 2 0 2 0 0 0 0 0 0
37 Electroforming 3 0 3 2 2 0 0 0 0 1 3 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0
2 HF integrated components design lumped 2 0 0 1 1 3 1 1 2 2 2 2 1 1 2 2 2 2 2 1 1 1 2 2 1 1
19 Processing MCM-D embedded passives MIM 0 0 0 0 0 3 0 0 3 2 2 1 1 2 0 1 1 1 2 1 0 0 0 2 0 0
23 External MCM-C processing 1 0 0 2 2 0 2 2 2 3 0 0 0 0 2 2 2 2 1 2 1 1 0 1 0 0
33 Wedge/Ribbon bond Au/Cu/Al 1 (!) 0 0 2 2 1 2 2 2 3 2 1 2 2 0 2 2 2 2 2 1 0 0 2 0 0
32 Wire ball bond Au 2 0 0 2 2 1 2 2 2 3 2 1 2 2 0 2 2 2 2 2 1 0 0 2 0 0
17 Mask production 3 3 1 2 2 3 2 2 2 3 3 2 1 2 0 2 2 2 2 2 0 0 0 2 0 0
20 Processing MCM-D embedded passives Resistor 2 0 0 0 0 3 3 3 3 3 2 2 1 2 0 1 1 1 2 1 0 0 0 2 0 0
44 Thermal testing 2 (!) 0 0 2 3 3 2 3 3 3 3 2 1 1 2 2 2 1 1 2 2 1 0 1 0 0
45 Thermomechanical testing 1 !!! 0 0 2 2 3 3 3 3 3 3 2 0 0 2 2 2 2 1 2 2 1 0 1 0 0
36 Electroplating 3 0 3 2 2 2 2 2 1 3 2 2 2 2 0 0 0 1 1 1 0 0 0 1 0 0
18 MCM-D processing (BCB,Cu/Ti/Al) 3 0 3 2 2 3 3 3 3 3 3 3 1 2 0 2 2 2 2 2 0 0 0 2 0 0
27 Substrate design MCM-D 2 (!) 2 1 2 2 3 3 3 3 3 3 3 2 2 1 3 3 2 2 2 1 1 0 2 0 0
14 Thermal design 2 0 0 2 2 2 2 3 3 3 2 1 2 2 3 2 2 1 2 2 1 1 2 2 2 0
46 Environmental testing 1 !!! 0 0 3 3 1 3 3 2 3 1 2 3 3 2 2 2 2 1 2 2 1 0 1 0 0
35 Encapsulation 1 !!! 0 0 3 3 1 2 2 3 3 3 3 3 3 0 1 1 2 2 1 1 0 0 1 0 0
31 Electroplated bumping 2 0 3 1 1 1 1 1 2 3 3 2 3 3 0 1 1 2 2 2 1 0 0 1 0 0
47 EMC testing 1 0 0 0 0 1 0 0 3 3 0 1 2 3 0 1 1 2 2 1 1 1 0 1 0 0
21 Processing flex 1 0 3 0 0 1 0 0 0 1 0 3 2 2 1 1 1 1 1 1 0 0 0 2 0 0
25 External Flex processing 1 !!! 0 0 0 0 0 0 0 0 1 2 3 3 3 1 1 1 2 0 2 1 1 0 2 0 0
34 SMT 1 !!! 0 0 2 2 0 2 1 2 2 0 3 3 3 2 2 2 2 2 2 1 0 0 2 0 0
29 Flip Chip Mounting 2 0 0 1 1 0 0 0 2 3 3 2 3 3 0 2 2 2 2 2 1 0 0 1 0 0
30 Stud bumping 2 0 0 1 1 0 0 0 2 3 0 2 3 3 0 2 2 2 2 2 1 0 0 1 0 0
24 External PCB processing 3 0 0 0 0 0 0 0 2 0 2 0 3 3 3 2 2 2 2 2 2 2 0 2 0 0
39 HF measurement on-substrate 2 (!) 0 0 0 0 3 0 0 3 0 3 3 1 3 3 3 3 3 3 3 2 1 0 0 0 0
26 Substrate design PCB/MCM-L 2 (!) 1 1 0 0 0 0 0 2 0 0 3 3 3 3 3 3 2 3 2 2 1 0 3 0 0
40 Characterization radar system 2 0 0 0 0 0 0 0 0 0 0 0 0 3 0 3 3 2 3 0 0 0 0 0 0 0
1 HF Circuit Design 2 0 0 1 1 2 1 1 2 2 3 2 1 1 3 3 3 2 1 3 2 2 3 2 2 1
3 HF integrated components design distributed 2 0 0 1 1 3 1 1 2 1 2 2 1 1 2 3 3 3 2 3 2 1 2 1 1 1
6 HF antenna design 1 !!! 0 0 1 1 3 1 1 2 1 1 2 1 2 2 3 3 3 3 2 1 1 2 1 0 0
12 Analog embedded system design 2 0 0 2 2 0 2 2 2 2 2 0 1 2 2 3 3 2 3 2 3 2 1 2 1 0
42 Characterization antenna 2-26 GHz 2 0 0 0 0 0 0 0 1 0 0 2 0 3 2 0 0 3 3 0 2 1 0 0 0 0
9 Radar System design 2 0 0 0 0 2 0 0 2 0 0 1 0 0 0 3 3 2 3 0 0 0 1 0 1 0
43 Characterization antenna 26-80 GHz 0 !!! 0 0 0 0 0 0 0 1 0 0 0 0 1 1 3 3 3 1 3 1 1 0 0 0 0
7 HF interconnect design 1 0 0 1 1 2 1 1 2 1 2 2 2 2 2 2 2 3 3 2 1 1 3 2 1 1
8 Circuit Design 2 0 0 2 2 1 2 2 2 2 2 1 2 2 2 2 2 2 1 3 3 3 2 2 2 0
10 Radio Transceiver design 1 !!! 0 0 1 1 1 1 1 2 0 2 1 0 2 2 2 2 2 3 3 3 3 1 0 1 0
41 Characterization radio tranciver 1 !!! 0 0 0 0 0 0 0 0 0 0 1 0 3 1 2 2 2 3 3 3 2 0 0 0 0
5 HF chip design SiGe 3 0 0 1 1 0 1 1 2 1 2 0 1 2 1 2 2 3 1 2 2 1 3 1 2 2
4 HF chip design CMOS 1 0 0 1 1 0 1 1 2 1 2 0 1 2 1 1 1 3 1 2 2 3 3 1 2 2
11 FPGA Programming 0 0 0 1 1 0 1 1 2 2 2 0 1 1 0 1 1 2 3 1 2 1 1 2 2 0
13 Digital embedded system design 1 0 0 2 2 0 2 2 2 2 2 0 1 2 1 2 2 2 3 1 2 1 0 2 3 0
STRATEGIC ANALYSIS OF COMPETENCIES AND PRODUCTS
Table: Detailed description of identified clusters Cluster 1. Upper left 2. Center 3. Lower right
Characteristics Embedded modules Flexible electronics Wireless HF
Products - Sensor Modules Pressure. - Sensor Modules Gas. - Thin film substrate mfg
Embedded Passives. - Sensor Modules Strain. - Sensor Modules Temperature. - Space Electronics/MCM. - Embedded Systems Robust. - Opto-El Communications.
- Flex Substrate mfg. - Wearable Electronics Wired. - Wearable Electronics
Wireless.
- Power Amplifier Wireless Module. - Radar Front End Industrial. - Radar Front End Automotive. - Antenna Integrated Phased Array. - Embedded Systems Wireless. - Wireless Transceivers 26-100GHz - Wireless Transceivers 1-26GHz.
Mostly needed competence
- External MCM-C processing. - Wedge/Ribbon bond Au/Cu/Al - Wire ball bond Au - Mask production - Processing MCM-D embedded
passives Resistor - Thermal testing - Thermomechanical testing - Electroplating - MCM-D processing
(BCB,Cu/Ti/Al) - Substrate design MCM-D - Thermal design - Environmental testing - Encapsulation - Electroplated bumping
- Electroplating - MCM-D processing
(BCB,Cu/Ti/Al) - Substrate design MCM-D - Thermal design - Environmental testing - Encapsulation - Electroplated bumping - EMC testing - Processing flex - External Flex processing - SMT - Flip Chip Mounting - Stud bumping - External PCB processing - HF measurement on-
substrate - Substrate design PCB/MCM-
L
- SMT - Flip Chip Mounting - Stud bumping - External PCB processing - HF measurement on-substrate - Substrate design PCB/MCM-L - Characterization radar system - HF Circuit Design - HF integrated components design
distributed - HF antenna design - Analog embedded system design - Characterization antenna 2-26 GHz - Radar System design - Characterization antenna 26-80 GHz - HF interconnect design - Circuit Design - Radio Transceiver design - Characterization radio tranciver - HF chip design SiGe
COMPETENCE ANALYSIS
Skill Present level
Needed level
Conclusion Possible solution on competence problem
Wedge/Ribbon bond Au/Cu/Al
low Medium Potential lack of competence
Realise budgeted investment in new bond head and practice with it.
Thermal testing Medium High Potential lack of competence
Increase access to competence through cooperation with ING and eventually SP
Thermomechanical testing
low High Serious lack of competence
Increase access to competence through cooperation with ING, but even ING is not on a high level. Competence increasing projects are needed.
Substrate design MCM-D
medium High Potential lack of competence
General PCB/MCM design competence has typically been achieved by consultants or ex-jobb.
Environmental testing
Low high Serious lack of competence
Increase access to competence through cooperation with SP
Encapsulation Low high Serious lack of competence
Require competence in encapsulation by future recruitment in Jönköping.
External Flex processing
Low High Serious lack of competence
Flex circuit design and processing has not been needed yet.
SMT Low High Serious lack of competence
Traditional packaging/assembly competence is lacking.
HF measurement on-substrate
Medium High Potential lack of competence
Current projects must be verified at 80GHz- upgrade lab or find partner.
Substrate design PCB/MCM-L
Medium High Potential lack of competence
Maybe by influencing future recruitment in electronic design at ING and establishing cooperation.
HF antenna design Low High Serious lack of competence
Should be solved by recruitment 2006
Characterization antenna 26-80 GHz
Non Medium Serious lack of competence
Make agreement with SP, who already has invested in equipment and skilled personal
Radio Transceiver design
Low High Serious lack of competence
Training and recruitment.
MAKING INNOVATION
DESCRIBING A COMPANY´S BUSINESS MODEL
THE APPLE´S BUSINESS MODEL OF IPOD AND ITUNES
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