MANAGING COMPLEX SYSTEMS

Mike Danilovic

Professor of Industrial Management at Halmstad University, Sweden

UNDERSTANDING COMPLEXITY

• Complexity is basically about … – variation among elements and systems – interdependencies and – relations between items, functions, people and

activities.

MASTERING THE DYNAMICS!

THREE MAJOR DOMAINS

• The structure of products reflects the logic of technology!

• The structure of processes and manufacturing reflects the logic of products!

• The structure of organizations reflects traditions and the logics of (old) products and processes!!!

TECHNOLOGY AND HUMAN-MACHINE-INTERFACE – EARLY CARS AND AIRPLANES

Spirit of St.Louis Cockpit 1927

BMW 328 MM Cockpit 1938

Ignition

Lights Control Switches Dashboard

Turn Signals

Starter

Control Switches Steering Column

Distributer

Radio

Standard Equipment

Optional Equipment

THE ONBOARD NETWORK OF 1957

BMW 740 i Cockpit 1994

Boeing 747 Cockpit 1989

TECHNOLOGY AND HUMAN-MACHINE-INTERFACE – MODERN CARS AND AIRPLANES

BMW 745 i Cockpit 2001

Boeing 777 Cockpit 1995

TECHNOLOGY AND HUMAN-MACHINE-INTERFACE – LATEST CARS AND AIRPLANES

Airbus A380 Cockpit 2006

Anti-theft System

Tire Pressure Control

Rain Sensor

Light Switching Module

Heating Control

Heating Control (Rear)

1 Axle Air Suspension

Control Center Mid-Console

Trailer Module

Instrument Cluster

Car Access System

Security and Information Module

Automobile Center

Door Module Passenger‘s Side

Human Machine Interface

Parking Distance Control

Digital Diesel Engine Electronic 1

Active Cruise Control

Central Switches Steering Column

Door Module Driver’s Side Left A Pillar

Left B Pillar

Right A Pillar

Right B Pillar

Door Front Left

Driver‘s Seat

Audio System Kontroller

Door Front Right

Rear Seat

Aktive Roll Stabiliser

Dynamic Stability Control

Electronic Transmission Control

Passenger‘s Seat

Door Module Driver‘s Side Rear

Door Module Passenger’s Side Rear

Seating Module Driver

Seating Module Passenger

Antenna Tuner Multi Media Changer

Audio-CD Changer Video Module

Control Center Mid- Console Rear

Adaptive Light Control

Electronic Damper Control

Electromech. Parking Brake

Wheel Speed Sensor

Seating Module Passenger’s Side Rear

Powermodul

Digital Diesel Engine Elektronik 2

Sun Roof

Chassis Integration Module

Amplifier

Navigation System

Telephone Interface

Voice Recognition System

Headset Interface

Rear Door Lift

Seating Module Driver’s Side Rear

Auxiliary / Additional Heater

Controller

Wiper Module

Standard Equipment

Optional Equipment

Diagnosis Access

Central Gateway Module

K-CAN System MOST K-CAN Peripherie byteflight PT-CAN

E/E-PLATFORM - THE ONBOARD NETWORK OF 2001

Connectivity due to basic functionalities a single control unit ... connectivity realized in and

between two seperate control units ... ... connectivity realized

in a total vehicle platform

IN VEHICLE CONNECTIVITY - FUNCTIONAL CONNECTIVITY

Car2X - CONNECTIVITY SCENARIOS

Car2X Car2Home

Car2Enterprise

Car2CustomerPortal

Car2MobileDevice

Car2Tag

Car2TrafficInfrastructure

Car2Car

THREE APPROACHES TO MANAGING COMPLEX SYSTEMS

PLANNING

INTEGRATION

SELF-ORGANIZING

BARRIERS TO INTEGRATION

ManagingIntegration

Structure:Work Breakdown Structure

(WBS)Work Packages (WP)

Work Flow:Processes

Task DefinitionOrganizational Routines

People:Psychological and social boundaries

The logic of decomposition - Divergent proces

The logic of integration - Simultanious convergent and divergent

processes

Product level

Systems level

Sub-systems level

Elements level

System chunks level

System teams level

Managing Complexity - The Traditional Approach to Decomposition and Integration

The logic of decomposition - Divergent proces

The logic of integration - Simultanious convergent and divergent

processes

Product level

Systems level

Sub-systems level

Elements level

System chunks level

System teams level

Managing Complexity - The Information Driven Management Approach to

Decomposition and Integration

•Identity •Political •Authority •Tasks

ManagingIntegration

People:Managing Social Rooms

Product & OrganizationalStructures:

Work Breakdown Structure (WBS) Work Packages (WP)

Proceses & Work Flow: Participatipatory Approach Task Definition Organizational Routines

MANAGING COMPLEXITY THROUGH INTEGRATION IN PRODUCT DEVELOPMENT

The Concept of Social Rooms

THE AESTHETICAL ROOM

THE COGNITIVE ROOM THE POLITICAL ROOM

TheNonsense

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MULTIPROJECT/PORTFOLIO MANAGEMENT

CASE: SAAB AEROSPACE

PART OF THE BUSINESS PORTFOLIO

MULTIPROJECT/PROGRAM/PORTFOLIO MANAGEMENT IN

HELTH CARE

11 15 19 7 27 23 5 6 4 3 2 1 29 21 17 13 9 25 26 22 30 14 18 10 24 28 20 16 8 12

NPÖ Halland WORKSHOP Programstruktur via beroendematris, 29/2 2012, output och återföring 14/3 Rader = projekt och delprojekt för NPÖ, Kolumner = berörda organisationer i Halland, Markera i varje fält 0,1,2 eller 3 plus ev. kommentar, 0= inget beroende, 1= information, 2= kommunikation, 3= gemensam utveckling rev 15/3 och den 16/3 RG, ML

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13 TEKNIK-SITHS 1 1 1 1 1 1 1 1 1 1 1 1 1

14 TEKNIK-DRIFTSUPPORT-INERA NAT.SUPPORT 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1

37 ANSLUTNING-API 3

36 ANSLUTNING-BRYGGA JOURNAL NPÖ 3

15 TEKNIK-DRIFTSUPPORT-REGIONAL SUPPORT 3

19 TEKNIK-LOGGTJÄNSTER 1 1 1 1 1 1 1

11 TEKNIK-SJUNET 3 1 1 1

16 TEKNIK-TGP 3 3 3 3 3 3 3

1 ÅTKOMST-INFRASTRUKTUR (IT) 3 3 3 3 3 3 3 1 2 1 1 1 1 1 2 2 2 2 2 2 2

3 ÅTKOMST-HSA 2 2 2 2 2 2 2 2 1 1 1 1 3 3 3 3 3 3 2 2 3 3 3 3 1

2 ÅTKOMST-DRIFTSUPPORT 3 3 3 3 3 3 3 2 1 1 1 1 3 3 3 3 3 2 2 3 3 3 3 3 1 1 1 1 1 1

8 ÅTKOMST-SÄK-LOGG 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

21 VERKSAMHET-ARBETSFLÖDEN-NYA PROCESSER 1 1 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 3 3 3 3 3 3

25 VERKSAMHET-UPPFÖLJNING 'LOGGANALYS' 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3

20 VERKSAMHET-ARBETSFLÖDEN-NYA RUTINER 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1

7 ÅTKOMST-SÄK-TGP 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

10 ÅTKOMST-PDL 1 3 1 1 1 1 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

6 ÅTKOMST-SÄK-BIF 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

9 ÅTKOMST-SÄK-SPÄRR 2 3 3 3 3

22 VERKSAMHET-TERMER & BEGREPP 1 2 2 2 2 2 1 1 1 2

23 VERKSAMHET-UTBILDNING 3 1 3 3 3 1 1 1 1 1 1 2 2 2 2 2 2 2 1 1 1 1 1

24 VERKSAMHET-INFORMATIONSKAMPANJER 2 3 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1

17 TEKNIK-INTEGRATIONSPLATFORM-VAS 3 3

18 TEKNIK-INTEGRATIONSPLATFORM-TIETO 3 3

38 ANSLUTNING-MAPPNING 3 2 2 2

39 ANSLUTNING-KVALITETSKONTROLL 3 2 2 2

40 ANSLUTNING-UTDATA-INNEHÅLL 3 2 2 2

41 ANSLUTNING-INNEHÅLL-LÄSBARHET 3 2 2 2 2 2 2 2 2 2

26 ANSLUTNING- IM-Uppgifter om vård- och omsorgstagaren 3 1 1 1 1

27 ANSLUTNING-IM-Diagnos 3 1 1 1 1

28 ANSLUTNING-IM-Ordinerade och förskrivna läkemedel 3 1 1 1 1

29 ANSLUTNING-IM-Genomförda och inbokade vård- och omsorgskontakter 3 1 1 1 1

30 ANSLUTNING-IM-Vård- och omsorgsdokument 3 1 1 1 1

31 ANSLUTNING-IM-Undersökningsresultat 3 1 1 1 1

5 ÅTKOMST-SITHS-SUPPORT 2 2

4 ÅTKOMST-SITHS-UTFÄRDANDE 2

12 TEKNIK-HSA

32 ANSLUTNING-IM-Uppmärksamhetssignal

33 ANSLUTNING-IM-Patientens funktionstillstånd

34 ANSLUTNING-IM-Vård- och omsorgsplaner

35 ANSLUTNING-IM-Vård- och omsorgstjänst

A1ALLA IT/DP 14

A2 ALLA KOMMUN SÄK

VÅRD/DP 14

B ALLA KOMMUN IT

OCH RH IT/DP 16, 1, 3, 2 C2 ALLA KOMMUN, SÄK OCH

FÖRVALTNING/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6

D REGIONKONTORET, ALLA

KOMMUN FÖRVALTNING, OCH VÅRD / DP 23, 24

E REGIONSERVICE, ALLA KOMMUN VÅRDPERSONAL/

DP 41, 26, 27, 28, 29, 30, 31

C1 ALLA RH OCH ALLA KOMMUN, SÄK

OCH VÅRD/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6

11 15 19 7 27 23 5 6 4 3 2 1 29 21 17 13 9 25 26 22 30 14 18 10 24 28 20 16 8 12NPÖ Halland WORKSHOP Programstruktur via beroendematris, 29/2 2012, output och återföring 14/3 Rader = projekt och delprojekt för NPÖ, Kolumner = berörda organisationer i Halland, Markera i varje fält 0,1,2 eller 3 plus ev. kommentar, 0= inget beroende, 1= information, 2= kommunikation, 3= gemensam utveckling rev 15/3 och den 16/3 RG, ML

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14 TEKNIK-DRIFTSUPPORT-INERA NAT.SUPPORT 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1

37 ANSLUTNING-API 3

36 ANSLUTNING-BRYGGA JOURNAL NPÖ 3

15 TEKNIK-DRIFTSUPPORT-REGIONAL SUPPORT 3

19 TEKNIK-LOGGTJÄNSTER 1 1 1 1 1 1 1

11 TEKNIK-SJUNET 3 1 1 1

16 TEKNIK-TGP 3 3 3 3 3 3 3

1 ÅTKOMST-INFRASTRUKTUR (IT) 3 3 3 3 3 3 3 1 2 1 1 1 1 1 2 2 2 2 2 2 2

3 ÅTKOMST-HSA 2 2 2 2 2 2 2 2 1 1 1 1 3 3 3 3 3 3 2 2 3 3 3 3 1

2 ÅTKOMST-DRIFTSUPPORT 3 3 3 3 3 3 3 2 1 1 1 1 3 3 3 3 3 2 2 3 3 3 3 3 1 1 1 1 1 1

8 ÅTKOMST-SÄK-LOGG 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

21 VERKSAMHET-ARBETSFLÖDEN-NYA PROCESSER 1 1 1 1 1 1 1 1 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 3 3 3 3 3 3

25 VERKSAMHET-UPPFÖLJNING 'LOGGANALYS' 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3

20 VERKSAMHET-ARBETSFLÖDEN-NYA RUTINER 1 3 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1

7 ÅTKOMST-SÄK-TGP 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

10 ÅTKOMST-PDL 1 3 1 1 1 1 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

6 ÅTKOMST-SÄK-BIF 3 2 2 2 2 3 3 3 3 3 3 2 2 2 2 2 2 1 1 1 1 1 1

9 ÅTKOMST-SÄK-SPÄRR 2 3 3 3 3

22 VERKSAMHET-TERMER & BEGREPP 1 2 2 2 2 2 1 1 1 2

23 VERKSAMHET-UTBILDNING 3 1 3 3 3 1 1 1 1 1 1 2 2 2 2 2 2 2 1 1 1 1 1

24 VERKSAMHET-INFORMATIONSKAMPANJER 2 3 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1

17 TEKNIK-INTEGRATIONSPLATFORM-VAS 3 3

18 TEKNIK-INTEGRATIONSPLATFORM-TIETO 3 3

38 ANSLUTNING-MAPPNING 3 2 2 2

39 ANSLUTNING-KVALITETSKONTROLL 3 2 2 2

40 ANSLUTNING-UTDATA-INNEHÅLL 3 2 2 2

41 ANSLUTNING-INNEHÅLL-LÄSBARHET 3 2 2 2 2 2 2 2 2 2

26 ANSLUTNING- IM-Uppgifter om vård- och omsorgstagaren 3 1 1 1 1

27 ANSLUTNING-IM-Diagnos 3 1 1 1 1

28 ANSLUTNING-IM-Ordinerade och förskrivna läkemedel 3 1 1 1 1

29 ANSLUTNING-IM-Genomförda och inbokade vård- och omsorgskontakter 3 1 1 1 1

30 ANSLUTNING-IM-Vård- och omsorgsdokument 3 1 1 1 1

31 ANSLUTNING-IM-Undersökningsresultat 3 1 1 1 1

5 ÅTKOMST-SITHS-SUPPORT 2 2

4 ÅTKOMST-SITHS-UTFÄRDANDE 2

12 TEKNIK-HSA

32 ANSLUTNING-IM-Uppmärksamhetssignal

33 ANSLUTNING-IM-Patientens funktionstillstånd

34 ANSLUTNING-IM-Vård- och omsorgsplaner

35 ANSLUTNING-IM-Vård- och omsorgstjänst

A1ALLA

IT/DP 14

A2 ALLA KOMMU

VÅRD/DP 14

B ALLA KOMMUN IT OCH

RH IT/DP 16, 1, 3, 2 C2 ALLA KOMMUN, SÄK OCH

FÖRVALTNING/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6

D REGIONKONTORET, ALLA KOMMUN

FÖRVALTNING, OCH VÅRD / DP 23, 24

E REGIONSERVICE, ALLA KOMMUN VÅRDPERSONAL/ DP

41, 26, 27, 28, 29, 30, 31

C1 ALLA RH OCH ALLA KOMMUN, SÄK

OCH VÅRD/ DP 3, 2, 8, 21, 25, 20, 7, 10, 6

DMM metodik tillämpat på NPÖ som program

De 7 programgrupperna • A1 Driftssupport Teknik: Samtliga ITverksamheter har samarbete

runt teknisk support mot Inera/nationella NPÖ • A2 Driftssupport Användare: Alla kommuner, säk + vårdpersonal +

It har samarbete runt användarsupport support för NPÖ • B Åtkomst Teknik: IT i RH och kommuner har samarbete runt

tekniska lösningar för att personalen skall ha Åtkomst till patientens information.

• C1 Åtkomst Regelverk: Säk och Vård i RH och kommuner har ett förberedande samarbete runt regler och rutiner för att personalen skall ha Åtkomst till patientens information.

• C2 Åtkomst Drift: Säk och Förvaltning i kommunerna har samarbete runt regler och rutiner för att personalen skall ha Åtkomst till patientens information..

• D Information och Utbildning: Regionkontoret info, Vård och IT samt kommuners förvaltning och Vård, har samarbete runt Information och utbildning.

• E Informationsmängder Läsbarhet: Regionens IT och vård, kommunernas Vård samarbetar om läsbarheten av informationsmängderna.

CORE COMPETENCE ANALYSIS –

STRATEGIC COMPENTENCIES AND PRODUCTS IN KNOWLEDGE

INTENSIVE ENTERPRISE

IDENTIFICATION OF COMPETENCIES ON

FOUR LEVELS

Table 1: Competence areas with subdivision on three levels Level 1 Level 2 Level 3 Level 4 High frequency (GHz) Design Circuit Design Integrated Components Substrate Lumped Distributed Chip CMOS SiGe Antenna Interconnect Electronic System Design Circuit Design Radar System Radio Transceiver Embedded Electronic FPGA Programming Analog Digital Thermal Management Software C++ Labview Internal Substrate Processing Mask production MCM-D (BCB,Cu/Ti/Al) MCM-D embedded

passives MIM

Resistor (SiCr,NiCr) Flex Wafer back-etching External Substrate Processing MOM-C PCB Flex Substrate Design PCB/MCM-L MCM-D LTCC/HTCC Internal Prototype Assembly Flip Chip Mounting Bumping Stud bumping Electroplated Wire ball bond Au Wedge/Ribbon bond

Au/Cu/Al

SMT Encapsulation Electroplating Electroforming Characterization HF Measurement

Techniques On-chip

On-substrate (SMA) Radar System Radio Transceiver Antenna 2-26GHz 26-80GHz Thermal Thermomechanical Environmental EMC Material Analysis

IDENTIFYING CORE COMPETENCIES

THAT ARE RELATED TO STRATEGIC

PRODUCTS

21 22 12 14 15 13 11 19 9 20 16 18 17 3 2 1 7 8 5 4 6 24 10 25 23

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38 HF measurement on-chip 2 0 0 0 0 0 0 0 0 0 2 0 0 0 1 2 2 2 0 2 2 1 0 0 0 0

15 Software C++ 2 0 0 1 1 0 1 1 2 2 1 0 1 1 1 1 1 1 2 1 1 1 1 2 1 0

16 Software Labview 2 0 0 1 1 0 1 1 2 2 1 0 1 1 1 1 1 1 2 1 1 1 2 2 2 0

28 Substrate design LTCC/HTCC 0 1 0 2 2 0 2 2 2 2 1 0 0 0 2 1 1 2 1 2 1 1 0 1 0 0

48 Material Analysis 2 0 2 2 3 1 2 2 0 2 1 1 1 1 0 1 1 0 0 1 1 0 0 0 0 0

22 Wafer back-etching 0 0 0 3 3 0 0 0 1 0 3 0 0 0 0 2 2 2 0 2 0 0 0 0 0 0

37 Electroforming 3 0 3 2 2 0 0 0 0 1 3 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0

2 HF integrated components design lumped 2 0 0 1 1 3 1 1 2 2 2 2 1 1 2 2 2 2 2 1 1 1 2 2 1 1

19 Processing MCM-D embedded passives MIM 0 0 0 0 0 3 0 0 3 2 2 1 1 2 0 1 1 1 2 1 0 0 0 2 0 0

23 External MCM-C processing 1 0 0 2 2 0 2 2 2 3 0 0 0 0 2 2 2 2 1 2 1 1 0 1 0 0

33 Wedge/Ribbon bond Au/Cu/Al 1 (!) 0 0 2 2 1 2 2 2 3 2 1 2 2 0 2 2 2 2 2 1 0 0 2 0 0

32 Wire ball bond Au 2 0 0 2 2 1 2 2 2 3 2 1 2 2 0 2 2 2 2 2 1 0 0 2 0 0

17 Mask production 3 3 1 2 2 3 2 2 2 3 3 2 1 2 0 2 2 2 2 2 0 0 0 2 0 0

20 Processing MCM-D embedded passives Resistor 2 0 0 0 0 3 3 3 3 3 2 2 1 2 0 1 1 1 2 1 0 0 0 2 0 0

44 Thermal testing 2 (!) 0 0 2 3 3 2 3 3 3 3 2 1 1 2 2 2 1 1 2 2 1 0 1 0 0

45 Thermomechanical testing 1 !!! 0 0 2 2 3 3 3 3 3 3 2 0 0 2 2 2 2 1 2 2 1 0 1 0 0

36 Electroplating 3 0 3 2 2 2 2 2 1 3 2 2 2 2 0 0 0 1 1 1 0 0 0 1 0 0

18 MCM-D processing (BCB,Cu/Ti/Al) 3 0 3 2 2 3 3 3 3 3 3 3 1 2 0 2 2 2 2 2 0 0 0 2 0 0

27 Substrate design MCM-D 2 (!) 2 1 2 2 3 3 3 3 3 3 3 2 2 1 3 3 2 2 2 1 1 0 2 0 0

14 Thermal design 2 0 0 2 2 2 2 3 3 3 2 1 2 2 3 2 2 1 2 2 1 1 2 2 2 0

46 Environmental testing 1 !!! 0 0 3 3 1 3 3 2 3 1 2 3 3 2 2 2 2 1 2 2 1 0 1 0 0

35 Encapsulation 1 !!! 0 0 3 3 1 2 2 3 3 3 3 3 3 0 1 1 2 2 1 1 0 0 1 0 0

31 Electroplated bumping 2 0 3 1 1 1 1 1 2 3 3 2 3 3 0 1 1 2 2 2 1 0 0 1 0 0

47 EMC testing 1 0 0 0 0 1 0 0 3 3 0 1 2 3 0 1 1 2 2 1 1 1 0 1 0 0

21 Processing flex 1 0 3 0 0 1 0 0 0 1 0 3 2 2 1 1 1 1 1 1 0 0 0 2 0 0

25 External Flex processing 1 !!! 0 0 0 0 0 0 0 0 1 2 3 3 3 1 1 1 2 0 2 1 1 0 2 0 0

34 SMT 1 !!! 0 0 2 2 0 2 1 2 2 0 3 3 3 2 2 2 2 2 2 1 0 0 2 0 0

29 Flip Chip Mounting 2 0 0 1 1 0 0 0 2 3 3 2 3 3 0 2 2 2 2 2 1 0 0 1 0 0

30 Stud bumping 2 0 0 1 1 0 0 0 2 3 0 2 3 3 0 2 2 2 2 2 1 0 0 1 0 0

24 External PCB processing 3 0 0 0 0 0 0 0 2 0 2 0 3 3 3 2 2 2 2 2 2 2 0 2 0 0

39 HF measurement on-substrate 2 (!) 0 0 0 0 3 0 0 3 0 3 3 1 3 3 3 3 3 3 3 2 1 0 0 0 0

26 Substrate design PCB/MCM-L 2 (!) 1 1 0 0 0 0 0 2 0 0 3 3 3 3 3 3 2 3 2 2 1 0 3 0 0

40 Characterization radar system 2 0 0 0 0 0 0 0 0 0 0 0 0 3 0 3 3 2 3 0 0 0 0 0 0 0

1 HF Circuit Design 2 0 0 1 1 2 1 1 2 2 3 2 1 1 3 3 3 2 1 3 2 2 3 2 2 1

3 HF integrated components design distributed 2 0 0 1 1 3 1 1 2 1 2 2 1 1 2 3 3 3 2 3 2 1 2 1 1 1

6 HF antenna design 1 !!! 0 0 1 1 3 1 1 2 1 1 2 1 2 2 3 3 3 3 2 1 1 2 1 0 0

12 Analog embedded system design 2 0 0 2 2 0 2 2 2 2 2 0 1 2 2 3 3 2 3 2 3 2 1 2 1 0

42 Characterization antenna 2-26 GHz 2 0 0 0 0 0 0 0 1 0 0 2 0 3 2 0 0 3 3 0 2 1 0 0 0 0

9 Radar System design 2 0 0 0 0 2 0 0 2 0 0 1 0 0 0 3 3 2 3 0 0 0 1 0 1 0

43 Characterization antenna 26-80 GHz 0 !!! 0 0 0 0 0 0 0 1 0 0 0 0 1 1 3 3 3 1 3 1 1 0 0 0 0

7 HF interconnect design 1 0 0 1 1 2 1 1 2 1 2 2 2 2 2 2 2 3 3 2 1 1 3 2 1 1

8 Circuit Design 2 0 0 2 2 1 2 2 2 2 2 1 2 2 2 2 2 2 1 3 3 3 2 2 2 0

10 Radio Transceiver design 1 !!! 0 0 1 1 1 1 1 2 0 2 1 0 2 2 2 2 2 3 3 3 3 1 0 1 0

41 Characterization radio tranciver 1 !!! 0 0 0 0 0 0 0 0 0 0 1 0 3 1 2 2 2 3 3 3 2 0 0 0 0

5 HF chip design SiGe 3 0 0 1 1 0 1 1 2 1 2 0 1 2 1 2 2 3 1 2 2 1 3 1 2 2

4 HF chip design CMOS 1 0 0 1 1 0 1 1 2 1 2 0 1 2 1 1 1 3 1 2 2 3 3 1 2 2

11 FPGA Programming 0 0 0 1 1 0 1 1 2 2 2 0 1 1 0 1 1 2 3 1 2 1 1 2 2 0

13 Digital embedded system design 1 0 0 2 2 0 2 2 2 2 2 0 1 2 1 2 2 2 3 1 2 1 0 2 3 0

STRATEGIC ANALYSIS OF COMPETENCIES AND PRODUCTS

Table: Detailed description of identified clusters Cluster 1. Upper left 2. Center 3. Lower right

Characteristics Embedded modules Flexible electronics Wireless HF

Products - Sensor Modules Pressure. - Sensor Modules Gas. - Thin film substrate mfg

Embedded Passives. - Sensor Modules Strain. - Sensor Modules Temperature. - Space Electronics/MCM. - Embedded Systems Robust. - Opto-El Communications.

- Flex Substrate mfg. - Wearable Electronics Wired. - Wearable Electronics

Wireless.

- Power Amplifier Wireless Module. - Radar Front End Industrial. - Radar Front End Automotive. - Antenna Integrated Phased Array. - Embedded Systems Wireless. - Wireless Transceivers 26-100GHz - Wireless Transceivers 1-26GHz.

Mostly needed competence

- External MCM-C processing. - Wedge/Ribbon bond Au/Cu/Al - Wire ball bond Au - Mask production - Processing MCM-D embedded

passives Resistor - Thermal testing - Thermomechanical testing - Electroplating - MCM-D processing

(BCB,Cu/Ti/Al) - Substrate design MCM-D - Thermal design - Environmental testing - Encapsulation - Electroplated bumping

- Electroplating - MCM-D processing

(BCB,Cu/Ti/Al) - Substrate design MCM-D - Thermal design - Environmental testing - Encapsulation - Electroplated bumping - EMC testing - Processing flex - External Flex processing - SMT - Flip Chip Mounting - Stud bumping - External PCB processing - HF measurement on-

substrate - Substrate design PCB/MCM-

L

- SMT - Flip Chip Mounting - Stud bumping - External PCB processing - HF measurement on-substrate - Substrate design PCB/MCM-L - Characterization radar system - HF Circuit Design - HF integrated components design

distributed - HF antenna design - Analog embedded system design - Characterization antenna 2-26 GHz - Radar System design - Characterization antenna 26-80 GHz - HF interconnect design - Circuit Design - Radio Transceiver design - Characterization radio tranciver - HF chip design SiGe

COMPETENCE ANALYSIS

Skill Present level

Needed level

Conclusion Possible solution on competence problem

Wedge/Ribbon bond Au/Cu/Al

low Medium Potential lack of competence

Realise budgeted investment in new bond head and practice with it.

Thermal testing Medium High Potential lack of competence

Increase access to competence through cooperation with ING and eventually SP

Thermomechanical testing

low High Serious lack of competence

Increase access to competence through cooperation with ING, but even ING is not on a high level. Competence increasing projects are needed.

Substrate design MCM-D

medium High Potential lack of competence

General PCB/MCM design competence has typically been achieved by consultants or ex-jobb.

Environmental testing

Low high Serious lack of competence

Increase access to competence through cooperation with SP

Encapsulation Low high Serious lack of competence

Require competence in encapsulation by future recruitment in Jönköping.

External Flex processing

Low High Serious lack of competence

Flex circuit design and processing has not been needed yet.

SMT Low High Serious lack of competence

Traditional packaging/assembly competence is lacking.

HF measurement on-substrate

Medium High Potential lack of competence

Current projects must be verified at 80GHz- upgrade lab or find partner.

Substrate design PCB/MCM-L

Medium High Potential lack of competence

Maybe by influencing future recruitment in electronic design at ING and establishing cooperation.

HF antenna design Low High Serious lack of competence

Should be solved by recruitment 2006

Characterization antenna 26-80 GHz

Non Medium Serious lack of competence

Make agreement with SP, who already has invested in equipment and skilled personal

Radio Transceiver design

Low High Serious lack of competence

Training and recruitment.

MAKING INNOVATION

DESCRIBING A COMPANY´S BUSINESS MODEL

THE APPLE´S BUSINESS MODEL OF IPOD AND ITUNES