FROM

NIKHIL KUMAR

NIRT BHOPAL

Initially Circuit Diagram of IC’s are designed…..

Formation Of Wafers from Huge Monocrystal…..

Wafers Cut from Crystal

Wafers pieces

Formation of silicon lattice takes place

Silicon Disk is carried to a Cleaned

Room and 25 of Disks are Packed

in a Sealed Container and Passed

through 100’s of Manufacturing

Steps.

The Photolithographic technique

Transfers Circuit Structures to

Wafers.

Photosensitive resist is applied on

the silicon Disk.

UV lights transfer circuit Structures depicted on

mask to wafers.

Exposed Parts are Removed & these Structures can

be used as Templates…..

Ion Implantation of Wafer’s is done where electrical properties is

specified by using its property of Conductivity…..

Dopants Atoms are injected in silicon atom & is distributed randomly in

lattice.

At high temp. these atoms acquires fixed position.

Random Dopants Atoms

Fixed dopants atoms

Barrier Layer is applied which prevent short Circuit and after that cleaning is

done to remove tiny dust Particles.

Copper is used to interconnect transistors to form IC’s

Excess copper is Removed and levelled

About two month later, a single wafer is formed which links

up billion of transistors

Lattice structure Appearance…..

Last Step is Packing of Chip where chip is cut-off from wafers.

Finally Chip is formed and placed….

THANKS……