DENSO SiC Power Module in Toyota Mirai II - Sample

©2021 by System Plus Consulting | SPR21627 - DENSO SiC Power Module in the Toyota Mirai II - Sample 1

DENSO SiC Power Module in the Toyota Mirai IIDiscover the technology, design, and cost analysis of DENSO’s SiC module, the first to be used in fuel cell electric vehicles.

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

SPR21627 – Power Semiconductor report by Amine ALLOUCHEPhysical Analysis by Léo VATANT

December 2021 – Sample

http://www.systemplus.fr/


SUMMARY

Overview / Introduction 4

o Executive Summary

o Market

o Reverse Costing Methodology

o Glossary

Company Profile 9

o DENSO Company Profile

o DENSO SiC Technology

o Toyota Mirai II FCEV

Physical Analysis 18

o Synthesis of the Physical Analysis

o Package Analysis

✓ Package Opening

✓ Package Cross-Section

o SiC MOSFET Die

✓ SiC MOSFET Die View & Dimensions

✓ SiC MOSFET Die Process

✓ SiC MOSFET Die Cross-Section

o Diode Die

✓ Diode Die View & Dimensions

✓ Diode Die Process

✓ Diode Die Cross-Section

Manufacturing Process 68

o SiC MOSFET Fab Unit and Process Flow

o Diode Fab Unit and Process Flow

o Packaging Fab Unit

o Packaging Process Flow

Cost Analysis 83

o Synthesis of the Cost Analysis

o Yields Explanation & Hypotheses

o SiC MOSFET

✓ SiC MOSFET Front-End Cost

✓ SiC MOSFET Wafer Cost per Process Step

✓ SiC MOSFET Die Probe Test & Dicing

✓ SiC MOSFET Die Cost

o Diode

✓ Diode Front-End Cost

✓ Diode Wafer Cost per Process Step

✓ Diode Die Probe Test & Dicing

✓ Diode Die Cost

o Source & Drain Plates Cost

✓ BOM Cost & Assembly Cost

o Module Cost

✓ Packaging BOM & Assembly Cost

✓ Module Final Cost

Selling Price Analysis 105

o Estimation of Selling Price

Feedback 107

Related Analyses 109

Company Services 111



Overview / Introductiono Executive Summaryo Marketo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting

Executive Summary

The new environmental regulations to reduce average CO2 emissions, along with automotive trends, play in favor of greater vehicle electrification and faster deployment of electric vehicles/hybrid electric vehicles (EV/HEVs). Yole Développement expects the EV/HEV market to reach 41 million vehicles by 2026 according to the Power Electronics for E-Mobility 2021 report.

Numerous carmakers continue qualifying SiC devices in main inverters, OBC, and DC/DC converters for their next-generation models. Toyota is one of the pioneers in integrating SiC dies in their vehicles and, now it is the first car makerusing a SiC MOSFETs in fuel cell electric vehicle (FCEV). In fact, the Toyota Mirai II integrates a SiC based power module inthe boost converter.

In this context, System Plus Consulting provides a full reverse costing study of the DENSO SiC Power Module in the ToyotaMirai II.

Supported by a full teardown of the module, this report reveals DENSO’s technology choices in its SiC MOSFET, as well asthe design of the module’s packaging and diode chip. The module is assembled with the standard molding technology ofDenso and uses spacer for better thermal dissipation. The two dies are assembled with clips and wire bonding.

Detailed optical and SEM images with precise measurements show the structure of the transistor and the diode. Then acomplete analysis of the supply chain is performed, and the dies process flow is described step-by-step.

This report provides insights into technology data, manufacturing cost, and selling price of the module. Also furnished isan estimated manufacturing cost of all the module’s components, as well as a selling price analysis.


https://www.i-micronews.com/products/power-electronics-for-e-mobility-2021/


Overview / Introduction


Physical Analysis o Synthesiso Packageo SiC MOSFETo Diode


Cost Analysis


Feedback

Related Analyses


SiC Module in Fuel Cell Boost Converter of Toyota Mirai II

Fuel Cell Boost Converter of Toyota Mirai II: Opening Steps – Optical Views©2021 by System Plus Consulting

Fuel Cell Boost Converter of Toyota Mirai II

Analyzed SiC Power Module







Cost Analysis


Feedback

Related Analyses


Transfer-molded package:

o Dimensions: xxx mm x xxx mm x xxx mm

Synthesis of the Physical Analysis

SiC MOSFET:

o Dimensions: xxx mm² (xxx mm x xxx mm)

o Electrical connection: SnCu attach + xxx spacer + xxx wire bonding

Package Opening tilted – Optical View©2021 by System Plus Consulting

Si diode:

o Dimensions: xx mm² (xxx mm x xxx mm)

o Electrical connection: SnCu attach + xxx spacer







Cost Analysis


Feedback

Related Analyses


Package Views & Dimensions

o Transfer mold dimensions: xxx mm x xxx mm x xxx mm

o Overall dimensions: xxx mm x xxx mm x xxx mm

Module Package Frontside – Optical View©2021 by System Plus Consulting

xxx mm

Xx

mm

Module Package Backside – Optical View©2021 by System Plus Consulting

Module Package Lateral side – Optical View©2021 by System Plus Consulting

xxx mm

xxx mm

xxx mm

xxx mm

xxx mm

xxx mm xx mm

xxx mm Source plate Drain plate







Cost Analysis


Feedback

Related Analyses


Package Opening (1/2)

Package Opening – Optical View©2021 by System Plus Consulting

Source & drain terminals: part of Cu plates (x2)

Drain Cu plate

Xxx SiC MOSFET

Xxxx diode

Wire bonding (x5)

Small terminals (x5)

Xxx package







Cost Analysis


Feedback

Related Analyses


Package Cross-Section

Xxxx Diode: xxx mm

Xxxx µm

Package Cross-Section – SEM View©2021 by System Plus Consulting

Thickness:

o xxx spacer: xxx mm

o Spacer attach: xxx µm

o Die topside attach: xxxx µm

Source plate

xxx µm







Cost Analysis


Feedback

Related Analyses


SiC MOSFET – Die Dimensions

SiC MOSFET Die – Optical View©2021 by System Plus Consulting

o Die dimensions:xxx mm² (xxx mm x xxx mm)

xxx

mm

Xxx mm







Cost Analysis


Feedback

Related Analyses


Die Process – Delayering

Die Delayering – SEM View©2021 by System Plus Consulting

Pitch:

o Dimension: xxx µm

Die Delayering – Optical View©2021 by System Plus Consulting







Cost Analysis


Feedback

Related Analyses


Die Cross-Section







Cost Analysis


Feedback

Related Analyses


Diode Die Cross-Section

Die Cross-Section – SEM View©2021 by System Plus Consulting

o Si oxide #1: xxx µm



o Polysilicon: xxx µm





Physical Analysis

Manufacturing Process Flowo SiC MOSFET Fab Unito SiC MOSFET Process Flowo Diode Fab Unito Diode Process Flowo Packaging Fab Unito Packaging Process Flow

Cost Analysis


Feedback

Related Analyses


SiC MOSFET Process Flow (3/4)





Physical Analysis

Manufacturing Process Flowo SiC MOSFET Fab Unito SiC MOSFET Process Flowo Diode Fab Unito Diode Process Flowo Packaging Fab Unito Packaging Process Flow

Cost Analysis


Feedback

Related Analyses


Module Process Flow

Module assembly:

✓ Unpacking small terminals, source and drain plates

✓ Small terminals xxxxx

✓ xxxx

✓ xxxxx

✓ xxxxx

✓ Inspection

✓ Continuity test

✓ xxxx

✓ xxxx

✓ xxxx

✓ LASER marking

✓ Final test of the module

Source plate assembly process:

✓ Unpacking plate + spacers

✓ xxxxx plating of plate and spacers

✓ Cleaning

✓ xxxxx

✓ Inspection

✓ Cleaning

Drain plate assembly process:

✓ Unpacking plate + dies

✓ Nickel plating

✓ Cleaning

✓ SnCu soldering of dies

✓ Inspection

✓ Cleaning





Physical Analysis


Cost Analysiso Synthesiso SiC MOSFET Costo Diode Cost o Source Plate Costo Drain Plate Costo Packaging Costo Module Cost


Feedback

Related Analyses


SiC MOSFET Front-End Cost





Physical Analysis




Feedback

Related Analyses


Diode Wafer Cost Per Process Steps





Physical Analysis




Feedback

Related Analyses


Module Cost – Assembly Cost



R E L A T E DA N A L Y S E S




Physical Analysis


Cost Analysis


Feedback

Related Analyses


Related Analyses

RELATED REPORTS

By System Plus Consulting:• SiC Transistor Comparison 2021

• GeneSiC 1200V Gen3 and 3300V Gen2 SiC MOSFETs

• SiC Diode Comparison 2020

• Wolfspeed All-SiC Module CAB450M12XM3

• Industrial Power Module Packaging Comparison 2020

By Yole Développement:• Power SiC: Materials, Devices and

Applications 2020

• Status of the Power Electronics Industry 2021

• Power Electronics for E-Mobility 2021

RELATED MONITORS

RELATED TEARDOWN TRACKS

By Yole Développement:• Compound Semiconductor

Quarterly Market Monitor

By System Plus Consulting:• Automotive Teardown Tracks


https://www.systemplus.fr/reverse-costing-reports/genesic-1200v-gen3-and-3300v-gen2-sic-mosfets/

https://www.systemplus.fr/reverse-costing-reports/sic-diode-comparison-2020/

https://www.systemplus.fr/reverse-costing-reports/wolfspeed-all-sic-module-cab450m12xm3/

https://www.systemplus.fr/reverse-costing-reports/industrial-power-module-packaging-comparison-2020/

https://www.i-micronews.com/products/power-sic-materials-devices-and-applications-2020/

https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2021/

https://www.i-micronews.com/products/power-electronics-for-e-mobility-2021/

https://www.i-micronews.com/products/compound-semiconductor-service-compound-monitor/

https://www.reverse-costing.com/teardowns/?q=&category=ADAS&category=Electrification&category=Infotainment&category=Telematics&category=Other+ECUs&show_only_full_teardowns=on/


COMPANYSERVICES




Physical Analysis


Cost Analysis


Feedback

Related Analyses

About System Plus Consultingo Company serviceso Contact

Our Core Activity : Reverse Costing®

A Structure, Process and Cost Analysis

Reverse Costing® consists of disassembling a device or a system in orderto identify its technology and discern its manufacturing processes andthen using in-house models and tools to determine its cost.





Physical Analysis


Cost Analysis


Feedback

Related Analyses


Fields Of Expertise





Physical Analysis


Cost Analysis


Feedback

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Business Model

Teardown Track

205+ teardowns per

year

Monitor1 per year quarterly updated

Custom Analysis150 custom analyses per

year

Report60+ per year

Costing Tools

5 process-based and 3 parametric

costing tools

Cost MethodsTrainingOn demand





Physical Analysis


Cost Analysis


Feedback

Related Analyses


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100+ collaborators in 8 different countries

Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement

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CorneliusRaleighPhoenix

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Physical Analysis


Cost Analysis


Feedback

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Contact

REPORTS, MONITORS & TRACKS

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DENSO SiC Power Module in Toyota Mirai II - Sample