42
MOS Transistor Mr. HIMANSHU DIWAKAR ASSISTANT PROFESSOR JETGI

MOS transistor 13

Embed Size (px)

Citation preview

Page 1: MOS transistor 13

MOS TransistorMr. HIMANSHU DIWAKAR

ASSISTANT PROFESSOR

JETGI

Page 2: MOS transistor 13

MOS Structure

(Two Terminal MOS Structure )

Page 3: MOS transistor 13

MOS Structure

Metal Oxide(Sio2) Semiconductor

( Energy band diagram for Metal, Oxide(Sio2) and

Semiconductor )

Page 4: MOS transistor 13

MOS Structure

Page 5: MOS transistor 13

MOS Structure

( Energy band diagram of Combined MOS system )

Page 6: MOS transistor 13

MOS System under External Bias

Page 7: MOS transistor 13

MOS System under External Bias

Page 8: MOS transistor 13

MOS System under External Bias

( N MOS operating in surface inversion region )

Page 9: MOS transistor 13

Structure and Operation of MOSFET

( N channel Enhancement MOSFET )

Page 10: MOS transistor 13

Structure and Operation of MOSFET

Page 11: MOS transistor 13

Structure and Operation of MOSFET

( Formation of Depletion Region in N type

Enhancement type MOSFET )

Page 12: MOS transistor 13

Structure and Operation of MOSFET

Page 13: MOS transistor 13

Threshold voltage

( N channel depletion MOSFET )

Page 14: MOS transistor 13

Operation of MOSFET Transistor

a) Linear region

Page 15: MOS transistor 13

Operation of MOSFET Transistor

b) Saturation region

Page 16: MOS transistor 13

Operation of MOSFET Transistor

c) Beyond Saturation region

Page 17: MOS transistor 13

Characteristics of MOSFET

a) Gradual Channel Approximation

Page 18: MOS transistor 13

Characteristics of MOSFET

a) Gradual Channel Approximation

( V- I characteristics of nMOS Transistor )

Page 19: MOS transistor 13

Characteristics of MOSFET

Page 20: MOS transistor 13

Characteristics of MOSFET

Page 21: MOS transistor 13
Page 22: MOS transistor 13

n-MOS Transistor - Structure

Page 23: MOS transistor 13

The MOS Transistor

n+n+

p-substrate

Field-Oxyde

(SiO2)

p+ stopper

Polysilicon

Gate Oxyde

DrainSource

Gate

Bulk Contact

CROSS-SECTION of NMOS Transistor

Page 24: MOS transistor 13

Carriers and Current

• Carriers always flow from the Source to Drain

• NMOS: Free electrons move from Source to Drain.

Current direction is from Drain to Source.

• PMOS: Free holes move from Source to Drain.

Current direction is from Source to Drain.

Page 25: MOS transistor 13

IGFET

• The dimension of SiO2 layer is about 0.02 to 0.1 micron.

• Gate is isolated thus Insulated-Gate FET

• Due to insulation the current flowing through the gate terminal is extremely small of the order of 10^-15 A.

• Drain is always kept as more positive than the source.

• The current flows from the Drain to Source

• P-n junctions are kept under the reverse bias conditions

• Typically the Length of the device is from 1 to 10 micron.

Page 26: MOS transistor 13

MOS Transistor structure

Polysilicon –Heavily doped non crystalline silicon.

Polysilicon allows the dimensions of the transistor to be realized accurately.

Gate Oxide – Silicon dioxide.

Thickness of gate oxide – 7 to 20nm.

No d.c. through gate.

Normally, p substrate is connected to 0V in digital circuits and to negative voltage in analog circuits.

Page 27: MOS transistor 13

Symmetry

The transistor is symmetric: The Drain (which is equivalent to a BJT’s Collector) and the Source (which is equivalent to a BJT’s Emitter) are fully symmetric and therefore interchangeable.

Page 28: MOS transistor 13

All MOS p-n Junctions

Unlike a BJT transistor, in which one of the p-njunctions is typically forwardly biased, and theother reversely biased, in a MOSFET all p-njunctions must always be kept reversely biased!

Page 29: MOS transistor 13

REGION OF OPERATION CASE-1 (No Gate Voltage)

• Two diodes back to back exist in series.

• One diode is formed by the pn junction between the n+ drain region and the p-type substrate

• Second is formed by the pn junction between the n+ source region and the p-type substrate

• These diodes prevent any flow of the current.

• There exist a very high resistance.

Page 30: MOS transistor 13

REGION OF OPERATION Creating a channel

• Apply some positive voltage on the gate terminal.

• This positive voltage pushes the holes downward in the substrate region.

• This causes the electrons to accumulate under the gate terminal.

• At the same time the positive voltage on the gate also attracts the electrons from the n+ region to accumulate under the gate terminal.

Page 31: MOS transistor 13

REGION OF OPERATION Creating a channel

• Apply some positive voltage on the gate terminal.

• This positive voltage pushes the holes downward in the substrate region.

• This causes the electrons to accumulate under the gate terminal.

• At the same time the positive voltage on the gate also attracts the electrons from the n+ region to accumulate under the gate terminal.

Page 32: MOS transistor 13
Page 33: MOS transistor 13
Page 34: MOS transistor 13
Page 35: MOS transistor 13

REGION OF OPERATION Creating a channel

• When sufficient electrons are accumulated under the gate an n-region is created, connecting the drain and the source

• This causes the current to flow from the drain to source

• The channel is formed by inverting the substrate surface from p to n, thus induced channel is also called as the inversion layer.

• The voltage between gate and source called Vgs at which there are sufficient electron under the gate to form a conducting channel is called threshold voltage Vth .

Page 36: MOS transistor 13

MOS Channel Formation

Page 37: MOS transistor 13

MOS Transistor - Symbols

Page 38: MOS transistor 13

Operation – nMOS Transistor

Accumulation Mode - If Vgs < 0, then an electric field is established across the substrate.

Depletion Mode -If 0<Vgs< Vtn, the region under gate will be depleted of charges.

Inversion Mode – If Vgs > Vtn, the region below the gate will be inverted.

Page 39: MOS transistor 13

Operation – nMOS Transistor

Page 40: MOS transistor 13

Operation – nMOS Transistor

Page 41: MOS transistor 13

Operation – nMOS Transistor

Page 42: MOS transistor 13

THANK YOU