Zeta Lam is a solution for thin HDI build up designs.

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A laminar composite that includes thin low profile copper with a “stand-off” layer and a film that fills and levels.

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Compared to traditional glass based materials, the low CTE films show excellent thermal stability.

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Materials prior to lamination process.

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Normal press lamination is used to bond the build-up layer.

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As lamination pressure is applied, the B-stage dry film melts and flows

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The B stage layer fills gaps between copper circuits and features, then the excess is squeezed out.

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The B stage is now cured and the package is ready for drilling and plating.

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Zeta Lam provides liquid like build up with standard PCB process equipment.

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Example of 3 build-up layers of Zeta Lam.

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Zeta Lam is easy to laser drill. It drills equally as well with UV or IR (CO2) lasers.

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Example of HDI build-up

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Insulectro supplies Zeta Lam to the PCB industry.

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