HDI & Ultra-HDI FlexHIGHLIGHTS

• Ultra-HDI multilayer Flex Printed Circuits• Ultra fine line flex cables• State-of-the-art microvia technology• High-performance base materials

HDI & Ultra-HDI Flex

HDI & Ultra-HDI Flex

Flex Printed Circuits (FPC) have numerous advantages over their rigid circuit counterparts. In the pursuit of continuous miniaturization, FPC material properties enable smaller application form factors with the benefit of reduced weight and optimized volume utilization. In addition to facilitating designs with ultra-dense and precise conductor geometries, polyimide based flex materials provide excellent electrical performance characteristics. All of these attributes are indispensable to an electronics industry that is driven to the everchallenging quest to extend functionality on continuously smaller footprints.

With innovations like DYCOstrate and the plasma-etched microvia, DYCONEX is an enduring pioneer of flexible multilayer HDI and Ultra-HDI boards. We are empowered by an unquestionable commitment to serve this business segment. As a technological frontrunner, DYCONEX is equipped to cope with cutting-edge design requirements and the most demanding quality standards as applied in the medical and defense industries.

Our high yield manufacturing of HDI1) and Ultra-HDI2) flex applications and professional, hands-on consulting services are compelling reasons to make DYCONEX your FPC partner of choice.

Definitions:1) HDI flex – L/S 50-150 µm, via 75-150 µm2) Ultra-HDI flex – L/S <50 µm, via < 75 µm

Technical Data

• Turnkey flex solutions targeting 3D miniaturization• Highly reliable, extremely robust multilayer flex/microvia substrates• Ultra-thin base materials• Filled via and stacked via process available• Complex mechanical/assembly assist features, including special profiles, fold lines, cut-outs and thinned bending zones/cavities• Wrap-around boards• Chip-on-flex (COF), chip scale packaging (CSP) substrates, and BGAs• A wide variety of surface finishes, for example; OSP, ENIG, ENEPIG, E-AU, DIG• Flying leads• Bending test for flexible circuits• Ultra-fine line flex cables

Technological Highlights

Description Production capability

Lines/spaces 25/35 μm

Microvias/pads Ø 50/150 μm

Thinnest starting material 25 μm

Thinnest dielectric thickness 12 μm

Conductor width tolerance +/- 20%

Artwork to soldermask tolerance (rigid) +/- 25 μm

Layer count 8

Description Leading edge capability

Lines/spaces 20/25 μm

Microvias/pads Ø 40/100 μm

Thinnest starting material 12 μm

Thinnest dielectric thickness 5 μm

Conductor width tolerance +/- 10%

Artwork to soldermasktolerance (rigid)

+/- 15 μm

Layer count 10+

Based in Switzerland, DYCONEX has been in the PCB business for more than 50 years and delivers leading edge interconnect solutions in flex, rigid-flex and rigid technology. DYCONEX core competence lies in the production of highly complex HDI, high-frequency and high-reliability circuit boards for medical, defense, aerospace, industrial and semiconductor applications. DYCONEX is an MST company.

10/2020 All data given in this document are for information purposes only and are not binding. The data are subject to change without notice. All rights reserved by DYCONEX. Copying, even in extracts, is only allowed by licence of DYCONEX.

Micro Systems Technologies GmbH Sieversufer 7-9 DE–12359 Berlin, GermanyPhone +49 (30) 68905-4001 info@mst.com www.mst.com

DYCONEX AGGrindelstrasse 40CH–8303 Bassersdorf, SwitzerlandPhone +41 (43) 266 11 00Fax +41 (43) 266 11 01mail.dyconex@mst.comwww.mst.com