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Webinar: HDI 2 Perfection in HDI Optimal use of the HDI technology Würth Elektronik Circuit Board Technology www.we-online.de Seite 1 04.09.2013

Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

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Page 1: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Webinar: HDI 2 –Perfection in HDI

Optimal use of the HDI technology

Würth Elektronik Circuit Board Technology

www.we-online.de Seite 1 04.09.2013

Page 2: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Agenda

Overview Webinar HDI 1

Route out a BGA

Costs

Roadmap – HDI 2.0

Lasercavity

www.we-online.de Seite 2 04.09.2013

Page 3: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Agenda

Overview Webinar HDI 1

Route out a BGA

Costs

Roadmap – HDI 2.0

Lasercavity

www.we-online.de Seite 3 04.09.2013

Page 4: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 4 04.09.2013

Overview

HDI

• High Density Interconnection

Microvia

• Smallest, laser drilled holes

Buried Via

• Buried drills on the inner layers

Pitch

• Middle of a pad to the middle of a pad

Page 5: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 5 04.09.2013

Overview - Why Microvia technology?

t

h

h

Basic material CTEz

Copper thickness t

Aspect Ratio AR= h /

IPC-2221/2122

TCT i.d.R -45° / + 125° C

Solder process

Expand! 0 10 20 30 40 50 60 70

25 50 75 100 125 150 175 200 225 250 T [°C]

Expand Z

-axis

m]

Standard-FR4 Z-Achse Cu

Page 6: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Overview - Technologys

www.we-online.de Seite 6 04.09.2013

Standard Microvia

Staggered Microvias

Stacked Microvias

Microvia on Buried

Via

Page 7: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Agenda

Overview Webinar HDI 1

Route out a BGA

Costs

Roadmap – HDI 2.0

Lasercavity

www.we-online.de Seite 7 04.09.2013

Page 8: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Intel Atom

Pitch 0.593 diagonal

Pad 325 µm / Trace 89 µm / Spacing 90 µm

www.we-online.de Seite 8 11.06.2013

Rout out BGA – 0,650 mm Pitch

Page 9: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 9 11.06.2013

Route out BGA – 0,500 mm Pitch

Page 10: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 10 11.06.2013

Route out BGA – 0,500 mm Pitch

Large solderpads

No fine line structures on the outer layers

+ No routing on the outer layers

-

Page 11: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 11 11.06.2013

Route out BGA – 0,500 mm Pitch

Page 12: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 12 11.06.2013

Route out BGA – 0,500 mm Pitch

Planar surface

+ Small solderpads

No routing on the outer layer

-

Page 13: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 13 11.06.2013

Route out BGA – 0,500 mm Pitch

Page 14: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 14 11.06.2013

Route out BGA – 0,500 mm Pitch

Routing on the outer layers

Normally one µVia layer could be saved

+ Fine line structures on the outer layer, small soldermask clearence

High production effort

-

Page 15: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 15 11.06.2013

Route out BGA – 0,400 mm Pitch

BGA Pad: 275 µm

µVia Pad inner layer: 300 µm

Trace width / spacing

Outer layer : 100 µm

Inner layer: 100 µm

Soldermask clearence: 35 µm

NSMD!!

- No trace between the pads

- Each row in the BGA needs an extra

µVia layer.

Page 16: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Agenda

Overview Webinar HDI 1

Route out a BGA

Costs

Roadmap – HDI 2.0

Lasercavity

www.we-online.de Seite 16 04.09.2013

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www.we-online.de Seite 17 04.09.2013

Costs

Pcb dimensions

Amount of layers

> could be essential if a product is succesful!

Page 18: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

We will have a…

04.09.2013 www.we-online.de Page 18

Why no plated through hole vias should be used,

if a complex HDI stackup is given?

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www.we-online.de Seite 19 04.09.2013

Costs

PTH Microvia

How many signal layers are needed?

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www.we-online.de Seite 20 11.06.2013

Complexity

Costs

1 + 6 + 1

1.

Microvias 1 to 2

8 to 7

PTH 1 to 8

1 x pressed

1 x electroplated

1 x laserdrilled

1 x mech. drilled

2 + 4 + 2

2. 1.

Microvias 1 to 2

+ 1 to 3

8 to 6

8 to 7

PTH 1 to 8

2 x pressed

1 x electroplated

1 x laserdrilled

1 x mech. drilled

Microvia Filling?

2 + 4 + 2

2. 1.

Microvias 1 to 2

2 to 3

7 to 6

8 to 7

PTH 1 to 8

2 x pressed

2 x electroplated

2 x laserdrilled

1 x mech. drilled

1 + 6b + 1

1. 2.

Microvias 1 to 2

8 to 7

PTH 1 to 8

Buried Via 2 to 7

2 x pressed

2 x electroplated

1 x laserdrilled

2 x mech. drilled

2 + 4(6b) + 2

2. 1.

Microvias 1 to 2

2 to 3

7 to 6

8 to 7

PTH 1 to 8

Buried Via 2 to 7

2 x pressed

2 x electroplated

2 x laserdrilled

2 x mech. drilled

2 + 4b + 2

2. 1.

3.

Microvias 1 to 2

2 to 3

7 to 6

8 to 7

PTH 1 to 8

Buried Via 3 to 6

3 x pressed

3 x electroplated

2 x laserdrilled

2 x mech. drilled

Laser drilling

1 to 3

Staggered

Microvias

buried Vias

extra

buried

Microvias

1 x pressed 2 x pressed 3 x pressed

100 %

115 %

120 %

142 %

150 %

175 %

90 %

ML08

ohne

µ-Vías

Costs

Page 21: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 21 04.09.2013

Kosten

Filling ?

Microvias stacked

0,40 mm BGA Pitch Microvias

staggered

Complexity

Costs

Page 22: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

We will have a…

04.09.2013 www.we-online.de Page 22

Why is it cheaper, to have Buried Vias from the first to the last Microvia layer?

Page 23: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Survey

04.09.2013 www.we-online.de Page 23

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Agenda

Overview Webinar HDI 1

Route out a BGA

Costs

Roadmap – HDI 2.0

Lasercavity

www.we-online.de Seite 24 04.09.2013

Page 25: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

www.we-online.de Seite 25 04.09.2013

Roadmap

HDI 2.0 [µm] 2013 2014 2015 Forecast

Trace width / spacing 75 50

Padsize Microvia 275 220

Dril ldiameter Microvia 100 90 75

Drill diameter Buried Via (mech.) 250 200 150

Forecast:

• BGA Pitch 0.30 mm

• ELIC

• HDI…5+x+5

• High frequency – High Speed

Page 26: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Agenda

Overview Webinar HDI 1

Route out a BGA

Costs

Roadmap – HDI 2.0

Lasercavity

www.we-online.de Seite 26 04.09.2013

Page 27: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Lasercavity?

With a laser prudced cavity

Exposing of layout on the inner layes

Embedding of components

Miniaturization

Better thermal management

www.we-online.de Seite 27 04.09.2013

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Querschnitt

www.we-online.de Seite 28 04.09.2013

Lasercavity

LASERCAVITY® – with sidewall matalization

HDI08_3+2(4b)+3

Page 29: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Lasercavity

www.we-online.de Seite 29 04.09.2013

Micorvias for the thermal connection

to the aluminum

Two step Lasercavity with different electrical potentials

Page 30: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Lasercavity

www.we-online.de Seite 30 04.09.2013

LASERCAVITY® - Two levels for wire bonding

65 µm

step depth

Page 31: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

Lasercavity

www.we-online.de Seite 31 04.09.2013

250 µm LC

1400 µm

Stackup: 1+6b+1

• Lasercavity on layer 6

• Lasercavity surface for AL wire bonding

LASERCAVITY®

1.4 mm deep

Page 32: Webinar: HDI 2 Perfection in HDI Optimal use of the HDI ... · Webinar: HDI 2 –Perfection in HDI Optimal use of the HDI technology ... Roadmap – HDI 2.0 Lasercavity Seite 2 04.09.2013

04.09.2013 www.we-online.de Page 32

Thank you for your attention!

Dominic Büch

WÜRTH ELEKTRONIK GmbH & Co. KG

Product Management

Lasercavity

Circuit Board Technology

P.: +49 7622 397 223

M.:+49 151 7270 9888

E. [email protected]

W. www.we-online.de