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Background Prototype power inverter - Smaller - Efficient GaN power transistor - High frequency switching - Low on-resistance - Operation in high temperatures Effects of high temperatures - Material wear down - Efficiency
Citation preview
Thermal Analysis and PCB Design for GaN Power Transistor
Pedro A. Rivera CURENT REU
Final presentation 7/23/2015
University of Tennessee
Background
2
• Prototype power inverter
- Smaller
- Efficient
• GaN power transistor
- High frequency switching
- Low on-resistance
- Operation in high temperatures
• Effects of high temperatures
- Material wear down
- Efficiency
Applications
3
• Electric/hybrid vehicles
• Solar energy
• Wind energy industry
• Domestic/commercial
• Military
Configuration
4
• Replace GaN transistor with resistor
• Experimental PCB design
- Thermal vias
- Bottom heat sink
Taken from GaN systems app note
Objective
5
• Analyze heat dissipation of resistors and heat sink temperature
• Compare different PCB cooling designs • Find the best cooling design
Method
6
Experimental Simulation Theoretical
GaN die
Heat sink
• Obtain data from:
- Resistor
- Heat sink
• FEMM software
- Materials
- Measurements
• Calculate thermal resistance
Results
7
Design #1
0 2 4 6 8 10 12 14 16 18 20280290300310320330340350360370
Comparison of experimental resistor temper-ature for Design #1
ExperimentalSimulation Design #1Theoretical Design #1
Power (W)
Tem
pera
ture
(˚K)
• Experimental results match well simulation and theoretical results
Results
8
0 2 4 6 8 10 12 14 16 18 20300350400450500550600650700750
Comparison of experimental resistor temperature for Design #2
ExperimentalSimulation Design #2Theoretical Design #2
Power (W)
Tem
pera
ture
(˚K)
Design #2
• Not much area under heat source • Higher thermal resistance
Results
9
0 2 4 6 8 10 12 14 16 18 20300350400450500550600650700750
Comparison of experimental resistor temper-ature for Design #3
Experimental Simulation Design #3Theoretical Design #3
Power (W)
Tem
pera
ture
(˚K)
Design #3
• Improves design #2
Conclusion/Future work
10
• The use of thermal vias and heat sink on the bottom was the best design
• The farther away the heat sink from the heat source the worst the cooling will be
• Results can be used for comparison in future designs
• Create new designs to compare
• Use software with three dimensional viewing
Acknowledgements
This work was supported primarily by the ERC Program of the National Science Foundation and DOE under NSF Award Number EEC-1041877.
Other US government and industrial sponsors of CURENT research are also gratefully acknowledged.
11
Questions and Answers
12