REQUEST FOR PROPOSAL (RFP) for FABRICATION, … · This Request for Proposal ... MIC, LNA housing, feed thrus and SMA connector required for LNA fabrication will be provided as free

Page 1

REQUEST FOR PROPOSAL (RFP)

for

FABRICATION, ASSEMBLY, TEST &

EVALUATION

of

L1 & L5 Band

LNA Filter Module

SPACE APPLICATIONS CENTRE

INDIAN SPACE RESEARCH ORGANISATION

GOVERNMENT OF INDIA

AHMEDABAD - 380 015

INDIA

Page 2

About the RFP:

Space Applications Centre (SAC), Ahmedabad, a unit of Indian Space Research

Organization (ISRO), requests vendor to submit quotation for the fabrication,

assembly, testing and evaluation of L1& L5 Band Low Noise Amplifier (LNA) Filter

module as detailed in this Request for Proposal (RFP).

The details of this are given in the following sections:

Exhibit A: Introduction & Scope of Work

Exhibit B: Design Details of L1 & L5 Band LNA & Filter

Module

Exhibit C: Details of the components used in LNA

Exhibit D: Circuits List, sizes and details

Exhibit E: Test setup details

Exhibit F: R&QA requirement

Page 3

EXHIBIT A

Introduction & Scope of Work:

1. Introduction

Space Applications Centre, Ahmedabad (SAC), a unit of Indian Space Research

Organization (ISRO) had successfully developed L1 & L5 Band LNA and Filter module.

This Request for Proposal (RFP) is for the start-to-end fabrication and delivery of the

LNA Filter module as per ISRO’s already proven designs.

2. Scope of Work

The vendor is required to fabricate, test and characterize LNA as per ISRO’s

approved drawings and fabrication sequence.

It comprises of MIC based circuit and PCB circuit having distributed / discrete

components.

Dual band filter will be given as part of free issue material(FIM).

Integration of LNA and Filter in integrated LNA Filter module assembly as per

approved drawing and fabrication sequence.

Test and Evaluation(T&E) of LNA Filter module as per approved T&E document.

The LNA Filter module needs to be fabricated following & conforming to the

Reliability & Quality Assurance (R&QA) requirements.

The fabrication of LNA Filter module includes:

1) Procurement of all components of LNA as per procurement specifications

approved by QA SAC.

2) Fabrication of LNA’s PCB circuit substrates as per approved drawings provided

and as per ISRO guidelines. SAC will provide dxf / gerber and dimension drawings of

PCB card.

3) Gold plated carrier plates, MIC, LNA housing, feed thrus and SMA connector

required for LNA fabrication will be provided as free issue material (FIM).

4) Component mounting/populating and assembly of LNA’s MIC circuit and PCB

Circuit as per the assembly drawing and fabrication sequence. The circuits need to be

assembled in mechanical housing and performance test is to be carried out. Measured

results of LNA meeting the specifications have to be demonstrated to SAC engineers.

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In case of any deviations from the specifications, the performance needs to be

optimized.

5) Dual band Filter will be provided as FIM.

6) Integration of LNA and dual band filter in an integrated LNA Filter module

housing as per assembly drawing.

7) Carrying out Test and Evaluation of LNA Filter module as per Test and Evaluation

documents.

Note:

1. The Vendor shall be responsible for carrying out the activities mentioned above and

also for actions arising out of non-conformances at various stages.

2. SAC approved bill of material to be provided by SAC

3. The TBD components, if any, will be included in the final fabrication document.

While procuring the passive components like capacitors and resistors the vendor

should also make sure to procure a range of components with electrical values nearby

the desired value for final optimization. The quotation submitted should also take

into account for these extra components, based on vendors past experiences in

developing RF subsystems.

Detailed Quantum of Work:

The total work briefly described above for the fabrication of the LNA Filter module is

detailed in upcoming section for convenience of the vendor for understanding the

quantum of work involved. The total work can be typically divided in the following

stages,

(A) Electronic Fabrication

(B) Procurement of Electronic parts, material and inspection

(C) Components mounting, assembly and packaging

(D) Testing and performance optimization of LNA

(E) Integration of LNA with Filter and characterization of integrated LNA Filter

module

(F) Data review by SAC

(G) Environmental testing

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(H) Review of Test results by SAC

The fabrication activities are to be carried out by vendor as per SAC/ISRO qualified

processes and by SAC approved vendors, with quality control at each step, as per the

SAC approved fabrication and test documents. Activities in detail are given as below:

A) Electronic Fabrication

i) Fabrication of bare PCB from ISRO approved vendor, on FR4 (glass epoxy)

laminates (Four Layers) as per approved dxf/gerber file provided by SAC.

Post-fabrication compatibility check is performed to ensure the mechanical

compatibility of package & PCB.

B) Procurement of Mechanical and Electronic parts, material and inspection

i) Procurement of all electronic and miscellaneous components as enlisted in

EXHIBIT B, C, D & E along with TBDs except the following FIM:

List of FIM

Sr.

No. Component / Package Type/Grade.

1 FC 40 Feed thru Hi rel

2 FP100 Feed Thru Hi rel

3 MIC substrates (as per list in Exhibit D)

3 MIC Connector Tab Type Hi rel

4 Gold Plated Kovar CP

5 Gold Plated LNA and LNA Filter module housing

6 Dual Band Filter

ii) Inspection of incoming parts and materials.

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C) Component mounting, assembly and packaging of LNA as per the following

processes:

i) Attachment of Alumina substrates on carrier-plates using reflow soldering.

ii) Mounting of components like chip capacitors, resistors, wires, active devices on

MIC and PCB by suitable techniques mentioned in fabrication sequence.

iii) Ribbon bonding from one substrate to another substrate.

iv) Fitting of MIC and PCBs in mechanical housing.

v) Assembled package wiring

vi) RF absorber and getter material mounting on Al alloy cover

vii) Conductive RTV application

The fabrication sequence may be modified depending upon fabrication

processes.

D) Testing and Performance Optimization of LNA:

The unit testing is carried out in following phases:

i) Functional Testing & Optimization

ii) Temperature compensation for finalizing the TBD values.

iii) Verification of performance of the sub-system over given temperature range.

E) Integration and characterization of LNA Filter module as per the following

process:

i) Fabrication and testing of flexible RF cable (MF141) assemblies

ii) Assembly and interconnection of LNA, Filter and 9 pin D-type connector in

integrated LNA filter housing.

iii) RTV application

iv) Functional testing as per specification listed in EXHIBIT E.

F) Data Review by SAC

G) Environmental testing

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Each unit (LNA Filter module) shall go through environmental test. These test will be

carried out on each unit to verify the workmanship and performance of the unit under

given operating conditions. It includes vibration test and thermal test as per exhibit E.

H) Review of Test results by SAC

Notes:

(1) The units are required to undergo the above tests successfully, meeting all the

specifications, before delivery to SAC.

(2) Vendor should have capability in terms of fabrication facility, storage facility and

test facility as well as necessary technical expertise to build, optimize, test and

deliver the high reliability product.

2.1 Responsibilities

The following table defines the responsibilities between SAC and the vendor.

Sr.

No. Activity Responsibility

1. Fabrication document ( SAC approved mechanical drawings,

components list, assembly details and fabrication sequence) SAC

2. Testing Procedures (To be prepared by Vendor and to be

reviewed and approved by SAC). Vendor

3. Providing FIM as per list given in Exhibit A SAC

4. Procurement of all electronic parts as per Exhibit C & D and

all raw materials & consumable and their incoming inspection

& batch acceptance tests / COC Vendor

5. Providing Gerber/DXF files of PCB of LNA SAC

6. Photo films/masks for PCB fabrication and its QC Vendor

7. Electrical Hardware Fabrication and QC (Including bare PCB

fabrication and external DC harness) Vendor

8. Assembly and packaging of RF section of LNA Vendor

9. Assembly of substrates, PCB and interconnection of LNA Vendor

10. Absorber fixing on RF cover of LNA Vendor

11. Calibrated Test Equipment & Facilities Vendor

12. Functional testing, tuning and optimisation of LNA Vendor

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13. RTV and araldite application in LNA Vendor

14. Audit on vendor QC cleared LNA unit SAC

15. Cover closing clearance & cover closing of LNA Vendor

16. Fabrication and testing of MF141 flexible cable Vendor

17. Integration of SAC supplied Filter and LNA in LNA Filter

housing

Vendor

18. RTV and araldite application in LNA Filter module Vendor

19. Functional testing of LNA Filter module Vendor

20. Audit on vendor QC cleared LNA Filter module SAC

21. Cover closing clearance & cover closing of LNA Filter

module

Vendor

22. Final functional verification and temperature test data of LNA

Filter module Vendor

23. Documentation of test results & compliance chart Vendor

24. Rework and re-optimisation, if required at any stage Vendor

25. Test and Evaluation Vendor

26. Documentation of test results & compliance chart Vendor

27. Review of test results & shipment clearance SAC

28. Delivery of Fabricated units at SAC Vendor

2.2 Delivery Schedule

Activity

Activity

Carried by

Activity

Duration

(Months)

Delivery of all approved drawings,

fabrication sequence & bill of material

SAC To+0.5

Fabrication, testing and delivery of 1 QM

unit of LNA Filter module

To + 2.5 = T1

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Fabrication, testing and delivery of 20 FM

unit of LNA Filter module

Vendor 2 Units in

every month

after T1

Notes:

1. A detailed delivery schedule shall be presented in a bar chart form showing

sequence and time of all important activities e.g. fabrication, assembly,

performance testing and final test and evaluation for future monitoring of the

project.

2. FIM will be provided to vendor by SAC as when required (to maintain delivery of 2

units of LNA filter module every month)

2.3 Vendor Selection Criteria:

Vendor should have the following at the time of bid:

Bidder shall be an “Established indigenous industry”.

Minimum Class 1,00,000 clean room

Fabrication line qualified by ISRO as per ISRO-PAX-300/305

ISRO certified fabricator/ inspector for Hi-Rel fabrication activities

Previous experience of working with MIC and PCB fabrication & testing

for Hi-Rel applications.

Experience of fabrication and testing of FM hardware for ISRO payload

applications

Test and measurement equipments and storage facility in-house

availability Documents/ certificate for above should be submitted to access vendor

capabilities, technical expertise to build, optimize, test and deliver the high

reliability product.

2.4 Guidelines / Information to Vendor

The Vendor is requested to examine the RFP thoroughly and offer compliance / non-

compliance point by point while specifying its offered value against the specification.

Since the information is proprietary to SAC-ISRO, all necessary documents

mentioned in this RFP will be shared after the order is placed.

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Any clarification regarding this RFP if required may be obtained before submitting

the quotation.

2.5 Proprietary Rights

All Documents, Designs, Layouts, Specifications and developed circuits for this activity

will be the property of SAC and without permission of SAC it shall not be shared or

provided to any third party.

2.6 Deliverables

i. LNA Filter module as per purchase order.

ii. Characterization data and report of LNA filter module.

iii. Test and evaluation data and report mentioning all results compliances and non-

compliances against the mentioned specifications.

iv. Systematic Log-history of all fabrication processes of LNA with values and

identification numbers of all components and material assembled during the

fabrication phase.

v. Systematic report and data on deviation of fabrication processes, including change

of components with proof of approval from SAC for the same.

vi. All report related to non-conformances of all stages of fabrication.

vii. COC of ordered item

Delivery Norms

All circuits and subsystems should have clearly readable identification marking on

them, as per SAC’s defined nomenclature. All reports, history sheets and data

should refer these markings only.

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EXHIBIT B:

Design Details of L1 & L5 Band Low Noise Amplifier and Filter:

Low Noise Amplifier:

The details of L1 & L5 Band Low Noise Amplifier to be developed is given below:

L1 & L5 Band LNA provided low noise amplification at 1.1764 GHz and

1.57542 GHz Band with 50 Ohm RF IP and OP interface.

Specifications

Table 2.1.1 : Specifications of Low Noise Amplifier

Sr.

No.

PARAMETER

Unit SPECIFICATION

L1 L5

1 Frequency Band MHz 1176.45 ±2 1575.42 ± 2

2 Gain dB >33 >33

3 Noise Figure dB <1.3 <1.4

4 Return Loss at

Input/ Output

dB >14 >14

5 1 dB

Compression

Point

dBm >11.0 >11.0

6 RF Interface:

Input/ Output

SMA-F

7 Power Supply +/- 5 V, 80 mA

8 Dimensions mm 85 X 73 X 35

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Design Philosophy

LNA has been built in balanced microstrip configuration. Its main components are given

below.

Balance LNA: L1 & L5 band two stage balance LNA on 25 mil Alumina

Bias Card: Bias distributing network for microstrip circuit. Developed on 4-layer FR-

4 substrate.

Total number of circuits:

1. 1 number of MIC based circuits on Alumina substrate: These circuits consist of

microstrip line based two stage balance low noise amplifier.

2. 1 numbers of FR4 (4 layer) PCB based circuit.

Package Details

LNA is housed in H-box mechanical housing with top side MIC mounting

and bottom side PCB mounting. Figure 1 shows the integrated LNA.

Fig. 1 Assembly drawing of Integrated LNA ( MIC Side)

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Fig.2 LNA Package (Top View) Fig.3 LNA Package (Bottom View)

Mechanical housing is gold plated.

Package Material = Aluminum

L1 & L5 Band Filter: Dual band filter will be provided as an FIM. Following is the

specification of filter:

Table 2.1.2 : Specifications of Low Noise Amplifier

Sr No Parameter Unit Specification

L5 L1

1 Passband MHz 1176.45 ±2 1575.42 ± 2

2 Insertion Loss dB <1.0 <1.0

3 Return loss at input and output

ports

dB >14 >14

4

Filter rejection at:

1350MHz, 2000MHz, 2211MHz,

2237.5MHz,

2259MHz, 2275MHz, 5510MHz,

5775MHz and 5790MHz

dB

>55

5 Group delay ns <10

6 RF Interface: Input/ Output SMA-F

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LNA Filter Module: Following is the specification of integrated LNA Filter module:

Table 2.1.3 : Specifications of LNA Filter Module

Sr

No Parameter Unit

Specification

L5 L1

1 Frequency Band MHz 1176.45 ±2 1575.42 ± 2

2 Gain dB >32 >32

3 Noise Figure dB <2.5 <2.6

4 Return Loss

Input

Output

dB

>11

>14

>11

>14

5 1 dB Compression Point dBm >11.0 >11.0

6 Filter rejection at:

1350MHz, 2000MHz,

2211MHz, 2237.5MHz,

2259MHz, 2275MHz,

5510MHz, 5775MHz and

5790MHz

dB

>55

7 RF Interface: Input/ Output SMA-F

8 Size mm 150 X 150 X 70 , approx..

*Spurious specifications for EMI/EMC test will be provided at the time of testing of units

LNA and filter will be integrated in an LNA filter module housing. LNA and filter will be

interconnected using flexible RF cable (MF141) and power supply of LNA will be

provided from 9-pin D-type connector.

Page 15

Fig.4: Assembly drawing of integrated LNA Filter module

Page 11

EXHIBIT C:

Details of the components used in LNA

The vendor has to procure all MIL grade components required for the fabrication of LNA as per R&QA requirement in EXHIBIT F.

The detailed component list is provided below:

Sr.

No.

Component /

Package Style Type/Part NO.

Procurement

Information Suggested MFR / VENDOR

TOTAL

Quantity

for 1 unit

of LNA

1. BJT / SURFACE

MOUNT BFY 740 Hi-rel INFINEON 4

2. Ground Lugs Hi-rel 1

3. Absorber sheets

4.5GHz SF-4.5 (18"X12") size

Hi-rel

eccosorb 1 sheet

each

4. GASKETS for

package

Hi-rel

5. Cu-Mg Wires

6. Adhesive for

fixing absorbers

7. Fasteners

Page 12

Sr

No.

Component

/ Package

Style

Type/Part

NO. TOL Rating

Procurement

Information

Suggested

MFR /

VENDOR

TOTAL

Quantity for

1 unit of

LNA

1 CDR12 Capacitor ±0.1pF 150V dc MIL-PRF-55681, R or

better AVX/ATC 14

2 CDR12 Capacitor ±0.1pF 150Vdc MIL-PRF-55681, R or

better ATC 10

3 CDR32 Capacitor ±10% 100Vdc MIL-PRF-55681, R or

better VISHAY 10

4 CDR35 Capacitor ±10% 100Vdc MIL-PRF-55681, R or

better VISHAY 2

Page 13

Sr.

No.

Component /

Package Style

Type/Part

NO. TOL Rating

Procurement

Information

TOTAL

Quantity

for 1 unit

of LNA

1 CHIP

(RM0705) Resistor ± 2% 50mW

MIL-PRF-55342, R or

better

6

2 CHIP

(RM0705) Resistor ±2% 50mW 2

3 CHIP

(RM0705) Resistor ±2% 50mW 6

4 CHIP

(RM0805) Resistor ± 1% 1W 1

5 CHIP


6 CHIP


7 CHIP


Page 14

Sr.

No.

Component /

Package Style

Type/Part

NO. TOL Rating

Procurement

Information

TOTAL

Quantity

for 1 unit

of LNA

8 CHIP

(RM0805) Resistor ± 1% 1W

MIL-PRF-55342, R or

better

1

9 CHIP


10 CHIP


11 CHIP


12 CHIP


13 CHIP


14 CHIP


Page 15

Sr.

No.

Component /

Package Style

Type/Part

NO. TOL Rating

Procurement

Information

TOTAL

Quantity

for 1 unit

of LNA

15 CHIP

(RM0805) Resistor ± 1% 1W

MIL-PRF-55342, R or

better

1

16 CHIP

(RM0805) Resistor ± 1% 250mW 1

17 CHIP


18 CHIP


19 CHIP


20 CHIP


21 CHIP


Page 16

Sr.

No.

Component /

Package Style

Type/Part

NO. TOL Rating

Procurement

Information

TOTAL

Quantity

for 1 unit

of LNA

22 CHIP


MIL-PRF-55342, R or

better

1

23 CHIP


24 CHIP


25 CHIP


26 CHIP


Page 17

Sr.

No.

Component /

Package Style

Type/Part

NO. TOL Rating

Procurement

Information

TOTAL

Quantity

for 1 unit

of LNA

27 CHIP


MIL-PRF-55342, R or

better

1

EXHIBIT D:

Circuits List, sizes and details

The detailed circuit lists for LNA is provided below:

PCB based circuit

Sr.

No. PCBName

PCB Size

(mm x mm)

PCB

thickness

(mm)

Qty Substrate

1 LNA Bias

Card 75X40 1.6 1

FR4

(4layer)

MIC based circuit

Sr. No. MIC Name MIC Size (mm x

mm)

MIC thickness

(mm) Qty Substrate

1 LNA-IP 15.6X25.4 0.653 1 25 mil Alumina-

2Layer

2 LNA-Inter stage 20.4X25.4 0.653 1 25 mil Alumina-

2Layer

3 LNA-OP 15.6X25.4 0.653 1 25 mil Alumina-

2Layer

4 Link card 12.7X25.4 0.635 1 25mil Alumina-

3Layer

General Details of the MIC and PCB circuits:

Vendor has to fabricate PCB circuit used in LNA listed above.

For the fabrication of PCB circuit, following will be provided by SAC.

dxf/gerber of the circuit to be fabricated.

Dimension drawing of the circuit.

PCB design is on FR4 substrate (Er=4.7) with 1 ounce of Cu metallization. All the

PCBs are to be marked with unique card code number as mentioned. Also PCB’s

with the same card code number should be marked with unique identity number.

VECTOR NETWORK

ANALYZER

RECEIVER UUT

with DC Supply

I/P

OP

EXHIBIT D:

TEST SETUP DETAILS

Coaxial cables used during measurement, will be calibrated separately and corresponding losses

will be deducted from measurements.

1. Noise Figure

Noise Figure measurement is done using Noise Figure Analyzer. The first step is calibration and

is done without the DUT in place. After calibration, DUT is inserted and measurement is

repeated.

Noise Figure measurement set up is shown below.

FIG. 5 TEST SETUP FOR NOISE FIGURE MEASUREMENT

2.Gain, Input and Output Return Loss and Rejection measurement

Gain and input & output return loss measurement is done using vector network analyzer.

FIG. 6 TEST SETUP FOR GAIN AND RETURN LOSS MEASUREMENT

NOISE SOURCE DRIVE

O/P NOISE

SOURCE

I/P

CALIBRATION

LNA UUT with DC Supply

INPUT

NOISE FIGURE

ANALYZER

VECTOR NETWORK

ANALYZER

RECEIVER UUT

with DC Supply

I/P

OP

Power Meter

3. P1dB Measurement

The P1dB will be measured on VNA with VNA input power calibration using power meter and

two port S-parameter calibration.

FIG. 7 TEST SETUP FOR P1dB MEASUREMENT

SUMMARY OF TEST RESULTS

MODEL : FM

UNIT : LNA

I.D.NO. : LNA-

PARAMETER SPECIFICATION IBT

POST VIB.

TEST COLD TOT HOT TOT FBT

L1 L5 L1 L5 L1 L5 L1 L5 L1 L5

Noise Figure

Gain

IP Return Loss

OP Return Loss

P1dB

Rejection

DC Voltage

DC Current

EXHIBIT F:

R&QA requirement of fabrication & testing of LNA filter module

Para

No. Notes

Vendor’s

Compliance

1.0 INTRODUCTION:

This section describes the Reliability and Quality Assurance

requirements to be followed by Vendor during fabrication,

assembly and testing of ordered subsystems.

Mandatory requirements: It is mandatory that ISRO qualified

PCB and MIC fabrication and assembly process line of the

vendor including fabricator & inspector shall be used for

fabrication of ordered units. Necessary certificate shall be

attached along with the quote. SAC may visit the vendor facility

to access their capability after receiving the quote.

Vendor shall have capability in terms of SAC/ISRO qualified

fabrication, test and storage facilities as well as necessary

technical expertise to build, optimize, test and deliver the high

reliability product.

2.0 APPLICABLE DOCUMENTS:

Following workmanship standard shall be followed during

realization of the hardware.

ISRO-PAX-300

Issue-5, Nov 2012

Workmanship Standards for the Fabrication of Electronic

Packages

ISRO-PAX-305 Qualification requirements and Workmanship Standard for

Microwave Integrated Circuits (MIC)

3.0 RELIABILITY:

3.1 Operating condition for Active Components:

The electrical designs are made compliant to the SAC derating

requirements. During optimization the electrical operating

conditions of active devices shall be selected such that junction/

Para

No. Notes

Vendor’s

Compliance

channel temperatures of all solid-state devices shall not exceed

+110ºC for Silicon and GaAs under nominal operating (RF ON

in case of RF active components) and worst case environmental

conditions.

4.0 ENVIRONMENTAL SPECIFICATIONS

4.1 Operating Environment:

The unit shall meet all the performance requirements as given in

electrical specifications under the following environmental

conditions:

a) Temp. Range :

i) Flight Acceptance : 10°C to 60oC

ii) Proto Flight / Qualification : 5oC to +70oC

b) Pressure: The unit shall be capable of operating and

compliant to the specifications at ambient pressure as well as

vacuum level of 10-5 torr or batter

Note: All temperatures are referred to the base plate.

Temperature up to +60oC of base plate should not affect the life,

operation and performance of the unit.

4.2 EMI / EMC :

EMI / EMC requirements of MIL-STD-461E (Test applicability of

are shown in Table-2)

Unit shall meet Radiated Susceptibility requirements of MIL-STD-

461E.

4.3 Space Radiation:

Radiation shielding shall be carried out by the vendor as per

SAC approved drawing.

5.0 PARTS:

5.1 Electronic Parts:

Following quality level of part are to be procured for QM / FM.

TABLE-2: PARTS QUALITY

Para

No. Notes

Vendor’s

Compliance

(whichever device family applicable) Device Family Quality Level

Active devices MIL Temperature grade

Passive devices MIL Temperature grade

Multi-pin / SMA

connectors MIL Temperature grade

1. Procurement specifications for components shall be

generated by the Vendor and provided to SAC for review &

approval, before procurement. All the components shall be

procured with manufacturer COC and data pack.

2. Vendor shall ensure that all the parts and fabricated

hardware are stored under controlled environment in a

Bonded-Store till their actual use as per procedure outlined in

ISRO-PAS-207.

5.2 Mechanical parts:

Mechanical packages, boxes, covers, clamps, CPs, patterned

substrates, PCBs, test jig etc. shall be fabricated by Vendor /

Sub-vendor as per SAC supplied approved drawings including

their plating / coating.

All the bought out mechanical components including fasteners,

spring, plain washers, nuts etc. shall be procured by the vendor in

accordance with procurement specifications approved by SAC.

Following traceability information shall be maintained by the

vendor for records & submitted to SAC as a part of data package.

a) Raw material identification details, relevant in-house incoming

inspection & test reports.

b) Materials batch / lot Nos. information

c) Inspection reports for both bought out & in-house fabricated

Para

No. Notes

Vendor’s

Compliance

hardware.

d) Certificate of Compliance (CoC) supplied by sub-

vendor/manufacturer for bought out items.

6.0 INSPECTION OF PARTS :

6.1 Electronic parts

All the active and passive electronic parts (packaged) shall be

subjected to incoming inspection by Vendor including batch

acceptance report of PCB and MIC (Lot No, Batch No, Date

code etc.).

CoC of inspected parts shall be submitted to SAC along with

Data package of unit.

6.2 Mechanical parts

Mechanical parts shall undergo 100% dimensional measurements and visual inspection including plating / thermal painting workmanship point of view. All inspection and clearance records for the materials shall be maintained by the vendor. Only approved and cleared materials shall be used.

7.0 MATERIALS:

Vendor shall ensure to use ISRO approved / qualified materials.

Procurement of all the mechanical and electronic fabrication

materials shall be done as per SAC Approved Materials List

(DML). Vendor shall review & clear Material Test Report (MTR) &

CoC of the manufacturer. Non-metallic materials shall have a

Total Mass Loss (TML) of less than 1% and Collectable Volatile

Condensable Materials (CVCM) of less than 0.1% when

subjected to a test condition of +125ºC and 1x10-06 torr pressure

for 24 hours. If CoC contains outgassing parameters, then

separate test not required. All inspection and clearance records

for the materials shall be maintained by the vendor.

Materials list consisting of the name of vendor, shelf life,

qualifying agency, location of application in the sub-systems shall

be submitted to SAC for approval. Only Space qualified Printed

Para

No. Notes

Vendor’s

Compliance

Circuit Boards (PCBs), approved photo mask, patterned MICs

etc. shall be used during fabrication of hardware. Bare PCBs /

MICs shall be procured from ISRO/ESA/MIL qualified vendor.

All the materials shall be used within their shelf life.

8.0 PROCESSES:

ISRO-PAX-300 / 305 workmanship standards shall be followed

for the fabrication work. All electronic fabrication processes like

substrate metallization, pattern generation, substrate cutting,

parts mounting/assembly, etc. shall be ISRO qualified. Similarly,

the processes used for surface treatment of the box like plating

and coating in realizing the hardware shall also be ISRO

qualified. All the processes shall be carried out in accordance

with PIDs reviewed by QA-SAC.

The following electronic / mechanical fabrication processes /

activities are likely to be used for fabrication of unit.

(a) Electronic fabrication process:

1. Fabrication (Pattern engraving) on MICs on 25 mil Alumina

substrates having space qualified thin film metallization,

including PCBs.

2. Attachment of substrate on gold plated CPs

3. Passive and Active component mounting & reflow soldering

on Alumina & PCBs

4. 1 mil gold wire bonding

5. Assemblies of fabricated CPs/PCBs in gold plated Al box

6. Cu enamel wire soldering on MIC & PCB

7. Local potting & araldite application wherever ever required

as per SAC approved location diagram

Fabrication of flexible cable assembly9. Integration/harnessing

Para

No. Notes

Vendor’s

Compliance

of fabricated LNA with Filter module

(b) Mechanical Fabrication process:

1. Fabrication of mechanical packages & covers.

2. Fabrication of Kovar carrier plates.

3. Gold plating of carrier plates and aluminium packages.

4. Post gold plating machining of package, if reqd.

Fabrication work shall be carried out on ISRO qualified fabrication

line by ISRO certified operators.

9.0 QUALITY CONTROL (QC):

Vendor’s in-house Quality Control (QC) shall carry out 100%

inspection of all the fabricated / processed units as well as on-line

inspection during the electronic & mechanical fabrication activity.

9.1 QA AUDIT

If required, SAC may carry out audit on hardware accepted by

vendor QC; from both electronic & mechanical point of view on

sample basis; at various stages of realization. SAC shall audit all

related facilities, Fabrication processes, overall documentation,

including parts & materials test reports, etc.

Vendor is required to submit schedule of cover closing in

advance to SAC for audit activities.

Virtual Audit (Photographic & Documentation): Based on

confidence level build-up on fabricated hardware, SAC may opt

for virtual audit of hardware, provided vendor facility, process line,

their quality system, etc. found satisfactory. For this vendor has to

send required details along with photograph to SAC for Audit.

The Vendor shall generate close outs of discrepancies observed

during audit and submit the same to SAC for review and

Para

No. Notes

Vendor’s

Compliance

acceptance,

10.0 MARKING AND IDENTIFICATION

The units shall be identified by assigning unique serial number on

the exterior surface of both package & cover. Marking shall not

degrade the performance and quality of the unit.

Unit Name Unit Number

Contract Number Serial Number

Name of the Manufacturer Date of Mfgr.

The permanency of the marking shall be sufficient to withstand

the specified environmental testing and normal cleaning

operations using Isopropyl Alcohol and other cleaning solvents.

11.0 STORAGE and TRANSPORTATION

Storage of hardware, parts & materials:

Storage of fabricated hardware, parts & materials shall be done

as per ISRO-PAS-207. Active & Passive Component shall be

stored in controlled area environment under Class 100,000 clean

room with round the clock controlled temperature (22 ±3ºC) &

humidity (45 to 55% RH). Parts shall be stored in such manner

as to prevent damage due to undue stresses. ESD protection

care shall be taken while receiving & issue of components. A

manufacturer instruction for storage & handling of parts shall

strictly be followed during the storage. Dry N2 (Nitrogen) purged

packaging and storage cabinets shall be used for storage of

critical components like MMIC bare dice and oxygen sensitive

items like PCBs / mechanical hardware.

Transportation:

Para

No. Notes

Vendor’s

Compliance

Suitable packing (as specified in ISRO-PAS-207) shall be

provided for the transportation of the unit by air or road without

any degradation / damage.

Each unit shall be packaged in individual ESD protective

packaging and protect the unit from environmental conditions

encountered during transportation, like heat, humidity & dust.

This individual container shall then be placed in a transportation

container. More than one individual unit may be placed in the

transportation container. The transportation container shall

protect the units from heat, humidity, dust, mechanical shock &

vibrations during transportation.

The individual unit packages and transportation containers shall

be clearly marked with following instructions along with other

mandatory markings.

“ESD sensitive units”

“To be opened only under clean environment with ESD

precautions”

“High reliability space usage systems”

12.0 MODEL PHYLOSOPHY

Following Model shall be fabricated.

(a) Qualification Model (QM)

(b) Flight Model (FM)

Go ahead for QM shall be given after demonstration of

satisfactory performance of QM.

12.1 Test Applicability

Applicable tests for QM and FM are given in Table-2 below.

Table – 1: Tests applicability

Para

No. Notes

Vendor’s

Compliance

Sr.

No. Name of Test QM FM

1. Initial Bench test √ √

2. Burn-in test √

(168 Hrs)

√

(168 Hrs)

3. Post Burn-in performance test √ √

4. Humidity Test √ NA

5. Post Humidity performance test √ NA

6. Passive Thermal Cycling test √ √

7. Post thermal cycling

performance test

√ √

8. Active Sine Vibration Test √ NA

9. Post Sine Vibration elect.

performance test √ NA

10. Active Random Vibration Test √ √

11. Post random vibration elec.

Performance test √ √

12. Mechanical shock test √ NA

13. Post shock elec. performance

test √ NA

14. EMI Tests RS-103 RS-103

15. Thermo Vacuum test √ √

16. Final Bench Test √ √

Note:

1. At the end of each environmental /mechanical test, visual

inspection and electrical performance check shall be carried

out.

2. Vendor shall send the measurement data to SAC for review

& clearance for next test.

3. Suitable buffer connectors shall be provided to protect input /

output connectors of the device from wear and tear due to

Para

No. Notes

Vendor’s

Compliance

mating / de-mating with other connectors during testing.

Record of number of time mating / de-mating of connectors

shall be maintained.

12.2 Failure:

Deviation from the agreed electrical specifications shall be

treated as non-compliance, and as cause to reject the units.

Any failure observed at any stage during testing shall be reported

to SAC immediately. This shall be followed by detailed failure

analysis by Vendor clearly identifying the cause of failure as

random or design related. Any modifications required in electrical,

mechanical or fabrication process related aspects shall be

approved by SAC. In case of mechanical or electrical failures; a

retest plan or modification in the test plan may be necessary.

Based on the failure analysis, such retest plan / modified test plan

shall be decided and implemented after approval by SAC.

13.0 TEST CONDITION & DETAILS:

Following paragraphs give details of various tests to be

performed on QM / FM units. All the tests shall be conducted

using the equivalent FM Semi-Rigid cable assemblies except

vibration test.

External visual inspection shall be conducted after each

environmental test.

13.1 Physical Measurement:

All the units shall be examined for Mass and Dimensions.

Measured value shall be recorded.

13.2 Visual Inspection:

13.2.1 Internal Visual Inspection (Pre-Cap):

After completion of fabrication, internal visual inspection of the

units shall be carried out by Vendor QC to detect any

workmanship related deviation and non-conformance w.r.t

respective ISRO standards. SAC may audit the pre-cap visual

Para

No. Notes

Vendor’s

Compliance

inspection. Vendor shall inform the schedule of cover closing of

units.

13.2.2 External Visual Inspection:

All the units shall be examined visually at 10 X magnification

before and after each environmental test. The units shall be

inspected for surface finish, plating, mechanical and

workmanship related defects.

13.3 Initial Bench Test (IBT):

This test shall be performed to verify compliance to all the

electrical parameters and will be taken as reference for all

subsequent tests. Electrical parameters shall be measured as

specified.

13.4 Burn-In Test

For FM unit, burn-in shall be carried out at maximum Operating

Temperature while for QM unit, it shall be carried out at maximum

qual. Temperature, in power ‘ON’ condition. The duration of Burn-

in shall be 168 hrs. Data log for Time-Temperature shall be kept

for verification.

13.5 Post Burn-in Electrical Test:

This test shall be conducted at ambient temperature. Electrical

parameters shall be measured during Post burn-in functional

tests shall be performed.

13.6 Humidity Test:

This test shall be conducted on QM units as per the following

profile:

Para

No. Notes

Vendor’s

Compliance

Stabilize the humidity chamber at RH not less than 85% at any

temperature < 38 0C. Keep the unit inside the chamber. Follow the test

cycle. Repeat this cycle twice for a total duration of 48 hrs.

At the end of the test cycle remove the unit from the humidity chamber.

Detailed visual inspection and performance test shall be carried out

after the test. Also confirm that there is no corrosion, decolourisation,

fungus growth and any problem related to peeling off. Also examine

the connectors carefully, for any defect (under magnification, if

necessary).

13.7 Passive thermal cycling test:

QM and FM units shall be subjected to passive thermal cycling

test as per following profile. Electrical measurements shall be

carried out after the test.

Model Cold (T1) Hot (T2)

FM 10ºC 60ºC

QM 5ºC 70ºC

Para

No. Notes

Vendor’s

Compliance

13.8 Active Vibration Test:

Sine / Random vibration tests shall be carried out on applicable

QM / FM units. Visual & electrical measurement shall also be

performed after each Sine & Random vibration test. Vibration

levels given below are tentative. Levels may be changed

depending upon mechanical configuration.

Vendor shall generate a vibration test report in a standard format,

a shown in Annexure-4, which will be sent to SAC for review and

acceptance.

13.8.1 Resonance Search

Pre & Post Vibration, resonance search shall be carried out in all

the three axes as per following levels. Natural resonance

frequency (Fn) shall be greater than 100 Hz and drift in pre &

post vibration ‘Fn’ shall be within 10%.

Frequency (Hz) Amplitude

10 - 2000 0.5 g

Sweep rate 4 Oct / Minute

Vibration test sequence:

For QM Unit (all axis): LLS, Sine Vib, LLS, Functional test, LLS

Para

No. Notes

Vendor’s

Compliance

Random Vibration, LLS

For FM Unit (all axis) : LLS pre, Random vibration, LLS post.

Vendor shall use valid calibrated torque wrenches for fixture &

package mounting.

13.8.2 Sine Vibration:

Sine vibration test shall be conducted only on QM unit. The unit

shall be in operating condition for the duration of vibration test.

Gain and DC currents shall be monitored and logged

continuously during vibration.

Frequency (Hz)

Amplitude (g)

Longitudinal

Axis Lateral axis

10-16 20 mm DA 15 mm DA

16-100 10 g 6 g

Sweep rate 2 oct/min 2 oct/min

1 sweep in each axis shall be performed.

13.8.3 Random Vibration:

Units shall be subjected to random vibration tests with levels as

given below in passive mode. Frequency verses PSD plots shall

be obtained and shall be kept along with the test results for

verification.

Gain and DC currents shall be monitored and logged

continuously during vibration.

Frequency Power spectral density g2/Hz

Para

No. Notes

Vendor’s

Compliance

(Hz) QM

(X, Y & Z axis)

FM

(X, Y & Y axes)

20 0.002 0.001

68 0.002 0.001

250 0.138 0.062

1000 0.138 0.062

2000 0.034 0.015

Overall RMS 13.5 9

Duration 120 sec. 60 sec.

13.9 Mechanical Shock Test:

QM unit shall be subjected to mechanical shock test as per the

following test levels in all the 3 axes. Shock levels specified with

Q = 10.

Parameter Specifications

Acceleration 50g

Duration 10msec

Waveform Half Sine

No of Shocks 6 Shocks

(One/axis/direction)

Axis All 3 axis

(levels are tentative; it may change depending on mounting

location of the unit)

13.10 EMI /EMC Test:

RS-103 test shall be carried out at following frequencies and electrical

field levels on QM and FM Units. These frequencies levels and output

spurious specifications may be modified, and shall be informed at the

time of testing.

FREQUENCIES AND LEVELS FOR QM UNIT

Sr. No. Frequency (MHz) Field Strength

(V/m)

1 20 5

Para

No. Notes

Vendor’s

Compliance

2 30 5

3 40 5

4 49 5

5 60 5

6 80 5

7 100 5

8 150 5

9 240 5

10 402.52 to 402.85 (10kHz step size)

20

11 434 5

12 543 5

13 1310 5

14 1350 10

15 2211 20

16 2237.5 20

17 2259 20

18 2275 20

19 2720 5

20 2800 10

21 4000 5

22 5510 5

23 5660 10

24 5790 10

25 7000 5

26 8000 5

27 10000 5

FREQUENCIES AND LEVELS FOR FM UNITS

Sr. No. Frequency (MHz) Field Strength

(V/m)

1 49 5

2 402.52 to 402.85 (10kHz step size)

20

3 434 5

4 1310 5

5 1350 10

6 2211 20

Para

No. Notes

Vendor’s

Compliance

7 2237.5 20

8 2259 20

9 2275 20

10 2720 5

11 2800 10

12 5510 5

13 5660 10

14 5790 10

13.11 Thermo Vacuum Test:

Test severity is model dependent. This test is useful in identifying

failures related to workmanship, component and design deficiencies.

The temperature limits for these units are given in Table-4 and Test

profile is given in Fig. 2.

Table-4 Temperature Limits

Important Considerations for thermo vacuum test

It shall be ensured that thermo vacuum chamber is properly calibrated

prior to the start of the test.

The input and output cables shall be properly identified and calibrated.

It should be ensured that the temperature sensors are mounted at pre-

identified locations for monitoring package temperatures.

Procedure for Carrying out thermo vacuum test

a) The package shall be mounted on the base plate of the chamber. It

shall be ensured that the package is making proper contact with the

base plate of the chamber.

b) The reference and redundant sensors shall be mounted on the base

plate but very close to the package.

c) The patch panel connectors shall be properly identified and marked

for input and output terminals of the packages.

d) It shall be ensured that the sensors mounted at all identified

locations on the package are making proper contact and are in

Model Cold (T1) Hot (T2) Operating Hot

FM 10ºC 60ºC 40ºC

QM 5ºC 70ºC 40ºC

Para

No. Notes

Vendor’s

Compliance

working order.

e) Pre-thermo vacuum electrical parameter measurements at ambient

temperature and pressure in the chamber are considered as

reference for this test and are carried out in the open chamber

condition. The identified parameter measurements at pre-defined

temperatures shall be carried out after ensuring that the package

temperature has stabilized and power ON/OFF cycling is carried

out.

f) After post-thermo vacuum electrical parameter measurements at

ambient temperature and pressure in the chamber, the package

shall be taken out from the chamber and shall be inspected visually.

In case of failure of any type vendor has to inform SAC. A failure

analysis shall be required & corrective action suggested by SAC.

The unit will then undergo re-testing as per SAC recommendations.

g) Continuous monitoring and logging of gain shall be carried out

during the test.

Fig.2 Thermo Vacuum Test Profile

13.12 Final Bench Test (FBT):

The final bench test shall be conducted for measurement of

electrical parameters as given in test matrix. The test shall be

conducted at ambient temperature. All the test results shall be

recorded and any performance deviation with respect to Initial

Para

No. Notes

Vendor’s

Compliance

Bench Test shall be evaluated and shall be within specified limits.

13.13 Final Visual Inspection:

The unit shall be inspected for plating, surface, finish, mechanical

deviations, corrosion and workmanship related defects. No visual

degradation shall be allowed after completion of QM or FM test.

14.0 NON-CONFORMANCE MANAGEMENT:

Effective non-conformance management mechanism shall be

established by the vendor. Major non-conformance at any stage,

which affects the quality & reliability or the fabrication process of

entire lot, shall be reported to SAC immediately with

photographs, nature of non-conformance observed, etc.

Disposition shall be taken in consultation with QA, SAC.

However, for all the minor non-conformances, approval from SAC

is not mandatory, and shall be reviewed and discussed by the

vendor’s NCR board. Non-conformance report shall be generated

by the concerned agency and shall be reviewed and disposed-off

by the NCR board.

Any non-conformance affecting the fabrication and / or inspection

procedure shall be reported to SAC. Changes in related

documents shall be implemented and revision number of the

document shall be updated. This shall be followed by updating all

the documentation (fabrication, inspection, test etc).

All the non-conformances with the disposition given by the NCR

board shall be reported to SAC periodically. This shall be

followed by report of close out action completion, if any. For all

the non-conformance report, SAC representative shall be the

focal the person.

15.0 CONFIGURATION CHANGE CONTROL

The manufacturer shall follow an effective configuration change

control procedure during the fabrication stages. Plans for both

non-conformance and configuration change control shall be made

for submission to SAC for review and approval before initiation of

manufacturing activities.

16.0 DOCUMENT TO BE SUPPLIED :

Para

No. Notes

Vendor’s

Compliance

16.1 The following documents shall be supplied along with the quote:

a) Pont by point compliance to all the requirements of this

document.

b) Details to be provided as per QA check list given in Annexure-

3

16.2 The following documents shall be supplied during the contract:

a) Materials & Process List to be used for the fabrication of

units, detailing their quality level, procurement specifications,

traceability information, out gassing specifications etc.

b) CoC, screening (at Vendors / sub-vendors) reports, incoming

inspection report, batch acceptance test reports of Parts &

Materials

c) Record of Bias conditions of identifying the channel / junction

temperatures of all the active devices

d) Interface control drawing (AutoCAD soft copy)

e) Details of design modifications (wherever applicable) with

respect to the given details

f) Process Identification Document.

g) Test procedure documents for Qualification and Acceptance

tests with test conditions, procedures, list of equipment and

their calibration status, for review & approval by SAC

h) Non-conformance management plan

i) Configuration change control plan.

j) Program management plan

16.3 Following documents shall be supplied during the program with

respect to relevant activity.

a) Status report for the fabrication activity and test schedule.

b) Schedule for Cover closing of the QM and FM units

c) Details of test set-up and readiness

d) Non-conformance report at agreed intervals

Para

No. Notes

Vendor’s

Compliance

e) Failure Report; as and when failure occurs

16.4 Following detailed documents shall be supplied for each unit

along with deliverables, in soft copy on CD/ DVD.

a) T & E report of each unit containing detailed test results, test

history, conformance matrix, TBD value of components etc.

b) CoC of the deliverable units

c) CoC of parts & materials Including screening report

d) All fabrication details supplied by SAC for fabrication

e) Non Conformance reports with close-outs

Annexu

re-1

TEST MATRIX for QM

Sr.

No. Parameters

IBT

A/C

La

b.

Bu

rn-i

n

Po

st

Sin

e V

ibra

tio

n

Po

st

Ra

nd

om

Vib

rati

on

Po

st

Sh

oc

k

TO

T a

s P

er

Th

erm

al C

yc

le

FB

T A

/C L

ab

.

1 Gain √ √

2 Noise Figure √ √

3 Input Return Loss √ √

4 Output Return Loss √ √

5 P1dB (O/P) √ √

6 Rejection √ √

7 DC Voltage √ √

8 DC Current √ √

Para

No. Notes

Vendor’s

Compliance

Vendor’s Compliance:

Para

No. Notes

Vendor’s

Compliance

Annexu

re-2

TEST MATRIX for FM

Sr.

No. PARAMETERS

IBT

A/C

La

b.

Bu

rn-i

n

Po

st

Sin

e V

ibra

tio

n

Po

st

Ra

nd

om

Vib

rati

on

TO

T a

s P

er

Th

erm

al C

yc

le

FB

T A

/C L

ab

.

1 Gain √ √

2 Noise Figure √ √

3 Input Return Loss √ √

4 Output Return Loss √ √

5 P1dB (O/P) √ √

6 Rejection √ √

7 DC Voltage √ √

8 DC Current √ √

Vendor’s Compliance:

Para

No. Notes

Vendor’s

Compliance

Annexu

re-3

QA Check List

Vendor to provide complete details of following with relevant certificates.

Sr.

No

Details of information required Vendor

response

1 Point by Point compliance provided ? Yes / No

2 List each applicable process ISRO qualified at your /

sub-vendor’s facility, their qualification report &

qualification certificate.

Process Name Facility Certi. No.

a) Fabrication facilities: MIC /PCB

b) Component mounting & Assembly

process on,

MIC and PCB

c) Plating / Surface treatment

3 List of ISRO certified fabricator and Inspector for both

MIC and PCB work available at the time of bid.

4 Details of Test engineer with experience available at

the time of bid.

5 List of Test & Measuring instrument for optimizing RF

circuits with major specification like frequency range,

etc.

6 Location of test facilities likely to be used for following

tests shall be provided. (whichever applicable)

a) Physical Measurements

b) Visual Inspection (internal & external)

c) Electrical measurements

d) Burn-in

e) Humidity test

f) Passive thermal cycling test:

Para

No. Notes

Vendor’s

Compliance

g) Active Vibration Test (Sine & Random):

h) Mechanical Shock Test:

i) EMI /EMC Test:

j) Thermo Vacuum Test:

Para

No. Notes

Vendor’s

Compliance

Annexu

re-4

Para

No. Notes

Vendor’s

Compliance

Para

No. Notes

Vendor’s

Compliance