Flextronics

Product Innovation Center CONFIDENTIAL

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Product Innovation Center (PIC)

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Milpitas Product Innovation Center – Value Proposition

Flagship Center of Excellence Gateway Launch Center Best possible total customer experience and service level End-to-end solutions to enable full customer scalability Advanced technology with state-of-the-art equipment to support fast product development and launch Promote a success driven environment, culture and mindset

Objective Flextronics is committed to providing our OEM customers with advanced innovative

solutions and offerings that increase their competitiveness and time to market

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Zahid Hussain Vice President

Milpitas Global Operations Organization

Support Functions

Martin Morales

HR Manager

Business Supply Chain Operations

Micki Christensen

COE Manager

Juan Barrio

Controller

Matt Tester

IT Director

Kesavan Srikumar Engineering/Technology

Sr. Director

Paul Henningsen Strategy & Planning

Sr. Director

Jayne Carthy Business Development

Director

Open

NPI & Sustaining PM

Sr. Director

NPI and

Production Planning

Tim Griffin

Sr. Material Director

Procurement / Sourcing

Process Excellence

Mark Hanna

Operation

M4 & M6

Alan Cube

Mechanicals

General Manager

Stephen Chen

Engineer & QA

Director

Raymond Tran

Operation

Hall Mark Logistics and Order

Fulfillment Bernard Chan

Operation

M8 & M9

John Chu

Facilities Manager

Rachel Ha Administrator

Open

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Milpitas Product Innovation Center

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An ff campus Bldgs.: Logistics, Machining, Plating, Refurbishment and Repair

M1

M2 M3 M4 M5

M6 M7 M8 M9

NPI Enclosures

FA Lab

AEG Lab

System

Integration

Welcome

Center

PCBA &

System

Integration

NPI

MCC8

SOLAR Expansion Expansion

LabIX

MCC2

• Inclusive ecosystem for product innovation in one campus

• An average of 58k sq ft per building

• Off campus Bldgs.: Logistics, Machining, Plating, Refurbishment & Repair

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Flextronics Confidential

Flextronics Product Innovation Center (PIC) is the gateway to Flextronics

9 Manufacturing buildings on campus (3 dedicated to NPI)

4 additional manufacturing buildings off campus

1 Failure analysis lab

55k Active part numbers across

campus

85% Of lot size on campus are 100 pieces or less

11k+ Customer ECO’s per year (

300 additional ECO’s on the fly

Flextronics Milpitas PIC – Quick Facts

2 Customer Confidential Centers

97 Active customers

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Milpitas, CA – Manufacturing Overview

Site Details | MILPITAS

Site Address 637 - 1177 Gibraltar Court,

Milpitas, CA 95035, USA

Footprint 280K sq. ft. manufacturing space

110K sq. ft. DOF, warehouse

Headcount ~1200 employees

Markets Telecom, Server, Storage, Computing, Medical

Site

Capabilities

13 SMT lines, 1 backplane line, NPI, quick-turn

prototype, DFX, failure analysis, metal stamping,

adhesive dispensing and curing, system integration,

CTO/BTO, repair

Product

Examples

Solar modules, Automated Wafer Transport System,

PCBA for Aerospace & Defense,, High-end servers,

computing, switches/ routers, telecom amplifiers,

storage, data security, machine controls, RF tags, video

transmission equipment

Logistics 6 mi. (10km) to San Jose Airport

35mi. (56km) to San Francisco Airport

Certifications ISO 9001, ISO 14001, Tl9000, AS 9100, J-STD-001,

ESD 20-20, ITAR

Simple to Complex BTO/CTO Pick, Pack & Ship

Global Positioning

Devices

Data Storage

Appliances

Large System

Architecture

Manufacturing Offering

• Design Services • Electro-mechanical Assembly

• Engineering Services • Systems Integration

• Prototypes/NPI • New Product Development/DfX

• Sheet Metal: Soft Tool Fab. • Complex System Integration

Site Product and Capabilities Examples

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BGA

Smallest Pitch (0.3mm)

Highest Pin Count (3000)

Largest Package size 59.5 x 51 mm

1.27mm <=500 I/O to 1500<=2000 I/O to >2500 I/O

1mm <=300 I/O to 1500 <= 2000 I/O to >2500 I/O

Pitch =0.80mm, <=0.75mm

Pitch <=0.75mm

HyperBGA <=42.5mm to 52.5mm < =55.5mm

Flip Chip

Mirrored BGAs

BGA Replacement Double Sided

BGA Replacement Double Sided Mirrored

HiCTE

Non-symmetrical BGA, pitch - 1mm, I/O - 1944

CCGA

1.27mm >=500 I/O to >=1657 I/O

1mm >=300 I/O to >=1657 I/O

Smallest Pitch (0.8mm)

Highest Pin Count (2092)

LGA

Smallest Pitch (0.4mm)

Highest Pin Count (1156)

POP

POP (0.5mm + 0.65mm)

POP (0.4mm + 0.65mm)

Micro BGA/CSP

Pitch - 0.4 mm to 0.8mm

Rnet

High Density Rnet

Smallest Pitch (0.635mm)

Highest Pin Count (10)

MLF/QFN

MLF/QFN 0.5mm >=68 I/O>=100 I/O

MLF/QFN 0.4mm >=8 I/O

Smallest Pitch

Highest Pin Count

0805, 0603,0402,0201,01005

SIP R2D2 (Under AEG)

QFP/TSOP Smallest Pitch (0.3 mm, Pin count 240)

QSOP Smallest Pitch (0.5mm, Pin Count-28)

Stacked Devices

Stack Die

Straddle Mount

Hirose IT2, IT3

NexLev Connector 23.5 mm,15.5 mm,10.5 mm

Mictor <=200 pin; >200 pim

Pressfit VHDM <200pins

Pressfit VHDM 200 <=400pins

Pressfit VHDM 401 <=800pins

Pressfit VHDM 801 <=1200pins

Pressfit VHDM >=1201pins

Pressfit VHDM - PCB Thickness <0.093mils

Pressfit VHDM - PCB Thickness 0.093<=0.110mils

Pressfit VHDM - PCB Thickness 0.111<=0.118mils

Pressfit VHDM - PCB Thickness 0.119<=0.126mils

Pressfit VHDM - PCB Thickness >=0.127mils

Pressfit GBX - PCB Thickness <0.093mils

Pressfit GBX - PCB Thickness 0.093<=0.110mils

Pressfit GBX - PCB Thickness 0.111<=0.118mils

Pressfit GBX - PCB Thickness 0.119<=0.126mils

Pressfit GBX - PCB Thickness >=0.127mils

BGA MegArray <=300 I/O

BGA MegArray >=300 I/O

Double Sided Pressfit

Largest PCBA 24"W x 36" L

Thickness >0.126

Micro Visa, Burried/Blin Vias

Ceramic, Meg3/4/5, Aluminium, Halogen Free

Chip Packages

Stacked Packages

QFP/TSOP/QSOP

Connectors

PCB

Milpitas Component Package Capabilities

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Full Scale Manufacturing

• PCBA, Backplane, Enclosure, System Integration,

Direct fulfillment, CTO,RMA and Repair services

(Replace, Re-ball, Rework /Jumpers, others)

Manufacturing Engineering Support

Early engagement

• DFM (Valor Trilogy), DFA (Boothroyd

Dewhurst),DFT, DFSC

Technology and Process Qualification

• 01005,0201,0.3mm CSP, Pb/HF free, fiber

splicing/routing, RF

Full Test suite

• SPI, AOI, 5DX, Flying probe, ICT, Boundary scan,

FCT, UTS, Hipot

Special Process

• Heat-sink assembly, Edge bonding, RTV,

Conformal Coating, Underfill

Reliability Test

• ESS, HALT/HASS, ORT

ROHS, WEEE, REACH, EuP*

New Product Introduction Services

Repair &

Refurbish

*Restriction of hazardous substances ,Waste Electrical and Electronic Equipment,

Registration, Evaluation, Authorization and Restriction of Chemical substances ,Energy Using Product,,

Volume

Production

Product

Stabilization

Rapid

Prototyping

Design &

Engineering

Product

Concept

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DFM

DFA

DFT

• BOM: AVL/ AML Analysis.

• Fabrication.

• PCBA.

• Mechanical Tolerance

• Stack up Analysis.

• Mechanical Assembly.

• Test Strategy.

• Yield Prediction.

• ICT Fixture Stress Analysis.

Boothroyd & Dewhurst DfA

eFDa Geometric Package library

eFlex Design Automation GUI

eFDa PCB Viewer

eFDA Results Viewer

eFDa Yield Prediction Tool

Flex DFM Sheet Metal

Analysis Tool

Test Way DFT Analysis Tool

EMS / ODM Products

Flex FEA Analysis- PCBA Tool

Flex Tolerance Stack-up Analysis Tool

Flextronics DFX Toolbox

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Did You Know …

Flextronics PIC Product Development

• Concept through production • Quick turn procurement & assembly • Supply chain strategy • Virtual manufacturing floor • Test strategy & development • Transfer to production

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Did You Know …

Automated Platform

• Global platform

• Automation speed

• Supply chain responsiveness

• Consistency

• 2,000 customers and over 20,000

suppliers

• Milpitas Flextronics sets the global

standards O

ther 3

PL

Suppliers Customer

FlexFlow web access

D. S. S.

Customer Portal

Supplier ERP/MRP

EDI/XML Web-FC

EDI/XML

Web

EDI/XML

PC/Clients SFC-System Q-System

PC/Clients

Shipment Tracking

Customer’s ERP

Web

FMS

Logistics tracking

We

b

Me

tho

ds

FSP

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Did You Know …

Customer Confidential Centers

• Private manufacturing centers • State of the art manufacturing

equipment • Airport type security • NDA access only • Metal detectors • Stealth stock room • 3D plastic printer • 2 break-out labs

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Did You Know …

3D Plastic Print Capability

• No tooling required

• Size 19.7 x 15.7 x 7.9 inches

• 8 material types in one sample

• Most of the samples run in 24 hours

• CAD data of sample is required

Samples of Objet Connex Parts

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Did You Know …

3D Metal Print Capability • No tooling required

• Size 9 x 9 x 12 inches

• Material types: • Aluminum/Cobalt & Alloy

• Chrome

• Steel/Nickel & Alloy

• Titanium

• Most of the samples run in 24 hours

• CAD data of sample is required

Samples of EOS M280 3D Metal Printer

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Did You Know …

Samples of 3D Metal Printer

Skull plate printed in 3D metal

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Did You Know …

Robotics

• Deploying robots • Objective is to remove non value add

activities from employees • Increase productivity and lower cost • New robots are “human” looking and

user friendly - Baxter

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Did You Know …

Prototype Sheet Metal Manufacturing

• Prototype facility • Quick turn, soft tooling • DFx Manufacturing • Engineering support • Changes on the floor

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Did You Know …

Failure Analysis Laboratory • Mechanical Tests: shear & pull, dye & pry • Metallurgical Analysis: cross-sectioning, SEM/EDX, photomicrography,

EDXRF for RoHS compliance • Chemical Analysis: FTIR, ion chromatography • Non-Destructive Test & Inspection: x-ray laminograph; radiograph,

OGP, C-SAM • Reliability Test: HALT/HASS, ATC • Drop testing

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Did You Know ……

Advanced Engineering Laboratory

The objective of this lab is to have dedicated team and

space to keep Flextronics ahead of new technologies

entering the industry. To support our advanced

technology roadmap

- Milpitas, California

- Dedicated SMT line and equipment

- Robotics laboratory

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• Aerosol jet printing for 10 micron lines with nano

silver

• Printable Batteries…bendable, safe and

rechargeable.

• Reel to Reel capabilities for HVM

• Low temperature interconnect with nano copper (75C

to 180 C nano copper pillar technology)

• High Thermal Conductivity epoxies ( >150W/mK)

• Thermal Distribution Sheets (TDS) ( > 800W/mK,

twice better than copper)

• Indestructible glob tops for IP protection

• Strong IP portfolio... essentially defensive patents to

be shared with our preferred customers .

• Close collaboration with Consortiums like iNEMI,

IMAPS, HDP & Universities like HKUST, Georgia

Tech, UNC, USC and Berkeley

Advanced Engineering Laboratory

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End-to-End Supply Chain Management

Repair / Service

Parts Logistics

Hubbing and

Distribution

Worldwide

Direct

Fulfillment

Supplier

Managed

Inventory

• Test, repair and

refurbishment

• Service parts

distribution

• Pick-pack-ship

• Finished goods

hubbing

• 70% of

shipments to end

customer

• 70% of spend on

SMI

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In Closing

Well positioned with scale,

capabilities and cost structure

Balanced customer and product portfolio

Well positioned for eco-system shifts

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Thank you for your time today. If you

have any further questions please do

not hesitate to contact me or a

member of our Flextronics team.

www.flextronics.com