Chapter 1 - Introduction to IC Design

8/12/2019 Chapter 1 - Introduction to IC Design

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IC DESIGN AND PROCESSBENM 3 33


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Learning Outcomes At the end of this subject, student should

be able to: Discover the IC design technology, structure of CMOS

devices, fabrication and packaging process. [PO1,C3] Analyze a CMOS operation and characteristics. [PO2,C4] Design transistor-level logic and layout design for CMOS

technology. [PO3,C5] Demonstrate a report on a digital circuit design project to

recognize the needs for, and ability to engage inindependent and life-long learning as well as identifyentrepreneurial and business opportunities in related area.[PO11,A3]


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Week Session Syllabus

1 Lecture 1

17/2-21/2Introduction

Chapter 1: Introduction to IC Design

History of microelectronicsComponents for logicA brief history of MOSTIntroduction to ICClassification of ICIC designWhy design ICIC design hierarchy

IC technologies (CMOS, Bipolar & BiCMOS)

2 Lecture 224/2-28/2Tutorial 1

Chapter 2: CMOS Characteristics and Analysis Review of MOS transistorspn-junctionMOS Transistors : nMOS and pMOS

3 Lecture 33/3-7/3 Chapter 2: CMOS Characteristics and Analysis MOS modes and regions of operationsMOS enhancement transistors


Chapter 2: CMOS Characteristics and Analysis IV characteristicsNon ideal IVCV characteristics


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5 Lecture 517/3-21/3

Lab 1

Chapter 2: CMOS Characteristics and Analysis DC response : CMOS inverter, voltage transfer characteristic, operating regions, betaratio, threshold voltage.


Chapter 3: CMOS Circuits and Logic Design Design representationsComplementary CMOSMOS transistors switches

CMOS logic

7 Lecture 731/3-4/4

Test 1

Chapter 3: CMOS Circuits and Logic Design InverterCombinational logicNAND gateNOR gateCompound gate

8 MID TERM BREAK (7/4-11/4)


Chapter 4: IC Layout and Design IntroductionLayout design rules and layout considerationsnMOS transistor layoutCMOS inverter layout


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10 Lecture 921/4-25/4

Lab 2

Chapter 4: IC Layout and Design Stick diagram: stick diagram color code, transistor, implied connections andcrossovers, contacts and taps.Practice of stick diagram

11 Lecture 1028/4-2/5

Assignment

Chapter 4: IC Layout and Design Layout designMask layoutComplex logic gates layout

12 Lecture 115/5-9/5

Lab 3

Chapter 4: IC Layout and Design Euler pathMultiple gatesMulti-cell layout

13 Lecture 1212/5-16/5

Chapter 5: IC Fabrication & Process Technology IntroductionSilicon semiconductor manufacturing technologySemiconductor device fabricationFabrication process: silicon wafer preparation, epitaxial growth, oxidation.


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14 Lecture 1319/5-23/5

Industrial TalkTutorial 5

Chapter 5: IC Fabrication & Process Technology Fabrication process (cont) : photolithography, diffusion, ion implantation,etching, isolation, metallization, packaging.

15 Lecture 14

26/5-30/5Test 2

Chapter 5: IC Fabrication & Process Technology

SiO2 patterningLOCOS/STIBasic CMOS technologyCross -section

16 REVISION WEEK

17, 18 EXAMINATION WEEK


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References Sung-Mo Kang, Yusuf Leblebici, CMOS Digital Integrated Circuits, McGraw

Hill, 2009.

B. L. Anderson, R. L. Anderson, Fundamentals of Semiconductor Devices ,McGraw Hill, 2008. J. M. Rabaey, Digital Integrated Circuits: A Design Perspective , Prentice

Hall, 2009. Muhammad H. Rashid, Microelectronic Circuit: Analysis and Design ,

Cengage Learning, 2010. Behzad Razavi, Design of Analog CMOS Integrated Circuits , Mc Graw Hill,

2010.


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Evaluation


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Introduction to IC DesignCHAPTER


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HISTORY OF MICROELECTRONICS Science of electronics began in 1895 Lorentz postulated existenceof electrons

By 1897, Braun built simple cathode-ray tube (the 1st

electronvalve)

Beginning of century, Fleming invented Diode he called a valve

In 1907, Lee De Forest made a triode & can amplify signals

By 1940s several scientist in Bell Labs start investigating materialcalled semiconductors

Then they made a diode from it that have many advantages NoVacuum, Much smaller, Operate well in Room temperature & Nowarm-up time The start of Microelectronics !!!


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HISTORY OF MICROELECTRONICS(cont..)

In 1948, William Shockley at Bell Lab invented Transistor act asamplifier & Received Nobel Price in 1956

By 1953, Transistors were small enough to be fitted in ear & canoperate in higher freq within larger temperature ranges, then itbecame so small that many can be placed in single piece of silicon Microchips & They started the Microelectronics Industry !!

By 1960s, several transistors put on single IC, further refined intoSSI (Small-scale integration : < than 100 transistors), 1966 evolvedto MSI (Medium-scale integration : > than 100 but < than 1000transistor), Next to LSI (Large-scale integration : > than 1000), thenVLSI ( > than 100 000 transistors) & now ULSI ( > than 1 miltransistors)


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Components for Logic

Diode p n

Bipolar Transistors npn

pnp

MOS TransistorsEnhancement Depletion

N-channel

P-channel

n np

G

DS

Silicon Oxide Insulator

Field Induced N-channel

SUB

B

E

C


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A Brief History of MOST Basic principles proposed by J. Lilienfeld as early as 1925 !!! In 1935, O. Heil resembling closely structure of modern MOS transistor Materials problem foiled these early attempts & led to invention of Bipolar

transistor MOS remained oddity till invention of Si planar process in 1960 led to MOS

calculator in 1965 using single-polarity p-type transistor Used of both polarity transistor on the same substrate was invented in early

1960 s by 2 people: P.K. Weimer issued on May 22, 1965 that featured elements of modern CMOS flip-

flops led to TFT technology Frank Wanlass Fairchild S/C R&D granted on 5 Dec 1967 that covered CMOS

concept & three ccts : Inverter, NOR & NAND using MOS Devices Hallmark of CMOS LOW POWER DISSIPATION has overcome bipolar popularity

Initially used for low power application such as watches CMOS technology has increased in level and now it clearly holds the center stage

as the dominant of VLSI technology


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Introduction to IC In electronics, an integrated circuit:

Also known as IC, microcircuit, microchip, silicon chip

or chip. Is a miniaturized electronic circuit:

Consist of semiconductor active devices (diode, BJT,MOS, CMOS inverter) and passive components (resistor,capacitor, inductor).Manufactured in the surface of a thin substrate ofsemiconductor material.


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Basic Definition of IC Is a miniature, low cost electronic circuit consisting of active

and passive components that are joined together on a singlecrystal chip of silicon.

Advantages of IC miniaturization leads to increased equipment density. system reliability is increased because soldering is avoided. the cost is low because ICs are manufactured in a batch process. operating speed is increased. power consumption is decreased.


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History of Integrated Circuits Integrated circuits, i.e., devices with multiple electronic

devices on the same substrate,

were invented in late 1950s, by Jack St. Clair Kilby at TexasInstruments,Inc. In 1970s, Gordon Moore, on of the founders of Intel ,

predicted that the number of transistors per chip doubles every onesand a half years.

The minimum channel length of MOS transistors droppedfrom 25m in 1960s to 90nm in the year 2002,

with benefit of much higher complexity, smaller volume and higherspeed.


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Integrated Circuits of Ten or TwentyYears Ago A signal processing system required multiple:

analog IC chips (amplifiers, filters and A/D and D/A converters) digital IC chips (memory, DSP and interfacing logic) and plenty of

passive discrete components. Analog and digital IC chips were traditionally designed and

fabricated in different technologies. analog circuits use bipolar technologies digital circuits are in MOS technologies.

A system which consists of a large number of integrated anddiscrete components is power hungry, huge and expensive.


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Integrated Circuits of Today Most of the integrated chips have both analog and

digital circuits. is called mixed-signal integration .

Penetrating into every corner of our everyday life,from supercomputers, space probes, medicaldiagnostic equipments and etc.

Digital circuit design is mostly automated from logicsynthesis to placement and routing while analog circuit design remains as an almost all

handcrafted art.


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Integrated Circuits of Today (cont..)

Figure 1.0: Mixed-signal system-on-a-chip (SoC) integration


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Classification of IC ICs can be classified into different types depending

on: Linearity type of transistor used

or manufacturing process.


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Classification of IC (cont..) Linearity.

can be classified as either linear or digital.linear ICs:

have any output voltage and will follow linearity principleinside the specified range.is the operational amplifier or op amp, which consists of

resistors, diodes, and transistors in a conventional analogcircuit.

digital ICs :have only two possible output levels.Example: Logic gates and flip-flop


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Classification of IC (cont..) Transistor

BJT ICs use Bipolar Junction Transistors and FET ICs useField Effect Transistor.

Manufacturing can be classified as either hybrid or monolithic.


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Classification of IC (cont..) Manufacturing

Hybrid IC:electronic circuit integrated on the ceramicsubstrate using various components and thenenclosed in the single package

are combinations of monolithic, film anddiscrete components.

is often encapsulated in epoxy, as shown in

the Fig. 1. 1.is used for high frequency and highpower(e.g communication system, voltageregulator, etc). Figure 1.1


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Classification of IC (cont..) Manufacturing

Monolithic IC:called a chip or die, contains both active and passive elements.entire circuit is built into a single piece of semiconductor.

the most common integrated circuits such as microprocessors,memories, etc.


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IC Design Integrated circuit design:

Is a subset of electrical engineering.

encompasses the specialized design techniques required tobuild miniaturized electronic components into an electricalnetwork on a monolithic semiconductor substrate.

involves the creation of electronic components such as

transistors, resistors, capacitors and the metallicinterconnect of these components onto a piece ofsemiconductor (silicon).


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IC Design (cont..) A method to isolate the individual components formed in the

substrate is necessary since the substrate silicon is conductive

and often forms an active region of the individualcomponents. The two common methods are:

p-n junction isolation dielectric isolation.

Attention must be given to: power dissipation of transistors andinterconnect resistances

current density of the interconnection,contacts and vias.

since ICs contain verytiny devices comparedto discretecomponents


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IC Design (cont..) the physical layout of certain circuit sub blocks is

typically critical: in order to segregate noisy portions of an IC from quiet

portions to balance the effects of heat generation across the IC

OR to facilitate the placement of connections to circuitry

outside the IC.


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IC Design (cont..)

IC design falls into two broad categoriesdesign techniques : digital IC analog IC


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IC Design (cont..) Digital IC Design:

focuses on maximizing circuit density and placing circuits sothat clock and timing signals are routed efficiently.

Increasing the switching speed and minimizing capacitanceof the interconnection.

maximizes the performance of microprocessors, FPGAs,RAM, ROM, flash memories and digital ASICs.


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IC Design (cont..) Analog IC Design:

is more concerned with the physics of the semiconductor devices such

as gain, matching, power dissipation, resistance, etc. Fidelity of analog signal amplification and filtering is usually critical and

as a result, analog ICs use larger area active devices than digital designsand are usually less dense in circuit.

has specializations in power IC design and RF IC design. is used in the design of op-amps, linear regulators, phase locked loops,

oscillators and active filters.


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A typical IC design cycleinvolves several steps:


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Why Design Integrated Circuits Size

ICs are much smaller

both transistors and wires are shrunk to micrometer/nanometer sizes,compared to the millimeter or centimeter scales of discrete components. Small size leads to advantages in speed and power consumption,

since smaller components have smaller parasitic resistances, capacitancesand inductances.

Speed Signals can be switched between logic 0 and 1 much quicker within a

chip than they can between chips. Communication within a chip can occur hundreds of times faster than

communication between chips on the PCB. The high speed of circuits on-chip is due to their small size

smaller components and wires have smaller parasitic capacitances that slowdown the signal.


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Why Design Integrated Circuits(cont) Power Consumption

Logic operations within a chip also take much lesspower.

Once again, lower power consumption is largely due tothe small size of circuits on the chip

smaller parasitic capacitances and resistances requireless power to drive them.


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Integrated Circuits Design Hierarchy ICs are microscopic electronic network that are created in a

special type of material called a semiconductor.

Silicon is a semiconductor and is used as the base material forthe vast majority of modern electronic systems. ICs are quite complex, and a complete understanding of every

aspect of chip design and fabrication requires several years ofstudy and practical experience.

Design task is made easier by breaking the problem intodesign hierarchies where the problem is viewed at severaldifferent levels.


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Integrated Circuits Design Hierarchy(cont) System Design

Main operations of the chip are determined. Blockdiagrams are used to illustrate the main sections that makeup the system. Only the input / output characteristics areimportant, and there are no details about what actually isinside each block.

Logic Design Design the logic networks that are required inside eachblock to obtain the input/output characteristics used at the

system design level. The output is generally in the form of anetlist, which is just a description of the logic gates andwiring needed to implement the design.


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Integrated Circuits Design Hierarchy(cont)

Circuit Design Logic network is transformed into an electronic network using transistors as

switching devices. Digital variables are represented by voltage levels that

change in time. Transistors allow the designer to create logic circuits that steersignals into different paths using switching mechanisms. Physical Design

Electronic circuits are transformed into on-screen colored geometrical patternsusing computer graphics and analysis tools. Each color or shading represents amaterial, such as a metal, and the patterns indicate how to form 3-D transistorstructures and wire them together.

Chip Fabrication The physical design is transformed into a finished silicon chip that can be put

into a package for eventual wiring into a product.


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CMOS, Bipolar and BiCMOStechnologies

CMOS and Bipolar in silicon are the two mainstream

semiconductor technologies. BiCMOS is the combination of the above two, which

has both CMOS and bipolar transistors. BiCMOS = CMOS + Bipolar


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CMOS, Bipolar and BiCMOStechnologies (cont..)

CMOS technologies have the advantages of: Low cost for very large scale integration of both high-density digital

circuits ( DSP and memory) and analog circuits (amplifiers, filters, A/D& D/A converters).

High accuracy sample data circuits for ideal properties of MOS switchessuch as switched-capacitor filters and A/D & D/A converters.

new CMOS technologies with smaller feature sizes can operate atincreasingly high speed, comparable to some bipolar technologies.

More efficient in power consumption


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Bipolar silicon technologies: bipolar transistors can operate at higher frequencies than

CMOS with relatively smaller consumption.

suitable for pure analog integration with relatively highoperating speed (RF circuits) or relatively high powerapplications .

digital circuits in bipolar are power hungry, prohibiting verylarge scale integration.


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BiCMOS technologies have most advantages of bothCMOS and bipolar technologies

but at the expense of higher manufacturing cost due torequired extra processing steps.

The performance of bipolar transistors in BiCMOSare usually inferior to that of pure bipolartechnologies.

Thus CMOS technologies become mainstream technologiesfor mix signal integration due to the advantages of low costand high integration density.

Documents

Chapter 1 - Introduction to IC Design