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Powering the c-Si Roadmap
APPLIED HCT WAFERING SYSTEMS
32
Silicon and wafering costs together represent over 50% of module cost. They must be reduced dramatically to meet industry cost reduction objectives.
The rapid expansion of solar energy is fueled by a relentless reduction in cost per watt. Because silicon and wafering represent over 50% of total module cost, advances in wafering technology are paramount. Applied HCT, the world leader in wafering technology, is accelerating the c-Si
Wire size has a major impact on silicon cost through kerf loss. Process optimization drives nearly 1/4 of total wafer cost, primarily through slicing yield, wire and slurry consumables and tool fixed costs. Process performance has direct impact on wafer slicing yield. Wafering process optimization is also critical to achieve even thinner wafers.
Achieving lowest overall wafering cost requires process optimization among multiple variables. Each reduction strategy has potential trade-offs. An integrated approach to process optimization using platform design flexibility, advanced consumables and process know-how is required for lowest total cost.
WAFERING COST
LOWEST TOTAL COST PER WAFER
PROCESS OPTIMIZATION CHALLENGE
DRIVINGDOWN
THE CHALLENGE
Slicing YieldYield has tremendous leverage in reducing wafering cost. Yield is affected by wafer surface quality (TTV, TV, saw marks) and wafers lost during the wafering process (wafer and wire breaks). Advances in net throughput, consumables and wire technology must be accomplished without sacrificing yield. Large load size and advanced wire handling, along with tight process control and sophisticated tool automation are key yield enablers.
Reduced Silicon UsageSilicon is still the largest single cost component of wafer cost. Ultra-thin wire capability is required to reduce kerf loss but it can come at the expense of productivity to keep slicing yield high. Balance of the trade-off depends largely on raw silicon market price which can fluctuate and so can optimal wire size. Thinner wafers lower the cost of Si per wafer but challenge kerf loss, yield and productivity. Careful process optimization is required to achieve the potential gain.
Consumables CostWire and slurry consumption drive consumables cost. Slurry recycling is a powerful way to lower slurry cost if slicing yield is not impacted. Wire breakage severely impacts consumables cost — process optimization is critical in keeping productivity high at the same time as maintaining low wire breakage rates. Advanced wire technologies, such as structured and diamond wire, promise to lower consumables cost per wafer while boosting productivity.
Net ThroughputAchieving high productivity or MW/Y from the system has a direct impact on fixed costs and return on invested capital. Both higher table speed and higher load size can boost productivity but careful balance with yield is required.
TargetCurrent
Mod
ule
Cos
t – $
/Wat
t
Modules
Cells
Poly and Wafer
$1.40
$1.20
$1.00
$0.80
$0.60
$0.40
$0.20
$0
Poly andWafer
Poly andWafer
Cells
Modules
Cells
Modules
roadmap with process solutions to attack all high leverage areas that reduce wafer cost. From advances in platform architecture that enhance productivity and performance, to accelerating new wire technology, Applied HCT is propelling the industry forward with unique wire saw innovation.
Silicon and wafering are >50% of module cost
Driving c-Si to below $1 per watt
Wafering influences nearly 2/3 of wafer costs
Wafering cost reduction strategies
MaterialYield(kerf)
Wafer Si Consumables
Capital CostsSlicing Yield
WaferingWafer Cost
Thinner Wire
Higher Table Speed
Lower Wire Speed
Recycled Slurry
Thinner Wafer
Increased Material Yield
Decreased Fixed and Wire Costs
Decreased Wire Cost
Decreased Slurry Cost
Decreased Si Wafer Cost
Reduced Productivityand Slicing Yield
Reduced Slicing Yield
Reduced Slicing Yield
Reduced Slicing Yield
Reduced Productivityand Material Yield
54
THE APPLIED HCT B5
B5 WAFERING TECHNoLoGyTHE FUNDAMENTAL ADVANTAGE OF LARGER LOAD SIZE
A wider process window delivers yield with higher productivity
B5 uniquely optimizes load and table speed for lowest total cost
With 2x the load potential of conventional competing systems, the B5 gives users a wider process window to tune load size and table speed for highest yield and productivity and as a result lowest wafer cost.
As load size increases above 1m, table speed is reduced to optimize performance and yield. However, the larger load size more than compensates, delivering higher overall productivity. At work here is the unique relationship linking productivity to table speed and load, P = ƒ (load size x table speed) and higher tool uptime with less frequent swaps of larger loads. By tuning load and table speed, users can maintain yield and rapidly increase productivity, for the lowest total cost.
Reference data collected by Applied HCT on a B5 with 120μm wire, 180μm wafer, 80% recycled slurry, with load size 0.85m, 1.1m and 1.73m.
BEST IN CLASS YIELD INDUSTRY’S HIGHEST PRODUCTIVITY LOWEST TOTAL COST
• The benchmark in process performance
• Industry leading throughput and lowest total cost
• Designed for high availability in volume manufacturing
• Proven thin wire capability down to 120μm and below
• Robust platform extendable to advanced wire technologies
Load Length
Tabl
e Sp
eed
1mLoad Tool
2mLoad Tool
Productivity = ƒ (load size x table speed)
Flexible loading up to 2m
The unique 4 position architecture has the capacity for up to 2m in total load, easily configurable to provide a high degree of flexibility to meet industry roadmaps at high yield with major advances in productivity.
B5 2m Load LengthConventional 1m Load Length
1m 1.25m 1.5m 1.75m 2m
Load Length
0.6
400
350
300
250
200
150
Optimized table speed
Minimum table speed
0.8 1.0 1.2 1.4
Load in Meters
Tabl
e Sp
eed
in µ
m/m
in
1.6 1.8 2.0
9.5
9.0
8.5
8.0
7.5
7.0
0.5 1.0
Load in Meters
Prod
uctiv
ity in
MW
/Y
1.5 2.0
0.5 1.0
Load in Meters
Tota
l CoO
in $
/waf
er
1.5 2.0
0.6
100%
99%
98%
97%1.0 1.4
Load in Meters
Table Speed Productivity in MW/Y
Process Yield Wafer Total Cost
Slic
ing
Yie
ld %
1.8
76
THE DIFFERENCE
BEST IN CLASS YIELD 98% yield with >15% more productivityData collected at Applied HCT Cheseaux R&D Center: 120µm Wire, 180µm Wafer and 80% Recycled Slurry
INDUSTRY’S HIGHEST NET THROUGHPUT AND LOWEST TOTAL COST
Total wafer cost savings combined with higher productivity results in a powerful cash flow generation per tool advantage for wafer manufacturers. The B5 advantage results in a 20% higher net cash flow generation.
A wider B5 process window enables high yield with greater productivity. Comparison of process data for runs at 0.85m, 1.1m and 1.73m loads shows virtually identical process yields >98% at industry leading 30µm TTV, 20µm TV and 20µm saw marks limit while productivity increases by nearly 25%.
As part of the 20% productivity advantage of larger load, lies a lower system downtime advantage due to less frequent swaps of larger loads.
Both load sizes demonstrate best in class performance TV yield >98% at <20µm limit.
Total wafer cost modeling comparison at 120µm wire size and 180µm wafer size shows as much as a 3¢/wafer total CoO advantage between a 7.9MW/Y 0.95m load conventional tool and a 9.2MW/Y 1.73m load B5.
Both load sizes demonstrate best in class performance saw marks yield >98% at <20µm limit, with a 13µm average.
At industry leading 120µm wire size and 180µm wafer thickness, the B5 load advantage delivers >15% higher productivity per system when compared with conventional 1m load tools. When combined with the B5 25% footprint advantage over these same tools, the productivity advantage for a given factory size approaches 50% more wafers per year.
Both load sizes demonstrate best in class performance TTV yield >98% at <30µm limit, with a 15µm average.
20% GREATER CASH FLoW/TooLyIELD LoAD SIZE CoMPARISoN
30% LoWER SySTEM DoWNTIMETV LoAD SIZE CoMPARISoN
3¢ LoWER CoST/WAFERSAW MARKS LoAD SIZE CoMPARISoN
TTV LoAD SIZE CoMPARISoN
Productivity is driven by larger load size
High availability through reduced loading frequency
100
90
80
70
60
50
40
30
20
10
0
TTV<30μmPos A1.41%
TT
V μ
m
TTV<30μmPos D0.86%
100
90
80
70
60
50
40
30
20
10
0
TTV<30μmPos A1.54%
TTV Average
TTV<30μmPos B1.46%
TTV<30μmPos C1.06%
TTV<30μmPos D1.21%
TT
V μ
m
TTV LimitTTV Average
0.85m Load, 7.4MW/Y 1.73m Load, 9.2MW/Y
TTV Limit
50
45
40
35
30
25
20
15
10
5
0
SM<20μmPos A0.66%
Saw
Mar
ks μ
m
SM<20μmPos D0.67%
50
45
40
35
30
25
20
15
10
5
0
SM<20μmPos A1.54%
TTV Average
SM<20μmPos B1.71%
SM<20μmPos C0.59%
SM<20μmPos D0.51%
Saw
Mar
ks μ
m
TTV LimitTTV Average
0.85m Load, 7.4MW/Y 1.73m Load, 9.2MW/Y
TTV Limit
230
220
210
200
190
180
170
160
150
140
130
TV±20μmPos A0.50%
Thic
knes
s μm
TV±20μmPos D0.57%
230
220
210
200
190
180
170
160
150
140
130
TV±20μmPos A0.83%
TTV Average
TV±20μmPos B
2.20%
TV±20μmPos C
0.94%
TV±20μmPos D0.81%
Thic
knes
s μm
TTV LimitTTV Average
0.85m Load, 7.4MW/Y 1.73m Load, 9.2MW/Y
TTV Limit
0.85m, 7.4MW/Y
Limits: 30μm TTV, 20μm TV, 20μm Saw Marks
1.1m, 8.6MW/Y 1.73m, 9.2MW/Y
100%
99%
98%
97%
96%
95%
94%
93%
92%
91%
90%
0.95m Load, 7.9MW/Y 1.73m Load, 9.2MW/Y
2.21
2.20
2.19
2.18
2.17
2.16
Tota
l CoO
in $
/Waf
er
0.95m Load7.9MW/Y
1.73m Load9.2MW/Y
0.95m Load7.9MW/Y
Discounted Cash Flow (10%)Net Cash Flow
1.73m Load9.2MW/Y
12
10
8
6
4
2
0
5 Ye
ar N
et C
ash
Flow
Per
Too
l in
$M
0.95mConventional
1.73mOptimized
9.5
9
8.5
8
7.5
7
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0.95mConventional
MW
/Y P
er T
ool P
er m
2 of F
acto
ry
MW
/Y P
er T
ool
1.73mOptimized
0.95m Load, 7.9MW/Y
1.73m Load, 9.2MW/Y
Load SwapDowntime
>15% MoRE MW/y PER TooL
98
DESIGNED FOR HIGH AVAILABILITY IN VOLUME MANUFACTURING
PROVEN THIN WIRE CAPABILITY DOWN TO 120μm AND BELOW
Flexible load sizeFlexible 2m maximum load size, in 0.25m increments, lets factories adjust capacity and achieve the highest yield and productivity.
Reduced downtime for slurry changeThe B5 design provides for simple, rapid change of slurry canisters, with the option for automatic slurry refill.
Greater process reproducibilityInterface to Applied’s E3 process automation software enables real-time data logging, fault detection and function control.
Minimal downtime for breakageEarly-warning wire wear detection alerts operators before wire failure, minimizing yield loss and downtime.
Reduced footprintWith 25% smaller footprint than competing tools, the B5 produces 50% more MW annually for a given factory size.
Minimal wire breakageAdvanced wire management continuously controls acceleration, tension and alignment angle for low breakage and consistent cut.
PRoVEN PERFoRMANCE
Low inertia wire managementA proprietary low-inertia design carefully controls wire vibration and strain at the wafer level and reduces tension in transition periods.
Controlled acceleration and deceleration algorithmsThe B5 system’s control software continuously manages wire acceleration/deceleration to reduce the potential for wire breakage.
Continuously adjustable wire trackingContinuous wire position tracking at the feeding spool ensures optimum alignment during unwinding, avoiding unwanted tension and wire breakage risk.
B5 design optimized for thin wire performance
Existing installed B5 tools can be easily upgraded to
thin wire capability with a thin wire retrofit kit. Local
process application consultation can assist customers
to achieve optimal process performance and
productivity with the B5 platform.
Minimal downtime for wire changeThe B5’s unique conical take-up spool and expandable shaft feeding spool enable fast wire change in a production environment.
Thin wire capability is essential to reduce kerf loss.
With Applied HCT’s system engineering approach,
the proven B5 system has been designed for optimum
performance with thin wire technology, providing
high yield with industry leading productivity. With
over 500 systems in production with thin wire
capability, the B5 is the clear leader in bringing thin
wire to volume manufacturing.
The experience from more than 1000 systems in volume production.
1110
Current: Loose Abrasive
Future: Fixed Abrasive
Direction of wire
Direction of wire
Straight Wire
Structured Wire
Slurry motion
STRUCTURED WIRE DIAMoND WIREBenefits•Efficient slurry transport
•Faster cut rate
•Cooler slicing process
• Expected better surface quality and TTV
Challenges•~1% increase in kerf loss
•Lower wire breaking load
•Some wire price increase
Benefits•Water based coolant, no slurry
•Dramatic improvement in cut rate
•Reduced energy consumption
•Expected lower sub-surface damage
Challenges•Quality of diamond wire
•Wire price and consumption
•Wire damage/breakage risk
• Coolant formulation, distribution and price
•Mono vs. multi dependence
WIRE RoADMAP
Advanced wire technology promises to improve cut performance, increase productivity and substantially reduce slurry costs. However, implementation is a significant challenge: hardware, consumables and process must be fully optimized for yield, high productivity and low cost. Applied Materials has an aggressive roadmap to deliver the new wire technologies as they become proven
STRUCTURED WIRE: AN EXCLUSIVE TECHNoLoGy FRoM APPLIED HCT
Applied HCT is pioneering structured wire to
deliver an immediate performance and productivity
advantage to wafering. In parallel, our engineers
continue development of reliable, cost-effective
diamond wire technology.
EVoLUTIoNARy REVoLUTIoNARyStructured wire is the industry-proven solution for squaring, which can be rapidly implemented as a low-risk approach on current or new B5 wafering systems. The enhanced cut rate and efficient slurry utilization enhances productivity.
Diamond wire is currently being optimized in both cropping and squaring applications to ensure robust release for wafering applications, expected in 2012. This staged approach reduces risks associated with implementation of diamond wire technology.
ROBUST PLATFORM EXTENDABLE TO ADVANCED WIRE TECHNOLOGIES
Dual wire technology roadmap
2010 2011 2012
Standard wire CoO
Thin structured wire CoO
Thin structured wire productivity
Diamond wire CoO
Diamond wire productivity
Standard wire productivity
Increased by
10–20%
Reduced by
0–5% Reduced by
5–10%
Increased by
100–200%
Structured Wire
Diamond Wire
Proven B5 platform reduces risk
robust for manufacturing with lower overall cost. As part of this commitment to excellence, Applied has ongoing development partnerships with both wire and slurry manufacturers to optimize performance, reduce cost and ensure multiple sources of supply. Collaborations with leading customers are helping to accelerate learning in volume manufacturing.
1312
Meeting customers’ cost and productivity challenges requires high-output wafering hardware, process control software, plus advanced wire technology and slurry management. Applied Materials’ has the engineering depth, financial strength and industry experience to meet these technology challenges and deliver innovation at all levels.
CoMPLETE SoLUTIoN
AUTOMATION SOFTWARE
APPLIED GLOBAL SERVICES
CROPPER
E3 AUTOMATION
SQUARER B5
SMARTFACTORY
The Applied HCT Cropper cuts the tops and tails from crystalline silicon ingots at a high load capacity. It offers the same low kerf loss, high throughput and high reliability as the Applied HCT Squarers.
The Applied HCT Squarer is capable of squaring both mono and multi-crystalline silicon ingots with productivity of up to 80MW per year and low kerf loss (0.30–0.35μm wire). The system is upgradable to both diamond and thick structured wire.
The Applied HCT B5 wafering system cuts both monocrystalline and multi-crystalline silicon stock into ultra-thin wafers. The system provides best in class process yield with the industry’s highest productivity, and is a proven platform for advanced wire technologies.
The Applied Materials E3 equipment diagnostics platform connects to any solar tool, providing pre-integrated MES connectivity specifically designed for c-Si manufacturing. For example, the E3 SPC component automatically detects product quality variations, providing control charts, automatic notification and a corrective action plan to factory operators.
SmartFactory is a scalable, affordable factory automation solution that improves tool utilization and increases throughput. By tracking work-in-progress (WIP) within a factory, SmartFactory assures high factory productivity.
Applied Global Services has the solar industry’s largest team of highly trained support experts and provides spare parts, parts refurbishment and system upgrades, all designed to help you get the most out of your tools.
Ingot production
Squaring Cropping Wafering Grinding & Chamfer
Clean Metrology
A FULL RANGE OF SOLUTIONS FOR CRITICAL WAFERING STEPS
1514
REDUCING THE TIME, CoST AND RISK FoR CUSToMERS•Advancedwaferingequipmentdevelopment•Processresearchandoptimization•Wiretechnologydevelopmentandperformancevalidation•Waferperformancevalidationonfullcellline•Applicationdevelopmentforcustomerspecificsolutions
STATE OF THE ART R&D TECHNoLoGy CAPABILITy
R&D LEADERSHIP
Wafering Apps and Cell Manufacturing Lab Xi’an ChinaProcess validation on wider data sets
Hardware reliability testing
Performance validation on cell line
Customer demos and training
Wafering Center of ExcellenceCheseaux, Switzerland New product and process development
Development and demonstration of advanced wire sawing processes
Customer demos and training
Engineering fast turn design for
manufacturability
R&D Lab for performance
validation
Manufacturing proximity to
engineering for fast cycles of learning
SWISS DESIGN, ACCELERATED LEARNING
APPLIED MATERIALS + HCT
First wire saw produced in 1984
First wire saw for 300mm wafers
First to develop wire saw for ingot squaring
First to use wire saws for ingot cropping
First to use wire saws for cutting multiple ingots
First to offer 2m load potential
First to cut 120µm thin wafers in volume production
First to cut Jumbo (Gen 5) ingot in less than three hours
First to introduce structured wire technology
MARKET AND TECHNoLoGy LEADERSHIP
OF LEADERSHIP IN WIRE SAW TECHNOLOGY
OVER 25 YEARS
Born of Swiss precision engineering
combined with Applied Materials volume
production experience.
Over 2000 systems in volume
manufacturing worldwide.
Market leader for wafering systems.
Track record of system reliability and
manufacturing productivity.
Backed by the global service, supply chain, process expertise and factory
automation capability of Applied Materials.
From the #1 producer of solar and
semiconductor processing equipment.
Applied Materials3050 Bowers AvenueP.O. Box 58039Santa Clara, CA 95054-3299U.S.A.Tel: +1-408-727-5555
Applied Materials Route de Genève 421033 CheseauxSwitzerlandTel: 41 21 731 9100Fax: 41 21 731 9101
www.appliedmaterials.com/technologies/solar
© Applied Materials, Inc. 2011. Applied Materials, the Applied Materials logo, and other trademarks so designated or otherwise indicated as product names or services, are trademarks of Applied Materials, Inc. in the U.S. and other countries. All rights reserved. April 2011.
