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© Semiconductor Components Industries, LLC, 2006 May, 2006 - Rev.6 1 Publication Order Number: 2N6027/D 2N6027, 2N6028 Preferred Device Programmable Unijunction Transistor Programmable Unijunction Transistor Triggers Designed to enable the engineer to “program’’ unijunction characteristics such as R BB , h, I V , and I P by merely selecting two resistor values. Application includes thyristor-trigger, oscillator, pulse and timing circuits. These devices may also be used in special thyristor applications due to the availability of an anode gate. Supplied in an inexpensive TO-92 plastic package for high-volume requirements, this package is readily adaptable for use in automatic insertion equipment. Features Programmable - R BB , h, I V and I P Low On-State Voltage - 1.5 V Maximum @ I F = 50 mA Low Gate to Anode Leakage Current - 10 nA Maximum High Peak Output Voltage - 11 V Typical Low Offset Voltage - 0.35 V Typical (R G = 10 kW) Pb-Free Packages are Available* *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PUTs 40 VOLTS, 300 mW Preferred devices are recommended choices for future use and best overall value. See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ORDERING INFORMATION K G A TO-92 (TO-226AA) CASE 029 STYLE 16 3 2 1 PIN ASSIGNMENT 1 2 3 Gate Cathode Anode http://onsemi.com 2N602x = Device Code x = 7 or 8 A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package MARKING DIAGRAM 2N 602x AYWW G G (Note: Microdot may be in either location)

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Page 1: Transistor 2N6028

© Semiconductor Components Industries, LLC, 2006

May, 2006 − Rev.61 Publication Order Number:

2N6027/D

2N6027, 2N6028Preferred Device

ProgrammableUnijunction Transistor

Programmable UnijunctionTransistor Triggers

Designed to enable the engineer to “program’’ unijunctioncharacteristics such as RBB, �, IV, and IP by merely selectingtwo resistor values. Application includes thyristor−trigger, oscillator,pulse and timing circuits. These devices may also be used in specialthyristor applications due to the availability of an anode gate. Suppliedin an inexpensive TO−92 plastic package for high−volumerequirements, this package is readily adaptable for use in automaticinsertion equipment.

Features

• Programmable − RBB, �, IV and IP

• Low On−State Voltage − 1.5 V Maximum @ IF = 50 mA

• Low Gate to Anode Leakage Current − 10 nA Maximum

• High Peak Output Voltage − 11 V Typical

• Low Offset Voltage − 0.35 V Typical (RG = 10 k�)

• Pb−Free Packages are Available*

*For additional information on our Pb−Free strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

PUTs40 VOLTS, 300 mW

Preferred devices are recommended choices for future useand best overall value.

See detailed ordering and shipping information in the packagedimensions section on page 5 of this data sheet.

ORDERING INFORMATION

K

G

A

TO−92 (TO−226AA)CASE 029STYLE 16

32

1

PIN ASSIGNMENT

1

2

3

Gate

Cathode

Anode

http://onsemi.com

2N602x = Device Codex = 7 or 8

A = Assembly LocationY = YearWW = Work Week� = Pb−Free Package

MARKING DIAGRAM

2N602x

AYWW �

(Note: Microdot may be in either location)

Page 2: Transistor 2N6028

2N6027, 2N6028

http://onsemi.com2

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating Symbol Value Unit

Power Dissipation*Derate Above 25°C

PF1/�JA

3004.0

mWmW/°C

DC Forward Anode Current*Derate Above 25°C

IT 1502.67

mAmA/°C

DC Gate Current* IG �50 mA

Repetitive Peak Forward Current100 �s Pulse Width, 1% Duty Cycle20 �s Pulse Width, 1% Duty Cycle*

ITRM1.02.0

A

Non−Repetitive Peak Forward Current10 �s Pulse Width

ITSM 5.0 A

Gate to Cathode Forward Voltage* VGKF 40 V

Gate to Cathode Reverse Voltage* VGKR �5.0 V

Gate to Anode Reverse Voltage* VGAR 40 V

Anode to Cathode Voltage* (Note 1) VAK ±40 V

Capacitive Discharge Energy (Note 2) E 250 �J

Power Dissipation (Note 3) PD 300 mW

Operating Temperature TOPR −50 to +100 °C

Junction Temperature TJ −50 to +125 °C

Storage Temperature Range Tstg −55 to +150 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.*Indicates JEDEC Registered Data1. Anode positive, RGA = 1000 �

Anode negative, RGA = open2. E = 0.5 � CV2 capacitor discharge energy limiting resistor and repetition.3. Derate current and power above 25°C.

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction−to−Case R�JC 75 °C/W

Thermal Resistance, Junction−to−Ambient R�JA 200 °C/W

Maximum Lead Temperature for Soldering Purposes(�1/16″ from case, 10 seconds maximum)

TL 260 °C

Page 3: Transistor 2N6028

2N6027, 2N6028

http://onsemi.com3

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)

Characteristic Fig. No. Symbol Min Typ Max Unit

Peak Current*(VS = 10 Vdc, RG = 1 M�) 2N6027

2N6028(VS = 10 Vdc, RG = 10 k�) 2N6027

2N6028

2,9,11 IP−−−−

1.250.084.00.70

2.00.155.01.0

�A

Offset Voltage*(VS = 10 Vdc, RG = 1 M�) 2N6027

2N6028(VS = 10 Vdc, RG = 10 k�) (Both Types)

1 VT0.20.20.2

0.700.500.35

1.60.60.6

V

Valley Current*(VS = 10 Vdc, RG = 1 M�) 2N6027

2N6028(VS = 10 Vdc, RG = 10 k �) 2N6027

2N6028(VS = 10 Vdc, RG = 200 �) 2N6027

2N6028

1,4,5 IV−−70251.51.0

1818150150−−

5025−−−−

�A

mA

Gate to Anode Leakage Current*(VS = 40 Vdc, TA = 25°C, Cathode Open)(VS = 40 Vdc, TA = 75°C, Cathode Open)

− IGAO−−

1.03.0

10−

nAdc

Gate to Cathode Leakage Current(VS = 40 Vdc, Anode to Cathode Shorted)

− IGKS − 5.0 50 nAdc

Forward Voltage* (IF = 50 mA Peak) (Note 4)

1,6 VF − 0.8 1.5 V

Peak Output Voltage*(VG = 20 Vdc, CC = 0.2 �F)

3,7 Vo 6.0 11 − V

Pulse Voltage Rise Time(VB = 20 Vdc, CC = 0.2 �F)

3 tr − 40 80 ns

*Indicates JEDEC Registered Data4. Pulse Test: Pulse Width ≤ 300 �s, Duty Cycle ≤ 2%.

K

GA

Programmable Unijunction

with �Program" Resistors

R1 and R2

1A −

VAK

+VBIA

R1

R1 + R2

R1

R2

− VS = VB

VAK

IA

+

VS

RG

RG = R1 R2

R1 + R2

Equivalent Test Circuit for

Figure 1A used for electrical

characteristics testing

(also see Figure 2)

1B −

Adjust

for

Turn−on

Threshold

100 k

1.0%

2N5270

VB

0.01 �F

20

R

R

RG = R/2VS = VB/2(See Figure 1)

+

−IP (SENSE)

100 �V = 1.0 nA

Scope

Put

Under

Test

CC

510 k 16 k

27 k

20 �

vo

+VB

+V

Vo

6.0 V

0.6 V

tft

IC − Electrical Characteristics

VA

VS

VFVV

−VP

IAIFIVIP

VT = VP − VS

IGAO

Figure 1. Electrical Characterization

Figure 2. Peak Current (IP) Test Circuit Figure 3. Vo and tr Test Circuit

Page 4: Transistor 2N6028

2N6027, 2N6028

http://onsemi.com4

VS, SUPPLY VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C)

I , V

ALL

EY

CU

RR

EN

T (

A

)V

100

10

1000

105 15 20

500

5

10

0−50 +50 +100

100RG = 10 k�

100 k�

1 M�

−25 +25 +75

RG = 10 k�

100 k�

1 M�

�TYPICAL VALLEY CURRENT BEHAVIOR

IF, PEAK FORWARD CURRENT (AMP) VS, SUPPLY VOLTAGE (V)

0.1

0.05

0.02

0.01

0.2

0.5

1.0

0.020.01 0.05 0.1

10

20

5.0

0

15

100 20 30

25

TA = 25°C

5.0 15 25

CC = 0.2 �F

1000 pF

V ,

PE

AK

OU

TP

UT

VO

LTA

GE

(V

)o

TA = 25°C

(SEE FIGURE 3)

I , V

ALL

EY

CU

RR

EN

T (

A

)V

2.0

5.0

10

0.2 2.00.5 1.0 5.0 35 40

A

K

G

K

A

G

E

P

N

N

P

Circuit Symbol

B2

B1

R1

R2

R1

R1 + R2

RBB = R1 + R2

� =

Equivalent Circuit

with External �Program"

Resistors R1 and R2

Typical Application

CC

RT

K

A G

R2

R1

+

Figure 4. Effect of Supply Voltage Figure 5. Effect of Temperature

Figure 6. Forward Voltage Figure 7. Peak Output Voltage

Figure 8. Programmable Unijunction

VP,

PE

AK

FO

RW

AR

D V

OLT

AG

E (

V)

Page 5: Transistor 2N6028

2N6027, 2N6028

http://onsemi.com5

VS, SUPPLY VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C)

I , P

EA

K C

UR

RE

NT

(

A)

P

1.0

0.5

0.3

0.2

0.1

2.0

3.0

5.0

10

105.0 15 20

1.0

0.5

20

0.2

0.1

2.0

50

5.0

10

0−50 +50 +100

100

TA = 25°C

(SEE FIGURE 2)

RG = 10 k�

100 k�

VS = 10 V

(SEE FIGURE 2)

1.0 M�

−25 +25 +75

RG = 10 k�

100 k�

1.0 M�

I , P

EA

K C

UR

RE

NT

(

A)

P�

TYPICAL PEAK CURRENT BEHAVIOR

2N6027

VS, SUPPLY VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C)

I , P

EA

K C

UR

RE

NT

(

A)

P

0.1

0.05

0.03

0.02

0.01

0.2

0.3

0.5

1.0

105.0 15 20

0.1

0.05

2.0

0.02

0.01

0.2

5.0

0.5

1.0

0−50 +50 +100

10

TA = 25°C

(SEE FIGURE 2)

RG = 10 k�

100 k�

VS = 10 V

(SEE FIGURE 2)

1.0 M�

−25 +25 +75

RG = 10 k�

100 k�

1.0 M�

I , P

EA

K C

UR

RE

NT

(

A)

P�

2N6028

0.07

0.7

Figure 9. Effect of Supply Voltage and RG Figure 10. Effect of Temperature and RG

Figure 11. Effect of Supply Voltage and RG Figure 12. Effect of Temperature and RG

ORDERING INFORMATION

U.S. European Equivalent Shipping† Description of TO−92 Tape Orientation

2N6027

2N6027RL12N6027RL1G

5000 Units / Box N/A − Bulk2N6027G

2N6028

2N6028G

2N6027RLRA

2000 / Tape & Reel Round side of TO−92 and adhesive tape visible2N6027RLRAG

2N6028RLRA

2N6028RLRAG

2N6028RLRM

2000 / Tape & Ammo Box

Flat side of TO−92 and adhesive tape visible2N6028RLRMG

2N6028RLRPRound side of TO−92 and adhesive tape visible

2N6028RLRPG

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

*The “G’’ suffix indicates Pb−Free package available.

Page 6: Transistor 2N6028

2N6027, 2N6028

http://onsemi.com6

PACKAGE DIMENSIONS

TO−92 (TO−226AA)CASE 029−11

ISSUE AL

STYLE 16:PIN 1. ANODE

2. GATE3. CATHODE

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

R

A

P

J

L

B

K

GH

SECTION X−X

CV

D

N

N

X X

SEATING

PLANEDIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.175 0.205 4.45 5.20B 0.170 0.210 4.32 5.33C 0.125 0.165 3.18 4.19D 0.016 0.021 0.407 0.533G 0.045 0.055 1.15 1.39H 0.095 0.105 2.42 2.66J 0.015 0.020 0.39 0.50K 0.500 −−− 12.70 −−−L 0.250 −−− 6.35 −−−N 0.080 0.105 2.04 2.66P −−− 0.100 −−− 2.54R 0.115 −−− 2.93 −−−V 0.135 −−− 3.43 −−−

1

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATIONN. American Technical Support: 800−282−9855 Toll FreeUSA/Canada

Europe, Middle East and Africa Technical Support:Phone: 421 33 790 2910

Japan Customer Focus CenterPhone: 81−3−5773−3850

2N6027/D

LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 303−675−2175 or 800−344−3860 Toll Free USA/CanadaFax: 303−675−2176 or 800−344−3867 Toll Free USA/CanadaEmail: [email protected]

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your localSales Representative