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a recent developement in Ultrasonic transducers,making the transducers based on capacitive transducers principle instead of piezoelectric effect
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Sree Vidyanikethan Engineering College
Rotational Capacitive Micromachined
Ultrasonic TransducersGuided byMrs.A.Yasmine Begum
ByD.Sai lohith11121A1017
Contents
Transducers- Acostic transducersWhat are MEMS?Difference between normal UT and CMUTCMUT- Structure, principle, fabricationComparison of piezo-electric and CMUTRotational CMUT- Fabrication,experiment and it’s resultsApplicationsconclusionReferences
Acoustic TransducersUltrasonic transducers
What is the difference between normal ultrasonic transducer and CMUT?
• Piezoelectric property• Capacitive transducer
Where ,C is the capacitance, ε0 is the permittivity of free space constant, K is the dielectric constant of the material in the gap, A is the area of the plates, and d is the distance between the plates.
where S is the area of capacitor plates, V is the applied bias voltage, is the permittivity of free space between capacitor plates, and d is the distance between the capacitor plates.
CMUT structure
Operation priciple
Fabrication
• Sacrificial release process• Wafer bonding,etc
Step 1: Starting waferStep 2: Deposition of sacrificial layerStep 3: Deposition of structural layerStep 4: Pattern the top polysilicon layerStep 5: Deposit a second sacrificial layerStep 6: Pattern and Etch the sacrificial layersStep 7: Deposit polysilicon structural layer.Step 8: Pattern Polysilicon.Step 9: Sacrificial layer removal and freeing of structures
Why we are going to CMUT over Piezoelectric Ultrasonic transducer?
batch-production wide bandwidth easier to fabricate integration with supporting electronic
circuits Wider temperature range
Why we are going to Rotational CMUT instead of normal CMUT?
• no internal damping • negligible thermal mechanical noise • enables lower resonant frequencies• higher compliance to acoustic signals• frequency response up to 200 kHz
Rotational Capacitive Micromachined UltrasonicTransducers
Sacrificial release Process
SEMs
Applications
2D and 3D arraysIntravascular ultrasound (IVUS)Second-harmonic imagingHydrophonesPhoto-Acostic imaging
ConclusionConclusion
Rigorous modeling and acoustic characterization of the rotational cMUT
as does a detailed comparison of the device technology against other airborne ultrasonic transducers
1 μm deflection, implying that at least 10× higher compliance diaphragms are realizable by use of the beam-coupled design.
References
Some referable websites about cMUTs
• http://www.kyg.stanford.edu/khuriyakub/opencms/en/research/cmuts/Principles/
• http://www.microfab.de/mems/ultrasonictransducers/cmut.html
• http://www-kyg.stanford.edu/khuriyakub/opencms/en/research/cmuts/general/index.html
• http://www.ncbi.nlm.nih.gov/pmc/articles/PMC3158704/
• http://www-old.me.gatech.edu/mist/cmut.htm
Thank you