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X-ray spectroscopy and metrology
with high-harmonic sources
Peter M. KrausAdvanced Research Center for Nanolithography (ARCNL), Amsterdam, The Netherlands.EUV Lithography Source Workshop, 06.11.2018 – HiLASE, Prague, Czech Republic.
EUV lithography requires new XUV sources
Understand EUV (13.5 nm) interactions to
improve masks, pellicles, mirrors, resists…
Y. Zhang et al., J. Micro Nanolith. MEMS
MOEMS 16, 023510 (2017)
Ulrafast XUV and soft x-ray spectroscopy
Resolve structures during lithography and
after production with sub-nm precision
L. Li et al., Chem. Soc. Rev., 2017, 46, 4855
Broadband XUV and soft x-ray imaging
We need an ultrafast, coherent, table-top XUV/soft x-ray source
Solution: High-harmonic generation (HHG)
3
Space
20 eV
= 60 nm
50 eV 120 eV
= 10 nm^^
argon atoms
1300 nm
~ 1 mJ
~1014 W/cm2
High-harmonic generation (HHG): Converting many IR-photons into one
XUV-photon
High-harmonic generation
Figure from:
P. M. Kraus, H. J. Woerner, Angew. Chem. 57,
5228 (2018).
Three-step model of HHG:
P. B. Corkum, PRL 71, 1994 (1993)
J. L. Krause, K. J. Schafer, K. C. Kulander,
PRL 68, 3535 (1992)
Quantum theory of HHG:
M. Lewenstein et al., PRA 49, 2117 (1994)
Three-step model of HHG
- 1 -
Ionization
E
0
- IP
3.17 Up
Core
Electron
mean field
Active
electron
r
- 2 -
Propagation
- 3 -
Recombination
XUV
emission
Typical parameters:
800 nm
~ 1 mJ
~ 1014 - 1015 W/cm2
Imaging needs in nanolithpgraphy
Lensless imaging with x-rays
from HHG
Compared to a conventional
microscope, the lenses are
replaced with a computer
algorithm
Collaboration with Stefan Witte
& Kjeld Eikema (ARCNL)
Needs in lithography: Short
wavelength, high average
power
Demonstrated HHG sources
S. Haedrich et al., J. Phys. B 49, 172002 (2016).
0.8 1.4 2.0e- transit time / fs
frequency
H9, H11, …. …, H31, H33, ….
time / fs0 0.5 1 1.5 2 2.5
ele
ctr
on d
ispla
cem
ent
laser
ele
ctr
ic fie
ld 800 nm
Longer driving wavelengths in the mid-infrared (MIR) allow to generate
higher x-ray energies with a lower average power through HHG
time / fs0 1 2 3 4la
ser
ele
ctr
ic fie
ld
0.5 1.5 2.5 3.5
1300 nm
1.2 2.2 3.2e- transit time / fs
frequency
H9, H11, …. …, H67, H69, ….
P. M. Kraus, H. J. Wörner, Angewandte Chemie (2018)
MIR driver for cutoff extension in HHG
T. Popmintchev, Science, 2012
HHG up to 1.6 keV has already been demonstrated
High x-ray flux requires a high repetition rate, few-cycle MIR source
Soft x-ray high-harmonic generation
Technical realization of new HHG source
Amphos pump laser:
1 kW, 20 mJ, 50 kHz,
1-2 ps, 1064 nm
MIR-OPCPA
100 W, 2 mJ, 50 kHz,
35 fs, 2000 nm, CEP stable
The OPCPA will drive a unique EUV/soft x-ray HHG source (<600 eV / 2 nm)
which will serve many collaborations within and outside of ARCNL.
Expectations for HHG-source at ARCNL
New HHG source
at ARCNL
S. Haedrich et al., J. Phys. B 49, 172002 (2016).
EUV lithography requires new XUV sources
Understand EUV (13.5 nm) interactions to
improve masks, pellicles, mirrors, resists…
Y. Zhang et al., J. Micro Nanolith. MEMS
MOEMS 16, 023510 (2017)
Ulrafast XUV and soft x-ray spectroscopy
Resolve structures during lithography and
after production with sub-nm precision
L. Li et al., Chem. Soc. Rev., 2017, 46, 4855
Broadband XUV and soft x-ray imaging
We need an ultrafast, coherent, table-top XUV/soft x-ray source
Solution: High-harmonic generation (HHG)
What happens in lithography?
New photoresists: tin-oxo cage compounds
High EUV sensitivity and finesse
?exposure
t = ?
What happens in the photoresists?wafer
photoresist
mask
exposure
Y. Zhang et al., J. Micro Nanolith. MEMS MOEMS 16, 023510 (2017)
Mechanisms in photoresists
Processes in photoresists after exposure:
- Metal-carbon bond dissociation
- Oxidation state change
- Spin state change
W. D. Hinsberg and S. Meyers Proc. of SPIE Vol. 10146, 1014604-1 (2017)
Principles of ultrafast EUV spectroscopy
Core-level reflectivity is element,
oxidation-state, and spin-state specific.
Ideally suited to unravel the complex
chemical dynamics of photoresists.
sample
HHG
target
metal
filter
EUV
attosecond
probe-pulse
VIS/DUV
femtosecond
pump-pulse
atomic-like
core level
HOMO
LUMO
energy
metal
filter EUV gratingXUV-sensitized
CCD camera
C. J. Kaplan, P. M. Kraus et al.,
PRB 97, 205202 (2018)
The XUV reflectivity measures the joint density of states
between the core level and CBs
GX U,KGL
3d3/2 (-29.9 eV)
3d5/2 (-29.3 eV)
D1
L3
L3D1
Reflectivity measures density of states
Iterative fit
𝜀 = 𝜀𝑐 +𝜔𝑝𝑒2
𝜔𝑒2 −𝜔2 − 𝑖𝜔𝛾
Femtosecond dynamics in germanium
C. J. Kaplan, P. M. Kraus et al.,
PRB 97, 205202 (2018)
DR/R
real imag.
Carrier Positions
Real part of the dielectric
function tracks carrier position
Imaginary part of the dielectric function
tracks carrier population in p-states
Carrier Amplitudes
Measuring the XUV dielectric function
C. J. Kaplan, P. M. Kraus et al.,
PRB 97, 205202 (2018)
Holes:
t1 = 0.6 ps: intravalley scattering
t2 = 4.8 ps: optical phonon decay
Electrons:
t1 = 0.4 ps: G-X & L-X scattering
t2 = 5.5 ps: optical phonon decay
Holes:
t = 3.2 ps: Carrier diffusion
and Auger recombination
Electrons:
t = 3.2 ps: Carrier diffusion
and Auger recombination
Carrier Positions Carrier Amplitudes
XUV transient reflectivity is a detailed and simultaneous probe of
carrier dynamics.
Time scales of carrier relaxation
C. J. Kaplan, P. M. Kraus et al.,
PRB 97, 205202 (2018)
Status at ARCNL: Spectroscopy of resists
2-color HHG (driving with 800+400 nm)
Currently measuring first broadband EUV absorption spectra.
Ongoing collaboration with Sonia Castellanos and Fred Brouwer.
XUV absorption of Ti-based resists
Tran
smis
sio
n23 eV
M2,3 edge3p -> LUMO33 eV
45 eV
Pixel
Transmission spectrum through TiO2
Observation of Ti M2,3-edge in photoresist product
Thank You!
HHG and EUV science group at ARCNL:Filippo Campi Reinout JaarsmaSylvianne Roscam Abbing Faegheh Sajjadian Maarten van der Geest (not in picture)Najmeh Sadegh (not in picture)
Ongoing collaborations at ARCNL:Stefan WitteKjeld EikemaSonia CastellanosFred Brouwer