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ADS 2011:

The IC/Module/Package/Board Design Solution

“Realizing the Multi-Technology Vision”

July 2009

Agilent EEsof EDA Overview

Complete MMIC/Module ADS Desktop Design

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RF & Microwave Market Trends

Increasing Complexity & Integration

• Commercial wireless and Aerospace/Defense Industries are rapidly moving

from single packaged MMICs, to larger, more complex ICs in multi-chip RF

modules

• Today‟s flows combine multiple, poorly integrated tools, which are not able

to address multiple technology design and verification

• The IC, laminate, package, and PCB system need to be designed together,

interactively

• Electro-magnetic interactions between substrates need to be modeled

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ADS 2011: The IC/Module/Package/PCB Design SolutionRealizing the Multi-Technology Vision

Multi-Technology Circuit Design

• Multiple die (IC and IPD)

• Multiple substrates (die, laminate, LTCC,

package, PCB)

• Multiple process design kits (PDKs)

– GaAs (HBT, pHEMT), GaN, SiGe, Si …

Integrated Electro-Magnetic Solvers

• Multi-Technology EM simulation

– Full 3D EM Simulation

• Finite Element Simulator

• Parameterized Solid Models of Components

• Multi-layer 3D Planar EM simulation

• Easy EM simulation for the every engineerMounted on Board

Multiple ICs Multiple Technologies

On Laminate &

Packaged

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Designing Across Multiple Technologies

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The Multi-Technology Challenge

LNA

GaAs Mixer

SiGe

RF Module

Laminate

Layer Defs

AEL Cust

Single Technology Space

Traditional Design Tools

• Designed to handle one

type of design

– IC, Module, or PCB

• Have a single technology

definition space

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True Multi-Technology Management

LNA

GaAsMixer

SiGe

RF Module

Laminate

Lam:Components

Lam:Material Prop

Lam:Layer Defs

Lam:AEL Cust

SiGe:Components

SiGe:Material Prop

SiGe:Layer Defs

SiGe:AEL Cust

GaAs:Components

GaAs:Material Prop

GaAs:Layer Defs

GaAs:AEL Cust

ADS 2011 Multi-technology Environment

New Library construct

maintains separate technology

definition areas

• No namespace collisions

• No layer mapping needed

• No PDK conflicts

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Multi-Technology Design & Library Management

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Multi-Technology Simulation and Modeling

• Simulate critical circuits across multiple substrates

• Design closer to the margins

• Detect and solve issues before manufacturing

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Module

Laminate

Mixer

SiGe

LNA

GaAs

Native Physical Multi-Substrate Support

• Easily add one or more pre-defined

substrates

– IC in a package, IC in a module,

module on a board, etc.

• Unlimited levels of technology stacking

– i.e. IC on a module on a PCB

• Supports flip chips, wire bonding, and

backside mounting

• No modification of layers required

• Directly modify any of the designs

– No flattening required

• Works with all the ADS tools

– Layout, 3D Visualization, Momentum

and FEM, etc.

Easy to combine multiple substrates

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New graphical substrate editor

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ADS Integrated 3D EM FlowMomentum & FEM in ADS, 3D EM Components & EMPro/FDTD link

EMPro PlatformADS Platform

FDTD SimulatorFEM SimulatorMomentum Simulator

Parameterized

3D EM

Components

Layout

CAD Data

Multi-Technology EM SimulationCapabilities & Vision

• Discover coupling effects prior to

fabrication

• More effectively optimize design elements

for final packaging

• More easily make design trade-offs

• Help diagnose and solve performance

problems

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+ =

3D view FEMMomentum

+

Package IC IC

Multi-technology

EM Simulation

Improved RF Circuit Design and Simulation

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Views

Easily Manage Models & Design Representations

• Cells represent a single design

object

• Cell Views provide multiple

representations of that design

object

– Different schematic variants,

behavioral, measured, layout,

EM data views, etc.

– User defined

• Simplifies schematics

• Easily select simulation model

• Explore design variants

Cell name

Views

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Dynamic Simulation Model Selection

Design, by its nature, is evolutionary. Selecting model type and accuracy is key to this. This

makes it simple and virtually instantaneous.

• Easily select the model to use for

simulation

– Tradeoff speed vs. accuracy

• Works on one or more selected

components

• Current active model is shown on the

schematic

• Easily create a model priority list to

work on entire design hierarchy

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Control Model Selection Through Design Hierarchy

• User defined model priority policies

• Activate policy to specify which models

will be preferred

• Option to individually override

• Easy way to control model selection

for complex designs

– i.e. trade-off between speed and

accuracy

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Example “fast” policy

Example “accurate” policy

Selecting which policy to use

Major Improvements to Load PullFrom load pull to design in a few clicks

• New load pull data controller

– Handles Maury load pull data

• Direct, instant loading of load pull data

– Handles multiple files

– Easier review of data

• Immediately simulate matching network

– Easier design optimization, including

improved discrete optimization

– Automatic interpolation of scattered

measurement data

• Automatically display performance

parameters

Fast, Easy, Intuitive

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Data Display Improvements

• Improved Smith Chart graphics

– Better display of chart values

– Better overall look and data granularity

• Set color for a group of traces

– Easier interpretation of sweeps

• Improved Data Display Template Browser

– Real time quick search

– Direct editing of template properties

– Save As and Delete from the Browser

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Improved Accuracy for Conductor ModelsNew Multi-level Hemispherical Model

Available in Momentum and Circuit Simulation

Closer correlation to measured data Hammerstad

The original hemispherical model

Hemispherical

NEW Multi-level

2 4 6 8 10 12 14 16 180 20

-5

-4

-3

-2

-1

-6

0

freq, GHz

dB

(meas_2000m

il_ro

4350b..

S(2

,1))

dB

(yunhui_

bb4_hfc

orr

0..

S(2

,1))

dB

(S(2

,1))

dB

(yunhui_

bb4_hfc

orr

1_9..

S(2

,1))

SEM photograph of rough copper at

5000x magnification at a 30 degree angle.

Courtesy of Steven Hall et al. 2007

Measured Data

Agilent 5500

Atomic Force Microscope

• More accurately reflects conductor surface

• Can use AFM measurements to set params

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Other 2011 Improvements – Circuit Simulation

• Linear Simulation Speedup - up to 10X

– For fully-linear circuits with swept, tuned, or optimized simulations

• Improved Transmission line models (including multi-layer library)

– More accurate broad-band skin effect calculation

– New, advanced method of calculating surface roughness loss

– More accurate calculation of Power/Ground Plane loss

• Output simulator results in Matlab format

– New controller makes it possible to filter the output

• New models supported

– NXP SiMKit 3.4, PSP 102.3.4 and 103.1.1, Mextram 504.8, BSIMSOI 4.3.0, BSIM 4.6.5,

HiSIM_HV 1.2.0, MOSVAR 1.1, R3, PSPICE diode

• Support for Verilog A now included as part of ADS Core for use with all

simulators

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Making EM Simulation

Part of Everyone’s Design Flow

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New Graphical Layer Definition

• Graphical, unified entry of layer and stackup data

– Defines layers and properties for Layout, Momentum, and FEM

• Easy drag and drop operations

– Easily select and modify properties

• Simpler, faster, and less error prone

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New Streamlined EM SetupMaking EM Work for Everyone

• Single dialog replaces 8 – Easily navigate & review the setup options

• Same setup for Momentum, Momentum RF, & FEM

– Easy to try different solvers on the same design

• Setup is automatically saved and can be reused for other EM simulations

Previous EM Setup ADS 2011

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Reusing Saved EM Setup ConfigurationsMaking EM Work for Everyone

• Makes it possible for non-experts to create

accurate EM models

• Big productivity improvement for all users

• Easier to experiment with different setup

options

Foundry

PDK

EM

Expert

Packaged

With

ADS

Design

Engineer

Designer‟s

own setups

Saves Mouse Clicks (30 down to 3)

Use saved setups

on new work

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Example: PDN impedance

Freq sweep 0-3 GHz

Matrix size: 17.501

2005 2008 2010

solve

time

load

time

solve

time

load

time

load

time

2003

Release Load Solve Storage

2005A

2008U1

2011

dense (N2) direct (N3) dense (N2)

dense (N2) iterative (NpN2) dense (N2)

dense (N2) direct (NlogN)1.5 sparse (NlogN)

sparse (NlogN) direct (NlogN)1.5 sparse(NlogN)

2003A

Momentum Solver – 5 years of (R)evolution

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* Performance will vary dependent on complexity, frequency and other factors

Preprocessor Mesher (2nd generation ) Solver

New Momentum 2nd Generation Mesher

• Increased accuracy, robustness and performance

– Fast floating-point interval arithmetic

• Improved mesh quality

– Avoids slivers

– Improved handling of small and wide shapes

– New algorithm for edge mesh and overlap extraction

• Reduced mesh complexity

– New quadranglesrectangle

NEW

quadrilateral

triangle

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OLD

NEW

Improved Causal substrate model in Momentum

Dielectric Loss Model

• Uses the causal Svensson/Djordjevic model

• Same technology as in ADS circuit simulator

Substrate Material editor

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New Integrated EM Port Viewer/Editor

Features of new Port Editor

• Copy a value and paste to

multiple ports

• New filtering

– Quickly find ports by

attributes

– Filter on one or multiple

attributes

• Automatic port generation

• Automatic port re-

sequencing

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Auto

Multi-port Editor

Combined

Multi-port

Viewer & Editor

Single port Editor

Expanded Bondwire Support

• New, fast analysis of bondwires in Momentum

– Automatically modeled as part of Momentum

simulation

– Calculates self and mutual inductance

– FEM provides the most accurate analysis

• Bondwires work for both Momentum and FEM

– Easily create the bondwire in Layout

– Full parametric control of bondwire profile

• Jedec Bondwire – Follows the JEDEC

standard parameters

• Shape Bondwire – More flexible control of the

bondwire profile

• Bondwires now have edit handles

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Set parameters

Create and edit in 2D

Render in 3D

Performance w/ & w/o package

Accurately predict real performance

QFN DesignerPredict Packaged Performance in Minutes

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Quickly synthesize complex package,

combine with IC & PCB data

Configure QFN package

Layout Usability: Object Handles

• Directly work on objects – quick & efficient

• Objects with handles

– Arcs, Circles, Polylines, Polygons,

Rectangles, Text

– Transmission Lines, Paths, Wires,

Traces, Annotations, Wire Labels, Rulers,

Dimension Lines

• Infrastructure available for end user

customization

– Add handles to pdk components and

design kits

– Customizable behavior

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Layout Command Line & Toolbar

• Command line provides efficient keyboard entry for common functions

• User can add their own functions to the command line

• The toolbar provides single click operations for frequently used features

– Set vertex selection on/off, control pin-number display and align shapes

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Layout Command Line - Current Functions

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New Look: Redesigned IconsModern look, easier to understand, new icons: menu cmds

Schematic & Layout icons & toolbars

Command Line Editor & Toolbar

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Support for International Character Set

• Can create annotations / documentation with international characters

• Provided in schematic and data display

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Other 2011 Improvements

• Desktop LVS Viewer can now display Calibre errors

• Backside component support

• Allegro/ADS link (IFF for Allegro) now included in shipping product

• New entry mode for circles and rectangles

– Use CTRL key and first point will be the center of the shape

• New Array Reference (AREFs) objects to Layout

– Much more memory efficient way to create large arrays of objects

• Advanced Model Composer (AMC) models can now be created with FEM

• Layout connectivity engine is up to 40X faster than previous releases

• Layout layers can now have sub-layers (purposes)

– Can visually distinguish different objects drawn on a layer

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Signal Integrity/Power Integrity

• Power Integrity with Momentum

– Unique capability for PI analysis on split

power/ground plane PCBs

– Accurate modeling of multi-GHz effects

– Easy setup with SI/PI Analysis tool

• IBIS AMI simulation support

– Fast, accurate SERDES models for „what if…?‟

channel simulation

• More accurate modeling of high frequency

effects in PCB transmission lines (multi layer

models library and Momentum)

– Surface roughness of copper traces

– MLM causal dielectric loss algorithm now added to

Momentum also

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For More Information

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Agilent ADS 2011 Web page (new feature details)

www.agilent.com/find/eesof-ads2011

ADS 2011 on YouTube

www.youtube.com/user/AgilentEEsof

ADS 2011 Overview (Quick Start Video, Multi-technology Tutorials, …)

www.agilent.com/find/eesof-ads2011-overview

ADS 2011 Summary

• RF design has moved to complex ICs in multi-chip RF modules

• Today‟s design flows are not able to address multiple technology design

• The IC, laminate, package, and PCB need to be designed together

• Electro-magnetic interactions between substrates need to be modeled

• ADS 2011 is the only EDA software able to address these multi-

technology design challenges

• ADS 2011 is the only solution to the PI “split power/ground” problem.

Agilent EEsof EDA

“Innovative Solutions,

Breakthrough Results”

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