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CoreTech System Co., Ltd.│Copyright© 2019 Moldex3D. All rights reserved.

徐志忠, Jim Hsu

部門協理, RD Director

Global Trends of IC Package Molding

CAE Technology

S6, iNEMI Session: Modeling & Simulation

in Electronics Packaging

IMPACT-IAAC, Taiwan

October 23, 2019

Computer Aided Engineering

CAE

Finite Element Analysis (FEA)

Computational Fluid Dynamics (CFD)

Multibody Dynamics Optimization & Simulation

Employees: 15,000Market value: 34.4 Billion

https://zh.wikipedia.org/wiki/

Employees: 3,400Market value: 17.5 Billion

Employees: 250Market value: 0.29 Billion

ANSYS to acquire LS-DYNA Sep 11, 2019

1/2

CAE ~ 200 Billionhttps://operanewsnow.com/author/htfmarketreport/

In Plastic Molding Process

CAE

Provide different solutions for specific needs of different

industries

Bring more efficient way to optimize your design with

environmental sustainability instead of traditional trial-

and-error method

What We Do

Iteration

產業客戶簡介

Moldex3D Global Customers

In Advanced Molding Process

Moldex3D

Ref: http://romeofan.tian.yam.com/posts/13639796

Molding Process In IC Packages

Void prediction, Fluid-structure interaction,

Warpage prediction before and after molding

Diverse solutions are developed

for IC Package process

ChemorheologyRelationship

between conversion Rand viscosity η

Thermal conductivity, k

Thermal properties

Heat capacity, Cp

( ) 0 =+

u

t

Mass balance

Energy balance

STkTt

TCp +−=

+

: u

Momentum balance

gpDt

D +−= τ

u

Chemical reaction balance

0=++ RjX

PVTCTemperature-pressure-cure

dependent volume, V(T, P, R)

Governing equations & Constituted properties

Moldex3D Material Research Center

Moldex3D Material Research Center

( )( )nmkkdt

d

−+= 121

−=

RT

EAk 1

11 exp

−=

RT

EAk 2

22 exp

Conversion rate

Chemical curing kinetics

Conversion rate

Chemorheology

Venting analysis enhancementWithout air resistance With air resistance

Jeong, Y., Ahn, B., Hsu, J., Yang, A., Koyama, T., Oi, K., ... & Tsuriya, M. (2018, April). SiP module mold flowability experiment result and simulation study.

In Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on (pp. 1-6). IEEE.

Void prediction during molding

Comparison of filling pattern between experiment and simulation results at distinct filling time

Resin and Air Front Evolutions

Dispenser

Encapsulant

Substrate Solder mask 5 Under bump metallization(UBM)6,9 Printed circuits7 Solder pads8 Through vias10 Solder bumps11 Die

Capillary underfill process

interfacial tension is treated as a body force

Continuum Surface Force (CSF)

( )f−= f

R h

fx

Dispensing Behaviors for Multi-paths

Dispensing Behaviors for Multi-paths

Real world

Further Stress simulationMolding simulation

Akbari, Saeed, Amir Nourani, and Jan K. Spelt. "Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and

underfilling." Composites Part A: Applied Science and Manufacturing 88 (2016): 178-189.

Sham, Man-Lung, Jang-Kyo Kim, and Joo-Hyuk Park. "Thermal performance of flip chip

packages: Numerical study of thermo-mechanical interactions." Computational materials

science 43.3 (2008): 469-480.

Hydrophobic behavior prediction to predict

the fillet

Hydrophobic behavior of the fillet

Direct forcing on solid body for moving boundary interface

Immersed Boundary Method

FOWLP assembly process

http://www.semicontaiwan.org/en/sites/semicontaiwan.org/files/data16/docs/(8)%20APIC%20YAMADA%20Innovative%20Wafer

%20Molding%20System%20for%20Fan%20Out.pdf

Melt front evolution during molding

– Die shift decreases as the die thickness is increased

– Die shift increases as the compression velocity is increased

Die thickness=759 um

Die thickness=559 um

Die thickness=359 um

Ref: Chee Houe Khong, etc., “A Novel Method to Predict Die Shift During Compression Molding

in Embedded Wafer Level Package”, 2009 Electronic Components and Technology Conference

Process conditions for die shift

Melt front Animation near corner A & B

Corner A

has the Max. WSI

Corner B

has the Max. WSI

Compression molding for wire sweep

Molding process In-mold curing Ejection to air

Conversion changes during the first two stages.

The distribution of conversion is not uniform at

this point, and different volume shrinkages occur.

This leads to the part of first warpage of package.

The package sustains temperature decreasing from mold temp.

to room temp and further to post-mold curing process.

The part of second warpage of package occurs in this step.

Post-mold curing

15%

deviation

4%

deviation

Ref : L. Tan et al., "Study of viscoelastic effect of EMC on

FBGA block warpage by FEA simulation," Electronic

Packaging Technology (ICEPT), 2013 14th International

Conference on, Dalian, 2013, pp. 343-346.

In-mold/Post-mold Warpage

Prediction

Moldex3D Material Research Center

PVTC instrument

( ),, PTVV =

1.0% volume shrinkage rate

for chemical shrinkage

Uncured state

Cured state

1.5 % volume shrinkage

rate for thermal shrinkage

( )( )

0894.0, ,

if

if ,

,exp

exp

if

if ,

,

1ln1

1)1(

11

565

43

43

21

21

0

0/

=−=+=

−

−=

+

+=

+−=

+−=

CbTTPbbT

TT

TT

Tbb

TbbB

TT

TT

Tbb

TbbV

B

pCVV

VVV

t

t

t

LL

SS

t

t

LL

SS

uncuredcured

cureduncured

PVTC model for shrinkage

final warpage for EMC/Cu final warpage for EMC/Si

Ref : http://www.imapsource.org/doi/abs/10.4071/2016DPC-TP25

A study on warpage behavior of EMC in post-

mold cure stage using Moldex3D

-1

-0.5

0

0.5

1

1.5

2

2.5

3

0 1000 2000 3000 4000

Max.

dis

pla

cem

ent

in w

arp

dir

ecti

on

Time (sec)

Displacement v.s. Time

0

20

40

60

80

100

120

140

160

180

200

0 1000 2000 3000 4000

Tem

pera

ture

(degre

e C

)

Time (sec)

Temperature v.s. Time

32

Case A B C

Experiment

Shape

Simulation

Shape(R15.0)

Real case study for PMC analysis

http://www.adhesivehelp.com/lord/lordelectronics.html

What’s the next step for prediction ?

What’s the next step for prediction ?

Valve gate module

Q Mi = Q x t / N

Q

Current dispensing module Real-dispensing module

Dispensing simulations are derived by different boundary

conditions to meet the real world requirements

What’s the next step for prediction ?

Filler size distribution during molding

Strip/Package Warpage prediction

after molding

Simulate the topnotch professional molding with constant technical innovation.

1990

2000

2010

2018

Past: Molding Simulation

(Software only)

Now: Molding Simulation Solution

(Software, Material, Machine)

Future: Molding Solution

(System control, Material, Process)

Talent is the most important asset of an enterprise !

Moldex3D