PRODUCT CHANGE NOTIFICATIONMold Compound Henkel GR9810 Kyocera KEG2250 ShinEtsu KMC-3580 Die Attach Henkel ATB-125US1 Henkel ATB-125 Hitachi HR9050G Bond Wire 0.8 mil Cu-Pd …

Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600

PRODUCT CHANGE NOTIFICATION

PCN: PCN154102 Date: October 08, 2015

Subject: Qualification of Cypress Bangkok as an additional Assembly Site for Select 165 Ball GridArray (BGA) Products

To: PCN INBOXEBV [email protected]

Change Type: Major

Description of Change:Cypress announces the qualification of Cypress Bangkok (formerly Spansion Bangkok) for theassembly of select 165 Ball Grid Array (BGA) products. Cypress Bangkok is a world-classassembly facility, qualified to build standard grade as well as automotive grade products consistentwith AEC-Q100. Cypress Bangkok is certified to several international quality standards, includingISO/TS16949, OHSAS18001 and ANSI/ESD S20.20. The qualification of this facility will enableCypress to tailor assembly operations to meet our customers’ stringent quality and reliabilityrequirements in our effort to continually provide world-class service. 165 BGA packages assembledat Cypress Bangkok will use the following Bill of Materials (BOM).

165BGAAssembly Site CY Philippines ASE Taiwan CY BangkokMold Compound Henkel GR9810 Kyocera KEG2250 ShinEtsu KMC-3580Die Attach Henkel ATB-125US1 Henkel ATB-125 Hitachi HR9050GBond Wire 0.8 mil Cu-Pd 0.8 mil Cu-Pd 0.8 mil Cu-Pd

Solder Ball95.5% Sn, 4.0% Ag, 0.5% Cu 95.5% Sn, 4.0% Ag, 0.5% Cu 95.5% Sn, 4.0% Ag, 0.5% Cu62.0% Sn, 36.0% Pb, 2.0% Ag 63.0% Sn, 37.0% Pb 63.0% Sn, 37.0% Pb

There are no changes to ordering part numbers. Product datasheets remain the same and can bedownloaded from the Cypress Website (www.cypress.com).

Benefit of Change:The addition of Cypress Bangkok as a manufacturing location allows Cypress to leverageadditional manufacturing expertise and quality focus. This in turn provides the means for Cypressto continue to meet our customers’ requirements and meet our delivery commitments in dynamicmarket conditions.

Document No. 001-12089 Rev. *F Page 1 of 1

Affected Part Numbers: 383Affected Parts: See the attached file for a list of all part numbers affected by this change. Notethat any new 165 BGA parts that are introduced after the publication of this PCN may also bemanufactured at the Cypress Bangkok facility.

Qualification Status:Cypress Bangkok has been qualified through a series of tests documented in the Qualification TestPlan (QTP) report 153602. The qualification report can be found as an attachment to thisnotification or by visiting www.cypress.com, typing the QTP number in the search window andclicking on the magnifying glass icon.

Sample Status:Qualification samples are not built ahead of time for all part numbers affected by this change.Please review the attached file for a list of affected part numbers with their associated sampleordering part numbers. Sample requests for products without sample order part numbers are notbuilt ahead of time, they will be built to order and subject to standard lead times. Please contactyour sales representative as soon as possible, but within 30 days of the date of this PCN, to placeany sample orders.

Approximate Implementation Date:Effective 90 days from the date of this notification or upon customer approval, whichever comesfirst, all shipments of the affected part numbers in the attached file will be supplied from CypressBangkok or any other approved assembly sites.

Anticipated Impact:Products manufactured at Cypress Bangkok are completely compatible with existing product froma functional, parametric, and quality performance perspective.

Cypress recommends that customers take this opportunity to review these changes against currentapplication notes, system design considerations and customer environment conditions to assessimpact (if any) to their application.

Method of Identification:There will be no changes to the part number. Cypress maintains traceability of product to waferlevel, including wafer fabrication location, through the lot number marked on the package.

Response Required:No response is required.

For additional information regarding this change, contact your local sales representative or contactthe PCN Administrator at [email protected].

Sincerely,

Cypress PCN Administration

www.cypress.com

mailto:pcn_admin%40cypress.com

Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.Note 2: Report available from Cypress Sales Offices or Distributors.Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. Inorder to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s arecalculated using MSDS, Material Analysis Reports and Cypress Assembly site information.Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.

Document No. 001-05596 Rev *P Page 1 of 21

165 – FBGA 13 x 15Non Pb-Free Package

PACKAGE MATERIAL DECLARATION DATASHEET

Cypress Package Code BB Body Size (mil/mm) 13 x 15

Package Weight – Site 1 B1 :490.0100 mgB2: 525.0100 mgB3: 516.8767 mgB4: 478.0000 mg

Package Weight – Site 2 B1: 474.1600 mgB2: 476.1300 mg

Package Weight – Site 3 B1: 568.7100 mgB2: 539.2500 mgB3: 459.6873 mgB4: 459.6791 mg

Package Weight – Site 4 B1: 480.6967 mg

SUMMARY

The 165-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production areRoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (aboveallowable levels).

ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)Package Qualification Report # 055103, 062504, 120610, 133105, 144604 (Note 1)

I. DECLARATION OF PACKAGED UNITS

A. BANNED SUBSTANCES

Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS arelisted in section 1A. Materials from this list may be contained or intentionally added to this product, as it is notconsidered Pb-Free or RoHS compliant.

Substances / CompoundsWeight by

mgPPM

Analysis Report(Note 2)

Cadmium and Cadmium Compounds 0 < 5.0

As per MSDS

Hexavalent Chromium and its Compounds 0 < 5.0Lead and Lead Compounds 33.58 68,529Mercury and Mercury Compounds 0 < 5.0Polybrominated Biphenyls (PBB) 0 < 5.0Polybrominated Diphenylethers (PBDE) 0 < 5.0Asbestos 0 0Azo colorants 0 0Ozone Depleting Substances 0 0Polychlorinated Biphenyls (PCBs) 0 0Polychlorinated Napthalenes 0 0Radioactive Substances 0 0Shortchain Chlorinated Paraffins 0 0Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0Tributyl Tin Oxide (TBTO) 0 0Formaldehyde 0 0




B1. MATERIAL COMPOSITION (Note 3)Using Non Halogen-free Substrate

MaterialPurpose of

UseSubstance

CompositionCAS

NumberWeight by

mg

% weight ofsubstance perHomogeneous

material

PPM% weight ofsubstance

per package

Substrate Base Material

SiO2 60676-86-0 19.6300 10.9997% 40,060 4.0060%Acrylic Proprietary,

29690-82-217.8500 10.0022% 36,428

3.6428%Epoxy 68541-56-0,

25068-38-614.2700 7.9962% 29,122

2.9122%Bisphenol 13676-54-5 26.7700 15.0006% 54,632 5.4632%Triazol 25722-66-1 31.2300 17.4997% 63,733 6.3733%Cu 7440-50-8 64.9500 36.3947% 132,548 13.2548%Ni 7440-02-0 2.6800 1.5017% 5,469 0.5469%Au 7440-57-5 0.9800 0.5491% 2,000 0.2000%Br Proprietary 0.1000 0.0560% 204 0.0204%

Solder BallExternalPlating

Sn 7440-31-5 57.1700 62.9972% 116,671 11.6671%Pb 7439-92-1 33.5800 37.0028% 68,529 6.8529%

Die Attach Adhesive

Fused silica 60676-86-0 41.8100 53.9972% 85,325 8.5325%Diester Proprietary 21.2900 27.4958% 43,448 4.3448%Epoxy Resin Proprietary 4.2600 5.5017% 8,694 0.8694%Functionalized esters Proprietary 7.7400 9.9961% 15,796 1.5796%Polymeric resin Proprietary 2.3300 3.0092% 4,755 0.4755%

Die Circuit Si 7440-21-3 54.2000 100.0000% 110,610 11.0610%Wire Interconnect Au 7440-57-5 5.1100 100.0000% 10,428 1.0428%

MoldCompound

Encapsulation

Silica (fused) 60676-86-0 68.6900 81.7154% 140,181 14.0181%Epoxy resin Proprietary 4.9800 5.9243% 10,163 1.0163%Phenolic resin Proprietary 3.9600 4.7109% 8,081 0.8081%Silica 7631-86-9 0.6400 0.7614% 1,306 0.1306%Mixed siloxanes Proprietary 0.4300 0.5115% 878 0.0878%Non Brominatedflame retardant

Proprietary 5.1500 6.1266% 10,5101.0510%

Carbon black pigment 1333-86-4 0.2100 0.2498% 429 0.0429%

Package Weight (mg): 490.0100 % Total: 100.0000




B2. MATERIAL COMPOSITION (Note 3)Using Halogen-free Substrate

MaterialPurpose of

UseSubstance

CompositionCAS Number

Weight bymg


material


per package


Cured Resin Proprietary 73.4000 27.9971% 139,807 13.9807%Glass Fabrics Proprietary 57.6800 22.0010% 109,865

10.9865%Copper Foil Proprietary 78.6500 29.9996% 149,807 14.9807%Diethylene GlycolMonoethyl EtherAcetate

Proprietary 13.1100 5.0006% 24,971

2.4971%AcetophenoneDerirative

Proprietary 13.1100 5.0006% 24,9712.4971%

Silica Crystalline Proprietary 13.1100 5.0006% 24,971 2.4971%Solvent naptha Proprietary 13.1100 5.0006% 24,971 2.4971%

Solder Ball External PlatingSn 7440-31-5 57.1800 62.0039% 108,912 10.8912%Pb 7439-92-1 33.2000 36.0009% 63,237 6.3237%Ag 7440-22-4 1.8400 1.9952% 3,505 0.3505%

Die Attach AdhesiveAg 7440-22-4 3.2400 79.8030% 6,171 0.6171%Bismaleimide Proprietary 0.4100 10.0985% 781 0.0781%Polymer Proprietary 0.4100 10.0985% 781 0.0781%

Die Circuit Silicon 7440-21-3 21.4000 100.0000% 40,761 4.0761%Wire Interconnect Au 7440-57-5 15.2400 100.0000% 29,028 2.9028%

MoldCompound

Encapsulation

Silica 60676-86-0 112.3700 86.4917% 214,034 21.4034%Non-BrominatedFlame Retardant

Proprietary 6.5000 5.0031% 12,3811.2381%

Epoxy Resin Proprietary 6.5000 5.0031% 12,381 1.2381%Phenol Resin Proprietary 3.2500 2.5015% 6,190 0.6190%Mixed Siloxanes Proprietary 0.6500 0.5003% 1,238 0.1238%Carbon BlackPigment

1333-86-4 0.6500 0.5003% 1,2380.1238%





B3. MATERIAL COMPOSITION (Note 3)Using Copper-Pd Wire

MaterialPurpose of

UseSubstance


Weight bymg


material


per package


Cured Resin Proprietary 73.4000 27.9971% 142,007 14.2007%Glass Fabrics Proprietary 57.6800 22.0010% 111,593

11.1593%Copper Foil Proprietary 78.6500 29.9995% 152,164 15.2164%Diethylene GlycolMonoethyl EtherAcetate

Proprietary 13.1100 5.0006% 25,364

2.5364%AcetophenoneDerirative

Proprietary 13.1100 5.0006% 25,3642.5364%


Solder Ball External PlatingSn 7440-31-5 57.1800 62.0039% 110,626 11.0626%Pb 7439-92-1 33.2000 36.0009% 64,232 6.4232%Ag 7440-22-4 1.8400 1.9952% 3,560 0.3560%

Die Attach Adhesive

Ag 7440-22-4 3.0450 75.0000% 5,891 0.5891%Bismaleimide Proprietary 0.7105 17.5000% 1,375 0.1375%Polymer/SyntheticResin

Proprietary 0.20305.0000%

3930.0393%

Additive Proprietary 0.1015 2.5000% 196 0.0196%Die Circuit Silicon 7440-21-3 21.4000 100.0000% 41,403 4.1403%Wire Interconnect Copper 7440-50-8 7.0357 99.0000% 13,612 1.3612%

Palladium 7440-05-3 0.0710 1.0000% 137 0.0137%

MoldCompound

Encapsulation

Silica 60676-86-0 115.6292 89.0004% 223,707 22.3707%Epoxy Resin Proprietary 9.0941 6.9997% 17,594 1.7594%Phenol Resin Proprietary 3.8975 2.9999% 7,540 0.7540%MelamineCyanurate Proprietary 0.6496 0.5000%

1,2570.1257%

Carbon BlackPigment Proprietary 0.6496 0.5000%

1,2570.1257%





B4. MATERIAL COMPOSITION (Note 3)Using Copper-Palladium Wire material, GR9810 Mold Compound and ATB120 Film

MaterialPurpose of

UseSubstance


Weight bymg


materialPPM

% weight ofsubstance

per package


Cured Resin Proprietary 73.4048 28.0000 153,567 15.3567%

Glass Fabrics Proprietary 57.6752 22.0000 120,659 12.0659%

Copper Foil Proprietary 78.6480 30.0000 164,536 16.4536%

Diethylene GlycolMonoethyl EtherAcetate

Proprietary 13.1080 5.0000 27,423 2.7423%

AcetophenoneDerirative

Proprietary 13.1080 5.0000 27,423 2.7423%

Silica Crystalline Proprietary 13.1080 5.0000 27,423 2.7423%

Solvent naptha Proprietary 13.1080 5.0000 27,423 2.7423%

Solder Ball External PlatingSn 7440-31-5 56.8129 64.0000 118,855 11.8855%Pb 7439-92-1 30.1818 34.0000 63,142 6.3142%Ag 7440-22-4 1.7754 2.0000 3,714 0.3714%

Die Attach Adhesive

Epoxy Resinadduct

Proprietary 2.8303 77.0000 5,921 0.5921%

Epoxy Resin Proprietary 0.5514 15.0000 1,153 0.1153%Dapsone 80-08-0 0.1470 4.0000 307 0.0307%Fumed Silica 67762-90-7 0.0735 2.0000 154 0.0154%Silane Proprietary 0.0735 2.0000 154 0.0154%

Die Circuit Si 7440-21-3 33.100 100.0000 69,247 6.9247%

Wire InterconnectCopper 7440-50-8 4.4883 99.0000 9,390 0.9390%Palladium 7440-05-3 0.0453 1.0000 95 0.0095%

MoldCompound

Encapsulation

Silica 60676-86-0 74.6117 87.0000 156,091 15.6091%Epoxy Resin Proprietary 7.2897 8.5000 15,250 1.5250%Phenol Resin Proprietary 3.0016 3.5000 6,279 0.6279%MelamineCyanurate

Proprietary 0.4288 0.5000 897 0.0897%

Carbond BlackPigment

1333-86-4 0.4288 0.5000 897 0.0897%

Package Weight (mg): 478.0000 % Total: 100.0000%




II. DECLARATION OF PACKAGING INDIRECT MATERIALS

Type MaterialLeadPPM

CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM

Analysis Report(Note2)

Tape & Reel Cover tape AdvantekCarrier tape < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 CoA-CART-R

Tray Tray < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 CoA-TRAY-GCoA-TRAY-R

Others Moisture Barrier bag < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 CoA-MBAG-GShielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 CoA-SBAG-G

Desiccant < 1000PPM

< 100PPM

2.5 < 1000PPM

< 1000PPM

< 1000PPM

CoA-DESS-G




ASSEMBLY Site 2: PT UNISEM BatamPackage Qualification Report # 072004, 073703 (Note 1)





mgPPM

AnalysisReport(Note 2)


As per MSDS





B1. MATERIAL COMPOSITION (Note 3)Using Ablebond 2000B Adhesive

MaterialPurpose of

UseSubstance Composition CAS Number

Weight bymg

% weightof

substanceper

Homogeneous

material

PPM


per package


Plating 1Au, metal & alloy 7440-57-5 1.0700 0.7368% 2,247 0.2247%Ni, metal & alloy 7440-02-0

4.9400 3.4017% 10,375 1.0375%Plating 2 Cu, metal & alloy 7440-50-8 37.1000 25.5474% 77,920 7.7920%

AUS308 Acrylic Resin ------------------ 1.1100 0.7644% 2,331 0.2331%PhthalcyanineBlue, OrganicPigment

------------------

0.0100 0.0069% 21 0.0021%Fillers (BariumSulfate, Silica,Talc)

------------------

0.8600 0.5922% 1,806 0.1806%Aromatic CarbonylCompound

------------------0.1100 0.0757% 231 0.0231%

Amine Compound ------------------ 0.1800 0.1239% 378 0.0378%Levelling Agents &Others

------------------0.0400 0.0275% 84 0.0084%

Acrylic Monomer ------------------ 0.1400 0.0964% 294 0.0294%Epoxy Resin 29690-82-2

68541-56-025068-38-6 0.4900 0.3374% 1,029 0.1029%

Barium Sulfate ------------------ 0.2200 0.1515% 462 0.0462%Organic Fillers ------------------ 0.0500 0.0344% 105 0.0105%

HL832 NX BT Resin 13676-54-525722-66-1 43.5700 30.0028% 91,509 9.1509%

Fibrous-glass-wool

65997-17-355.3300 38.1008% 116,208 11.6208%

SolderBall

ExternalPlating

Sn 7440-31-5 50.4600 62.9963% 105,979 10.5979%Pb 7439-92-1 29.6400 37.0037% 62,252 6.2252%

DieAttach

Adhesive

Ag 7440-22-4 5.0300 69.9583% 10,564 1.0564%Epoxy Resin Trade Secret 0.3600 5.0070% 756 0.0756%Diester Trade Secret 0.7200 10.0139% 1,512 0.1512%Polymeric Resin Trade Secret 0.3600 5.0070% 756 0.0756%Functionalized Ester Trade Secret 0.7200 10.0139% 1,512 0.1512%

Die Circuit Si 7440-21-3 25.4000 100.0000% 53,347 5.3347%

Wire Interconnect Au 7440-57-5 18.1800 100.0000% 38,183 3.8183%

MoldCompou

ndEncapsulation

Fused Silica 60676-86-0 190.0400 95.0010% 399,135 39.9135%Epoxy Resin Trade Secret 4.0000 1.9996% 8,401 0.8401%Phenol Resin Trade Secret 1.0000 0.4999% 2,100 0.2100%Phenol Novolac 9003-35-4 2.0000 0.9998% 4,201 0.4201%Metal Hydroxide Trade Secret 2.0000 0.9998% 4,201 0.4201%Carbon Black 1333-86-4 1.0000 0.4999% 2,100 0.2100%





B2. MATERIAL COMPOSITION (Note 3)Using CRM 1577A Adhesive

MaterialPurpose of

UseSubstance Composition CAS Number

Weight bymg

% weightof

substanceper

Homogeneous

material

PPM


per package


Plating 1Au, metal & alloy 7440-57-5 1.0700 0.7368% 2,257 0.2257%Ni, metal & alloy 7440-02-0

4.9400 3.4017% 10,418 1.0418%Plating 2 Cu, metal & alloy 7440-50-8 37.1000 25.5474% 78,244 7.8244%AUS308 Acrylic Resin ------------------ 1.1100 0.7644% 2,341 0.2341%

PhthalcyanineBlue, OrganicPigment

------------------

0.0100 0.0069% 21 0.0021%Fillers (BariumSulfate, Silica,Talc)

------------------

0.8600 0.5922% 1,814 0.1814%Aromatic CarbonylCompound

------------------0.1100 0.0757% 232 0.0232%

Amine Compound ------------------ 0.1800 0.1239% 380 0.0380%Levelling Agents &Others

------------------0.0400 0.0275% 84 0.0084%

Acrylic Monomer ------------------ 0.1400 0.0964% 295 0.0295%Epoxy Resin 29690-82-2

68541-56-025068-38-6 0.4900 0.3374% 1,033 0.1033%

Barium Sulfate ------------------ 0.2200 0.1515% 464 0.0464%Organic Fillers ------------------ 0.0500 0.0344% 105 0.0105%

HL832NX

BT Resin 13676-54-525722-66-1 43.5700 30.0028% 91,889 9.1889%

Fibrous-glass-wool 65997-17-3 55.3300 38.1008% 116,691 11.6691%Solder

BallExternalPlating

Sn 7440-31-5 50.4600 62.9963% 106,420 10.6420%Pb 7439-92-1 29.6400 37.0037% 62,511 6.2511%

DieAttach

Adhesive

Bismaleimide Trade Secret 4.3500 59.9174% 9,174 0.9174%Silicon Resin Trade Secret 1.8100 24.9311% 3,817 0.3817%Epoxy Resin 9003-36-5 0.7300 10.0551% 1,540 0.1540%Diluent Trade Secret 0.2900 3.9945% 612 0.0612%Carbon Black 1333-86-4 0.0400 0.5510% 84 0.0084%Dicyandiamide 461-58-5 0.0400 0.5510% 84 0.0084%

Die Circuit Si 7440-21-3 25.4000 100.0000% 53,568 5.3568%Wire Interconnect Au 7440-57-5 18.1800 99.9999% 38,341 3.8341%

MoldCompou

ndEncapsulation

Fused Silica 60676-86-0 118.8000 60.0000% 250,548 25.0548%Solid Epoxy Resin ------------------ 19.8000 10.0000% 41,758 4.1758%Phenol Resin ------------------ 19.8000 10.0000% 41,758 4.1758%Carbon Black 1333-86-4 1.9800 1.0000% 4,176 0.4176%Crystallin eSilica 14808-60-7 9.9000 5.0000% 20,879 2.0879%Metal Hydro Oxide ------------------ 27.7200 14.0000% 58,461 5.8461%







CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM





Desiccant < 1000PPM

< 100PPM

2.5 < 1000PPM

< 1000PPM

< 1000PPM

CoA-DESS-G




ASSEMBLY Site 3: Advanced Semiconductor Engineering Taiwan (ASET)Package Qualification Report #s 052208, 113007, 120107, 120612 (Note 1)





mgPPM

AnalysisReport(Note 2)


As per MSDS





B1. MATERIAL COMPOSITION (Note 3)Adhesive Using Epoxy

MaterialPurpose of

UseSubstance


Weight bymg


material


per package


SiO2 60676-86-0 16.9100 10.4901% 29,734 2.9734%

Acrylic Trade Secret 14.8300 9.1998% 26,077 2.6077%

Epoxy 29690-82-2,68541-56-0,25068-38-6

9.9000 6.1414% 17,408 1.7408%

Bisphenol 13676-54-5 24.1500 14.9814% 42,465 4.2465%

Triazol 25722-66-1 28.9800 17.9777% 50,957 5.0957%

Copper (Cu) 7440-50-8 63.4000 39.3300% 111,480 11.1480%

Nickel (Ni) 7440-02-0 2.2400 1.3896% 3,939 0.3939%

Gold (Au) 7440-57-5 0.7900 0.4901% 1,389 0.1389%

Solder Ball External PlatingTin (Sn) 7440-31-5 49.9300 62.9952% 87,795 8.7795%Lead (Pb) 7439-92-1 29.3300 37.0048% 51,573 5.1573%

Die Attach Adhesive

Silver 7440-22-4 32.9700 76.9967% 57,973 5.7973%Epoxy Resin Trade Secret 2.2500 5.2546% 3,956 0.3956%FunctionalizedEster

Trade Secret 2.2500 5.2546% 3,956 0.3956%

Diester Trade Secret 5.3500 12.4942% 9,407 0.9407%Die Circuit Silicon 7440-21-3 25.2500 100.0000% 44,399 4.4399%Wire Interconnect Gold (Au) 7440-57-5 3.5600 100.0000% 6,260 0.6260%

MoldCompound

Encapsulation

Silica fused 60676-86-0 228.3900 88.9993% 401,593 40.1593%Epoxy Resin 1 93705-66-9 11.5500 4.5008% 20,309 2.0309%Epoxy Resin 2 Undisclosed 5.1300 1.9991% 9,020 0.9020%Phenol resin 106466-55-1 11.5500 4.5008% 20,309 2.0309%





B2. MATERIAL COMPOSITION (Note 3)Adhesive using film

MaterialPurpose of

UseSubstance


Weight bymg


perHomogeneous material


perpackage


SiO2 60676-86-0 16.9088 10.4900% 31356 3.1356%

Acrylic Trade Secret 14.8295 9.2000% 27500 2.7500%

Epoxy 68541-56-0 9.8971 6.1400% 18353 1.8353%

Bisphenol 13676-54-5 24.1463 14.9800% 44777 4.4777%

Triazol 25722-66-1 28.9820 17.9800% 53745 5.3745%

Cu 7440-50-8 63.3960 39.3300% 117563 11.7563%

Ni 7440-02-0 2.2405 1.3900% 4155 0.4155%

Au 7440-57-5 0.7898 0.4900% 1465 0.1465%

Solder Ball External PlatingSn 7440-31-5 57.2900 62.9976% 106240 10.6240%Pb 7439-92-1 33.6500 37.0024% 62401 6.2401%

Die Attach Adhesive

Cresol-epichlorohydrin-formaldehydepolymer

37382-79-9 33.5580 60.0000% 62231 6.2231%

Rubber modifiedepoxy

Trade Secret 16.7790 30.0000% 31115 3.1115%

Aromatic amine Trade Secret 2.7965 5.0000% 5186 0.5186%Silicon-basedglycidyl ether

2530-83-8 2.2372 4.0000% 4149 0.4149%

Isopropylidenediphenol

80-05-7 0.5593 1.0000% 1037 0.1037%

Die Circuit Si 7440-21-3 32.9900 100.0000% 61178 6.1178%

Wire InterconnectAu 7440-57-5 3.8996 99.9900% 7232 0.7232%Ion Impurities Trade Secret 0.0004 0.0100% 1 0.0001%

MoldCompound

Encapsulation

Silica fused 60676-86-0 172.9270 89.0000% 320681 32.0681%Epoxy Resin(1) 93705-66-9 8.7435 4.5000% 16214 1.6214%Epoxy Resin(2) Undisclosed 3.8860 2.0000% 7206 0.7206%Phenol resin 106466-55-1 8.7435 4.5000% 16214 1.6214%





B3. MATERIAL COMPOSITION (Note 3)Using Copper Wire

MaterialPurpose of

UseSubstance


Weight bymg




perpackage


SiO2 60676-86-0 16.9088 10.4900% 36783 3.6783%


Epoxy 68541-56-0 9.8971 6.1400% 21530 2.1530%

Bisphenol 13676-54-5 24.1463 14.9800% 52528 5.2528%

Triazol 25722-66-1 28.9820 17.9800% 63047 6.3047%

Cu 7440-50-8 63.3960 39.3300% 137911 13.7911%

Ni 7440-02-0 2.2405 1.3900% 4874 0.4874%

Au 7440-57-5 0.7898 0.4900% 1718 0.1718%


Die Attach(FILM)

Adhesive

Modified Epoxyresin

Trade Secret34.4229

61.5463%74883 7.4883%

Epoxy resin Trade Secret 13.6975 24.4905% 29797 2.9797%Dapsone 80-08-0 4.3418 7.7629% 9445 0.9445%Treated fumesilica

67762-90-71.1705

2.0928%2546 0.2546%

Substitutedsilane

Trade Secret0.8476

1.5155%1844 0.1844%

Elastomericpolymer

Trade Secret0.7420

1.3267%1614 0.1614%

Epoxy resin Trade Secret 0.7077 1.2653% 1540 0.1540%Die Circuit Si 7440-21-3 32.9900 100.0000% 71766 7.1766%

Wire InterconnectCopper (Cu) 7440-50-8 2.0080 99.9900% 4368 0.4368%Ion Impurities Trade Secret 0.0002 0.0100% 1 0.0001%

MoldCompound

Encapsulation

Silica 60676-86-0 104.6163 89.0000% 227582 22.7582%Epoxy Resin Undisclosed 6.4146 4.5000% 13955 1.3955%Phenol resin Undisclosed 5.2483 2.0000% 11417 1.1417%Carbon Black 1333-86-4 0.3499 4.5000% 761 0.0761%





B4. MATERIAL COMPOSITION (Note 3)Using Copper-Pd Wire

MaterialPurpose of

UseSubstance


Weight bymg




perpackage


SiO2 60676-86-0 16.9088 10.4900% 36784 3.6784%


Epoxy 68541-56-0 9.8971 6.1400% 21530 2.1530%

Bisphenol 13676-54-5 24.1463 14.9800% 52529 5.2529%

Triazol 25722-66-1 28.9820 17.9800% 63048 6.3048%

Cu 7440-50-8 63.3960 39.3300% 137914 13.7914%

Ni 7440-02-0 2.2405 1.3900% 4874 0.4874%

Au 7440-57-5 0.7898 0.4900% 1718 0.1718%


Die Attach Adhesive

Modified Epoxyresin

Trade Secret34.4229

61.5463%74885 7.4885%

Epoxy resin Trade Secret 13.6975 24.4905% 29798 2.9798%Dapsone 80-08-0 4.3418 7.7629% 9445 0.9445%Treated fumesilica

67762-90-71.1705

2.0928%2546 0.2546%

Substitutedsilane

Trade Secret0.8476

1.5155%1844 0.1844%

Elastomericpolymer

Trade Secret0.7420

1.3267%1614 0.1614%

Epoxy resin Trade Secret 0.7077 1.2653% 1540 0.1540%Die Circuit Si 7440-21-3 32.9900 100.0000% 71767 7.1767%

Wire InterconnectCopper (Cu) 7440-50-8 1.9500 97.5000% 4242 0.4242%Palladium (Pd) 7440-05-3 0.0500 2.5000% 109 0.0109%

MoldCompound

Encapsulation

Silica 60676-86-0 104.6163 89.0000% 227586 22.7586%Epoxy Resin Undisclosed 6.4146 4.5000% 13955 1.3955%Phenol resin Undisclosed 5.2483 2.0000% 11417 1.1417%Carbon Black 1333-86-4 0.3499 4.5000% 761 0.0761%







CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM





Desiccant < 1000PPM

< 100PPM

2.5 < 1000PPM

< 1000PPM

< 1000PPM

CoA-DESS-G




***

ASSEMBLY Site 4: Cypress BangkokPackage Qualification Report # 153602 (Note 1)




Substances / Compounds Weight bymg

PPM AnalysisReport

Cadmium and Cadmium Compounds 0 < 5.0 As per MSDS

Hexavalent Chromium and its Compounds 0 < 5.0

Lead and Lead Compounds 29.5564 61,489

Mercury and Mercury Compounds 0 < 5.0

Polybrominated Biphenyls (PBB) 0 < 5.0

Polybrominated Diphenylethers (PBDE) 0 < 5.0

Asbestos 0 0

Azo colorants 0 0

Ozone Depleting Substances 0 0

Polychlorinated Biphenyls (PCBs) 0 0

Polychlorinated Napthalenes 0 0

Radioactive Substances 0 0

Shortchain Chlorinated Paraffins 0 0

Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0

Tributyl Tin Oxide (TBTO) 0 0

Formaldehyde 0 0




B1. MATERIAL COMPOSITION (Note 3)Using Copper-Palladium Wire material, KMC-3580LVA Mold Compound and HR9050G Film

MaterialPurpose of

UseSubstance


Weight bymg


material


perpackage


AluminumHydroxide

21645-51-2 29.8496 16.2300% 62,099 6.2099%

Copper 7440-50-8 53.1149 28.8798% 110,500 11.0500%

Gold 7440-57-5 0.2145 0.1166% 446 0.0446%

Nickel 7440-02-0 4.9462 2.6894% 10,290 1.0290%

Epoxy resin Trade secret 37.2404 20.2485% 77,475 7.7475%

SiO2 Glass Cloth 65997-17-3 58.5512 31.8357% 121,810 12.1810%

Solder Ball External PlatingSn 7440-31-5 50.3257 63.0000% 104,697 10.4697%Pb 7439-92-1 29.5564 37.0000% 61,489 6.1489%

Die Attach AdhesiveEpoxy resign Trade secret 0.3839 80.0000% 799 0.0799%Silica (fused) 60676-86-0 0.0960 20.0000% 200 0.0200%

Die Circuit Silicon 7440-21-3 25.6060 100.0000% 53,271 5.3271%

Wire InterconnectCu 7440-50-8 1.0918 98.3000% 2,271 0.2271%

Pd 7440-05-3 0.0189 1.7000% 39 0.0039%

MoldCompound

Encapsulation

Silica (fused) 60676-86-0 161.2460 85.0000% 335,455 33.5455%Carbon Black 1333-86-4 0.4743 0.2500% 987 0.0987%Epoxy resin Trade secret 26.2736 13.8500% 54,659 5.4659%Phosphoricorganic catalyst

Trade secret 0.5691 0.3000% 1,184 0.1184%

Metal Oxides Trade secret 1.1382 0.6000% 2,368 0.2368%







CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM





Desiccant < 1000PPM

< 100PPM

2.5 < 1000PPM

< 1000PPM

< 1000PPM

CoA-DESS-G

Document History Page

Document Title: 165 - FBGA 13X15 NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEETDocument Number: 001-05596




Rev. ECN No. Orig. ofChange

Description of Change

** 405951 YXP New specification*A 459354 XBQ Change Title – Remove package thickness as non significant

for PMDDAdded Assembly Site 2 – Package Qualification Report #055103

*B 1090043 VFR/HLR Changed Cypress Logo.Changed the value of Lead on Section 1 of Assembly Site 2.Completed the RoHS 6 substances (Lead, Mercury, HexavalentChromium, PBB and PBDE) for Declaration of IndirectPackaging Materials for Assembly Site 1 and 2.Deleted Platic Reel, Tube, Protective Band, Shipping and InnerPizza Box, Bubble pack on Table II – Declaration of PackagingIndirect Materials.Added % weight of substance per Homogeneous material onAssembly Site 1 and 2.Added PMDD for Site 3 – AIT, Batam, Indonesia

*C 1639867 VFR Added new PMDD for AIT, Batam, Indonesia under Assemblysite 4 – there is a change in mold compound and epoxy used. Ituses low-alpha mold compound and non-conductive epoxy.

*D 2770308 MAHA

Dcon

Added data for assembly site 5.Corrected the CAS number of gold for assembly sites 1 and 2.Added the CAS number of Lead for assembly sites 3 and 4.Change CML to WEB in distribution list.

*E 2779733 MAHA Added material declaration for assembly site 6.*F 3050768 MAHA Added the weight of Lead on Table A of assembly sites 1, 2, 3,

and 4.*G 3198391 MAHA Corrected the solder ball composition of Assembly site 6.*H 3403328 EBZ Added package weight B2 for Site 5. Added QTP #113007 for

Site 5. Added “adhesive using epoxy “for Material Compositiontable B1 for Site-5. Added Material Composition table B2 usingadhesive film for Site-5.

*I 3422912 MAHA Deleted assembly site 1. Deleted Ion Impurities from thematerial composition of assembly site 1. Recalculated the %weight of substance per Homogeneous material and PPMvalues of assembly site 1. Recalculated the PPM values of


Document Title: 165 - FBGA 13X15 NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEETDocument Number: 001-05596






assembly sites 2 and 3. Expressed the weight by mg, packageweight, % weight of substance per Homogeneous material, and% weight of substance per package in four decimal places forassembly sites 1, 2, 3, 4-B1, and 5.

*J 3593086 EBZ Added package weight B3 and B4 for Site 4. Added MaterialComposition table B3 using copper and table B4 using copperpd wire material for Site 4. Added package weight B2 for Site 5.Added Material Composition table B2 using copper pd wirematerial for Site 5.

*K 3807638 HLR Sunset Due – No Change*L 4031247 YUM Consolidate material composition in assembly site 1 and 5 in

one assembly site (CML).Removed assembly site 5.Consolidate material composition in one assembly site (PTUNISEM).Added assembly site name in the Assembly heading in site 1, 2and 3.

“M 4212758 JARG Added Material Composition for Assembly Site 1:B4 inreference with QTP 133105.

*N 4573742 HLR Sunset Due – No Change*O 4675460 CS Added reference QTP No. 144604 to Assembly Site 1*P 4906426 CS

DCON

Added assembly Site 4, Cypress Bangkok, QTP153602.

Removed Distribution and Posting from the document historypage.

Test Report. No. CANEC1501811807 Date: 05 Feb 2015 . Page 1 of 9.

GUANGZHOU SPECIAL COPPER ELECTRONICS MATERIAL CO.,LTD .

#58 NANYUN 2ND ROAD SCIENCE CITY,HIGH&NEW TECHNOLOGY INDUSTRIAL DEVELOPMENT

ZONE,GUANGZHOU

CHINA.

.

The following sample(s) was/were submitted and identified on behalf of the clients as : Pure Copper Anode .

SGS Job No. : CP15-005660 - GZ .

Date of Sample Received : . 30 Jan 2015.

Testing Period : . 30 Jan 2015 - 05 Feb 2015 .

Test Requested : . Selected test(s) as requested by client. .

Please refer to next page(s). .

Please refer to next page(s). .

Test Method : .

Test Results : .

Conclusion :. Based on the performed tests on submitted sample(s), the results of Lead,

Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBBs),

Polybrominated diphenyl ethers (PBDEs) comply with the limits as set by RoHS

Directive 2011/65/EU Annex II; recasting 2002/95/EC. .

Yan Lee .

Approved Signatory .

Signed for and on behalf ofSGS-CSTC Standards Technical Services Co., Ltd. Guangzhou Branch.


Test Results : .

Test Part Description : .

Specimen No.. SGS Sample ID. Description.

SN1. CAN15-018118.002 Copper-colored metal .

Remarks :.

(1) 1 mg/kg = 0.0001% .

(2) MDL = Method Detection Limit .

(3) ND = Not Detected ( < MDL ) .

(4) "-" = Not Regulated .

RoHS Directive 2011/65/EU.

Test Method : . (1)With reference to IEC 62321-5:2013, determination of Cadmium by ICP-OES.

(2)With reference to IEC 62321-5:2013, determination of Lead by ICP-OES.

(3)With reference to IEC 62321-4:2013, determination of Mercury by ICP-OES.

(4)With reference to IEC 62321:2008, determination of Hexavalent Chromium by spot test /

Colorimetric Method using UV-Vis.

(5)With reference to IEC 62321:2008, determination of PBBs and PBDEs by GC-MS. .

002.

Cadmium (Cd) . 100 mg/kg. 2 ND

Lead (Pb). 1,000 mg/kg. 2 ND

Mercury (Hg). 1,000 mg/kg. 2 ND

Hexavalent Chromium (CrVI) . - - ♢ Negative

Sum of PBBs. 1,000 mg/kg. - ND

Monobromobiphenyl . - mg/kg. 5 ND

Dibromobiphenyl . - mg/kg. 5 ND

Tribromobiphenyl . - mg/kg. 5 ND

Tetrabromobiphenyl . - mg/kg. 5 ND

Pentabromobiphenyl . - mg/kg. 5 ND

Hexabromobiphenyl . - mg/kg. 5 ND

Heptabromobiphenyl . - mg/kg. 5 ND

Octabromobiphenyl . - mg/kg. 5 ND

Nonabromobiphenyl . - mg/kg. 5 ND

Decabromobiphenyl . - mg/kg. 5 ND

Sum of PBDEs. 1,000 mg/kg. - ND

Monobromodiphenyl ether . - mg/kg. 5 ND

Test Item(s). Limit. Unit. MDL.


Test Item(s). Limit. Unit. MDL. 002.

Dibromodiphenyl ether . - mg/kg. 5 ND

Tribromodiphenyl ether . - mg/kg. 5 ND

Tetrabromodiphenyl ether . - mg/kg. 5 ND

Pentabromodiphenyl ether . - mg/kg. 5 ND

Hexabromodiphenyl ether . - mg/kg. 5 ND

Heptabromodiphenyl ether . - mg/kg. 5 ND

Octabromodiphenyl ether . - mg/kg. 5 ND

Nonabromodiphenyl ether . - mg/kg. 5 ND

Decabromodiphenyl ether . - mg/kg. 5 ND

Notes :.

(1) The maximum permissible limit is quoted from directive 2011/65/EU, Annex II

(2)◇Spot-test:

Negative = Absence of CrVI coating, Positive = Presence of CrVI coating;

(The tested sample should be further verified by boiling-water-extraction method if the spot test result is

Negative or cannot be confirmed.)

◇Boiling-water-extraction:

Negative = Absence of CrVI coating

Positive = Presence of CrVI coating; the detected concentration in boiling-water-extraction solution is

equal or greater than 0.02 mg/kg with 50 cm2 sample surface area.

Information on storage conditions and production date of the tested sample is unavailable and thus results

of Cr(VI) represent status of the sample at the time of testing. .

Hexabromocyclododecane (HBCDD).

Test Method : . Determination of HBCDD by GC-MS based on IEC 62321:2008. .

Test Item(s). Unit. MDL.

mg/kg.

002.

10 NDHexabromocyclododecane (HBCDD) .

Notes :.

(1) Reference Information: Directive 2011/65/EU recasting RoHS directive 2002/95/EC:

Hexabromocyclododecane (HBCDD) is considered as a priority for risk evaluation and substance

restriction. .

PFOS (Perfluorooctane Sulfonates) and PFOA (Perfluorooctanoic Acid).

Test Method : . With reference to US EPA Method 3550C: 2007, analysis was performed by HPLC-MS. .


Test Item(s). CAS NO. Unit. MDL. 002.

Perfluorooctane Sulfonates (PFOS) and related

Acid,Metal Salt and Amide .

1763-23-1. mg/kg. 10. ND.

Perfluorooctanoic Acid (PFOA) . 335-67-1. mg/kg. 10. ND.

Notes :.

For reference: commission regulation (EU) No 757/2010 amending regulation (EC) No 850/2004:

(1) For the purposes of this entry, Article 4(1) (b) shall apply to concentrations of PFOS equal to or below

10 mg/kg (0,001 % by weight) when it occurs in substances or in preparations.

(2) For the purposes of this entry, Article 4(1) (b) shall apply to concentrations of PFOS in semi-finished

products or articles, or parts thereof, if the concentration of PFOS is lower than 0,1 % by weight

calculated with reference to the mass of structurally or micro-structurally distinct parts that contain PFOS

or, for textiles or other coated materials, if the amount of PFOS is lower than 1μg /m2 of the coated

material..

Phthalate.

Test Method : . Determination of phthalates by GC-MS based on EN 14372:2004. .

CAS NO.Test Item(s). Unit. MDL. 002.

Dibutyl Phthalate (DBP) . 84-74-2. %(w/w). 0.003 ND

Benzylbutyl Phthalate (BBP) . 85-68-7. %(w/w). 0.003 ND

Bis(2-ethylhexyl) Phthalate

(DEHP).

117-81-7. %(w/w). 0.003 ND

Notes :.

(1) Reference Information: Directive 2011/65/EU recasting RoHS directive 2002/95/EC:

Bis (2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP) and Dibutyl phthalate (DBP) are

considered as a priority for risk evaluation and substance restriction. .

Remark: Results & photo(s) of this report refer to test report CANEC1501811805. .


ATTACHMENTS RoHS Testing Flow Chart

1) Name of the person who made testing: Bruce Xiao / Sunny Hu 2) Name of the person in charge of testing: Bella Wang / Cutey Yu 3) These samples were dissolved totally by pre -conditioning method according to below flow chart (Cr6+ and PBBs/PBDEs test method excluded ).

Sample Preparation

Sample Measurement

Acid digestion with microwave/ hotplate

Filtration

Solution Residue

1) Alkali Fusion / Dry Ashing

2) Acid to dissolve

ICP-OES/AAS

DATA

Sample solvent extraction

Filtration

GC-MS

DATA

Nonmetallic material

Metallic material

Adding digestion reagent

Heating to 90~95℃ for extraction

Filtration and pH adjustment

Adding 1,5- diphenylcarbazide for color development

UV-Vis

DATA

Spot test

Boiling water extraction

Adding 1,5- diphenylcarbazide for color development

A red color indicates the presence of Cr 6+. If necessary, confirm with UV-Vis.

DATA

Positive

Negative

Pb/Cd/Hg

PBBs/PBDEs

Cr6+

Concentration/ Dilution of extraction

solution


ATTACHMENTS

HBCDD Testing Flow Chart 1) Name of the person who made testing: Sunny Hu 2) Name of the person in charge of testing: Cutey Yu

Sample cutting / preparation

Sample Measurement

Solvent extraction

Concentration/Dilution

Filtration

GC-MS

DATA


ATTACHMENTS

Phthalates Testing Flow Chart 1) Name of the person who made testing: Sunny Hu 2) Name of the person in charge of testing: Cutey Yu


Sample Measurement

Solvent extraction


Filtration

GC-MS

DATA


ATTACHMENTS

PFOA / PFOS Testing Flow Chart 1) Name of the person who made testing: Zhihong Wang 2) Name of the person in charge of testing: Cutey Yu


Sample Measurement

Solvent extraction


Filtration

LC-MS

DATA


Sample photo: .

CANEC1501811807

CAN15-018118.002 .

SGS authenticate the photo on original report only .

*** End of Report *** .

Document No.002-03306 Rev. ** ECN # 4912817

Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.

Page 1 of 9

Cypress Semiconductor Package Qualification Report

QTP# 153602 VERSION **

September 2015

165 FBGA (13x15x1.4mm)

Sn/Pb & SAC405 Ball Finish, CuPd Wire

MSL3, 260C Reflow

BKK-Thailand (SB)

FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE

Prepared By:

Josephine Pineda (JYF) Reviewed By:

Rene Rodgers (RT) Reliability Engineer Reliability Manager

Approved By: Don Darling (DCDA)

Reliability Director

mailto:[email protected]



Page 2 of 9

PACKAGE QUALIFICATION HISTORY

QTP

Number

Description of Qualification Purpose

Date

153602

Qualification of 165 FBGA (13x15x1.4mm) at Cypress Bangkok, Thailand (BKK) Assembly using 0.8mil Cu-Pd wire, HR9050G Die Attach Film, KMC-3580LVA Mold Compound with Sn/Pb & Sn/Ag/Cu Ball Finish at MSL3, 260C Reflow Temperature

September 2015



Page 3 of 9

ELECTRICAL TEST / FINISH DESCRIPTION

Test Location: CML-R

Note: Please contact a Cypress Representative for other packages availability.

MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION

Package Designation: BW165, BB165

Package Outline, Type, or Name: 165-Ball FBGA (Fine Ball Grid Array)

Mold Compound Name/Manufacturer: KMC-3580LVA/ ShinEtsu

Mold Compound Flammability Rating: V-0 / UL94

Oxygen Rating Index: >40%

Leadframe Material: BT Resin

Lead Finish, Composition / Thickness: Sn/Ag/Cu (SAC405), SnPb

Die Backside Preparation Method/Metallization: Backgrind

Die Separation Method: Saw

Die Attach Supplier: Hitachi

Die Attach Material: HR9050G

Bond Diagram Designation: 001-98083

Wire Bond Method: Thermosonic

Wire Material/Size: CuPd, 0.8 mil

Thermal Resistance Theta JA °C/W: 72°C/W

Package Cross Section Yes/No: No

Assembly Process Flow: 001-97055

Name/Location of Assembly (prime) facility: BKK-Thailand (SB)

MSL Level 3

Reflow Profile 260C

javascript:getLocateDocDetails('001-98083','')



Page 4 of 9

RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS

Stress/Test Test Condition (Temp/Bias)

Result P/F

Acoustic Microscopy

J-STD-020 Precondition: JESD22 Moisture Sensitivity Level

(192 Hrs., 30C, 60% RH, 260C Reflow) P

Ball Shear JESD22-B116 P

Bond Pull MIL-STD-883 – Method 2011 P

Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package

P

Die Shear

MIL-STD-883, Method 2019 Per die size:

<3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf

P

Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack

P

Electrostatic Discharge Charge Device Model (ESD-CDM)

500V/1,000V/1,250V JESD22-C101

P

Final Visual JESD22-B101 P

High Accelerated Saturation Test (HAST)

JEDEC STD 22-A110: 110°C, 85% RH, 1.95V Precondition: JESD22 Moisture Sensitivity Level

(192 Hrs., 30 C, 60% RH, 260C Reflow)

P

High Temperature Storage JESD22-A103:150°C No bias P

Internal Visual MIL-STD-883-2014 P

Physical Dimension MIL-STD-1835, JESD22-B100 P

Pressure Cooker

JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level

(192 Hrs., 30 C, 60% RH, 260C Reflow)

P

Solder Ball Shear JESD22-B117 P

Solderability J-STD-002, JESD22-B102 P

Temperature Cycle

MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level

(192 Hrs., 30C, 60% RH, 260C Reflow) P

X-Ray MIL-STD-883 - 2012 P



Page 5 of 9

Reliability Test Data

QTP #: 153602

Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism

STRESS: ACOUSTIC, MSL3

CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 15 0

CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 15 0





STRESS: BALL SHEAR







STRESS: BOND PULL







STRESS: CONSTRUCTIONAL ANALYSIS





Page 6 of 9


QTP #: 153602


STRESS: DIE SHEAR







STRESS: DYE PENETRANT TEST






STRESS: ESD-CHARGE DEVICE MODEL

CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 500 9 0



STRESS: FINAL VISUAL







STRESS: HI-ACCEL SATURATION TEST (110C, 85%RH, 1.95V), PRE COND 192 HR 30C/60%RH (MSL3)

CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 264 28 0






Page 7 of 9


QTP #: 153602


STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C



STRESS: INTERNAL VISUAL




STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3)






STRESS: PHYSICAL DIMENSION







STRESS: SOLDER BALL SHEAR









Page 8 of 9


QTP #: 153602


STRESS: SOLDERABILITY TEST




STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3








STRESS: X-RAY









Document Title: QTP# 153602: 165 FBGA (13X15X1.4MM) SN/PB & SAC405 BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, BKK-THAILAND (SB)

Document Number: 002-03306


Page 9 of 9

Rev. ECN No.

Orig. of Change


** 4912817 JYF Initial spec release.

TEST REPORT

Applicant : Doosan Corporation Electro-Materials BG

Address : 10, Suji-ro 112beon-gil, Suji-gu,

Yongin-si, Gyeonggi-do, Korea

Page: 1 of 4

Report No. RT15R-S0822-015-E1 Date: Feb. 27, 2015

Sample Description : The following submitted sample(s) said to be:-

Name/Type of Product : DS-7409HG B

Sample ID No. : RT15R-S0822-015

Manufacturer/Vendor : Doosan Corporation Electro-Materials BG

Sample received : Feb. 12, 2015

Testing Date : Feb. 12, 2015 ~ Feb. 27, 2015

Test Type : RoHS wet chemical analysis

Test Method(s) : Please see the following page(s).

Test Result(s) : Please see the following page(s).

* Note 1 : The test results presented in this report relate only to the object tested.

* Note 2 : This report shall not be reproduced except in full without the written approval of the testing laboratory.

Approved by, Authorized by,

Authenticity check

Jade Jang / Lab. Technical Manager Bo Park / Lab. General Manager

Intertek Testing Services Korea Ltd.

Seoul Office: Tel : 02-6090-9500 Fax : 02-3409-0026 Daegu Office : Tel : 053-600-8647 Fax : 053-600-8645 Web Site : www.Intertek.co.kr Seoul Lab. Address : 1/F, A-ju Digital Tower, #284-56, Seongsu 2-ga, Seongdong-Gu, Seoul, 133-833 Korea

Ulsan Lab. Address : #340-2, Yongam-Ri, Chongryang-Myun, Ulju-Gun, Ulsan 689-865 Korea

This Test Report is issued by the Company subject to its Terms and Conditions of Business printed overleaf. Attention is drawn to the limitations of liability, indemnification and jurisdictional issues defined therein. This Test Report shall not be reproduced, except in full, without prior written consent of the Company.

TEST REPORT Page: 2 of 4



Sample Description : DS-7409HG B

Test Item Unit Test Method MDL Result

Cadmium (Cd) ㎎/㎏ With reference to

IEC 62321-5 Edition 1.0 : 2013, by acid digestion and

determined by ICP-OES

0.5 N.D.

Lead (Pb) ㎎/㎏ 5 N.D.

Mercury (Hg) ㎎/㎏

With reference to IEC 62321-4 Edition 1.0 :

2013, by acid digestion and determined by ICP-OES

2 N.D.

Hexavalent Chromium (Cr 6+

) (For non-metal)

㎎/㎏

With reference to IEC 62321 Edition 1.0 : 2008,

by alkaline digestion and determined by UV-VIS

Spectrophotometer

1 N.D.

Polybrominated Biphenyl (PBBs)

Monobromobiphenyl ㎎/㎏


by solvent extraction and determined by GC/MS

5 N.D.

Dibromobiphenyl ㎎/㎏ 5 N.D.

Tribromobiphenyl ㎎/㎏ 5 N.D.

Tetrabromobiphenyl ㎎/㎏ 5 N.D.

Pentabromobiphenyl ㎎/㎏ 5 N.D.

Hexabromobiphenyl ㎎/㎏ 5 N.D.

Heptabromobiphenyl ㎎/㎏ 5 N.D.

Octabromobiphenyl ㎎/㎏ 5 N.D.

Nonabromobiphenyl ㎎/㎏ 5 N.D.

Decabromobiphenyl ㎎/㎏ 5 N.D.

Polybrominated Diphenyl Ether (PBDEs)

Monobromodiphenyl ether ㎎/㎏


by solvent extraction and determined by GC/MS

5 N.D.

Dibromodiphenyl ether ㎎/㎏ 5 N.D.

Tribromodiphenyl ether ㎎/㎏ 5 N.D.

Tetrabromodiphenyl ether ㎎/㎏ 5 N.D.

Pentabromodiphenyl ether ㎎/㎏ 5 N.D.

Hexabromodiphenyl ether ㎎/㎏ 5 N.D.

Heptabromodiphenyl ether ㎎/㎏ 5 N.D.

Octabromodiphenyl ether ㎎/㎏ 5 N.D.

Nonabromodiphenyl ether ㎎/㎏ 5 N.D.

Decabromodiphenyl ether ㎎/㎏ 5 N.D.

Tested by : Seonae Kim, Jooyeon Lee, Hyoji Lee

Notes : ㎎/㎏ = ppm = parts per million

< = Less than

N.D. = Not detected ( <MDL )

MDL = Method detection limit









* View of sample as received;-









Flow Chart (IEC 62321 Edition 1.0)

Receipt

Sampling/

Grinding or Cutting

For different material,

digest the sample with

appropriate acid*1

Pb, Cd, Hg Cr6+

PBBs /PBDEs

Confirm the tested

samples are

totally dissolved*2

Make up with

deionized water

Analyzed by ICP-OES

Weigh sample and add

alkaline solution

Definite temperature

extraction

Cool and filter

the extract

Make up with deionized

water and add diphenyl-

carbazide solution

Analyzed by UV-VIS

Weigh sample

and add organic solvent

Soxhlet extraction

or solvent extraction

Concentrate the extract

and make up with

organic solvent

Analyzed by GC-MS

Polymers / Electronics

Data

Report

Data

Report

Data

Report

Remarks :

*1 : List of appropriate acid：

Material Acid added for digestion

Polymers HNO3, HCl, HF, H2O2, H3BO3

Metals HNO3, HCl, HF

Electronics HNO3, HCl, H2O2, HBF4 *2 : The samples were dissolved totally by pre-conditioning method according to above flow chart.

***** End of Report *****

This report is made solely on the basis of your instructions and/or information and materials supplied by you. It is not intended to be a recommendation for any particular course of action. Intertek does not accept a duty of care or any other responsibility to any person other than the Client in respect of this report and only accepts liability to the Client insofar as is expressly contained in the terms and conditions governing Intertek's provision of services to you. Intertek makes no warranties or representations either express or implied with respect to this report save as provided for in those terms and conditions. We have aimed to conduct the Review on a diligent and careful basis and we do not accept any liability to you for any loss arising out of or in connection with this report, in contract, tort, by statute or otherwise, except in the event of our gross negligence or wilful misconduct.





Page : 1 of 19

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:

(1)

(2)

:

As specified by client, with reference to RoHS Directive 2011/65/EU Annex II to determine Cadmium, Lead,Mercury, Cr(VI), PBBs, PBDEs contents in the submitted sample.

Please refer to next pages for the other item(s).

2015/03/27 TO 2015/04/08

Please refer to next page(s).

No. : CE/2015/37529 Date : 2015/04/08Test Report*CE/2015/37529*NIPPON MICROMETAL CORPORATION

158-1, SAYAMAGAHARA IRUMA-CITY, SAITAMA 358-0032, JAPAN

COPPER WIRE(EX1)

The following sample(s) was/were submitted and identified by/on behalf of the applicant as :

Testing Period

Test Result(s)

Sample Receiving Date

Sample Description

Style/Item No.

2015/03/27

NIPPON COPPER WIRE

Test Requested

33, Wu Chuan Rd., New Taipei Industrial Park, New Taipei City, Taiwan / 新北市新北產業園區五權路33號t+886 (02)2299 3279 f+886 (02)2299 3237 www.sgs.tw

Member of the SGS Group

SGS Taiwan Ltd. 台灣檢驗科技股份有限公司

This document is issued by the Company subject to its General Conditions of Service printed overleaf, available on request or accessible at http://www.sgs.com/en/Terms-and-Conditions.aspx and, for electronic format documents, subject to Terms and Conditions for Electronic Documents at http://www.sgs.com/en/Terms-and-Conditions/Termse-Document.aspx. Attention is drawn to the limitation of liability, indemnification and jurisdiction issues defined therein. Any holder of this document is advised that information contained hereon reflects the Company’s findings at the time of its intervention only and within the limits of client’s instruction, if any. The Company’s sole responsibility is to its Client and this document does not exonerate parties to a transaction from exercising all their rights and obligations under the transaction documents. This document cannot be reproduced, except in full, without prior written approval of the Company. Any unauthorized alteration, forgery or falsification of the content or appearance of this document is unlawful and offenders may be prosecuted to the fullest extent of the law. Unless otherwise stated the results shown in this test report refer only to the sample(s) tested.

Page : 2 of 19No. : CE/2015/37529 Date : 2015/04/08Test Report*CE/2015/37529*NIPPON MICROMETAL CORPORATION


Test Result(s)

：

Result

No.1

mg/kg With reference to IEC 62321-5: 2013and performed by ICP-AES.

2 n.d.


2 n.d.


2 n.d.

** With reference to IEC 62321: 2008 andperformed by Boiling water extractionMethod.#

# Negative

mg/kg With reference to IEC 62321: 2008 andperformed by UV-VIS.

2 n.d.

mg/kg With reference to US EPA Method3052. Analysis was performed by ICP-AES.

2 n.d.

mg/kg With reference to US EPA Method3050B. Analysis was performed byICP-AES.

2 n.d.

** Analysis was performed by FTIR andFLAME Test.

- Negative

mg/kg With reference to US EPA 3540Cmethod. Analysis was performed byGC/MS.

0.5 n.d.


0.5 n.d.


5 n.d.


100 n.d.

Polychlorinated Biphenyls(PCBs) (CAS No.: 1336-36-3)

Polychlorinated Terphenyls(PCTs)

Polychlorinated Naphthalene(PCNs)

Alkanes, C10-13, chloro (ShortChain Chlorinated Paraffins)(CAS No.: 85535-84-8)

Unit

PART NAME No.1

Test Item(s) MDLMethod

Lead (Pb)

Antimony (Sb)

Beryllium (Be)

Hexavalent Chromium Cr(VI)

PVC

Mercury (Hg)

Cadmium (Cd)

SILVER COLORED METAL WIRE (INCLUDING THE PLATING LAYER)







Result

No.1

mg/kg 10 n.d.

mg/kg 10 n.d.

mg/kg With reference to IEC 62321: 2008method. Analysis was performed byGC/MS.

5 n.d.

% With reference to EN 14372. Analysiswas performed by GC/MS.

0.003 n.d.


0.003 n.d.


0.01 n.d.


0.01 n.d.


0.003 n.d.


0.003 n.d.


0.003 n.d.


0.003 n.d.

mg/kg With reference to BS EN 14582:2007.Analysis was performed by IC.

50 n.d.


50 n.d.

Halogen

DNHP (Di-n-hexyl phthalate)(CAS No.: 84-75-3)

Hexabromocyclododecane(HBCDD) and all majordiastereoisomers identified (α-HBCDD, β- HBCDD, γ- HBCDD)(CAS No.: 25637-99-4 and 3194-55-6 (134237-51-7, 134237-50-6,134237-52-8))

DNOP (Di-n-octyl phthalate)(CAS No.: 117-84-0)

DBP (Dibutyl phthalate) (CASNo.: 84-74-2)

DIBP (Di-isobutyl phthalate)(CAS No.: 84-69-5)

DEHP (Di- (2-ethylhexyl)phthalate) (CAS No.: 117-81-7)

DIDP (Di-isodecyl phthalate)(CAS No.: 26761-40-0; 68515-49-1)

DINP (Di-isononyl phthalate)(CAS No.: 28553-12-0; 68515-48-0)

BBP (Butyl Benzyl phthalate)(CAS No.: 85-68-7)

Perfluorooctane sulfonates(PFOS-Acid, Metal Salt, Amide)

PFOA (CAS No.: 335-67-1)

Halogen-Fluorine (F) (CAS No.:14762-94-8)

Halogen-Chlorine (Cl) (CAS No.:22537-15-1)

Test Item(s) Unit Method MDL

With reference to US EPA 3550C:2007. Analysis was performed byLC/MS.







Result

No.1


50 n.d.


50 n.d.

mg/kg 0.03 n.d.

mg/kg 0.03 n.d.

mg/kg - n.d.

mg/kg 0.03 n.d.

mg/kg 0.03 n.d.

mg/kg - n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg - n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

mg/kg 5 n.d.

Nonabromodiphenyl ether

Decabromodiphenyl ether

Pentabromodiphenyl ether

Hexabromodiphenyl ether

Heptabromodiphenyl ether

Octabromodiphenyl ether

Tributyl Tin Oxide (TBTO)***(CAS No.: 56-35-9)

Dibutyl Tin (DBT)

Dioctyl Tin (DOT)

Tribromodiphenyl ether

Tetrabromodiphenyl ether

Nonabromobiphenyl

Decabromobiphenyl

Hexabromobiphenyl

Heptabromobiphenyl

Octabromobiphenyl

Tetrabromobiphenyl

Sum of PBBs

Monobromobiphenyl

Tributyl Tin (TBT)

Triphenyl Tin (TphT)

Sum of PBDEs

Monobromodiphenyl ether

Dibromodiphenyl ether

Pentabromobiphenyl

Halogen-Bromine (Br) (CAS No.:10097-32-2)

Halogen-Iodine (I) (CAS No.:14362-44-8)

Dibromobiphenyl

Tribromobiphenyl

Test Item(s) Unit Method MDL

With reference to ISO 17353. Analysiswas performed by GC/FPD.

With reference to IEC 62321: 2008 andperformed by GC/MS.







1.

2.

3.

4.

5.

6.

7.

8.

9. Parameter Conversion Table：Please refer to http://twap.sgs.com/sgsrsts/chn/download-REACH_tw.asp

# = a. Positive means the presence of CrVI on the tested areasb. Negative means the absence of CrVI on the tested areas

The detected concentration in boiling-water-extraction solution is equal or greater than 0.02 mg/kg with 50 cm²tested areas.

***: The substance was calculated by the test result of Tributyl Tin. The MDL was evaluated for Tributyl Tin.

Outlawing PFOS as substances or preparations in concentrations above 0.001% (10ppm), in semi-finished productsor articles or parts at a level above 0.1%(1000ppm), in textiles or other coated materials above 1µg/m².

Note：

PFOS Reference Information : POPs - (EU) 757/2010

mg/kg = ppm；0.1wt% = 1000ppm

n.d. = Not Detected

MDL = Method Detection Limit

" - " = Not Regulated

** = Qualitative analysis (No Unit)

Negative = Undetectable / Positive = Detectable







#FLOW

Note** (For IEC 62321)(1) For non-metallic material, add alkaline digestion reagent and heat to 90~95℃.

(2) For metallic material, add pure water and heat to boiling.

1) These samples were dissolved totally by pre-conditioning method according to below flow chart.

（Cr6+

test method excluded）

2) Name of the person who made measurement: Climbgreat Yang

3) Name of the person in charge of measurement: Troy Chang

Cutting / Preparation

Sample Measurement

Pb、Cd

Acid digestion by suitable aciddepended on different samplematerial (as below table)

Microwave digestion withHNO3/HCl/HF

Filtration

Add appropriate amountof digestion reagent

Heat to appropriatetemperature to extract

Cool, filter digestatethrough filter

Add diphenyl-carbazidefor color development

measure the absorbanceat 540 nm by UV-VIS

Hg

SolutionResidue

1) Alkali Fusion

2) HCl to dissolve

ICP-AES

Sample Material Digestion Acid

Steel, copper, aluminum, solder Aqua regia, HNO3, HCl, HF, H2O2

Glass HNO3/HF

Gold, platinum, palladium, ceramic Aqua regia

Silver HNO3

Plastic H2SO4, H2O2, HNO3, HCl

Others Added appropriate reagent to totaldigestion

Cr6＋

(Note**)







ICP-AES

Acid digestion by suitable acid depended on

different sample material (as below table)

Filtration

Solution Residue

1) Alkali Fusion2) HCl to dissolve

Sample Measurement



Glass HNO3/HF


Silver HNO3


Others Added appropriate reagent to total digestion

1) These samples were dissolved totally by pre-conditioning method according to below flow

chart.



Flow Chart of digestion for the elements analysis performed by ICP-AES







HBCDD analytical flow chart

Name of the person who made measurement: Roman Wong Name of the person in charge of measurement: Troy Chang

Data

Sample extraction / Ultrasonic method

Analysis was performed by GC/MS

Filter

Sample pretreatment

Concentrate/Dilute Extracted solution







Analytical flow chart of phthalate content


【Test method: EN 14372】

Sample pretreatment/separation

Sample extraction by soxhlet method



Data







Analysis flow chart for determination of PVC in material

Name of the person who made measurement: Roy Lin

Name of the person in charge of measurement: Troy Chang

Sample pre-treatment

Flame test

Sample analyzed by FTIR

Check wave-number of C-Cl bonding

Data







Analytical flow chart of Organic-Tin content

Sample pretreatment

Sample extraction by organic solvent

Derived by Sodium tetraethylborate


Data

Name of the person who made measurement: Roy Lin


Analysis was performed by GC/FPD







PBB/PBDE analytical FLOW CHART

First testing process

Optional screen process

Confirmation process

Sample

Screen analysis

Issue Report

Sample pretreatment

Sample extraction/Soxhlet method

Concentrate/DiluteExtracted solution

Analysis by GC/MS

Filter

Name of the person who made measurement: Roman Wong








PFOA/PFOS analytical flow chart of Ultrasonic extraction (LC/MS) procedure


Sample pretreatment

Sample extraction by Ultrasonic extraction

(Reference method: US EPA 3550C)


Analysis was performed by LC/MS

Data







Analytical flow chart of halogen content

Name of the person who made measurement: Rita Chen


Sample pretreatment / Separation

Weighting and putting sample in cell

Oxygen Bomb Combustion / Absorption

Analysis was performed by IC

Dilution to fixed volume







Chlorinated Paraffins analytical flow chart

Name of the person who made measurement: Barry Tseng Name of the person in charge of measurement: Troy Chang

Sample pretreatment


Concentrate/Dilute the extracted solution


Data







PCNs analytical flow chart


Sample pretreatment




Data







PCTs analytical flow chart


Sample pretreatment




Data







PCBs analytical flow chart


Sample pretreatment




Data







#PIC

** End of Report **

* The tested sample / part is marked by an arrow if it's shown on the photo. *





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2015/03/10 TO 2015/03/16


Based on the performed tests on submitted samples, the test results of Cadmium, Lead,Mercury, Cr(VI), PBBs, PBDEs comply with the limits as set by RoHS Directive2011/65/EU Annex II.

As specified by client, with reference to RoHS Directive 2011/65/EU Annex II todetermine Cadmium, Lead, Mercury, Cr(VI), PBBs, PBDEs contents in the submittedsample.


No. : CE/2015/32854 Date : 2015/03/16Test Report*CE/2015/32854*TAIYO INK MFG. CO., LTD.

2015/03/10


900, HIRASAWA, RANZAN-MACHI, HIKI-GUN, SAITAMA 355-0215 JAPAN

Style/Item No.

WHITE

HARDENER

Sample Submitted By TAIYO INK MFG. CO., LTD.

CA-40 AUS2-330Ps (UL:CA-40BB)

Test Method

Test Result(s)

Sample Description

Color

Test Requested

Conclusion

Sample Receiving Date

Testing Period





Page: 2 of 5No. : CE/2015/32854 Date : 2015/03/16Test Report*CE/2015/32854*TAIYO INK MFG. CO., LTD.


Test Result(s)

：

Result

No.1


2 n.d. 100


2 n.d. 1000


2 n.d. 1000

mg/kg With reference to IEC 62321: 2008 andperformed by UV-VIS.

2 n.d. 1000

mg/kg - n.d. 1000

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg - n.d. 1000

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

mg/kg 5 n.d. -

1.

2.

3.

4.

mg/kg = ppm；0.1wt% = 1000ppm

LimitMDLMethod

WHITE INK

Unit

Lead (Pb)

Pentabromobiphenyl

Monobromobiphenyl

Tribromobiphenyl

Tetrabromobiphenyl

PART NAME No.1

n.d. = Not Detected

MDL = Method Detection Limit

" - " = Not Regulated

Note：

With reference to IEC 62321: 2008 andperformed by GC/MS.

Decabromobiphenyl

Sum of PBDEs

Heptabromobiphenyl

Octabromobiphenyl

Pentabromodiphenyl ether

Nonabromobiphenyl

Tetrabromodiphenyl ether

Nonabromodiphenyl ether

Heptabromodiphenyl ether

Octabromodiphenyl ether

Hexabromobiphenyl

Decabromodiphenyl ether

Dibromodiphenyl ether

Tribromodiphenyl ether

Monobromodiphenyl ether

Hexabromodiphenyl ether

Test Item(s)

Mercury (Hg)

Hexavalent Chromium Cr(VI)

Sum of PBBs

Cadmium (Cd)

Dibromobiphenyl







Note**：(1) For non-metallic material, add alkaline digestion reagent and heat to 90~95℃.(2) For metallic material, add pure water and heat to boiling.

1) These samples were dissolved totally by pre-conditioning method according to below flow chart.

（Cr6+

test method excluded）




Sample Measurement

Pb、Cd

Acid digestion by suitable aciddepended on different samplematerial (as below table)

Microwave digestion withHNO3/HCl/HF

Filtration

Add appropriate amountof digestion reagent

Heat to appropriatetemperature to extract

Cool, filter digestatethrough filter

Add diphenyl-carbazidefor color development

measure the absorbanceat 540 nm by UV-VIS

Hg

SolutionResidue

1) Alkali Fusion

2) HCl to dissolve

ICP-AES

Sample Material Digestion Acid


Glass HNO3/HF


Silver HNO3


Others Added appropriate reagent to totaldigestion

Cr6＋

(Note**)








First testing process

Optional screen process

Confirmation process

Sample

Screen analysis

Issue Report

Sample pretreatment

Sample extraction/Soxhlet method

Concentrate/DiluteExtracted solution

Analysis by GC/MS

Filter

Name of the person who made measurement: Roman Wong








** End of Report **










Page:1of8

:

:

:

:

:

= = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = =

:

N o.:CE/2015/23732 Date:2015/02/26Test Report*CE/2015/23732*H IT AC H IC H E M ICAL CO.,L T D .

H IT AC H IC H E M ICAL CO.,L T D .

14,G OIM IN AM IK AIG AN ,IC H IH ARA-SH I,C H IB A,290-8567,JAPAN

H R-9050G SERIE S

Sam pleReceiv ingDate

2015/02/16 T O 2015/02/26

Pleas ereferto next page(s ).

T es tingPeriod

Test Result(s)

2015/02/16

DIE AT T AC H FIL M


Sam pleSu bm itted B y

Sam pleDes cription

Style/Item N o.





Page:2of8N o.:CE/2015/23732 Date:2015/02/26Test Report*CE/2015/23732*H IT AC H IC H E M ICAL CO.,L T D .


Test Result(s)

：

Result

No.1

m g/kg W ith referenceto IE C 62321-5:2013andperform edby ICP-AE S.

2 n.d.


2 n.d.


2 n.d.

m g/kg W ith referenceto IE C 62321:2008andperform edby U V -V IS.

2 n.d.

m g/kg W ith referenceto U S E PA M ethod3052.Analys is was perform edby ICP-AE S.

2 n.d.

m g/kg W ith referenceto U S E PA M ethod3052.Analys is was perform edby ICP-AE S.***

- n.d.

m g/kg - n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

MDLMethod

W ith referenceto IE C 62321:2008andperform edby G C/M S.

Unit

Antim ony (Sb)

Antim ony trioxide(Sb₂O₃)***(CAS N o.:1309-64-4)

Dibrom obiphenyl

T ribrom obiphenyl

T etrabrom obiphenyl

PAR T N AM E N o.1 M IXE D T RAN S L U C E N T A N D W H IT E FIL M

Test Item(s)

M ercu ry (H g)

H exav alent Chrom iu m Cr(V I)

Sum of PBBs

Cadm iu m (Cd)

H exabrom obiphenyl

Decabrom obiphenyl

H eptabrom obiphenyl

Octabrom obiphenyl

N onabrom obiphenyl

L ead(Pb)

Pentabrom obiphenyl

M onobrom obiphenyl







Result

No.1

m g/kg - n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 5 n.d.

m g/kg 50 n.d.

m g/kg 50 n.d.

m g/kg 50 n.d.

m g/kg 50 n.d.

1.

2.

3.

4.

5.

6.

7.T hes am ple(s )was /wereanalyzedon behalfoftheapplicant as m ixings am plein onetes ting.T heabov eres u lt(s )was /wereonly giv en as theinform ality v alu e.

Note：

m g/kg= ppm ；0.1wt% = 1000ppm

W ith referenceto B S E N 14582:2007.Analys is was perform edby IC.

Method

W ith referenceto IE C 62321:2008andperform edby G C/M S.

Test Item(s) Unit

Decabrom odiphenylether

H exabrom odiphenylether

H eptabrom odiphenylether

Octabrom odiphenylether

N onabrom odiphenylether

M onobrom odiphenylether

Dibrom odiphenylether

T ribrom odiphenylether

MDL

Halogen

H alogen-Flu orine(F)(CAS N o.:14762-94-8)

H alogen-Chlorine(Cl)(CAS N o.:22537-15-1)

n.d.= N ot Detected

M D L = M ethodDetection L im it

"-"= N ot Regu lated

Param eterConv ers ion T able：Pleas ereferto http://twap.s gs .com /s gs rs ts /chn/download-REAC H _ tw .as p

***:T hes u bs tancewas calcu latedby thetes t res u lt ofAntim ony.T heM D L was ev alu atedforAntim ony.

T etrabrom odiphenylether

H alogen-B rom ine(B r)(CAS N o.:10097-32-2)

H alogen-Iodine(I)(CAS N o.:14362-44-8)

Pentabrom odiphenylether

Sum of PBDEs







#FLOW

Note** (For IEC 62321)(1)Fornon-m etallicm aterial,addalkalinediges tion reagent and heat to 90~95℃.

(2)Form etallicm aterial,addpu rewaterandheat to boiling.

1) T hes es am ples weredis s olv ed totally by pre-conditioningm ethodaccordingto below flow chart.

（Cr6+tes t m ethodexclu ded）

2) N am eofthepers on w ho m adem eas u rem ent:Clim bgreat Yang

3) N am eofthepers on in chargeofm eas u rem ent:T roy Chang

C u tting/Preparation

Sam pleM eas u rem ent

Pb、Cd

Aciddiges tion by s u itableaciddependedon different s am plem aterial(as below table)

M icrowav ediges tion w ithH N O3/H Cl/H F

Filtration

Addappropriateam ou ntofdiges tion reagent

H eat to appropriatetem peratu reto extract

C ool,filterdiges tatethrou gh filter

Adddiphenyl-carbazideforcolordev elopm ent

m eas u retheabs orbanceat 540nm by U V -V IS

Hg

Solu tionRes idu e

1) AlkaliFu s ion

2) H C lto dis s olv e

ICP-AES

Sam pleM aterial Diges tion Acid

Steel,copper,alu m inu m ,s older Aqu a regia,H N O3,H C l,H F,H 2O2

G las s H N O3/H F

G old,platinu m ,palladiu m ,ceram ic Aqu a regia

Silv er H N O3

Plas tic H 2SO4,H 2O2,H N O3,H C l

Others Addedappropriatereagent to totaldiges tion

Cr6＋

(Note**)








Firs t tes tingproces s

Optionals creen proces s

C onfirm ation proces s

Sam ple

Screen analys is

Is s u eReport

Sam plepretreatm ent

Sam pleextraction/Soxhlet m ethod

Concentrate/D ilu teE xtracted s olu tion

Analys is by G C/M S

Filter

N am eofthepers on w ho m adem eas u rem ent:Rom an W ong

N am eofthepers on in chargeofm eas u rem ent:T roy C hang





Page:6 of8N o.:CE/2015/23732 Date:2015/02/26Test Report*CE/2015/23732*H IT AC H IC H E M ICAL CO.,L T D .


ICP-AES

Aciddiges tion by s u itableaciddependedon

different s am plem aterial(as below table)

Filtration

Solu tion Res idu e

1) AlkaliFu s ion2) H C lto dis s olv e

Sam pleM eas u rem ent

C u tting/Preparation

Steel,copper,alu m inu m ,s older Aqu a regia,H N O3,H C l,H F,H 2O2

G las s H N O3/H F

G old,platinu m ,palladiu m ,ceram ic Aqu a regia

Silv er H N O3

Plas tic H 2SO4,H 2O2,H N O3,H C l

Others Addedappropriatereagent to totaldiges tion

1) T hes es am ples weredis s olv ed totally by pre-conditioningm ethodaccordingto below flow

chart.

2) N am eofthepers on w ho m adem eas u rem ent:Clim bgreat Yang

3) N am eofthepers on in chargeofm eas u rem ent:T roy C hang

Flow Chart of digestion for the elements analysis performed by ICP-AES







Analytical flow chart of halogen content

N am eofthepers on w ho m adem eas u rem ent:Rita Chen

N am eofthepers on in chargeofm eas u rem ent:T roy C hang

Sam plepretreatm ent /Separation

W eightingandpu ttings am plein cell

Oxygen B om bCom bu s tion /Abs orption

Analys is was perform edby IC

Dilu tion to fixed v olu m e







#PIC

** EndofReport **


Page 1 of 5Issued Date : 2014. 07. 18Test Report No. F690101/LF-CTSAYAA14-34770

DUKSAN HI-METAL CO., LTD.

597-3,Yeonam-dong

Buk-gu,Ulsan

Korea

The following sample(s) was/were submitted and identified by/on behalf of the client as:-

SGS File No. : AYAA14-34770

Product Name : Sn/4.0Ag/0.5Cu

Item No./Part No. : N/A

2014. 07. 15

2014. 07. 18to2014. 07. 16Test Period :

Received Date :

For further details, please refer to following page(s)Test Results :

Jeff Jang / Chemical Lab Mgr

SGS Korea Co., Ltd.

SGS Korea Co.,Ltd.

Member of the SGS Group (Société Générale de Surveillance)

322, The O valley, 76, LS-ro, Dongan-gu, Anyang-si, Gyeonggi-do, Korea 431-080

t +82 (0)31 4608 000 f +82 (0)31 4608 059 http://www.sgsgroup.kr

This document is issued by the Company subject to its General Conditions of Service printed overleaf, available on request or accessible at <http://www.sgs.com/en/Terms-and-Conditions.aspx>

and, for electronic format documents, subject to Terms and Conditions for Electronic Documents at www.sgs.com/terms_e-document.htm <http://www.sgs.com/terms_e-document.htm>.

Attention is drawn to the limitation of liability, indemnification and jurisdiction issues defined therein. Any holder of this document is advised that information contained hereon reflects the

Company’s findings at the time of its intervention only and within the limits of Client’s instructions, if any. The Company’s sole responsibility is to its Client and this document does not exonerate

parties to a transaction from exercising all their rights and obligations under the transaction documents. This document cannot be reproduced except in full, without prior written approval of the

Company. Any unauthorized alteration, forgery or falsification of the content or appearance of this document is unlawful and offenders may be prosecuted to the fullest extent of the law. Unless

otherwise stated the results shown in this test report refer only to the sample(s).

F401 Version2


Sample No. : AYAA14-34770.001

Sn/4.0Ag/0.5CuSample Description :


N/AMaterials :

Heavy Metals

ResultsMDLTest MethodUnitTest Items

Cadmium (Cd) mg/kg With reference to IEC 62321-5:2013

(Determination of Cadmium by ICP-OES)

0.5 N.D.

Lead (Pb) mg/kg With reference to IEC 62321-5:2013

(Determination of Lead by ICP-OES)

5 251

Mercury (Hg) mg/kg With reference to IEC 62321-4:2013

(Determination of Mercury by ICP-OES)

2 N.D.

-With reference to IEC 62321:2008 (Determination

of Hexavalent Chromium by spot test/Colorimetric

Method using UV-Vis)

Hexavalent Chromium (Cr VI) By boiling

water extraction*

Negative**

Flame Retardants-PBBs/PBDEs


5With reference to IEC 62321:2008 (Determination

of PBBs and PBDEs by GC-MS)

Monobromobiphenyl N.D.mg/kg



Dibromobiphenyl N.D.mg/kg



Tribromobiphenyl N.D.mg/kg



Tetrabromobiphenyl N.D.mg/kg



Pentabromobiphenyl N.D.mg/kg



Hexabromobiphenyl N.D.mg/kg



Heptabromobiphenyl N.D.mg/kg



Octabromobiphenyl N.D.mg/kg



Nonabromobiphenyl N.D.mg/kg



Decabromobiphenyl N.D.mg/kg



Monobromodiphenyl ether N.D.mg/kg



Dibromodiphenyl ether N.D.mg/kg



Tribromodiphenyl ether N.D.mg/kg



Tetrabromodiphenyl ether N.D.mg/kg

SGS Korea Co.,Ltd.











F401 Version2



Sn/4.0Ag/0.5CuSample Description :


N/AMaterials :

Flame Retardants-PBBs/PBDEs




Pentabromodiphenyl ether N.D.mg/kg



Hexabromodiphenyl ether N.D.mg/kg



Heptabromodiphenyl ether N.D.mg/kg



Octabromodiphenyl ether N.D.mg/kg



Nonabromodiphenyl ether N.D.mg/kg



Decabromodiphenyl ether N.D.mg/kg

(1) N.D. = Not detected.(<MDL)

(2) mg/kg = ppm

(3) MDL = Method Detection Limit

(4) - = No regulation

(5) Negative = Undetectable / Positive = Detectable

(6) ** = Qualitative analysis (No Unit)

(7) * = Boiling-water-extraction:

Negative = Absence of CrVI coating

Positive = Presence of CrVI coating; the detected concentration in boiling-water-extraction

solution is equal or greater than 0.02 mg/kg with 50 cm2 sample surface area.

NOTE:

SGS Korea Co.,Ltd.











F401 Version2


Picture of Sample as Received:

SGS Korea Co.,Ltd.











F401 Version2


Testing Flow Chart for RoHS:Cd/Pb/Hg/Cr6+ /PBBs&PBDEs Testing

Sample Measurement

DATA

GC/MS

Solvent Extraction

of the Sample

Screen Analysis


of Extraction Solution

Filtration

Cd/Pb/Hg PBBs/PBDEs

Mechanic_Sample

Sample Measurement

Acid Digestion with

Microwave/Hotplate

Filtration

Residue

Total Digestion

ICP-AES/AAS/MS

DATA

Mechanic_Sample

Confirm

with UV-Vis

Cr

Sample Measurement

Adding Extraction Solution

Metallic Material

UV-Vis

DATA

Mechanic_Sample

6+

Filtration and pH Adjustment

Adding 1,5-Diphenylcarbazide

for Color Development

Heating to 90~95°C for Extraction

Nonmetallic Material

Adding 1,5-

Diphenylcarbazide

for Color Development

Mechanic_Sample

Sample Measurement

Spot Test / Boiling

Water Extraction

DATA

Cr6+

The samples were dissolved totally by pre-conditioning method according to above flow chart for Cd,Pb,Hg.

Section Chief : Gilsae Yi

*** End of Report ***

SGS Korea Co.,Ltd.











F401 Version2

BKK 165BGA MPN List

Item Marketing Part Number Sample Order Part Number

1 CY7C1143KV18-400BZI Available to order; subject to lead time

2 CY7C1143KV18-450BZC Available to order; subject to lead time

3 CY7C1145KV18-400BZXC Available to order; subject to lead time

4 CY7C1145KV18-400BZXCT Available to order; subject to lead time

5 CY7C1145KV18-400BZXI Available to order; subject to lead time


7 CY7C1145LV18-400BZXC Available to order; subject to lead time

8 CY7C1148KV18-400BZC CY7C1148KV18-400BZCKK


















26 CY7C1262XV18-366BZXC Available to order; subject to lead time


28 CY7C1263KV18-400BZI CY7C1263KV18-400BZIKK













41 CY7C1302DV25-167BZXC Available to order; subject to lead time

42 CY7C1303BV25-167BZC Available to order; subject to lead time

43 CY7C1305TV25-167BZC CY7C1305TV25-167BZCKK

44 CY7C1305TV25-167BZXC CY7C1305TV25-167BXCKK


46 CY7C1312KV18-250BZCT CY7C1312KV18-250BZCKK


48 CY7C1312KV18-250BZXC CY7C1312KV18-250BXCKK

49 CY7C1312KV18-250BZXCT CY7C1312KV18-250BXCKK





54 CY7C1312KV18-300BZXI CY7C1312KV18-300BXIKK



57 CY7C1312LV18-300BZXI Available to order; subject to lead time















72 CY7C1315KV18-250BZIT CY7C1315KV18-250BZIKK





77 CY7C1315LV18-250BZC Available to order; subject to lead time






















99 CY7C1413KV18-250BZCT Available to order; subject to lead time















114 CY7C1414KV18-250BZXIT CY7C1414KV18-250BXIKK





















































167 CY7C1512KV18-250BZIT CY7C1512KV18-250BZIKK



170 CY7C1512KV18-250BZXIT CY7C1512KV18-250BXIKK















































217 CY7C1520KV18-250BZIT Available to order; subject to lead time



















236 CY7C1562XV18-450BZC Available to order; subject to lead time




240 CY7C15632KV18-450BZC CY7C15632KV18-450BCKK



























































































331 CY7C25652KV18-500BZC CY7C25652KV18-500BCKK


333 CY7C25652KV18-500BZXC CY7C25652KV18-500BXKK


















351 CG7703AA Available to order; subject to lead time



354 CG7881AT Available to order; subject to lead time

355 CG7881ATT Available to order; subject to lead time



358 CG8192AAT Available to order; subject to lead time



























DUKSAN HI-METAL CO., LTD.

597-3,Yeonam-dong

Buk-gu,Ulsan

Korea

The following sample(s) was/were submitted and identified by/on behalf of the client as:-

SGS File No. : AYAA14-34789

Product Name : 63Sn/37Pb


2014. 07. 15

2014. 07. 18to2014. 07. 16Test Period :

Received Date :

For further details, please refer to following page(s)Test Results :

Jeff Jang / Chemical Lab Mgr

SGS Korea Co., Ltd.

SGS Korea Co.,Ltd.











F401 Version2



63Sn/37PbSample Description :


N/AMaterials :

Halogen Content


30BS EN 14582:2007 , ICBromine(Br) N.D.mg/kg

30BS EN 14582:2007 , ICChlorine(Cl) N.D.mg/kg

30BS EN 14582:2007 , ICFluorine(F) N.D.mg/kg

50BS EN 14582:2007 , ICIodine(I) N.D.mg/kg

(1) N.D. = Not detected.(<MDL)

(2) mg/kg = ppm

(3) MDL = Method Detection Limit

(4) - = No regulation

(5) ** = Qualitative analysis (No Unit)

(6) Negative = Undetectable / Positive = Detectable

NOTE:

Picture of Sample as Received:

SGS Korea Co.,Ltd.











F401 Version2


Flow Chart for Halogen Test

Weigh the samples into the combustion boat.

Analyze absorbed solution using Ion Chromatography.

Admit O2 gas or O2 +Ar2 gas and start the combustion.

Add absorption solution into the bomb or tube.

Sample screening using XRF.

Liquid containing water(>80%)

Dilute

the solution

(EPA300)

No

Yes

Allow during absorption of the burnt gas.

Data

*** End of Report ***

SGS Korea Co.,Ltd.











F401 Version2


Document No. 001-05409 Rev. *P Page 1 of 21

165-FBGA (13 x 15 mm)Pb-Free Package

PACKAGE MATERIAL DECLARATION DATASHEET

***Cypress Package Code BW Body Size (mil/mm) 13 x 15 mmPackage Weight – Site 1 B1: 588.9801 mg

B2: 629.1346 mgB3: 412.7573 mgB4: 412.7573 mgB5 : 468.4988 mg

Package Weight – Site 2 B1: 474.2273 mgB2: 473.6882 mg

Package Weight – Site 3 B1: 506.8201 mgB2: 498.6761 mgB3: 478.0000 mg

Package Weight – Site 4 B1: 480.6967 mg

SUMMARY

The 165-BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.

ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)Package Qualification Report #s 050704, 113007, 120107, 120612, 141202 (Note 1)



Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.Listed in the table below are materials that are neither contained nor intentionally added to this product.


mgPPM



CoA-BW165-ASET

Hexavalent Chromium and its Compounds 0 < 5.0Lead and Lead Compounds 0 < 5.0Mercury and Mercury Compounds 0 < 5.0Polybrominated Biphenyls (PBB) 0 < 5.0Polybrominated Diphenylethers (PBDE) 0 < 5.0Asbestos 0 0 As per MSDSAzo colorants 0 0 As per MSDSOzone Depleting Substances 0 0 As per MSDSPolychlorinated Biphenyls (PCBs) 0 0 As per MSDSPolychlorinated Napthalenes 0 0 As per MSDSRadioactive Substances 0 0 As per MSDSShortchain Chlorinated Paraffins 0 0 As per MSDSTributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDSTributyl Tin Oxide (TBTO) 0 0 As per MSDSFormaldehyde 0 0 As per MSDS




B1. MATERIAL COMPOSITION (Note 3)Adhesive using epoxy paste

MaterialPurpose of

UseSubstance


Weight bymg

% weight ofsubstance perHomogenous

material

PPM% weight of

substance perpackage


SiO2 60676-86-0 17.7650 11.0000% 30,162 3.0162%

Acrylic 29690-82-2 16.1500 10.0000% 27,420 2.7420%

Epoxy 68541-56-0 12.9200 8.0000% 21,936 2.1936%

Bisphenol 13676-54-5 24.2250 15.0000% 41,130 4.1130%

Triazol 25722-66-1 28.2625 17.5000% 47,986 4.7986%

Cu 7440-50-8 58.7860 36.4000% 99,810 9.9810%

Ni 7440-02-0 2.4225 1.5000% 4,113 0.4113%

Au 7440-57-5 0.8075 0.5000% 1,371 0.1371%

Br 7726-95-6 0.1615 0.1000% 274 0.0274%


Sn 7440-31-5 76.4955 95.5000% 129,878 12.9878%Ag 7440-22-4 3.2040 4.0000% 5,440 0.5440%Cu 7440-50-8 0.4005 0.5000% 680 0.0680%

Die Attach Adhesive

Fused Silica 60676-86-0 50.1876 54.0000% 85,211 8.5211%Diester -------------------- 25.5585 27.5000% 43,395 4.3395%Epoxy Resin -------------------- 5.1117 5.5000% 8,679 0.8679%Functionalizedesters

-------------------- 9.2940 10.0000% 15,780 1.5780%

Polymeric Resin -------------------- 2.7882 3.0000% 4,734 0.4734%Die Circuit Si 7440-21-3 54.8900 100.0000% 93,195 9.3195%Wire Interconnect Au 7440-57-5 5.2400 100.0000% 8,897 0.8897%

MoldCompound

EncapsulationSilica Fused 60676-86-0 172.9359 89.0000% 293,619 29.3619%Epoxy Resin -------------------- 10.6871 5.5000% 18,145 1.8145%Phenolic Resin -------------------- 10.6871 5.5000% 18,145 1.8145%





B2. MATERIAL COMPOSITION (Note 3)Adhesive using film

MaterialPurpose of

UseSubstance


Weight bymg


material


per package


SiO2 60676-86-0 16.9088 10.4900% 26,876 2.6876%

Acrylic 29690-82-2 14.8295 9.2000% 23,571 2.3571%

Epoxy 68541-56-0 9.8971 6.1400% 15,731 1.5731%

Bisphenol 13676-54-5 24.1463 14.9800% 38,380 3.8380%

Triazol 25722-66-1 28.9820 17.9800% 46,066 4.6066%

Cu 7440-50-8 63.3960 39.3300% 100,767 10.0767%

Ni 7440-02-0 2.2405 1.3900% 3,561 0.3561%

Au 7440-57-5 0.7898 0.4900% 1,255 0.1255%


Sn 7440-31-5 172.6875 95.5000% 274,484 27.4484%Ag 7440-22-4 7.2330 4.0000% 11,497 1.1497%Cu 7440-50-8 0.9041 0.5000% 1,437 0.1437%

Die Attach(FILM)

Adhesive

Cresol-epichlorohydrin-formaldehydepolymer

37382-79-9 33.5580 60.0000% 53,340 5.3340%

Rubbermodified epoxy

Trade Secret 16.7790 30.0000% 26,670 2.6670%

Aromatic amine Trade Secret 2.7965 5.0000% 4,445 0.4445%Silicon-basedglycidyl ether

2530-83-8 2.2372 4.0000% 3,556 0.3556%

4,4’Isopropylidenediphenol

80-05-7 0.5593 1.0000% 889 0.0889%

Die Circuit Si 7440-21-3 32.9900 100.0000% 52,437 5.2437%

Wire InterconnectAu 7440-57-5 3.8996 99.9900% 6,198 0.6198%Ion Impurities Trade Secret 0.0004 0.0100% 1 0.0001%

MoldCompound

Encapsulation

Silica fused 60676-86-0 172.9270 89.0000% 274,866 27.4866%Epoxy Resin (1) 93705-66-9 8.7435 4.5000% 13,898 1.3898%Epoxy Resin (2) Undisclosed 3.8860 2.0000% 6,177 0.6177%Phenol resin 106466-55-1 8.7435 4.5000% 13,898 1.3898%





B3. MATERIAL COMPOSITION (Note 3)Copper Wire Material

MaterialPurpose of

UseSubstance


Weight bymg


material


per package


SiO2 60676-86-0 17.7306 11.0000% 42,955 4.2955%

Acrylic 29690-82-2 16.1187 10.0000% 39,051 3.9051%

Epoxy 68541-56-0 12.895 8.0000% 31,241 3.1241%

Bisphenol 13676-54-5 24.178 15.0000% 58,577 5.8577%

Triazol 25722-66-1 28.2077 17.5000% 68,340 6.8340%

Cu 7440-50-8 58.7526 36.4500% 142,342 14.2342%

Ni 7440-02-0 2.4178 1.5000% 5,858 0.5858%

Au 7440-57-5 0.8865 0.5500% 2,148 0.2148%


Sn 7440-31-5 76.1824 95.5000% 184,568 18.4568%Ag 7440-22-4 3.1909 4.0000% 7,731 0.7731%Cu 7440-50-8 0.3989 0.5000% 966 0.0966%

Die Attach(FILM)

Adhesive

Modified Epoxyresin

Trade Secret 1.1619 61.5463% 2,815 0.2815%

Epoxy resin Trade Secret 0.4624 24.4905% 1,120 0.1120%Dapsone 80-08-0 0.1466 7.7629% 355 0.0355%Treated fumesilica

67762-90-7 0.0395 2.0928% 96 0.0096%

Substitutedsilane

Trade Secret 0.0286 1.5155% 69 0.0069%

Elastomericpolymer

Trade Secret 0.0250 1.3267% 61 0.0061%

Epoxy resin Trade Secret 0.0239 1.2653% 58 0.0058%Die Circuit Si 7440-21-3 51.273 100.0000% 124,221 12.4221%

Wire InterconnectCopper (Cu) 7440-50-8 2.008 99.9900% 4,865 0.4865%Ion Impurities Trade Secret 0.0002 0.0100% 1 0.0001%

MoldCompound

Encapsulation

Silica 60676-86-0 104.6163 89.7000% 253,457 25.3457%Epoxy Resin Undisclosed 6.4146 5.5000% 15,541 1.5541%Phenol resin Undisclosed 5.2483 4.5000% 12,715 1.2715%Carbon Black 1333-86-4 0.3499 0.3000% 849 0.0849%





B4. MATERIAL COMPOSITION (Note 3)Copper-Palladium Wire Material

MaterialPurpose of

UseSubstance


Weight bymg


material


per package


SiO2 60676-86-0 17.7306 11.0000% 42,956 4.2956%

Acrylic 29690-82-2 16.1187 10.0000% 39,051 3.9051%

Epoxy 68541-56-0 12.895 8.0000% 31,241 3.1241%

Bisphenol 13676-54-5 24.178 15.0000% 58,577 5.8577%

Triazol 25722-66-1 28.2077 17.5000% 68,340 6.8340%

Cu 7440-50-8 58.7526 36.4500% 142,342 14.2342%

Ni 7440-02-0 2.4178 1.5000% 5,858 0.5858%

Au 7440-57-5 0.8865 0.5500% 2,148 0.2148%


Sn 7440-31-5 76.1824 95.5000% 184,569 18.4569%Ag 7440-22-4 3.1909 4.0000% 7,731 0.7731%Cu 7440-50-8 0.3989 0.5000% 966 0.0966%

Die Attach(FILM)

Adhesive

Modified Epoxyresin

Trade Secret1.1619

61.5463%2,815 0.2815%

Epoxy resin Trade Secret 0.4624 24.4905% 1,120 0.1120%Dapsone 80-08-0 0.1466 7.7629% 355 0.0355%Treated fumesilica

67762-90-70.0395

2.0928%96 0.0096%

Substitutedsilane

Trade Secret0.0286

1.5155%69 0.0069%

Elastomericpolymer

Trade Secret0.0250

1.3267%61 0.0061%

Epoxy resin Trade Secret 0.0239 1.2653% 58 0.0058%Die Circuit Si 7440-21-3 51.2729 100.0000% 124,220 12.4220%

Wire InterconnectCopper (Cu) 7440-50-8 1.954 97.3000% 4,734 0.4734%Palladium (Pd) 7440-05-3 0.0542 2.7000% 131 0.0131%

MoldCompound

Encapsulation

Silica 60676-86-0 104.6164 89.7000% 253,457 25.3457%Epoxy Resin Undisclosed 6.4146 5.5000% 15,542 1.5542%Phenol resin Undisclosed 5.2483 4.5000% 12,715 1.2715%Carbon Black 1333-86-4 0.3499 0.3000% 848 0.0848%





B5. MATERIAL COMPOSITION (Note 3)Au Wire Material using Film Adhesive and G1250 Mold Compound

MaterialPurpose of

UseSubstance


Weight bymg


Material


per package


Cured Resin Proprietary 7.2520 28.0000 15,479 1.5479%Glass Fabrics Proprietary

5.6980 22.0000 12,162 1.2162%Copper Foil 7440-50-8 7.7700 30.0000 16,585 1.6585%DiethyleneGlycolMonoethyl EtherAcetate

Proprietary

1.2950 5.0000 2,764 0.2764%


Proprietary1.2950 5.0000 2,764 0.2764%

SilicaCrystalline

Proprietary1.2950 5.0000 2,764 0.2764%

Solvent naptha Proprietary1.2950 5.0000 2,764 0.2764%


Sn 7440-31-5 84.7754 95.5000 180,951 18.0951%Ag 7440-22-4 3.5508 4.0000 7,579 0.7579%Cu 7440-50-8 0.4439 0.5000 947 0.0947%

Die Attach(FILM)

Adhesive

Epoxy resin Trade Secret 2.9785 87.5000 6,358 0.6358%Dapsone 80-08-0 0.2553 7.5000 545 0.0545%Treated fumesilica

67762-90-70.0851 2.5000 182 0.0182%

Substitutedsilane

Trade Secret0.0851 2.5000 182 0.0182%

Die Circuit Si 7440-21-3 59.5700 100.0000 127,150 12.7150%Wire Interconnect Gold 7440-50-8 11.8859 100.0000 25,370 2.5370%

MoldCompound

Encapsulation

Silica 60676-86-0 247.5849 88.7500 528,463 52.8463%Epoxy Resin Undisclosed 16.7381 6.0000 35,727 3.5727%Phenol resin Undisclosed 13.9484 5.0000 29,773 2.9773%Carbon Black 1333-86-4 0.6974 0.2500 1,489 0.1489%





II. DECLARATION OF PACKAGING / INDIRECT MATERIALS


CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM

AnalysisReport(Note2)

Tape &Reel

Cover tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-R

Carrier tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-RPlastic Reel < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PLRL-R

Tray Tray < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-TRAY-R

Others

Moisture Barrier bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-MBBG-RShielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-RProtective Band < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PROB-RShipping and inner/pizza box

< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R




ASSEMBLY Site 2: PT UNISEM BatamPackage Qualification Report #s 071207, 073509 (Note 1)



Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.Listed in the table below are materials that are neither contained nor intentionally added to this product.


mgPPM



CoA-BW165-PT UNISEM





B1. MATERIAL COMPOSITION (Note 3)Using Green Molding Compound

MaterialPurpose of

UseSubstance Composition

CASNumber

Weight by mg


material

PPM

% weightof

substanceper

package

SubstrateBase

Material

Plating1

Au, metal & alloy 7440-57-5 1.0746 0.7398% 2,266 0.2266%

Ni, metal & alloy 7440-02-0 4.9375 3.3993% 10,412 1.0412%

Plating2

Cu, metal & alloy 7440-50-8 37.1037 25.5449% 78,240 7.8240%

Acrylic Resin ----------------- 1.1182 0.7699% 2,358 0.2358%

Phthalcyanine Blue,Organic Pigment

----------------- 0.0145 0.0100% 31 0.0031%

Fillers (BariumSulfate, Silica, Talc)

----------------- 0.8568 0.5899% 1,807 0.1807%

Aromatic CarbonylCompound

----------------- 0.1162 0.0800% 245 0.0245%

Amine Compound ----------------- 0.1888 0.1300% 398 0.0398%

Levelling Agents &Others

----------------- 0.0436 0.0300% 92 0.0092%

Acrylic Monomer ----------------- 0.1452 0.1000% 306 0.0306%

Epoxy Resin29690-82-268541-56-025068-38-6

0.4937 0.3399% 1,041 0.1041%

Barium Sulfate ----------------- 0.2178 0.1499% 459 0.0459%

Organic Fillers ----------------- 0.0436 0.0300% 92 0.0092%

BT Resin13676-54-525722-66-1

43.5660 29.9940% 91,867 9.1867%

Fibrous-glass-wool 65997-17-3 55.3288 38.0924% 116,672 11.6672%


Sn 7440-31-5 76.9975 98.5000% 162,364 16.2364%Ag 744-22-4 0.7817 1.0000% 1,648 0.1648%Cu 7440-50-8 0.3909 0.5000% 824 0.0824%

Die Attach Adhesive

Ag 7440-22-4 5.0330 70.0000% 10,613 1.0613%Epoxy Resin Trade Secret 0.3595 5.0000% 758 0.0758%Diester Trade Secret 0.7190 10.0000% 1,516 0.1516%Polymeric Resin Trade Secret 0.3595 5.0000% 758 0.0758%Functionalized Ester Trade Secret 0.7190 10.0000% 1,516 0.1516%

Die Circuit Si 7440-21-3 25.4000 100.0000% 53,561 5.3561%

WireInterconnec

tAu 7440-57-5 18.1782 100.0000% 38,332 3.8332%

MoldCompound

Encapsulation

Fused Silica 60676-86-0 190.0380 95.0000% 400,734 40.0734%Epoxy Resin Trade Secret 4.0008 2.0000% 8,436 0.8436%Phenol Resin Trade Secret 1.0002 0.5000% 2,109 0.2109%Phenol Novolac 9003-35-4 2.0004 1.0000% 4,218 0.4218%Metal Hydroxide Trade Secret 2.0004 1.0000% 4,218 0.4218%Carbon Black 1333-86-4 1.0002 0.5000% 2,109 0.2109%





B2. MATERIAL COMPOSITION (Note 3)Using standard molding compound

MaterialPurpose of

UseSubstance Composition

CASNumber

Weight bymg


perHomogeno

usmaterial

PPM


perpackage


Plating1

Au, metal & alloy 7440-57-5 1.0710 0.7400% 2,261 0.2261%

Ni, metal & alloy 7440-02-0 4.9208 3.4000% 10,388 1.0388%

Plating2

Cu, metal & alloy 7440-50-8 36.9785 25.5500% 78,065 7.8065%

Acrylic Resin ---------------- 1.1144 0.7700% 2,353 0.2353%

Phthalcyanine Blue,Organic Pigment

---------------- 0.0145 0.0100% 31 0.0031%

Fillers (BariumSulfate, Silica, Talc)

---------------- 0.8539 0.5900% 1,803 0.1803%

Aromatic CarbonylCompound

---------------- 0.1158 0.0800% 244 0.0244%

Amine Compound ----------------- 0.1881 0.1300% 397 0.0397%

Levelling Agents &Others

---------------- 0.0434 0.0300% 92 0.0092%

Acrylic Monomer ----------------- 0.1447 0.1000% 306 0.0306%

Epoxy Resin29690-82-268541-56-025068-38-6

0.0000 0 0.0000%

Barium Sulfate ----------------- 0.2171 0.1500% 458 0.0458%

Organic Fillers ----------------- 0.0434 0.0300% 92 0.0092%

BT Resin13676-54-525722-66-1

43.8821 30.3200% 92,639 9.2639%

Fibrous-glass-wool 65997-17-3 55.1421 38.1000% 116,410 11.6410%


Sn 7440-31-5 76.9975 98.5000% 162,549 16.2549%Ag 7440-22-4 0.7817 1.0000% 1,650 0.1650%Cu 7440-50-8 0.3909 0.5000% 825 0.0825%

Die Attach Adhesive

Bismaleimide Trade Secret 4.3260 60.0000% 9,133 0.9133%Silicon Resin Trade Secret 1.8025 25.0000% 3,805 0.3805%Epoxy Resin 9003-36-5 0.7210 10.0000% 1,522 0.1522%Diluent Trade Secret 0.2884 4.0000% 609 0.0609%Carbon Black 1333-86-4 0.0361 0.5000% 76 0.0076%Dicyandiamide 461-58-5 0.0361 0.5000% 76 0.0076%

Die Circuit Si 7440-21-3 25.4000 100.0000% 53,622 5.3622%

Wire Interconnect Au 7440-57-5 18.1782 100.0000% 38,376 3.8376%

MoldCompound

Encapsulation

Fused Silica 60676-86-0 190.0000 95.0000% 401,108 40.1108%Solid Epoxy Resin ----------------- 4.0000 2.0000% 8,444 0.8444%Phenol Resin ----------------- 1.0000 0.5000% 2,111 0.2111%Carbon Black 1333-86-4 2.0000 1.0000% 4,222 0.4222%Crystallin eSilica 14808-60-7 2.0000 1.0000% 4,222 0.4222%

Metal Hydro Oxide ----------------- 1.0000 0.5000% 2,111 0.2111%





II. DECLARATION OF PACKAGING / INDIRECT MATERIALS


CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM


Tape &Reel




Others


< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R




ASSEMBLY Site 3: Cypress Manufacturing Limited (CML)Package Qualification Report #s 094002, 120610, 133105, 144604 (Note 1)





mgPPM



CoA-BW165-CML





B1. MATERIAL COMPOSITION (Note 3)Using Gold wire material

MaterialPurpose of

UseSubstance


Weight bymg


material


perpackage


Cured Resin Proprietary 73.4076 28.0000% 144,840 14.4840Glass Fabrics Proprietary

57.6774 22.0000% 113,803 11.3803Copper Foil Proprietary 78.6510 30.0000% 155,185 15.5185Diethylene GlycolMonoethyl EtherAcetate

Proprietary

13.1085 5.0000% 25,864 2.5864AcetophenoneDerirative

Proprietary13.1085 5.0000% 25,864 2.5864

Silica Crystalline Proprietary 13.1085 5.0000% 25,864 2.5864Solvent naptha Proprietary 13.1085 5.0000% 25,864 2.5864

Solder Ball External PlatingSn 7440-31-5 84.7754 95.5000% 167,269 16.7269Ag 7440-22-4 3.5508 4.0000% 7,006 0.7006Cu 7440-50-8 0.4439 0.5000% 876 0.0876

Die Attach AdhesiveAg 7440-22-4 3.2480 80.0000% 6,409 0.6409Bismaleimide Proprietary 0.4060 10.0000% 801 0.0801Polymer Proprietary 0.4060 10.0000% 801 0.0801

Die Circuit Silicon 7440-21-3 33.1000 100.0000% 65,309 6.5309Wire Interconnect Au 7440-57-5 15.2600 100.0000% 30,109 3.0109

MoldCompound

Encapsulation

Silica 60676-86-0 89.4929 86.5000% 176,577 17.6577Non-BrominatedFlame Retardant

Proprietary5.1730 5.0000% 10,207 1.0207

Epoxy Resin Proprietary 5.1730 5.0000% 10,207 1.0207Phenol Resin Proprietary 2.5865 2.5000% 5,103 0.5103Mixed Siloxanes Proprietary 0.5173 0.5000% 1,021 0.1021Carbon BlackPigment

1333-86-40.5173 0.5000% 1,021 0.1021





B2. MATERIAL COMPOSITION (Note 3)Using Copper-Palladium wire material

MaterialPurpose of

UseSubstance


Weight bymg


material


perpackage


Cured Resin Proprietary 73.4000 27.9970% 147,190 14.7190%Glass Fabrics Proprietary

57.6800 22.0010% 115,666 11.5666%Copper Foil Proprietary 78.6500 29.9996% 157,718 15.7718%Diethylene GlycolMonoethyl EtherAcetate

Proprietary

13.1100 5.0006% 26,290 2.6290%AcetophenoneDerirative

Proprietary13.1100 5.0006% 26,290 2.6290%


Solder Ball External PlatingSn 7440-31-5 84.7800 95.5052% 170,010 17.0010%Ag 7440-22-4 3.5500 3.9991% 7,119 0.7119%Cu 7440-50-8 0.4400 0.4957% 882 0.0882%

Die Attach Adhesive

Silver 7440-22-4 3.2400 79.8030% 6,496 0.6496%BismaleimideResin

65997-17-3 0.4100 10.0984% 822 0.0822%

Synthetic Resin Proprietary 0.2659 6.5493% 533 0.0533%Additive Proprietary 0.1441 3.5493% 289 0.0289%


Wire InterconnectCu 7440-50-8 7.0449 98.9995% 14,127 1.4127%Pd 7440-05-3 0.0712 1.0005% 143 0.0143%

MoldCompound

Encapsulation

Silica 60676-86-0 92.0798 89.0004% 184,649 18.4649%Epoxy Resin Proprietary 7.2419 6.9997% 14,522 1.4522%Phenol Resin Proprietary 3.1037 2.9999% 6,224 0.6224%MelamineCyanurate

Proprietary0.5173 0.5000% 1,037 0.1037%

Carbon BlackPigment

1333-86-40.5173 0.5000% 1,037 0.1037%





B3. MATERIAL COMPOSITION (Note 3)Using Copper-Palladium Wire material, GR9810 Mold Compound and ATB120 Film

MaterialPurpose of

UseSubstance


Weight bymg


materialPPM


per package


Cured Resin Proprietary 73.4048 28.0000 153,567 15.3567%

Glass Fabrics Proprietary 57.6752 22.0000 120,659 12.0659%

Copper Foil Proprietary 78.6480 30.0000 164,536 16.4536%Diethylene GlycolMonoethyl EtherAcetate

Proprietary13.1080 5.0000 27,423 2.7423%


Proprietary13.1080 5.0000 27,423 2.7423%

Silica Crystalline Proprietary 13.1080 5.0000 27,423 2.7423%

Solvent naptha Proprietary 13.1080 5.0000 27,423 2.7423%

Solder Ball External PlatingSn 7440-31-5 84.7754 95.5000 177,354 17.7354%Ag 7440-22-4 3.5508 4.0000 7,428 0.7428%Cu 7440-50-8 0.4439 0.5000 928 0.0928%

Die Attach Adhesive

Epoxy Resinadduct

Proprietary2.8303 77.0000 5,921 0.5921%

Epoxy Resin Proprietary 0.5514 15.0000 1,153 0.1153%Dapsone 80-08-0 0.1470 4.0000 307 0.0307%Fumed Silica 67762-90-7 0.0735 2.0000 154 0.0154%Silane Proprietary 0.0735 2.0000 154 0.0154%

Die Circuit Si 7440-21-3 33.100 100.0000 69,247 6.9247%

Wire InterconnectCopper 7440-50-8 4.4883 99.0000 9,390 0.9390%Palladium 7440-05-3 0.0453 1.0000 95 0.0095%

MoldCompound

Encapsulation

Silica 60676-86-0 74.6117 87.0000 156,092 15.6092%Epoxy Resin Proprietary 7.2897 8.5000 15,250 1.5250%Phenol Resin Proprietary 3.0016 3.5000 6,279 0.6279%MelamineCyanurate

Proprietary0.4288 0.5000 897 0.0897%

Carbond BlackPigment

1333-86-40.4288 0.5000 897 0.0897%







CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM


Tape &Reel




Others


< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R




***

ASSEMBLY Site 4: Cypress BangkokPackage Qualification Report # 153602 (Note 1)


B. BANNED SUBSTANCES



mgPPM



CoA-BW165-CML





B1. MATERIAL COMPOSITION (Note 3)Using Copper-Palladium Wire material, KMC-3580LVA Mold Compound and HR9050G Film

MaterialPurpose of

UseSubstance


Weight bymg


material


perpackage


AluminumHydroxide

21645-51-2 29.8496 16.2300% 62,099 6.2099%

Copper 7440-50-8 53.1149 28.8798% 110,500 11.0500%

Gold 7440-57-5 0.2145 0.1166% 446 0.0446%

Nickel 7440-02-0 4.9462 2.6894% 10,290 1.0290%

Epoxy resin Trade secret 37.2404 20.2485% 77,475 7.7475%

SiO2 Glass Cloth 65997-17-3 58.5512 31.8357% 121,810 12.1810%

Solder Ball External PlatingSn 7440-31-5 76.2874 95.5000% 158,708 15.8708%Ag 7440-22-4 3.1953 4.0000% 6,647 0.6647%Cu 7440-50-8 0.3994 0.5000% 831 0.0831%

Die Attach AdhesiveEpoxy resign Trade secret 0.3839 80.0000% 799 0.0799%Silica (fused) 60676-86-0 0.0960 20.0000% 200 0.0200%


Wire InterconnectCu 7440-50-8 1.0918 98.3000% 2,271 0.2271%Pd 7440-05-3 0.0189 1.7000% 39 0.0039%

MoldCompound

Encapsulation

Silica (fused) 60676-86-0 161.2460 85.0000% 335,455 33.5455%Carbon Black 1333-86-4 0.4743 0.2500% 987 0.0987%Epoxy resin Trade secret 26.2736 13.8500% 54,659 5.4659%Phosphoricorganic catalyst

Trade secret 0.5691 0.3000% 1,184 0.1184%

Metal Oxides Trade secret 1.1382 0.6000% 2,368 0.2368%







CadmiumPPM

Cr VIPPM

MercuryPPM

PBBPPM

PBDEPPM


Tape &Reel




Others


< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R





Document Title: 165-FBGA (13 X 15 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEETDocument Number: 001-05409



** 402752 GFJ New document

*A 979562 VFR Change Cypress Logo.Added PMDD for site 2 – AIT, Batam, Indonesia.

*B 1639867 VFR Added new PMDD for AIT, Batam, Indonesia under Assembly site 3 –there is a change in mold compound and epoxy used. It uses low alphamold compound and non-conductive epoxy.

*C 2584298 HLR Added the CAS number for Br.Changed CAS number of Au on Assembly site 1.Added the %weight of homogenous material on Assembly site 1’smaterial composition table.Removed the name of material for substrate on Assembly Site 1 and 2.

*D 2711410 JARG Changed reference QTP # for Assembly Site 1

*E 2828353 HLR Added Assembly Site 4.

*F 3361110 HLR Added package weight B2 for Site 1. Added “adhesive using epoxypaste” for Material Composition table for Site-1. Added MaterialComposition table B2 using adhesive film material at ASE-G site.

*G 3428794 MAHA Corrected the CAS number of Au on the wire of assembly site 1 – B2.

*H 3546873 EBZUDR

Added package weight B3 for Site 1. Added Material Composition tableB3 using copper wire material for Site 1. Added reference QTP #120107for Site 1Added new Material Composition Table B2 at Assembly Site 4 –Autoline RA Copper Wire Qualification. Reference QTP # 120610.

*I 3559733 EBZ Added package weight B4 for Site 1. Added Material Composition tableB4 using copper palladium wire material for Site 1. Added referenceQTP #120612 for Site 1.Specified wire material for B1 and B2 for Site 4.

*J 3749957 HLR Updated the material composition tables for Assembly Site 1.B1,Assembly Site 2, Assembly Site 3 and Assembly Site 4.B1 to reflect 4decimal places on values.





Document Title: 165-FBGA (13 X 15 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEETDocument Number: 001-05409



*K 4058286 YUM Added Assembly Site Name in the Assembly heading in site 1, 2 and 3Changed Assembly code to Assembly site Name in site 1, 2 and 3.Removed entire Tube row in the Indirect Materials section.Consolidate material composition in one assembly site (PT UNISEM).

*L 4129555 JARG Added material composition table for Assembly Site 3:B3 in reference toQTP 133105.Corrected package weight and added comma on PPM values for thematerial composition table of Assembly Site1:B2.Corrected % weight of substance per package for the materialcomposition for Assembly Site 3:B2 to meet 100.0000%.

*M 4400765 HLR Added B5 Material Composition for Assembly site 1 - QTP No. 141202(Automotive).

*N 4517996 HLR Corrected the CAS Number of Palladium on Assembly Site. 1. B4Material Composition table.Removed the % symbol on CAS Number at Carbon Black and EpoxyResin for Assembly Site 2.B2 Material Composition table.

*O 4675460 CS Added reference QTP No. 144604 to Assembly Site 3

*P 4906329 CS

DCON

Sunset Review - added assembly Site 4, Cypress Bangkok,QTP153602.

Removed Distribution and Posting from the document history page.

Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600

PRODUCT CHANGE NOTIFICATION

PCN: PCN154102 Date: October 08, 2015

Subject: Qualification of Cypress Bangkok as an additional Assembly Site for Select 165 Ball GridArray (BGA) Products

To: PCN INBOXEBV [email protected]

Change Type: Major

Description of Change:Cypress announces the qualification of Cypress Bangkok (formerly Spansion Bangkok) for theassembly of select 165 Ball Grid Array (BGA) products. Cypress Bangkok is a world-classassembly facility, qualified to build standard grade as well as automotive grade products consistentwith AEC-Q100. Cypress Bangkok is certified to several international quality standards, includingISO/TS16949, OHSAS18001 and ANSI/ESD S20.20. The qualification of this facility will enableCypress to tailor assembly operations to meet our customers’ stringent quality and reliabilityrequirements in our effort to continually provide world-class service. 165 BGA packages assembledat Cypress Bangkok will use the following Bill of Materials (BOM).

165BGAAssembly Site CY Philippines ASE Taiwan CY BangkokMold Compound Henkel GR9810 Kyocera KEG2250 ShinEtsu KMC-3580Die Attach Henkel ATB-125US1 Henkel ATB-125 Hitachi HR9050GBond Wire 0.8 mil Cu-Pd 0.8 mil Cu-Pd 0.8 mil Cu-Pd

Solder Ball95.5% Sn, 4.0% Ag, 0.5% Cu 95.5% Sn, 4.0% Ag, 0.5% Cu 95.5% Sn, 4.0% Ag, 0.5% Cu62.0% Sn, 36.0% Pb, 2.0% Ag 63.0% Sn, 37.0% Pb 63.0% Sn, 37.0% Pb

There are no changes to ordering part numbers. Product datasheets remain the same and can bedownloaded from the Cypress Website (www.cypress.com).

Benefit of Change:The addition of Cypress Bangkok as a manufacturing location allows Cypress to leverageadditional manufacturing expertise and quality focus. This in turn provides the means for Cypressto continue to meet our customers’ requirements and meet our delivery commitments in dynamicmarket conditions.

Document No. 001-12089 Rev. *F Page 1 of 1

Affected Part Numbers: 383Affected Parts: See the attached file for a list of all part numbers affected by this change. Notethat any new 165 BGA parts that are introduced after the publication of this PCN may also bemanufactured at the Cypress Bangkok facility.

Qualification Status:Cypress Bangkok has been qualified through a series of tests documented in the Qualification TestPlan (QTP) report 153602. The qualification report can be found as an attachment to thisnotification or by visiting www.cypress.com, typing the QTP number in the search window andclicking on the magnifying glass icon.

Sample Status:Qualification samples are not built ahead of time for all part numbers affected by this change.Please review the attached file for a list of affected part numbers with their associated sampleordering part numbers. Sample requests for products without sample order part numbers are notbuilt ahead of time, they will be built to order and subject to standard lead times. Please contactyour sales representative as soon as possible, but within 30 days of the date of this PCN, to placeany sample orders.

Approximate Implementation Date:Effective 90 days from the date of this notification or upon customer approval, whichever comesfirst, all shipments of the affected part numbers in the attached file will be supplied from CypressBangkok or any other approved assembly sites.

Anticipated Impact:Products manufactured at Cypress Bangkok are completely compatible with existing product froma functional, parametric, and quality performance perspective.

Cypress recommends that customers take this opportunity to review these changes against currentapplication notes, system design considerations and customer environment conditions to assessimpact (if any) to their application.

Method of Identification:There will be no changes to the part number. Cypress maintains traceability of product to waferlevel, including wafer fabrication location, through the lot number marked on the package.

Response Required:No response is required.

For additional information regarding this change, contact your local sales representative or contactthe PCN Administrator at [email protected].

Sincerely,

Cypress PCN Administration

www.cypress.com

mailto:pcn_admin%40cypress.com