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Henkel –Your partner worldwide Henkel Solutions
Defense & Aerospace Industry
Unless otherwise indicated, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. © Henkel Corporation, 2010. All rights reserved. 6460/LT-5294 (4/2010)
Henkel Corporation15350 Barranca ParkwayIrvine, CA 926181-949-789-25001-800-562-8483
Across the Board,Around the Globe.www.henkel.com/electronics
AMERICASHEADQUARTERS:UNITED STATES15350 Barranca Parkway Irvine, CA 92618 Tel: +1-949-789-2500 Tel: +1-800-562-8483
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Henkel America 46 Manning Road Billerica, MA 01821 Tel: +1-978-436-9700 Tel: +1-800-832-4929
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ASIA PACIFICHEADQUARTERS: ASIA928 Zhangheng Road, Zhangjiang Hi-Tech Park, Pudong New District, Shanghai, 201203, P. R. China Tel: +86 21 2891 8000
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UK AND IRELANDHenkel Ltd. Adhesives LimitedTechnologies House Wood Lane End, Hemel HempsteadHertfordshire HP2 4RQ, England Tel: +44 (0)1442 278000
Henkel Ltd. UK Station Road, Linton Cambridge CB1 6NW, England Tel: +44 1-223-893-771
Defense and Aerospace . . . . . . . . . 1, 2
Paste Adhesives . . . . . . . . . . . . . . . . 3, 4
Film Adhesives . . . . . . . . . . . . . . . . . . . 5
Underfills and Encapsulants . . . . . . . . 6
Conformal Coatings . . . . . . . . . . . . . . 7
Solder Pastes and Fluxes . . . . . . . . . . 7
PCTIM . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TABLE OF CONTENTS
Henkel has more than 35 years of experience in supplying the defense and aerospace industry with Ablestik, Acheson, Emerson & Cuming, Loctite, Hysol and Multicore product solutions. We are qualified and specified by all major defense and aerospace OEMs and contractors, supporting our products through a worldwide sales, application engineering, research and development, and manufacturing network.
Our state-of-the-art products, certification to major defense and aerospace specifications, and technical expertise ensure that products built with Henkel electronic assembly materials will be the highest in performance and in reliability. We are committed to meeting and exceeding your requirements with:
• MIL-STD-883,Method5011 approved products
• NASAoutgassingASTME 595-77/84/90approvedproducts
• Provenfilmandpastetechnologyin defense and aerospace applications
• Customfilmpre-form manufacturing capability
• Low-risksupplychain
Across the Board,Around the Globe.www.henkel.com/electronics
1
PCB AssemBly mArket solutions
DeFense AnD AerosPACe
Paste Adhesives
eCCoBonD Ce8500
eCCoBonD Ce3103
loCtite 3880
trA-DuCt 2902
eCCoBonD XCe-3104Xl
eCCoBonD 57C A/B
ABleBonD 8700e
ABleBonD 84-1lmisr4
ABleBonD 8175
ABleBonD 56C
eCCoBonD e3503-1
trA-BonD F112
eCCoBonD e8502-1
eCCoBonD 104 A/B
trA-BonD 2151
ABleBonD 8700k
ABleBonD 967-3
ABleBonD 84-3
ABleBonD 84-1lmit1
non-electrically Conductive
electrically Conductive
Defense and Aerospace
ABleBonD85-1
ABleBonD967-1
eCCoBonD Ce3535-1
trA-BonD 724-14C
Film Adhesives
electrically Conductiveelectrically insulating
and thermally Conductive
ABleFilm 5025e
emerson & CuminGCF3350
ABleFilm eCF561e
ABleFilmeCF564A
ABleFilmeCF568
emerson & CuminGCF3366
ABleFilm 550k
ABleFilm 561k
ABleFilm563k
ABleFilm564A
ABleFilm5020k
electrically insulatingelectrically Conductive
ABleBonD 958-11
2
PCB AssemBly mArket solutions
DeFense AnD AerosPACe
Solder MaterialConformal
Coating
non-Conductive
PCTIM
thermal Pads
loCtite isostrate
loCtite Powerstrate
Xtreme
loCtite silverstrate
Fluxessolder Paste
Encapsulants
non-Conductive
Underfills
non-Conductive
Hysol FP4526
ABleBonD uF8807
emerson & CuminGXe1218
loCtite 3549
Hysol FP4451tD
Hysol FP4460
Hysol FP4470
styCAst 2651
styCAst 50500-1
styCAst 50500D
styCAst 2850Ft
Hysol PC12-007m
eCCoCoAt uV7993
Hysol PC18m
multiCore mP218
multiCore Ws200
multiCore HyDro-X 20
multiCore mFr301
Defense and Aerospace
non-electrically Conductive
electrically Conductive
3
PCB AssemBly mArket solutions
DeFense AnD AerosPACePAste ADHesiVes: eleCtriCAlly ConDuCtiVe
PROD
UCT
DESC
RIPT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
VISC
OSIT
Y,CP
S
VOLU
ME
RESI
STIV
ITY,
OhM
/CM
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
WOR
K LI
FE, h
RS.
TG, °
C
TCE
(α/β
)PP
M/°
C
CURE
TIM
E@
150
°C
CURE
OPT
ION
@
125
°C
STOR
AGE
LIFE
@
25°
C (M
ONTh
S)
ABLEBOND 84-1LMISR4
For small components or high speed dispense manufacturing, consider this die attach material.
MIL-STD-883, Method 5011
N/A 8,000 1 x 10-4 2.5 N/A 18 120 40/1501 hr.
@ 175°CN/A 12
ABLEBOND 84-1LMIT1
For the most demanding applications needing both excellent electrical and thermal conductivity, consider this paste for both dispense and screen printing.
MIL-STD-883, Method 5011
Yes 22,000 1 x 10-4 3.6 1,885 2 wks. 103 52/200 1 hr. 2 hrs. 12
ABLEBOND 85-1
Eliminate migration or corrosion concerns and easily tune your high frequency modules with this gold-filled paste.
MIL-STD-883, Method 5011
N/A paste 8 x 10-4 2 N/A 2 days 107 N/A 1 hr. 2 hrs. 12
ABLEBOND 967-1
Reduce risk to your delicate components with this low temperature cure, electrically conductive paste or increase your manufacturing through-put with a quick cure.
N/A Yes 14,0001.5 x 10-2 Good 1,200 2 days 75 68/216 15 min.
6 hrs. @ 65°C
12
ABLEBOND 8175
This MIL STD 883, MTD 5011 certified electrically conductive paste has a proven history for large die attach applications where CTE mismatch is an issue.
MIL-STD-883, Method 5011
N/A 55,000 5 x 10-4 3.2 1,650 2 wks. 90 55/200 30 min.1 hr.
@ 130°C12
ABLEBOND 8700E
For quality assurance in long life expectancy programs, consider this large chip attach material with excellent performance in thermal cycling.
MIL-STD-883, Method 5011
Yes 19,000 2 x 10-4 2.1 N/A 7 days 160 45/1201 hr.
@ 175°C2 hrs.
@ 160°C12
ECCOBOND 56C/CAT 11
High electrical and thermally conductive 2-component adhesive.
N/A Yes paste 2 x 10-4 3 800 4 115 N/A8 hrs.
@ 80°C2 hrs.
@ 100°C12 mos. @ 25°C
ECCOBOND 57C A/B
Convenient 1-to-1 mix ratio, high electrical and thermally conductive 2-component adhesive.
N/A Yes paste 6 x 10-4 7 700 1 N/A N/A45 min.
@ 100°C24 hrs. @ 25°C
12 mos. @ 25°C
ECCOBOND CE3103
For Sn, Sn/Pb and OSP-coated Cu metalizations, consider this lead-free dispensable adhesive alternative to SMD.
N/A N/A 40,000 7 x 10-4 N/A 1,150 24 109 45/146 3 min. 5 min. 6
ECCOBOND CE3535-1
Electrically conductive adhesive compatible with 100% tin finished components, providing a lead free alternative to solder.
N/A N/A 100,0003.3 x 10-3 N/A N/A 2 days N/A N/A
60 min. @ 150°C
10 min. @ 175°C
4 mos. @ -40°C
ECCOBOND CE8500
Low stress adhesive with high temperature characteristics and low modulus.
N/A N/A 120,000 5 x 10-4 4 450 2 days 24 N/A 40 min.2 hrs.
@ 110°C12
ECCOBOND XCE3104XL
For reliable SMD assemblies and improved fine pitch printing capability, utilize this electrically conductive paste.
N/A N/A 54,000 5 x 10-4 1.8 N/A 2 days 109 46/16015 min.
@ 125°C10 min.
@ 150°C6
LOCTITE 3880
Syringe or stencil dispense, silver conductive adhesive for solder replacement. Long work life. Can be stored in conventional refrigerator (-40°C freezer not required).
N/A N/A N/A 6 x 10-4 >2 600 N/A 40 45 6 min. 10 min.3 mos. @ 1°C
TRA-DUCT 2902
2-component, room temperature cure, general purpose, conductive adhesive.
N/A Yes 20,000 6 x 10-4 3 1,600 1 52 4924 hrs. @ 25°C
1-4 hrs. @ 65°C
N/A
4
PCB AssemBly mArket solutions
DeFense AnD AerosPACe
PR
ODUC
T
DESC
RIPT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
VISC
OSIT
Y,CP
S
VOLU
ME
RESI
STIV
ITY,
OhM
/CM
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
WOR
K LI
FE, h
RS.
TG, °
C
TCE
(α/β
)PP
M/°
C
CURE
TIM
E@
150
°C
CURE
OPT
ION
@
125
°C
STOR
AGE
LIFE
@
25°
C (M
ONTh
S)
ABLEBOND 84-3
Eliminate concerns of reliability and outgassing with this MIL-STD-883, MTD 5011 electrically insulating material for chip attach applications.
MIL-STD-883, Method 5011
Yes 50,0003.5 x 1015 0.83 N/A 2 wks. 85 40/100 1 hr. 2 hrs. 12
ABLEBOND 958-11
This flexible electrically insulating paste offers you freedom in design through management of CTE mismatch.
MIL-STD-883, Method 5011
N/A 45,000 5 x 1014 Good 2,700 2 wks. 89 15/45 1 hr.2 hrs.
@ 130°C12
ABLEBOND 967-3
Reduce risk to your delicate components with this low temperature cure electrically insulating paste or increase your manufacturing through-put with a quick cure.
MIL-STD-883, Method 5012
N/A 7,000 2 x 1013 0.7 1,700 2 days 85 N/A 5 min. 6 hrs.
@ 65°C12
ABLEBOND 8700K
For quality assurance in long life expectancy programs consider this hybrid component attach material with excellent performance in thermal cycling.
MIL-STD-883, Method 5011
Yes 45,0003.5 x 1014 0.5 N/A
30 days
165 20/551 hr.
@ 175°C2 hrs.
@ 160°C12
ECCOBOND 104 A/B
For high strength and chemical resistance, consider this adhesive.
N/A N/A 25,000 1 x 1015 N/A 1,800 12 225 60 3 hrs.6 hrs.
@ 120°C6
ECCOBOND E3503-1
For the attachment of high power LEDs and other heat sensitive devices, consider this long pot life, low temperature cure material.
N/A N/A 60,000 N/A 1.0 1,200 7 days 95 N/A30 min.
@ 100°C5 min.
@ 150°C6
ECCOBOND E8502-1
Low stress adhesive with high temperature performance and low modulus.
N/A N/A 45,000 4 x 1013 1 450 2 days 65 N/A 1 hr.90 min.
@ 120°C6 mos.
@ -20°C
TRA-BOND 724-14C
Polyurethane adhesive with excellent adhesion even in cyrogenic conditions.
N/A N/A 500,000 1 x 1010 N/A 1,700 30 min. N/A N/A72 hrs. @ 25°C
3 hrs. @ 74°C
N/A
TRA-BOND 2151
Thermally conductive adhesive. N/A Yes 40,000 10 x 1015 1.0 2,850 1.5 60 2524 hrs. @ 25°C
2-4 hrs. @ 65°C
12
TRA-BOND F112
Low stress, impact resistant, low viscosity adhesive.
N/A N/A 1,800 N/A N/A 3,000 1 100 6024 hrs. @ 25°C
1 hr. @ 65°C
N/A
PAste ADHesiVes: eleCtriCAlly insulAtinG
5
PCB AssemBly mArket solutions
DeFense AnD AerosPACeFilm ADHesiVes: eleCtriCAlly ConDuCtiVe
Film ADHesiVes: eleCtriCAlly insulAtinG AnD tHermAlly ConDuCtiVe
PROD
UCT
DESC
RIPT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
CARR
IER
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
MOD
ULUS
, KPS
I
TG, °
C
RECO
MM
ENDE
D Th
ICKN
ESS,
MIL
S
WOR
K LI
FE,
MON
ThS
CURE
TIM
E
@ 1
50°C
CURE
OPT
ION
@
125
°C
STOR
AGE
LIFE
@
-40
°C
(MON
ThS)
ABLEFILM 5025E
High conductivity and low flow enable efficient manufacturing and high performance. Also available in gold-filled version.
N/A N/A None 2 x 10-4 7 3,000 530 90 2, 4 3 30 min. 2 hours6 mos. @ 5°C
ABLEFILM ECF561E
MIL-STD-883, MTD 5011 certified electrically conductive film. Has a proven history for substrate attach, heat sink and grounding applications in defense and aerospace applications.
MIL-STD-883, Method 5011
Yes None 2 x 10-4 3.5 2,500 528 902, 3, 4,
5, 63 30 min. 2 hours 12
ABLEFILM ECF564A
Electrically conductive film containing rubberized particles offering an excellent balance of strength, adhesion and flexibility. Specifically designed to maintain adhesion at elevated temperatures, ensuring effective grounding under extreme conditions.
MIL-STD-883, Method 5011
N/A None 2 x 10-4 1,500 580 190 4 3 1 hour 2 hours6 mos. @ 5°C
ABLEFILM ECF568
High strength, flexible, electrically conductive film offering freedom in design through management of CTE mismatch.
N/A Yes Glass6.5 x 10-3 1.6 2,000 585 47 5
4 days
1 hour 2 hours 12
EMERSON & CUMING
CF3350
Eliminate any concerns of moisture and chemical corrosion with this high purity, low outgassing, electrically conductive film.
MIL-STD-883, Method 5011
N/A Glass 4 x 10-4 3.8 2,200 N/A 150 53
days2 hours N/A 12
EMERSON & CUMING
CF3366
Reduce risk to your delicate components with this low temperature cure, high flow film.
N/A Yes Glass 3 x 10-4 0.9 5,100 530 113 5, 624
hours2 hours @ 95°C
4 hours @ 75°C
12
PROD
UCT
DESC
RIPT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
CARR
IER
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
MOD
ULUS
, KPS
I
TG, °
C
RECO
MM
ENDE
D Th
ICKN
ESS,
MIL
S
WOR
K LI
FE,
MON
ThS
CURE
TIM
E
@ 1
50°C
CURE
OPT
ION
@
125
°C
STOR
AGE
LIFE
@
-40
°C
(MON
ThS)
ABLEFILM 550K
Utilize an array of difficult-to-bond substrates with this high strength material.
N/A Yes Glass 7.2 x 1017 0.8 3,300 1,200 102 5 6 30 min. 2 hours 12
ABLEFILM 561K
This high strength, flexible, electrically insulating film offers you freedom in design through management of CTE mismatch.
N/A N/A Glass 1.0 x 1013 0.8 3,300 632 55 5 6 30 min. 2 hours 12
ABLEFILM 563K
For the high thermal conductivity, consider this electrically insulating high strength film.
N/A N/ANone
or Glass
1.2 x 1013 1.1 3,000 930 974 (None) 5 (Glass)
3 30 min. 2 hours 12
ABLEFILM 564A
Eliminate any concerns of moisture and chemical corrosion with this high purity, low outgassing, electrically insulating film.
MIL-STD-883, Method 5011
N/A Glass 2 x 1014 0.29 3,800 N/A 140 4, 5 3
days2 hours N/A 12
ABLEFILM 5020K
Excellent adhesion to gold-plated surfaces and high strength ensure the integrity of your hermetic packages.
MIL-STD-883, Method 5011
Yes Glass 8 x 1014 0.7 3,000 1,100 109 4, 5, 6 6 1 hour N/A 12
6
PCB AssemBly mArket solutions
DeFense AnD AerosPACeunDerFill: non-ConDuCtiVe
enCAPsulAnts: non-ConDuCtiVe
PROD
UCT
DESC
RIPT
ION
APPL
ICAT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
VISC
OSIT
Y,
CPS
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
WOR
K LI
FE,
hOUR
S
TG, °
C
TCE
(α/β
)PP
M/°
C
CURE
TIM
E
CURE
OPT
ION
STOR
AGE
LIFE
@
-40
°C(M
ONTh
S)
ABLEBOND UF8807
Eliminate any concerns about moisture and chemical corrosion with this high performance cynate ester underfill.
Underfill N/A N/A 13,000 N/A 0.6 N/A 8 135 21/8030 min.
@ 165°C3 hrs.
@ 125°C12 mos. @ -40°C
EMERSON & CUMING
XE1218
Reworkability enables you to preserve your high value CSPs, BGAs and boards.
Underfill N/A N/A 1,400 4 x 1011 N/A N/A 24 15 7510 min.
@ 110°C22 min.
@ 100°C6 mos.
@ -20°C
hYSOL FP4526
Epoxy underfill designed for capillary flow under flip chip components.
Underfill N/A N/A 4,700 N/A N/A N/A 36 133 3330 min.
@ 165°CN/A
9 mos. @ -40°C
LOCTITE 3549
Next generation reworkable underfill for thermal mechanical reliability. Designed to snap cure at low temperatures to minimize thermal stress on PCBs. Fast flow for improved process time.
Underfill N/A N/A 2,200 8.1 x 10114 N/A N/A 14 days 26 675 min.
@ 120°C3 min.
@ 130°C6 mos.
@ 2-8°C
PROD
UCT
DESC
RIPT
ION
APPL
ICAT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
VISC
OSIT
Y,
CPS
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
WOR
K LI
FE,
hOUR
S
TG, °
C
TCE
(α/β
)PP
M/°
C
CURE
TIM
E
CURE
OPT
ION
@
125
°C
STOR
AGE
LIFE
@
-40
°C
(MON
ThS)
hYSOL FP4451TD
Tall dam version of FP4451 for applications requiring a taller narrower dam. Ionically clean.
Dam N/A N/A 300,000 N/A N/A N/A N/A 150 21
30 min. @ 125°C + 90 min. @ 165°C
90 min. @ 165C
12 mos. @ -40°C
hYSOL FP4460
High purity, low stress, glob top encapsulant with high moisture resistance and long working life.
COB N/A N/A N/A N/A N/A N/A 2 days 171 203 hrs.
@ 150°CN/A
9 mos. @ -40°C
hYSOL FP4470
High adhesion version of FP4450 for 260°C L3 JEDEC performance.
Fill N/A N/A 48,000 N/A N/A N/A N/A 148 1830 min.
@ 125°C90 min. @ 165C
9 mos. @ -40°C
STYCAST 50500D
For protection of wire bonds, consider this high purity material for use either as a dam or a glob top.
Dam N/A N/A 125,000 N/A 0.6 1,300 N/A 70 80 2 hrs. N/A4 mos.
@ -40°C
STYCAST 50500-1
For protection of wire bonded ICs, consider this flowable material for a fill.
Fill N/A N/A 35,000 N/A 0.6 N/A N/A 140 20 1 hr. N/A4 mos.
@ -40°C
STYCAST 2651/CAT 11
For excellent adhesion, low outgassing and certification to MIL-I-16923, consider this encapsulant.
Encapsulant MIL-I-16923 Yes 25,000 5 x 1016 0.66 9,000 4 N/A 401 hr.
@ 120°C8 hrs.
@ 80°C6
STYCAST 2850FT/CAT 11
For high thermal conductivity and low outgassing, consider this encapsulant.
Encapsulant N/A Yes 5,600 1 x 1015 1.02 N/A 4 115 31/981 hr.
@ 120°C8 hrs.
@ 80°C12
7
PCB AssemBly mArket solutions
DeFense AnD AerosPACeConFormAl CoAtinG: non-ConDuCtiVe
PROD
UCT
DESC
RIPT
ION
APPL
ICAT
ION
MIL
CER
TIFI
ED
NASA
OUT
GASS
ING
APPR
OVED
VISC
OSIT
Y,
CPS
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
LAP
ShEA
R
STRE
NGTh
, PSI
WOR
K LI
FE,
hOUR
S
TG, °
C
TCE
(α/β
)PP
M/°
C
CURE
TIM
E
@ 1
50°C
CURE
OPT
ION
@
125
°C
STOR
AGE
LIFE
@
-40
°C
ECCOCOAT UV7993
For rugged protection without limiting your manufacturing through-put, consider this environmentally friendly, UV-conformal coating.
Conformal Coating
MIL-I-46058C
N/A 120 2.2 x 1016 N/A N/A N/A N/A N/A
UV tack, 50%
Humidity, 25°C for 100 hrs.
UV tack, 70%
Humidity, 25°C,
50 hrs.
6 mos. @ 125°C
hYSOL PC12-007M
Hysol PC12-007M is a 100 percent solids, general purpose, epoxy-printed circuit coating developed to meet military requirements. The coating is suitable for continuous operation up to 125ºC (257ºF) and may be used on any substrate offering good adhesion.
Conformal Coating
MIL-I-46058C
N/A7,500-20,000
1 x 1014 N/A N/A 1,5 N/A N/A2 hrs.
@ 75°CN/A
18 mos. @ 25°C
hYSOL PC18M
Solvent based, 1-component urethane conformal coating providing superior toughness, abrasion and solvent resistance.Meets MIL-I-46058C requirements.
Conformal Coating
MIL-I-46058C
N/A300-400
2 x 1013 N/A N/A N/A N/A N/A
2 hrs. @ 60°C
with 30%-50%
RH
7 days @ 25°C
with 30%-50%
RH
18 mos. @ 25°C
PROD
UCT
DESC
RIPT
ION
APPL
ICAT
ION
ALLO
Y
MET
AL L
OADI
NG, %
TACK
, G/M
M2
PRIN
T SP
EED,
MM
/S
IPC/
J-ST
D-00
4 CL
ASSI
FICA
TION
MULTICORE MP218
Halide-free, no-clean, pin-testable solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing.
No-clean tin leadSn62/Sn63/63S4 (anti-tombstoning)
89.5% - 90.0% 1.6 25-100 ROLD
MULTICORE WS200
High performance, water-washable solder paste. Residues are readily removed with DI water, without the need for a saponifer. WS200 has good open time with excellent print definition and soldering activity.
Water wash tin lead
Sn62/Sn63/63S4 (anti-tombstoning)
90.50% 0.8 25-101 ORH1
PROD
UCT
DESC
RIPT
ION
SOLI
DS C
ONTE
NT, %
ACID
VAL
UE,
MG
KOh/
G
IPC/
J-ST
D-00
4 CL
ASSI
FICA
TION
APPL
ICAT
ION
MULTICORE hYDRO X20
Water soluble flux formulated for use on electronic assemblies designed for water cleaning. Meets requirements of MIL-P-28809A.
20 24 ORH1 Spray/Foam
MULTICORE MRF301
No-clean, highly active, liquid flux for surfaces with poor solderability. 6.0 40 ROM0 Spray/Foam
solDer mAteriAl: solDer PAste
solDer mAteriAl: FluXes
8
PCB AssemBly mArket solutions
DeFense AnD AerosPACe
PCtim: non-insulAtinG
PROD
UCT
DESC
RIPT
ION
ThER
MAL
IMPE
DANC
E,
°C-I
N2 /W
@ 8
0 PS
I
ThER
MAL
IMPE
DANC
E,
°C-I
N2 /W
@ 5
50 K
PA
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
PhAS
E Ch
ANGE
TE
MP.
, °C
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
DIEL
ECTR
IC S
TREN
GTh,
V/
MIL
TOTA
L Th
ICKN
ESS,
IN.
LOCTITE POWERSTRATE XTREME
Unsupported film with superior thermal performance even at low pressures. Direct attach to heat sink at room temperature without adhesive.
0.003 0.022 3.40 45 N/A N/A 0.008
PROD
UCT
DESC
RIPT
ION
ThER
MAL
IMPE
DANC
E,
°C-I
N2 /W
@ 8
0 PS
I
ThER
MAL
IMPE
DANC
E,
°C-I
N2 /W
@ 5
50 K
PA
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
PhAS
E Ch
ANGE
TE
MP.
, °C
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
DIEL
ECTR
IC S
TREN
GTh,
V/
MIL
TOTA
L Th
ICKN
ESS,
IN.
LOCTITE ISOSTRATEIndustry standard, electrically insulating, phase change material
0.120 0.780 0.45 60 N/A4,500
minimum0.002 - 0.006
PCtim: eleCtriCAlly insulAtinG
PROD
UCT
DESC
RIPT
ION
ThER
MAL
IMPE
DANC
E,
°C-I
N2 /W
@ 8
0 PS
I
ThER
MAL
IMPE
DANC
E,
°C-I
N2 /W
@ 5
50 K
PA
ThER
MAL
CO
NDUC
TIVI
TY, W
/MK
PhAS
E Ch
ANGE
TE
MP.
, °C
VOLU
ME
RESI
STIV
ITY,
Oh
M-C
M
DIEL
ECTR
IC S
TREN
GTh,
V/
MIL
TOTA
L Th
ICKN
ESS,
IN.
LOCTITE SILVERSTRATE
Excellent thermal performance particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required (silver-filled).
0.003 0.022 3.14 51 2 N/A 0.004
PCtim: eleCtriCAlly ConDuCtiVe
Defense and Aerospace . . . . . . . . . 1, 2
Paste Adhesives . . . . . . . . . . . . . . . . 3, 4
Film Adhesives . . . . . . . . . . . . . . . . . . . 5
Underfills and Encapsulants . . . . . . . . 6
Conformal Coatings . . . . . . . . . . . . . . 7
Solder Pastes and Fluxes . . . . . . . . . . 7
PCTIM . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TABLE OF CONTENTS
Henkel has more than 35 years of experience in supplying the defense and aerospace industry with Ablestik, Acheson, Emerson & Cuming, Loctite, Hysol and Multicore product solutions. We are qualified and specified by all major defense and aerospace OEMs and contractors, supporting our products through a worldwide sales, application engineering, research and development, and manufacturing network.
Our state-of-the-art products, certification to major defense and aerospace specifications, and technical expertise ensure that products built with Henkel electronic assembly materials will be the highest in performance and in reliability. We are committed to meeting and exceeding your requirements with:
• MIL-STD-883,Method5011 approved products
• NASAoutgassingASTME 595-77/84/90approvedproducts
• Provenfilmandpastetechnologyin defense and aerospace applications
• Customfilmpre-form manufacturing capability
• Low-risksupplychain
Across the Board,Around the Globe.www.henkel.com/electronics
Henkel –Your partner worldwide Henkel Solutions
Defense & Aerospace Industry
Unless otherwise indicated, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. © Henkel Corporation, 2010. All rights reserved. 6460/LT-5294 (4/2010)
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Across the Board,Around the Globe.www.henkel.com/electronics
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