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AM15540v4
D(5, 6, 7, 8)
G(4)
S(1, 2, 3)
FeaturesOrder code VDS RDS(on) max. ID
STLD257N4F7AG 40 V 1.1 mΩ 120 A
• AEC-Q101 qualified • Among the lowest RDS(on) on the market• Excellent FoM (figure of merit)• Low Crss/Ciss ratio for EMI immunity• High avalanche ruggedness• Wettable flank package
Applications• Switching applications
DescriptionThis N-channel Power MOSFET utilizes STripFET™ F7 technology with anenhanced trench gate structure that results in very low on-state resistance, while alsoreducing internal capacitance and gate charge for faster and more efficient switching.
Product status link
STLD257N4F7AG
Product summary
Order code STLD257N4F7AG
Marking 257
PackagePowerFLAT™ 5x6
dual side cooling
Packing Tape and reel
Automotive-grade N-channel 40 V, 0.82 mΩ typ., 120 A, STripFET™ F7 Power MOSFET in a PowerFLAT™ 5x6 DSC package
STLD257N4F7AG
Datasheet
DS12565 - Rev 4 - March 2019For further information contact your local STMicroelectronics sales office.
www.st.com
1 Electrical ratings
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
VDS Drain-source voltage 40 V
VGS Gate-source voltage ±20 V
ID(1)(2) Drain current (continuous) at TC = 25 °C 120 A
ID(1)(2) Drain current (continuous) at TC = 100 °C 120 A
IDM(2)(3) Drain current (pulsed) 480 A
PTOT(2) Total power dissipation at TC = 25 °C 158 W
TJ Operating junction temperature range-55 to 175 °C
Tstg Storage temperature range
1. Limited by package2. The value is rated according to Rthj-case bottom side.
3. Pulse width limited by safe operating area
Table 2. Thermal data
Symbol Parameter Value Unit
Rthj-c top side Thermal resistance junction-case top side 2.90
°C/WRthj-c bottom side Thermal resistance junction-case bottom side 0.95
Rthj-pcb(1) Thermal resistance junction-pcb 31.3
1. When mounted on an 1-inch² 2 Oz, Cu board, t ≤ 10 s
Table 3. Avalanche characteristics
Symbol Parameter Value Unit
IAVAvalanche current, repetitive or not repetitive (pulse width limited bymaximum junction temperature) 50 A
EASSingle pulse avalanche energy (starting Tj = 25 °C, ID = IAV,VDD = 25 V) 608 mJ
STLD257N4F7AGElectrical ratings
DS12565 - Rev 4 page 2/13
2 Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 4. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)DSSDrain-source breakdownvoltage VGS = 0 V, ID = 1 mA 40 V
IDSSZero gate voltage draincurrent
VGS = 0 V, VDS = 40 V 1 µA
VGS = 0 V, VDS = 16 V, Tj = 125 °C(1) 300 μA
IGSS Gate-body leakage current VDS = 0 V, VGS = 20 V 100 nA
VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2.0 4.0 V
RDS(on)Static drain-source
on-resistance
VGS = 10 V, ID = 60 A 0.82 1.1mΩ
VGS = 6.5 V, ID = 60 A 3.1 4.8
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance
VDS= 25 V, f = 1 MHz, VGS = 0 V
- 5400 - pF
Coss Output capacitance - 1870 - pF
Crss Reverse transfer capacitance - 45 - pF
Qg Total gate charge VDD = 20 V, ID = 120 A,
VGS = 0 to 10 V
(see Figure 13. Test circuit for gatecharge behavior)
- 66.5 - nC
Qgs Gate-source charge - 33.5 - nC
Qgd Gate-drain charge - 13 - nC
Table 6. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time VDD = 20 V, ID = 60 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 12. Test circuit forresistive load switching times andFigure 17. Switching time waveform)
- 28 - ns
tr Rise time - 19 - ns
td(off) Turn-off delay time - 58 - ns
tf Fall time - 32 - ns
STLD257N4F7AGElectrical characteristics
DS12565 - Rev 4 page 3/13
Table 7. Source-drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
ISD(1) Source-drain current - 120 A
ISDM(1)(2) Source-drain current (pulsed) - 480 A
VSD (3) Forward on voltage VGS = 0 V, ISD = 90 A - 1.1 V
trr Reverse recovery time ISD = 120 A, di/dt = 100 A/µs,
VDD = 20 V
(see Figure 14. Test circuit forinductive load switching and dioderecovery times)
- 54 ns
Qrr Reverse recovery charge - 53 nC
IRRM Reverse recovery current - 1.9 A
1. Limited by package.2. Pulse width is limited by safe operating area.3. Pulse test: pulse duration = 300 µs, duty cycle 1.5%
STLD257N4F7AGElectrical characteristics
DS12565 - Rev 4 page 4/13
2.1 Electrical characteristics (curves)
Figure 1. Safe operating areaGIPG240420181309SOA
102
101
100
10-1
10-2
10-1 100 101
ID (A)
VDS (V)
tp =100 µs
tp =1 ms
tp =10 mssingle pulse
TJ≤175 °CTC=25 °CVGS=10 V
Operation in this areais limited by R DS(on)
Figure 2. Thermal impedance
GIPG240420181308ZTH
10 -1
10 -2
10 -5 10 -4 10 -3 10 -2 10 -1
K
tp (s)
0.05
Figure 3. Output characteristics
GIPG240420181307OCH
250
200
150
100
50
00 2 4
ID (A)
VDS (V)
VGS =5 V
VGS =7, 8, 9, 10 V
VGS =6 V
VGS =4 V
Figure 4. Transfer characteristics
GADG260720181336TCH
100
80
60
40
20
03 3.5 4 4.5 5 5.5
ID (A)
VGS (V)
VDS = 5 V
Tj = -55 °C
Tj = 25 °C
Tj = 175 °C
Figure 5. Gate charge vs gate-source voltage
GIPG240420181308QVG
12
10
8
6
4
2
00 20 40 60 80
VGS (V)
Qg (nC)
VDD = 20 VID = 120 A
Figure 6. Static drain-source on-resistance
GADG200620181612RID
0.9
0.8
0.7
0.60 20 40 60 80
RDS(on) (mΩ)
ID (A)
VGS = 10 V
STLD257N4F7AGElectrical characteristics (curves)
DS12565 - Rev 4 page 5/13
Figure 7. Capacitance variations
GIPG240420181307CVR
10 4
10 3
10 2
10 1 0 10 20 30 40
C (pF)
VDS (V)
CISS
COSS
CRSS
f = 1 MHz
Figure 8. Normalized gate threshold voltage vstemperature
GADG060820180915VTH
1.2
1
0.8
0.6
0.4
0.2-75 -25 25 75 125 175
VGS(th) (norm.)
Tj (°C)
ID = 250 µA
Figure 9. Normalized on-resistance vs temperature
GADG060820180915RON
1.8
1.6
1.4
1.2
1.0
0.8
0.6-75 -25 25 75 125 175
RDS(on) (norm.)
VGS = 10 VID = 60 A
TJ (°C)
Figure 10. Normalized V(BR)DSS vs temperature
GIPG240420181302BDV
1.06
1.04
1.02
1.00
0.98
0.96
0.94-75 -25 25 75 125 175
V(BR)DSS (norm.)
ID = 1 mA
Tj (°C)
Figure 11. Source-drain diode forward characteristics
GIPG240420181303SDF
1.0
0.9
0.8
0.7
0.6
0.5
0.410 30 50 70 90
VSD (V)
ISD (A)
Tj = -55 °C
Tj = 25 °C
Tj = 175 °C
STLD257N4F7AGElectrical characteristics (curves)
DS12565 - Rev 4 page 6/13
3 Test circuits
Figure 12. Test circuit for resistive load switching times
AM01468v1
VD
RG
RL
D.U.T.
2200μF VDD
3.3μF+
pulse width
VGS
Figure 13. Test circuit for gate charge behavior
AM01469v1
47 kΩ1 kΩ
47 kΩ
2.7 kΩ
1 kΩ
12 V
IG= CONST100 Ω
100 nF
D.U.T.
+pulse width
VGS
2200μF
VG
VDD
Figure 14. Test circuit for inductive load switching anddiode recovery times
AM01470v1
AD
D.U.T.S
B
G
25 Ω
A A
B B
RG
GD
S
100 µH
µF3.3 1000
µF VDD
D.U.T.
+
_
+
fastdiode
Figure 15. Unclamped inductive load test circuit
AM01471v1
VD
ID
D.U.T.
L
VDD+
pulse width
Vi
3.3µF
2200µF
Figure 16. Unclamped inductive waveform
AM01472v1
V(BR)DSS
VDDVDD
VD
IDM
ID
Figure 17. Switching time waveform
AM01473v1
0
VGS 90%
VDS
90%
10%
90%
10%
10%
ton
td(on) tr
0
toff
td(off) tf
STLD257N4F7AGTest circuits
DS12565 - Rev 4 page 7/13
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,depending on their level of environmental compliance. ECOPACK specifications, grade definitions and productstatus are available at: www.st.com. ECOPACK is an ST trademark.
4.1 PowerFLAT™ 5x6 dual side cooling package information
Figure 18. PowerFLAT™ 5x6 dual side cooling package outline
8548760_2
Plated Area
STLD257N4F7AGPackage information
DS12565 - Rev 4 page 8/13
Table 8. PowerFLAT™ 5x6 dual side cooling mechanical data
Dim.mm
Min. Typ. Max.
A 0.66 0.71 0.76
A1 0.60 0.75
b 0.33 0.43 0.53
c 0.15 0.203 0.30
D 5.00 BSC
D1 4.06 4.21 4.36
D2 2.40 BSC
D3 2.80 3.30 3.80
E 6.00 BSC
E1 3.525 3.675 3.825
E2 1.05 1.20 1.35
E3 3.80 BSC
E4 4.20 4.70 5.20
e 1.27 BSC
I 0.15
L 0.15 0.25 0.35
L1 0.925 1.05 1.175
L2 0.45 0.575 0.70
ϑ 12° BSC
ϑ1 7° BSC
j 0.20 BSC
Figure 19. PowerFLAT™ 5x6 dual side cooling recommended footprint (dimensions are in mm)
STLD257N4F7AGPowerFLAT™ 5x6 dual side cooling package information
DS12565 - Rev 4 page 9/13
4.2 PowerFLAT™ 5x6 dual side cooling packing information
Figure 20. PowerFLAT™ 5x6 dual side cooling tape (dimensions are in mm)
8548087_REV1
Figure 21. PowerFLAT™ 5x6 dual side cooling reel (dimensions are in mm)
STLD257N4F7AGPowerFLAT™ 5x6 dual side cooling packing information
DS12565 - Rev 4 page 10/13
Revision history
Table 9. Document revision history
Date Revision Changes
02-May-2018 1 Initial release.
26-Jul-2018 2
Document status promoted from preliminary to production data.
Updated Table 4. On/off states.
Updated Section 2.1 Electrical characteristics (curves).
Minor text changes
6-Aug-2018 3
Updated Table 5. Dynamic.
Updated Section 2.1 Electrical characteristics (curves)
Minor text changes
21-Mar-2019 4
Modified Table 4. On/off states.
Modified Figure 1. Safe operating area, Figure 4. Transfer characteristics,Figure 6. Static drain-source on-resistance and Figure 9. Normalized on-resistance vs temperature.
Minor text changes.
STLD257N4F7AG
DS12565 - Rev 4 page 11/13
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.1 PowerFLAT™ 5x6 dual side cooling package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 PowerFLAT™ 5x6 dual side cooling packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
STLD257N4F7AGContents
DS12565 - Rev 4 page 12/13
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.
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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
STLD257N4F7AG
DS12565 - Rev 4 page 13/13