Launch Readiness Review

Northwest Nazarene UniversityChad Larson, Ben Gordon, Seth Leija,

David Vinson, Drew Johnson, Zach ThomasJune 1st, 2012

Study the effects of a rocket launch on superhydrophobic material developed at Oakridge National Laboratory

Study radiation hardened chips in partnership with American Semiconductor Inc.

Mission

Payload: Arduino plus Chips

Payload: Superhydrophobic Outer Box

Payload

Payload

User Guide ComplianceRequirement Payload Status

Mass Allotment: 6.5 with ballasts, ballasts need to be added to structure

Volume Allotment: 4.75” high

Center of Gravity In the allotted 1x1x1inch center of canister. Will be retested once the ballasts have been added.

Activation 1.SYS.2. G-switch

Structure Mounts No mounts to side of can.

Sharing More contact with Harding will be necessary this next week.

Our electrical system is essentially fully integrated except for one chip.

Between the two experiments, they will both fit on the one polycarbonate plate and there are no foreseeable problems.

We have not yet written out a integration procedure. We will be contacting Harding a lot this week, preparing for a smooth and hassle free integration.

Integration Plan

Our electrical system has been fully integrated into the RockOn board and is activated through the g-switch.

Our payload will fulfill our mission requirements testing both superhydrophobic materials as well as radiation hardened chips.

Activation

The electrical system has been fully integrated with the RockOn board and is only missing one chip until it is fully ready for flight.

The FleX chip was placed in a socket at BSU and is expected to arrive today after which it will be integrated into the system.

The code for the FleX chip has to be finished, but should be done as soon as the chip arrives.

Electrical System

The manufacture of the superhydrophobic experiment boxes will be completed this following week. One box has been manufactured and the other one is being made and should be completed today.

After today, only the interior boxes will need to be put together using the superhydrophobic plates.

Superhydrophobic Experiment

We are in the process of being ready for the launch. We are extremely close to being fully prepared and should be completely ready to go by next week. We have several team members who will work all next week and the week before we leave to ensure a completed payload.

The polycarbonate plate has been ordered and will be made next week, after which we will attach the boxes and electrical system and fully assemble the entire payload and prepare for integration.

Level of Readiness

Complete Outer boxes: June 1th

Complete Inner boxes: June 4th

Attach final chip/code/sim: June 6th

Complete polycarbonate plate: June 8th

Fully attach payload to plate: June 9th

Action Items

Our hotel has been booked and flights have been purchased.

One professor wanted to come later in the week of the launch and has filled out registration. We will talk to Wallops when we arrive to see if it is worth it for him to fly down.

Check In

Almost the entire team was out of the U.S. the last three weeks, but arrived back today. Our sole focus the next 12 days will be our RockSat experiment and are confident that everything will be completed and ready to go by next week.

Questions?