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RockHydro Individual Subsystem Testing Report
Northwest Nazarene UniversityAdvisor: Dr. Lawrence
Chad LarsonBen Gordon
Seth LeijaDavid VinsonZach ThomasDrew Johnson
Team Pictures Mission Overview Schedule Changes Since CDR Superhydrophobic Subsystem Electrical Subsystem Subsystem Integration Lessons Learned Conclusion
Table of Contents
Team Organization
American Semiconductors
Dale Wilson
Electrical David Vinson
Seth LeijaDrew Johnson
Superhydrophobic
Mechanical Ben GordonChad LarsonZach Thomas
AdvisorDr. Dan
Lawrence
AdvisorDr. Parke
Study the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.
The material will be tested under an electron microscope pre and post flight to determine the condition of the surface.
It is expected that the material will survive the flight and still be superhydrophobic.
Mission Overview
Mission Overview Test Flexfet technology
◦ Viability in high radiation environment Test FleX technology
◦ Testing of hardware in high G environment Return useful data to ASI Provide low cost space launch opportunity
to ASI
Superhydrophobic:◦ Receive plates from Oakridge: Feb 15◦ Begin building aluminum enclosure: Feb 20◦ Begin building polycarbonate enclosure: Feb 20◦ Complete building and begin testing: Feb 27◦ Study SH with electron microscope: Feb 20- Feb
27
This is slightly behind where we had planned due to our design change and we are waiting for our plates from Oakridge to arrive.
Schedule
Electrical:◦ Get socket in mail: Feb 18◦ Finish Arduino code: Feb 20◦ Testing: Feb 22◦ Integrate with g-switch: Feb 28◦ Run Full Flight Test: March 4
Schedule
Changes Since CDR The biggest change since
the CDR is the removal of the “donut” which has been replaced with two aluminum boxes. This change was done because the box allows for our experiment to be looked at under an electron microscope. The details of this change are in the slides below.
Also, the PCB is no longer needed.
Superhydrophobic Subsystem Right now, the plates
that are coated with different superhydrophobic materials are being shipped from Oakridge National Laboratory and should arrive later this week.
Superhydrophobic/Mechanical Subsystem◦ Chad Larson
Electrical Subsystem◦ Seth Leija
Subsystem Overview
Superhydrophobic Subsystem
Once the plates arrive, they will be looked at under an electron microscope at Boise State University. This will allow us to see what the material looks like before and after the flight to determine if it survived the rocket launch
Superhydrophobic Subsystem
Aluminum Box
The new containers for the superhydrophobic plates are made out of a solid piece of aluminum. The superhydrophobic plate will slide into place inside the container and then the box will be sealed with an O-ring and screwed down.
Aluminum Box
O-Ring
Slits that hold the SH Plates
Screws on the outside of the O-ring
Solid Aluminum Box
Polycarbonate Box
Polycarbonate Box
On the outside of the Aluminum box, will be a box made of polycarbonate that is made using screws and sealed with a silicon based sealant.
• Hardwareo Hardware has been assembledo Preliminary tests have been successful
Successfully writes inputs and outputs to txt files (ASCII)o Currently awaiting socketo Certain errors have occurred when saving to an SD card
Files are deleted on ejection of SD card
• Softwareo Preliminary code to check for errors is working
Takes input vectors in Matlab and outputs a vector containing error positionso Currently does not open files directlyo Have not yet determined the best way to display errors
Electrical Subsystem
Data Collection Testing Hardware
◦ Arduino Mega 2560◦ Adafruit Datalogger
Shield Stored on SD memory card
Reasoning◦ Expandability◦ Ease of use◦ User Community
Resources How
◦ Outputs two text files◦ Contains input data and
output data
Data Analysis Using Matlab
◦ Ease of use◦ Graphing
How◦ Reading data from
files◦ Analyze expected vs
actual data◦ Output pertinent
information
G-Switch
Arduino
ASC Chip(Packaged)
ASC Chip(Unpackaged
)
SD Card
Clock
Microcontroller
PowerDataClock Power
Supply
Block Diagram
Subsystem Integration The two different
experiments integration should not be too complex. The two boxes will be at the bottom of the canister, and then the electronics will be on a plate directly above it.
Your first design will NOT be your final design.
Focus on trying to finalize design early on. Be flexible Splitting up the work into different “teams”
is very beneficial…..as long as there is good communication.
Be prepared to error check your code!
Lessons Learned
Superhydrophobic Plates are arriving this week!
Building Enclosure for material is main goal.
Electrical System is going smoothly. We gave a presentation to American Semiconductor, Inc. this last week!
Conclusion