ITRS 2.0 Mart Graef, Paolo Gargini

2013 ITRS

2012 ITRS

Update

International Technology Roadmap for Semiconductors (ITRS) 1998 - now

2011 ITRS

2010 ITRS

Update

2009 ITRS

http://www.itrs.net Japan

Korea

Europe

Taiwan

USA

2008 ITRS

Update

2007 ITRS

2006 ITRS

Update

2005 ITRS

2004 ITRS

Update

2003 ITRS

2002 ITRS

Update

2001 ITRS

2000 ITRS

Update

1999 ITRS

1998 ITRS

Update

1997 NTRS

1994 NTRS

1992 NTRS

1991 MicroTech

2000 Report

USA

ITRS Objective

• Provide guidance to the semiconductor industry by predicting technology trends in the industry, spanning 15 years (near-term 1-6 yrs; long-term 7-15 yrs)

ITRS Technology Working Groups

1. System Drivers

2. Design

3. Test & Test Equipment

4. Process Integration, Devices & Structures

5. RF and Analog/Mixed Signal

6. Emerging Research Devices

7. Emerging Research Materials

8. Front End Processes

9. Lithography

10.Interconnect

11.Factory Integration

12.Assembly & Packaging

13.Environment, Safety & Health

14.Yield Enhancement

15.Metrology

16.Modeling & Simulation

Impact of the ITRS

• Provides a benchmark for the semiconductor industry

• Identifies technology challenges

• Generates industrial and academic research agenda

• Is used by policy-makers

Reaching dimension/complexity limits

Complexity in # of devices

1 µm

10 mm

100 µm

10 nm

1 Å

1958 1947

1 1000 1M 1G 1T

2020 Beyond CMOS?

Source: STMicroelectronics

2014

Validated concept

Quantum computing Spintronics Molecular electronics Nanotubes Graphene

“More Moore” & “More than Moore”

Source: ITRS (2011)

Smart microsystems: More Moore + More than Moore

More Moore

More than Moore

Data Processing

& Storage

Power

Radio

Sensor &

Actuator

Heterogeneous Integration

Technology diversification in the ITRS

Introduction

More-than-Moore

concept

Towards

ITRS 2.0

MEMS Working

Group started

Cooperation

with iNEMI

started

MtM Workshops in

2011, 2012, 2013,

2014

Device Technologies

& Architectures

Generic

Functions

System

View

Driving

Applications

Lead

markets

Society Needs

Automotive Lighting Healthcare Energy

DA1

SV1

GF2 Communication Energy

harvesting Sensing Illumination

DTAn DTA1 DTA4 DTA2 DTA1 MEMS

DA2

SV2

DA3

SV3

Smart

catheter

SV4

Device Technologies

& Architectures

Generic

Functions

System

View

Driving

Applications

Lead

markets Automotive Lighting Healthcare Energy

DA1

SV1

GF2 Communication Energy

harvesting Sensing Illumination

DTAn DTA1 DTA4 DTA2 DTA1 MEMS

DA2

SV2

DA3

SV3

Smart

catheter

SV4

Computing

Data

center

SV0

Data

processing

Data

storage

Moore’s Law Extended

ITRS 2.0 Focus Topics

• System Integration—studies and recommends system architectures to meet the needs of the industry. It prescribes ways of assembling heterogeneous building blocks into coherent systems.

• Outside System Connectivity—refers to physical and wireless technologies that connect different parts of systems.

• Heterogeneous Integration—refers to the integration of separately manufactured technologies that in the aggregate provide enhanced functionality.

• Heterogeneous Components—describes devices that do not necessarily scale according to “Moore's Law,” and provide additional functionalities, such as power generation and management, or sensing and actuating.

• Beyond CMOS—describes devices, focused on new physical states, which provide functional scaling substantially beyond CMOS, such as spin-based devices, ferromagnetic logic, and atomic switch.

• More Moore—refers to the continued shrinking of horizontal and vertical physical feature sizes to reduce cost and improve performance.

• Manufacturing—consists of tools and processes necessary to produce items at affordable cost in high volume.

More than Moore

Assessment of Driving Forces

Heterogeneous

Integration

Heterogeneous

Components

System

Integration

Outside System

Connectivity

More

Moore

Beyond

CMOS

Factory

Integration /

Manufacturing

Applications: Internet of Things

Mobile

communication

Information

Smart

Automotive Big Data

Green Energy

Technology

Medical

Healthcare

ITRS 2.0 Information Flow

1. System Integration identifies global ecosystem drivers and translates them into trends and indicators.

2. Heterogeneous Integration, Heterogeneous Components and Outside System Connectivity identify specific trends, drivers, challenges and roadblocks related to their fields.

3. System Integration provides inputs to all the Focus Teams

4. More than Moore and More Moore provide inputs to Factory Integration

ITRS Realignment: Focus Teams

Focus Topics Focus Teams

System Integration System Drivers X

Outside System Connectivity ERM, RF/AMS X X

Heterogeneous Integration Assembly & Packaging X X X

Heterogeneous Components MEMS X X

Beyond CMOS ERD X X X

More Moore PIDS X X X X X X

Manufacturing Factory Integration X X X

Fro

nt

End

Pro

cess

ing

Expertise Teams

Fact

ory

inte

grat

ion

Mo

del

ling

& s

imu

lati

on

Ass

emb

ly &

Pac

kagi

ng

MEM

S

Lith

ogr

aph

y

Des

ign

Test

Emer

gin

g R

esea

rch

Mat

eria

ls

Emer

gin

g R

esea

rch

Dev

ices

RF/

An

alo

g &

Mix

ed S

ign

al

ESH

Inte

rco

nn

ect

Met

rolo

gy

Pro

cess

Inte

grat

ion

, Dev

ices

& S

tru

ctu

res

Yiel

d

Beyond CMOS Efforts Based on Future Market Drivers

Computing/ Communication

Today’s ITRS Focus

Internet-of-Things

- Sensor integrated with CMOS

- Energy-harvesting devices - Low power devices

(e.g. TFET, NEMS) - Embedded NVM (low

power, low cost) - RF and wireless - Security

Cloud/Big Data

- Optical interconnects - Storage Class Memory - Efficient DC-DC converters - Data driven computing - Security

Emerging Research Devices’ areas of focus: Today:

- Emerging Logic - Emerging Memory

In the future, add: - Optical components - Sensor integration - Energy-harvesting - Circuit blocks and architectures for IoT, cloud - DC-DC converters

ITRS 2.0 Status

• The 7 Focus ITWGs have been formed

• Few additional members are under consideration

• Several meetings were held to date

• Draft outlines of the 7 programs have been generated

• First face to face meeting was held on July 7th, 2014

• Review (3) cycles identified

• 2014 ITRS white paper in preparation

More than Moore

Assessment of Driving Forces

Heterogeneous

Integration

Heterogeneous

Components

System

Integration

Outside System

Connectivity

More

Moore

Beyond

CMOS

Factory

Integration /

Manufacturing

Applications: Internet of Things

Mobile

communication

Information

Smart

Automotive Big Data

Green Energy

Technology

Medical

Healthcare