13
Four In-depth Seminars by Industry Leading Experts I/O Design Concepts for the ESD Engineer ESD Robust System – IC Design Contribution ESD Design Challenges in State-of-the-Art Analog Technologies VFTLP Tester Overview and Device Electrical Characteristics Keynote Presentation Carbon Nanomaterials for Next-Generation Interconnects and Passives Twenty-four Technical Presentations and Posters Covering: Modeling and Simulation for ESD Design New Design Tools for ESD Advanced Device Phenomena On-chip ESD Protection Design Test Methods and Tester Effects System Level ESD Issues Open Poster Sessions Discussion Groups Special Interest Group (SIG) Meetings The ESD Association newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 25, No. 2 March/April 2009 In this issue www.esda.org From the President David E. Swenson, page 2 Standards Update, page 3 & 4 Symposium Exhibits, pages 5 & 6 Education News, pages 7 & 8 ESD on Campus, page 9 Spotlight, page 10 Q & A, page 11 Local Sparks, page 12 Calendar, page 13 Now Available! ESD Association Calendar, Including local chapter meetings, regional tutorials, IEW, symposium and more. Look for this Icon You can print this calendar and use it at your desk. It is a helpful reminder of upcoming courses and events. Visit the Association web site www.esda.org to download your 2009 calendar Y ou are cordially invited to attend and actively participate in the 2009 International Electrostatic Discharge Workshop (IEW). This Workshop provides a unique environment for envisioning, developing and sharing ESD design and test technology for present and future semiconductor applications. The Workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits and systems as well as advanced semiconductor system on chip (SOC) and system in package (SIP) applications. Here you will closely interact with your peers at technical seminars and presentations, invited and open poster sessions, moderated discussion group meetings and special interest group (SIG) meetings. A ll workshop activities take place at the beautiful Stanford Sierra Camp and Conference Center. This rustic and relaxed mountain setting provides an atmosphere ideal for interactive learning and helpful discussions. T here should be ample time available for one-on-one exchanges in the poster session mixers, inter-session breaks and during the family style meals in the conference center dining room. As an added highlight, Wednesday afternoon is left free for hiking, boating, sports or relaxation. This exciting and well balanced program was put together specifically to address the needs and interests of ESD engineers for the benefit of their company. Both attendees and their organizations gain from this investment in learning. Be aware that space at the Camp is limited, so please register early. See you at the 2009 IEW! www.esda.org 2009 International Electrostatic Discharge Workshop Stanford Sierra Conference Center, May 18-21, 2009, Lake Tahoe, CA IEW Technically Co-Sponsored by Register Early and Save! IEW International ESD Workshop May 18-21, 2009 Stanford Sierra Camp Lake Tahoe, CA 2009 IEW Highlights Registrations are now being accepted for this year’s IEW! For complete information download the 2009 program and registration form at: http://www.esda.org/documents/ IEWProgram2009.pdf

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Page 1: IEW ostatic kshop - ESD A · kshop A IEW eiall oooe b Register Early and Save! IEW International ESD Workshop May 18-21, 2009 Stanford Sierra Camp Lake Tahoe, CA 2009 IEW Highlights

Four In-depth Seminars by Industry Leading ExpertsI/O Design Concepts for the ESD EngineerESD Robust System – IC Design ContributionESD Design Challenges in State-of-the-Art Analog TechnologiesVFTLP Tester Overview and Device Electrical Characteristics

Keynote PresentationCarbon Nanomaterials for Next-Generation Interconnects and Passives

Twenty-four Technical Presentations and Posters Covering: Modeling and Simulation for ESD DesignNew Design Tools for ESDAdvanced Device PhenomenaOn-chip ESD Protection DesignTest Methods and Tester EffectsSystem Level ESD Issues

Open Poster SessionsDiscussion GroupsSpecial Interest Group (SIG) Meetings

The ESD Association newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 25, No. 2 March/April 2009

In this issue

www.esda.org

From the President David E. Swenson, page 2

Standards Update, page 3 & 4

Symposium Exhibits, pages 5 & 6 Education News, pages 7 & 8 ESD on Campus, page 9

Spotlight, page 10

Q & A, page 11

Local Sparks, page 12

Calendar, page 13

Now Available!

ESD Association Calendar, Including local chapter meetings, regional

tutorials, IEW, symposium and more.

Look for this Icon

You can print this calendar and use it at your desk. It is a helpful reminder of

upcoming courses and events.

Visit the Associationweb site www.esda.org

to download your 2009 calendar

You are cordially invited to attend and actively participate in the 2009 International Electrostatic

Discharge Workshop (IEW). This Workshop provides a unique environment for envisioning, developing

and sharing ESD design and test technology for present and future semiconductor applications. The

Workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits

and systems as well as advanced semiconductor system on chip (SOC) and system in package (SIP)

applications. Here you will closely interact with your peers at technical seminars and presentations, invited

and open poster sessions, moderated discussion group meetings and special interest group (SIG) meetings.

All workshop activities take place at the beautiful Stanford Sierra Camp and Conference Center. This

rustic and relaxed mountain setting provides an atmosphere ideal for interactive learning and helpful

discussions.

There should be ample time available for one-on-one exchanges in the poster session mixers, inter-session

breaks and during the family style meals in the conference center dining room. As an added highlight,

Wednesday afternoon is left free for hiking, boating, sports or relaxation. This exciting and well balanced

program was put together specifically to address the needs and interests of ESD engineers for the benefit of

their company. Both attendees and their organizations gain from this investment in learning. Be aware that

space at the Camp is limited, so please register early. See you at the 2009 IEW!

www.esda.org

2009 International Electrostatic

Discharge Workshop

Stanford Sierra Conference Center, May 18-21, 2009, Lake Tahoe, CA

IEW

Technically Co-Sponsored by

Register Early

and Save!

IEW International ESD Workshop

May 18-21, 2009 Stanford Sierra Camp Lake Tahoe, CA

2009 IEW Highlights

Registrations are now being accepted for this year’s IEW!For complete information download the 2009 program and registration form at:http://www.esda.org/documents/IEWProgram2009.pdf

Page 2: IEW ostatic kshop - ESD A · kshop A IEW eiall oooe b Register Early and Save! IEW International ESD Workshop May 18-21, 2009 Stanford Sierra Camp Lake Tahoe, CA 2009 IEW Highlights

March/April 2009

2

DESCO Industries, Inc.3651 Walnut Avenue, Chino, CA 91710

Tel: 909-627-8178 Fax: 909-627-7449 www.descoindustries.comESD CONTROL PRODUCTS: Charleswater, CMG, Desco, EMIT, Menda,

ESD Systems.com, Protektive Pak, Semtronics, Statguard Flooring

3MElectronic Solutions Division

Tel: 1-800-328-1368 www.3M.com/electronicsManufacturer of static control permanent flooring, wrist/heel straps,

static shielding bags & testing/monitoring equipment

As we begin the New Year, the economy is everyone’s number one-concern. The ESD Association Board of Directors is certainly mindful of the burdens placed on our volunteers and everyone that would like to attend our events. Almost every company has travel restrictions in place for at least the first quarter. I had to travel this week and cannot remember a time (except right after 9/11) when the parking lots at the Austin, TX airport were so empty. At the time of this writing, we are nearing the end of the allotted time for registration at the Disneyland Hotel in Anaheim for our February meeting. It appears that we will make the minimum attendance level so there will be no penalties. As you probably realize, we have contracts with meeting site hotels, usually signed years in advance, that specify the number of attendees (by

number of room nights). Certainly there is an attrition level with each contract, but we need to make the minimum otherwise there are penalties and additional costs as-sociated with the meeting space and catering. As we plan and strategize the events scheduled for 2009, we will be making all the adjustments that we possibly can to ensure that we are able to deliver our programs and conduct meetings as efficiently as possible. We appreciate the effort that our volunteers make everyday to support the ESD Association and we are grateful to all the employers who provide the resources that allow our volunteers to participate. Let us all do what we can to ensure that our busi-nesses and companies survive and then are ready to thrive once we get the economy to the turn-around point. It has to come around, doesn’t it? Hopefully sooner rather than later!

As mentioned in the last issue of Threshold in this column, we have a number of new things going on in 2009. Several years ago, we estab-lished a New Business Development committee under the guidance of Ed Weggeland and assisted by his wife Debbie. When Ed became ill, much of this effort had to stop. I am very happy to let you know that Steve Heymann of MKS/Ion Systems has volunteered to take over the lead-ership of this area and has been appointed to the Board of Directors. Steve is looking at several new initia-tives and is establishing contacts with other organizations to offer our ex-

pertise as appropriate to their varied missions. Our educational programs and standards and test method docu-ments should be of interest to many other organizations but many are not aware of our existence. The New Business Development committee is going to make sure that we continue to support our Association Board of Directors’ mantra that Ed established years ago – “To Serve Industry and Become Known”. I think Steve ought to get a tattoo on his forearm.

A very important “change” has been made in the way we are able to deliver standards, test methods and other ESDA Standards related documents. It is now possible to get the documents electronically, saving a lot of time and mailing expense. We have been talking about this for a long time and now, thanks to our Headquarter’s Staff, you can order a document over the internet and get delivery of a PDF document to your computer in a short while (after credit card processing). It is not instanta-neous but much better than delivery by mail. We hope many of you take advantage of this method.

Good luck to you all. I hope you are able to participate in ESD Association activities and I look forward to seeing you at our upcoming events.

ESDA activities....

From the President

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March/April 2009

Association

Standards SummaryFebruary 2009 Meeting Series Disneyland Hotel, Anaheim, CA

WG2.0 – Garments. The working group (WG) completed the techni-cal and administrative support (TAS) committee’s comments on WIP2.1-2009. Test data collected on humid-ity testing of the groundable system was reviewed during the meeting. The WG plans to resubmit a complet-ed WIP document to TAS in March and have a complete document ready for Standards Committee (STDCOM) vote-by-mail after the May meeting series.

WG�.0 – Ionization. The WG en-countered some inconsistencies with the initial small charged plate monitor (CPM) testing. The testing has been redone and there is good repeatabil-ity. The WG worked on WIP3.4-2009 and has submitted a completed doc-ument to TAS for review before the next meeting series in May. A pur-pose and scope pertaining to perfor-mance and design of standard CPMs will be submitted for approval as a new project in the near future.

WG5.0 – (CBE) Device Testing. The Charged Board Event (CBE) Adhoc meeting. The adhoc team of WG members met to get an update as to the status of the action items from the September 08 meeting series. Pre-sentations have been held at various local chapters and societies locations and are planned for future locations including workshops at IEW09 and Symposium 09. Articles have been published in Conformity and the 3M newsletter. A future article is planned for EDFA/ASM magazine. The goal of the CBE adhoc team is to write a TR and hopefully upgrade to a WG to an SP. This CBE testing will mainly help to identify failure types

JPTG (WG5.1) – (HBM) Device Testing. This is a joint committee between the ESDA and JEDEC. The WG reviewed detailed com-ments from members on different sections in the document. There was discussion regarding sec-tions in the JEDEC document that are not in the ESDA document. Two of those sections have been approved to be added to the joint document. More discussion and data is needed regarding the accepted test proce-dures from the JEDEC document. A merged document should be submit-ted to TAS in May.

WG5.2 – (MM) Device Testing. The WG started the adjudication process of the STDCOM vote by mail com-ments received for WIP5.2-2008. The WG began making non-technical changes in the document and a com-plete draft document should be sent to ESDA in 2-3 weeks. The group is waiting for the industry review pe-riod. WG5.�.1 – (CDM) Device Testing. The WG started the adjudication pro-cess of the STDCOM vote by mail comments received for WIP5.3.1-2008. A teleconference is sched-uled to finish the adjudication of all comments. The document will be submitted to ESDA before the next meeting series. Tim Maloney gave a presentation on CDM detection with EMI and a presentation on TDT ap-proximation of CDM. Satoshi Isofuku gave a presentation on 30pf 1 GHz scope rise time issue. Scott Ward gave presentations on 3 zap vs. 1 zap CDM and single pin supply do-main group zapping. Mike Hopkins

gave a presentation on device vs. system level ESD – need for a sus-ceptibility test for device / system. Leo G. Henry gave a presentation on CDM Joint Committee / Gap Analysis of ESDA and JEDEC standard docu-ments. An advisory team was started to review the gap analysis of JEDEC and ESDA documents and propose ideas to the WG. WG5.4 – (TLU) Device Testing. A presentation was provided by Infi-neon that focused on the need for updated Latch-up method as SP5.4-2008 isn’t what is required. Mem-bers were asked for real world failure and waveforms. A teleconference is scheduled to discuss if any data is available to justify the WG staying ac-tive or going dormant. A decision re-garding the WG’s status will be made during the teleconference.

WG5.5 – (TLP) Device Testing. There was no activity on STM5.5.1-2008 or SP5.5.2-2007. A VF-TLP round robin is taking place to elevate the SP document to a STM. A tech-nical report will be published with the round robin data. A few problems have been encountered and will be rectified after testing is completed by all seven test sites. Tim Maloney gave a presentation on VF-TLP transients and how to use the information. Jon Barth gave a presentation on com-plete specifications for VF-TLP. The WG’s next project will be transient analysis of VF-TLP waveforms.

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March/April 2009

4

Association

WG5.6 – (HMM) Device Testing. The WG started the adjudication pro-cess of the STDCOM vote by mail comments received for WIP5.6-2008. No technical changes were made. Teleconferences are scheduled to complete adjudication of comments. A round robin will be started that could potentially elevate the document to a STM. Kathy Muhonen gave a pre-sentation on using the guns accord-ing to the HMM document, noting that two guns have drastically different waveforms.

WG6.0 – Grounding. The five-year review of S6.1-2005 was completed by the WG. A clarification sentence was added to Section 7.2.2 per a request by industry. There were no technical changes or other changes made. The document was submit-ted to ESDA HQ for a STDCOM re-affirmation vote at the May meeting series.

WG7.0 – Flooring. The five-year review of S7.1-2005 was complet-ed. The TAS comment pertaining to changing the designation of the doc-ument to a STM was agreed upon. The Compliance Verification flooring section was discussed.

WG10.0 – Handlers. The test data pertaining to WIP10.2 was reviewed. Task teams have been formed to be-gin writing a WIP document.

WG11.0 – Packaging. Round robin testing was completed and reviewed for WIP11.14. Additional lab test-ing is planned. STM11.13-2005 is up for five-year review. An industry

comment was addressed regarding editorial changes in the document. The WG will reaffirm STM11.13-2004 when data is available from 11.14.

WG1�.0 – Handtools. The WG dis-cussed changes to the test procedure that were found to be needed during round robin testing. The changes were made to WIP13.1. A new round robin was scheduled between the February and May meetings. The document should be submitted to TAS between the May and Septem-ber meetings for review. WG14.0 – Simulators. A new con-cept was introduced regarding ESD scanning and a work statement will be started. This may be a project for the HMM WG. SP14.1-2004 TAS com-ments were reviewed and accepted. The document is targeted for review to TAS by the May meeting series. WIP14.4 was reviewed and should be submitted to TAS before the May meeting series. A presentation was given by Mike Hopkins on behalf of Masamitsu Honda.

WG15.0 – Gloves. The WG reviewed WIP15.2 and changes were made. The test method was changed based on new data received. The docu-ment will be distributed to all of the working group members for approval and should be submitted to TAS in two weeks.

WG16.0 – Workstations. The com-mittee reviewed TAS comments on WIP16.1. A discussion was held re-garding whether the document should be expanded or contracted.

Standards Summary continued

Submit Your Ideas To The Suggestion Box

As a member-driven organization, the ESDA needs and wants your input into our operations and programs. That’s the idea behind the new Suggestion Box. We invite your suggestions about any aspect of the Association. We’ll discuss them, evaluate them, and implement those that are deemed appropriate.

How do you submit a suggestion? Simple. Just send an e-mail to [email protected] or log on to the web site and click on the suggestion box icon on the home page.

We’ll respond to your suggestions. When the suggestions and their potential implementation are of general interest to the membership, we’ll publish them in Threshold.

Put your thinking caps on and submit those suggestions. It’s your organization.

TREK, INC.11601 Maple Ridge Road, Medina, NY 14103

Tel: 585-798-3140 Fax: 585-798-3106 www.trekinc.com

Designer and manufacturer of instrumentation and sensors for measuring surface voltage, ionizer performance, and surface resistivity

ACL Staticide1960 E. Devon Avenue, Elk Grove Village, IL 60007

Tel: 847-981-9212 Fax: 847-981-9278www.aclstaticide.com

Anti-static mats, topical anti-stats, floor finishes and coatings, static meters, cleanroom products

WG5�.0 – Compliance Verification. The WG reviewed comments regard-ing new sections for TR53-01-06 on gloves, fingercots and handtools. The document should be submitted to TAS within a month.

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March/April 2009

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Symposium

Exhibit at the 2009 EOS/ESD Symposium in Anaheim, California The EOS/ESD Symposium cov-ers a broad base of interests including industrial, computer, communications, and military electronics; web processing; cleanrooms; semiconductors; MR heads; and electronic sys-tems, components, and equip-ment.

Five days of tutorials, technical papers, exhibits, workshops, peer networking, and special events provide the information to understand and control EOS and ESD, improve yields and productivity, increase quality and reliability, and control costs.

It’s the one event where you will find technical papers that em-phasize the latest research and technology; basic, intermediate, and advanced tutorials; exhibits of ESD control products and services; workshops; authors’ corners; Program Manager Cer-tification; Device/Design Certifi-cation; and more.

The Symposium is a targeted, concentrated audience of ESD and EOS professionals looking for solutions. This event draws nearly 500 attendees from 30 countries around the world. They come for tutorials, for technical papers, for workshops, for net-working...and they come for the exhibits.

Exhibitors have a number of marketing and promotion op-portunities available that sup-port the Symposium and create company awareness. These opportunities include advertis-ing in the Exhibits Directory, and sponsoring various Symposium events such as lunches, cof-fee breaks, receptions, and the opening breakfast.

Wolfgang WarmbierUntere Giesswiesen 21, D-78247 Hilzingen, Germany

Tel: 49-7731-86880 Fax: 49-7731-868846 www.warmbier.com • E-mail: [email protected]

ISO 9001:2000 certified for consulting, manufacturing and supply of static control materials and systems, ESD test Instrument calibration

Monroe Electronics100 Housel Avenue, Lyndonville, NY 14098

Tel: 585-765-2254 Fax: 585-765-9330E-mail: [email protected]

www.monroe-electronics.comFull line manufacturer of static measurement equipment

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March/April 2009

6

Exhibit at the 2009 EOS/ESD SymposiumContinued

3M Booth 220 ACL, Inc. Booth 222 Advanced Test Equip. Booth 323 Barth Electronics, Inc. Booth 130 CCI Booth 224 Desco Industries Inc. Booth 114 Electro-Tech Systems Booth 226 Flexco Booth 230 Floorfolio Booth 225 Grund Technical Sol. Booth 506 Hanwa Electronic Booth 432 Hyperion Catalysis Int’l Booth 227 ITW Richmond Tech. Booth 128 ITW-SIMCO Booth 314 Lubrizol Conductive Polymers Booth 214 Megalin Source Booth 327 Mentor Graphics Booth 503 MKS, ION Systems Booth 330 Monroe Electronics, Inc. Booth 501 Prostat Booth 322 RTP Company Booth 502 Simco Electronics Booth 321 Skolnik Booth 504 Static Solutions Booth 228 STATICO Booth 414 Stephen Halprin & Associates Booth 324 Tech Wear, Inc. Booth 420 Thermo Fisher Scientific Booth 320 Transforming Technologies Booth 221 Trek Inc. Booth 120 University Of Michigan Booth 223 Vidaro Corp. Booth 329 Publications CleanroomsConformityControlled Environments Equipment Protection IEST

Symposium

Thirty-two exhibitors have already committed to the 2009 EOS/ESD Sym-posium. Space is still available and can be reserved by contacting the ESD Association, 7900 Turin Rd, Building 3, Rome, NY 13440, phone 315-339-6937, or fax 315-339-6793.

The list of current exhibitors:

Static Solutions Inc.331 Boston Post Rd.-East, Marlboro, MA 01752 USA

Tel: 508-480-0700 Fax: 508-485-3353 www.staticsolutions.comWorldwide manufacturer of patented ESD Cleanroom products, including Ohm-StatTM combination/

resistivity meters, Ohm-ShieldTM coatings/floor finishes/paints, Ohm-CideTM EPA cleaners, Stat-o-FlexTM Class Zero wriststrap, and UltimatTM Class Zero out-gassing rubber.

Proline10 Avco Rd., Haverhill, MA 01835

Tel: 800-739-9067 Fax: 978-374-4885www.1proline.com E-mail: [email protected]

Manufactures ESD modular and ergonomic workstations

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March/April 2009

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Local ChaptersEducation

Online - Ultra-Sensitivity Trends and CDMMarch 18, 2009 • 2:00 p.m. Eastern Time Course length - one hourInstructor: Ted Dangelmayer, Dangelmayer Associates, L.L.C. Learn how to prepare for the trend toward the extensive use of ultra-sensitive components that is brewing in the electronics industry and the wide spread lack of understanding about CDM (Charged Device Model) that is making it more difficult. Case studies will illustrate how CDM failures can persist even with a robust HBM program in place. A series of photographs of common CDM issues in manufacturing will enable students to visualize how to implement CDM controls. A brief summary of the work by the Industry Council on ESD Target Levels will be included.

To register visit http://esda.org/documents/UltraSensitivityTrendsandCDMMar09.pdf

NORTH CENTRAL REGIONAL TUTORIALMay 6-7, Minneapolis, MN

ESD Basics for the Program Manager*May 6, 2009 • 8:�0 a.m. - 4:�0 p.m. Instructor: Steve Halperin Stephen Halperin & Associates, Ltd.This tutorial provides the foundation mate-rial for understanding electrostatics and ESD and their role in the manufacture and handling of ESD sensitive devices. The fundamental properties of charge, electric fields, voltage, capacitance and current are discussed with a view towards understanding key electrostatic phenomena and electrical processes. These include charge generation and decay, mate-rial properties and induction. An overview of device failure mechanisms is presented, in-cluding how these models impact ESD con-trol programs. Finally, the course provides an overview of ESD control procedures during handling and manufacture and an overview of ESD S20.20 program requirements.

How To’s of In-Plant ESD Auditing and Evaluation Measurements* May 7, 2009 • 8:�0 a.m. - 4:�0 p.m. Instructor: Steve Halperin Stephen Halperin & Associates, Ltd.This program was designed to support S20.20 in-plant verification requirements. It reviews the evaluation and audit measurement procedures for S20.20 ESD controls listed in the S20.20 document, Table 1-ESD Control Program Technical Requirements Summary. These recommended measurement procedures confirm the proper operation and use of ESD control products and materials selected as part of a facility’s S20.20 ESD control program.

System Level ESD/EMI: Testing to IEC and Other Standards* **May 6, 2009 • 8:�0 a.m. - 12:00 p.m.Instructor: Michael Hopkins Amber Precision InstrumentsThis tutorial is intended to help those tasked with testing products to IEC and other system level ESD standards by providing detailed information on IEC 61000-4-2, the most widely used standard, and highlighting the harmonization and differences between IEC, ANSI, Telcordia, and some automotive ESD standards. We will answer common questions regarding test setups, test points and procedures.

Device Technology and FA Overview *May 6, 2009 • 1:00 p.m. - 4:�0 p.m.Instructor: Leo G. Henry, Ph.D. ESD/TLP Consultants, LLC.

This tutorial is designed to give a broad overview of ESD device technology, the ways circuit designers protect against ESD, and the failure analysis techniques that are likely to be encountered in reports about ESD failures. After completing this tutorial you should be able to understand the basics of device protection design and some of the trade-offs inherent in that process. You should also be familiar with some of the most commonly used failure analysis techniques that can help identify failing circuit components - in other words “what does a semiconductor manufacturer do with the units I return for failure analysis?” The topics covered include the three most common ESD models, characteristics of ideal ESD protection, typical ESD protection schemes, key characteristics of ESD protection, failure analysis flow, and failure analysis tools and their uses.

To register visit http://www.esda.org/documents/NCRTPMay09flyer.pdf

Online - Susceptibility Testing of Devices and SystemsApril 21, 2009 • 2:00 p.m. Eastern Time Course length - one hour.Instructor: Michael Hopkins, Amber Precision Instruments

In this course, we will cover scanning methods (using a magnetic field noise source and probe) that allow identification of susceptible devices in a system, sensitive areas/pins of devices and associated circuitry. Crude methods of susceptibility scanning (monitoring voltages, currents, re-set lines, data streams etc) have been done for some time, but new automated methods and software analysis allow quick pinpointing of sensitive circuits and devices. Software allows not only the identification of sensitive areas, but can plot the relative sensitivities providing a 3 dimensional look at a circuit’s susceptibility.

To register visit http://www.esda.org/documents/SusceptibilityTesting_Hopkins4-21-09.pdf

ONLINE CLASSES REGIONAL TUTORIALS

*Course credit applies to the ESD Certified Professional-Program Manager certification curriculum.

**Course credit applies to the ESD Certified Professional-Device Design certification curriculum.

Molded Fiber Glass Tray Co.6175 US Highway 6, Linesville, PA 16424

Tel: 800-458-6050 Fax: 814-683-4504 E-mail: [email protected] of static dissipative and conductive trays and containers for

static protection of sensitive parts.

TOPLINE-ELME7331A Garden Grove Blvd., Garden Grove, CA 92841

Tel: 800-776-9888 E-mail: [email protected] www.ESD.TVFull line ESD products including shoes, garments, chairs, brushes, mats,

gloves. Maximum comfort.

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8

NORTH EAST REGIONAL TUTORIALMay 19-20 Tewksbury, MA

ESD Standards Overview for the Program Manager*May 19, 2009 • 8:�0 a.m. - NoonInstructor: David E. Swenson Affinity Static Control Consulting, LLC

The ESD Association’s introduction of the Program Manager Curriculum created a need to modify the Standards Tutorial that has been presented for a number of years, mainly to help individuals prepare for the NARTE Engineering and Technician Exams. Many of the ESDA Standards and Standard Test Methods are discussed in depth in the individual tutorials related to the specific subject matter. This Standards Tutorial provides an overview of all the Standards, grouped into common test types, based on measurement probe and test instruments. A common methodology is used in this tutorial to cover the requirements, applications and specifications for each Standard and Standard Test Method.

Packaging Principles for the Program Manager*May 19, 2009 • 1:00 p.m. - 4:�0 p.mInstructor: David E. Swenson Affinity Static Control Consulting, LLC

Shipping electronic parts within a factory, to another factory, distributor, or to an end-user has always been an area of uncertainty within the manufacturing process. To provide clear-cut information on what type of controlled packaging should be used in any situation, the ESD Association has recently released a comprehensive revision of the obsolete industry standard EIA 541-1988. The new document, ESD S541, is the focus of this session. It provides information and guidance, as well as material specifications, to assist in the design and implementation of a packaging plan for use within an ANSI/ESD S20.20 based ESD control program.

Current and newly released test method standards suitable for packaging material evaluation will be described.

Cleanroom Considerations for the Program Manager*May 20, 2009 • 8:�0 a.m. - Noon Instructor: Chris Long, IBM

Cleanrooms and clean environments are enabling technologies required for the manufacture of many products that have exacting contamination control requirements in order to achieve defined yield and reliability targets. Clean manufacture is required in the semiconductor, hard disk drive, flat panel display, and pharmaceutical industries, to name a few. Requirements of cleanroom/clean environments and tooling therein result in low humidity levels, low surface contamination levels, use of process-required insulators, and a lack of natural ions in the controlled environment. These factors can contribute to development of elevated static charge levels in close proximity to sensitive product, presenting both a contamination and electrostatic discharge exposure.

Ionization Issues and Answers for the Program Manager*May 20, 2009 • 1:00 p.m. - 4:�0 p.m.Instructor: Arnie Steinman MKS, Ion Systems

The primary method of static charge control is direct connection to ground for conductors, static dissipative materials, and personnel. But a complete static control program must also deal with isolated conductors, and insulating materials, and moving personnel that cannot be grounded. Air ionization can neutralize the charge on insulated and isolated objects.

To register visit http://www.esda.org/documents/NERTP09.pdf

REGIONAL TUTORIALS Cont.

Local ChaptersEducation

Visit ESDA on the Web

www.esda.orgDo you want to register for the 2009 IEW or one of several regional Tutorials? How about an online course?

Are you interested in becoming a Certified Program Manager or Device Design Certified?

What issue of Threshold included an article on the role of ESD consultants?

Where can I find ANSI/ESD S20.20 in Spanish?

What other products does the ESD Association have to offer?

You can find the answers to these questions and many more by visiting the ESDA website www.esda.org

To register for the Buyers Guide, or to look for companies who specialize in ESD products and services in the Buyers Guide, look for this icon on the ESDA website.

*Course credit applies to the ESD Certified Professional-Program Manager certification curriculum.

MicroStat Laboratories/River’s Edge Technical Service3612 3rd Pl. NW, Rochester, MN 55901

Tel: 507-292-0230 Fax: 507-292-0698 www.microstatlabs.comESD materials testing laboratory, ESD & contamination control auditing,

consulting • S20.20 program development

SIMCO ElectronicsWorldwide Headquarters

1178 Bordeaux Drive, Sunnyvale, CA 94089Tel: 800-432-2351 • [email protected]/www.simco.com

Accredited ESD testing, auditing, evaluation & training. Calibration and repair of ESD testing equipment.

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ESD On Campus

ESD on CampusBy Steven H. Voldman

The ESD on Campus program visited the City University of Hong Kong on one of Hong Kong’s most exciting days, as the Olympic torch was run through the city for the 2008 Beijing Olympics. After a long detour around the flag waving crowds, one enters City University of Hong Kong. You are greeted at the gates with two Qilin. The Qilin -- (Chinese: pinyin), or better known for the beer, as the Kirin (Japanese and Korean), is a Chinese mythical hooved creature with antlers and a tail. The Qilin is said to appear in conjunction with the arrival of a sage -- it is a good omen that brings serenity or prosperity. As one enters City University, students flow out of the MRT station into the university through high tech Moon Gate doors. City University of Hong Kong has 25,000 students and an Engineering School of 6,000 students. The school motto is “Officium et Civitas” -- a focus on professionalism, and contribution to society – key for the success of Hong Kong. As a result, a significant amount of research is directly geared toward modern problems and today’s applications. In the lab there is research on RF components, RFID

devices and electromagnetic interfer-ence (EMI). At this time there is a growing interest to get into ESD work in the semiconductor area.

Professor Hei Wong, whose focus is semiconductor devices and EMI, was the host. He provided a tour of the four RF EMI chambers. City Uni-versity of Hong Kong is not lacking in resources, new very well equipped laboratories and equipment fill the space in a traditional Hong Kong style. Every square foot counts in Hong Kong where land is limited and all buildings abut the mountain range. An ESD talk was given to faculty and students discussing areas of possible research in EMI and ESD. When in Hong Kong, one must explore the Dim Sum delicacies – the

University is unique with prepared ducks hanging in the student cafeteria and a Dim Sum restaurant integrated for students and faculty… such that I have never seen outside of Hong Kong. The honey coated deep fried eggplant was a new dish for me. As I got out of my taxi in Wanchai, flag waving and smiles lined the downtown street as the Olympic torch ran through.

I do have to admit, ESD took a second place finish to the Olympic torch on this special day. But at least we were there…and placed.

Steven H. VoldmanIEEE Fellow

City University of Hong KongEMI, ESD, Devices and Dim Sum

Professor Hei Wong (third from left), Steve Voldman (center) and several students

Tech Wear, Inc.2205 Faraday Ave., Suite B, Carlsbad, CA 92008

Tel: 760-438-7788 Fax: 760-438-6868Email: [email protected] www.techwear.com

Industry leader in static control garments, including groundable cleanroom garment systems.

Dur-A-Flex Inc.95 Goodwin St., East Hartford, CT 06108Tel: 800-253-3539 www.dur-a-flex.com

With over 40 years of experience and innovation. Dur-A-Flex manufactures epoxy, urethane and acrylic seamless flooring and wall systems for commercial,

industrial and institutional applications.

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March/April 2009

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Spotlight

Fred Tenzer became involved in static control in 1979 and got hooked on static after attending the first ESD Sym-posium in Denver, Colorado later that same year. At the third Symposium in 1982, the ESD Association was official-ly formed of which he is considered a founding member with an initial mem-bership number of <100.

That same year, 1982, was the begin-ning of the ESDA’s Standards activity. Fred wanted to be more involved, so he volunteered to participate in Standards. He recalls that the group first consisted of about 7 members; 5 from the user/military sector and two from the supplier side. The first Chairman was Whit Kirk and the first document produced was the wrist strap standard S1.0. Today, it is known as ANSI/ESD S1.1 For the Protection of Electrostatic Discharge Susceptible Items Wrist Straps.

By 1989, ESDA’s Standard activities had grown to ~18 people with about 4 active projects. There was still only one meeting per year, at the annual Sympo-sium. All that was about to change. In 1989, Steve Halperin became STDCOM Chair. He asked the ESDA President at that time, Clarence Muncie, if he had any restrictions. Being told there were

none. . . Steve went to work! Using his considerable organizational skills and legendary energy, Steve transformed Standards and STDCOM to the begin-nings of what we see today. He intro-duced STDCOM to 3 meeting series per year and the goal was to make the ESD Association the leader in ESD Standards development . . . World Wide. It was a real treat and honor to be part of the Halperin machine. It was some years prior to this that Steve in-troduced Fred to the EIA PEPS Com-mittee, TASK Force 1 and EIA-541, but that is another story.

By 1993, STDCOM had a whole new look. There were now over 150 volun-teers, meeting 3X per year, working on some 26 different projects for Standards. These projects were not only Standards documents and ADVs (today’s TRs – Technical Reports), but included projects with ANSI, IEC and other standards bodies. Today, Tim Jarrett is STDCOM Chair and the Stan-dards development activities continue to grow.

Over the past three decades, Fred has had the privilege to work with some of the greatest minds and greatest char-acters involved in static control. “I got into Standards and found that I got so much from the people that I never got out. My entire “volunteer career” with the ESDA has been with Standards. As a result, I’ve been blessed with life-long friendships that have developed from Standards work”.

Fred works for Desco Industries, Inc. who supports his involvement in Standards activities as the Chair of TAS (Technology and Administrative Support) and Vice-Chair of STDCOM. While the ESDA and all volunteer ac-

tivities depend on dedicated individuals that see the value of contributing their expertise and time to their industry via ESDA volunteer activities, the real unsung heroes in this are the compa-nies they work for. Whether a fortune 500 company, privately held corporation or LLC, without their support, both in allowing the workday time and funding the travel and expenses, our individual dedication could not be realized.

Fred has been married to his wife Therese (Tree) for 22 years. They met on Cape Cod where they both worked for Packaging Industries. They have lived in Atlanta, Chicago and for the past 15 years, in Stow in Northeast Ohio. Tree is considered an FBI (Full-Blooded Italian) and Fred, after 22 years of marriage, is accepted as an IBM (Italian By Marriage). Fred and Tree enjoy cooking, gardening and traveling. During the summer months, they enjoy exploring back roads together on their 100th anniversary Harley Heritage Soft Tail Classic.

While Fred has no Engineering degree, only a BS in business and an MBA, he often says that with his experience in Standards, he is fairly well grounded in Static Control. . . Pun intended.

Fred Tenzer - “Hooked on Static”

California Micro Devices Corp.490 N. McCarthy Blvd. #100 • Milpitas, CA 95035

Tel: 800-325-4966 Fax: 408-263-7846 www.cmd.com

Leading supplier of application specific analog and mixed signal semiconductor products, protection devices

Winifred Int’l Technology Ltd.399 Cailun Road, Pudong New Area, Shanghai, Chinawww. winifred-hk.com • e-mail: [email protected]

Leading supplier for ESD and contamination control products, wrist straps, rubber mats, test equipment, packaging products, clean gloves, garments,

chairs, and ionizers.

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March/April 2009

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Q&A

Q ‘I’m a major worldwide distributor of plastic sheeting (specifically 18 mil PET). For many years I have bought from US suppliers who, in cooperation with our organization, have been able to deliver the specifications and standards of quality required for our clientele.I have been struggling with developing overseas suppliers and after several years have located a very modern facility and developed a good partnership.They make extremely good material in (almost) every way. However we have discovered one serious problem which we need to resolve before proceeding with full scale production and distribution of their material.The material arrives with serious blocking issues. We now add modifiers which have mostly alleviated this issue but we are still hampered with static issues. Using handheld measuring devices on material from overseas locations we record a wide range of static from mid hundreds to several thousands, peaking around 10,000 to 12,000V.We have asked the factory to perform static tests as well and they have come up with the same numbers. And so we can confirm that the static is present at the point of extrusion and sheeting.The factory had placed some ionized air blowers on line, but this has not resolved the issue. We suspect that ionizers need to be installed on line, at the appropriate power and correct polarity to completely neutralize the electrostatic charge. Our US material carries a 200V charge at

delivery, an insignificant number.I need to better understand the difference between ionized air blowers and ionizers, the difference in their capabilities and effectiveness in dealing with this issue, following which I need to determine a suitable brand and product configuration to recommend and install at our overseas facility.

A I have many years of involvement with wide polymer webs of various formulations. As you are no doubt aware, static electricity generation is a dynamic process - changing at every interface between the web and rollers. The main areas to make sure static levels are reduced are prior to any coating application, immediately after coating, perhaps after curing and for sure prior to wind-up. I would not suggest the use of blowers as they generally do not provide enough ionization and contribute to movement of debris and other contaminants. For this application, ionizer bars should be placed cross web at a down web distance of approximately 3 to 4 times the roller diameter from the tangent point of the web passing over the roller. Grounded induction type bars will reduce inprocess static electricity to something less than 5kV in most cases and then a good electrical ionizer bar after that can knock it down to something approaching a few hundred volts - depending on web speed. If a nuclear type ionizer is available - they could reduce it even more. I would

try to reduce the voltage to as low as possible right at the wind-up station. The surface topology of the China made film may be flatter (smoother) than film made elsewhere. That will most certainly contribute to increased static charging and blocking so it is something I would look at right away.

Static Issues in Plastic Sheeting

Tell it like it is!In the last issue of Threshold we

included a questionnaire asking you to tell us what you think of the newsletter. We are pleased by the positive and encouraging comments we received.

The most popular columns are the Q&A, On Campus, and ESDA Spotlight. We also received comments indicating what you would like to see in the future. Some mentioned that they would like to see more technical information. Your ideas will help us to develop new columns and keep Threshold interesting and helpful.

Thank you for taking the time to tell it like it is!.

Terry Finn Marketing Administrator

CONTROLLED ENVIRONMENTS MAGAZINE4 Limbo Lane, Amherst, NH 03033

Tel:603-672-9997 Fax:603-672-3028 www.cemag.us [email protected]

Leading source of information on contamination prevention,detection, and control for cleanrooms and critical environments.

StAtico541 Taylor Way, #1, San Carlos, CA 94070 USA

Tel: 650-592-4733 Toll Free: 1-800-261-4149 Fax: 650-508-0761 • [email protected] • www.statico.com

Global supplier of static control & cleanroom products

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March/April 2009

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AssociationLocal Chapters

“Local Sparks” The Local Chapter Connection

The ESD Association takes pride in recognizing its local chapters across the country and abroad. The activities of local chapters provide both education and networking opportunities on a regular basis. New chapters are always forming and we will let you know how to get in touch with them through this column. Contact the ESD Association for information on starting a local chapter in your area.

If your local chapter has news or information that you would like to publish in this article, please send your information to [email protected].

Quick Links to ESD Local Chapters

ASEMEP ESD Council • aec.asemep.com.phAsociación ESD de Mexico • www.esdmexico.com

Indian Chapter no website availableNorth Central Chapter • www.esdnorthcentral.org

Northeast Chapter • www.nechapter-esda.orgSilicon Valley EOS/ESD Society • www.esdsiva.org

Southwest Chapter • www.southwestesd.comTexas Chapter • www.Centxesdassoc.homestead.com

CHAPTER NEWS - The Texas local chapter has set up a link where ESD related questions can be sent in by e-mail and then distributed for general response. It’s called ESDTALK! When an e-mail is sent to the ESDTALK e-mail address, the server redistributes it to each person registered on the distribution list. The recipient can respond to the individual sender

and/or the entire ESDTALK list. Everyone learns from the exchange of messages.

All ESDTALK users must first register. You can go to the Texas ESD Association Web site at http://centxesdassoc.homestead.com/ and click on the link for ESD talk.

Even if you don’t have a question to pose at this time, you can learn more by being on the distribution list for the exchange of information.

The network is not secure or appropriate for confidential information. Because this is an open response, the Association will not

CHAPTER MEETINGS & EVENTS Texas Chapter S20.20 Overview Date: Apr 22, 2009Time: 3-5PM Instructor: John Kinnear Location: 3M Innovation Center, 6801 River Place Blvd., Austin, TX 78726. be responsible for misinformation.

Northeast ChapterGeneral Meeting (ESD Testing) Date: March 25Time: 5:30 PM Location: Thermo Fisher Scientific, Lowell, MA

North Central ChapterAnnual Membership Dinner and Chapter MeetingDate: March 9thLocation: Holiday Inn Select & Suites, Bloomington, MN

Technical Presentation by John Kinnear, IBM Corporation. John will discuss his 2008 EOS/ESD Symposium paper, Process Capability & Transitional Analysis (co written with Steve Halperin and Ron Gibson).

You can find all of the chapter meeting and events in the online calendar. Print it out for your desktop reminder.www.esda.org

Your Listing Can Appear HereContact ESD Association for details

7900 Turin Road, Building 3, Rome, NY 13440-2069Tel: 315-339-6937 Fax: 315-339-6793

[email protected]

Your listing will also appear in the online calendar

Contact ESD Association for [email protected]

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March/April 2009

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T Calendar

Threshold

ThresholdTM is published six times a year by the ESD Association, a not-for-profit corporation. It strives for the advancement of theory and practice of electrical overstress avoidance and of allied arts and sciences and the maintenance of a high professional standing among its members and others.

©Copyright 2008, ESD Association, Rome, NY

ThresholdTM Publication Schedule Issue Deadlines January/February ......................Nov. 19 March/April .................................. Feb. 1 May/June ..................................... April 1 July/August ..................................June 1 September/October .....................Aug. 1 November/December ...................Oct. 1

Threshold Institutional ListingsSpace in the Threshold Institutional Listings, which appear at the bottom of newsletter pages, can be purchased for $600.00 for six consecutive issues. Listings will also appear in the online calendar. Larger contributions are welcome. No agency fee is granted for soliciting such contributions. Inquiries, or contributions made payable to the ESD Association, should be sent to:ESD Association, 7900 Turin Rd., Bldg. 3, Rome, NY 13440-2069 Tel: (315) 339-6937, Fax: (315) 339-6793, e-mail: [email protected].

Newsletter StaffBoard of Directors SponsorCraig ZanderProstat CorporationTel: 952-426-2611E-mail: [email protected]

EditorTerry FinnESD Association7900 Turin Road, Bldg. 3, Rome, NY 13440Tel: 315-339-6937 Fax: 315-339-6793E-mail: [email protected]

Associate EditorsDevelopmentDavid E. Swenson, PresidentAffinity Static Control Consulting, LLC

Production Design and TestSteve Voldman, Dr. Steven H. Voldman LLCLeo G. Henry, ESD/TLP Consultants

TechnologyCharvaka Duvvury, Texas Instruments

Editorial Advisory BoardBoard of Directors SponsorCraig Zander, Prostat Corporation

PresidentDavid E. Swenson, Affinity Static Control Consulting, LLC

Sr. Vice PresidentDonn Bellmore, Advanced ESD Services +

Vice PresidentLeo G. Henry, ESD/TLP Consultants, LLC.

TreasurerDonn Pritchard, Monroe Electronics

Human ResourcesArnie Steinman, MKS, Ion Systems

Additional Editorial AssistanceMarti Farris, Intel Corporation

ESD Association Headquarters StaffLisa, Pimpinella, Director of Operations Christina Earl, Standards Administrator Terry Finn, Marketing AdministratorCarrie Fragapane, Administrative AssistantKaren Macri, Administrator

7900 Turin Road, Bldg. 3, Rome, NY 13440-2069Tel: (315) 339-6937 • Fax: (315) 339-6793E-mail: [email protected] • Web: www.esda.org

March 18Online - Ultra Sensitivity Trends and CDM http://esda.org/documents/Ultra SensitivityTrendsandCDMMar09.pdf

May 6-7 Regional Tutorial Program Hilton, Minneapolis, MN

May 7-12ESD Association Meeting Series, Hilton, Minneapolis, MN

May 18-213rd Annual International Electrostatic Discharge Workshop (IEW),Stanford Sierra Conference Center, Lake Tahoe, CA

May 19-20 Regional Tutorial Program Holiday Inn, Tewksbury, MA

June 16-17 S20.20 Seminar 3M Innovation Center, Austin,TX

June 24-25 Device Design SeminarMunich, Germany

June 26 Testing and Smart PowerMunich, Germany

August 27- 31ESD Association Meeting Series, Disneyland Hotel, Anaheim, CA

August 30 - September 4EOS/ESD Symposium and Tutorials, Disneyland Hotel, Anaheim, CA

October 13-14S20.20 Seminar ESDA Headquarters, Rome, NY