Upload
others
View
8
Download
0
Embed Size (px)
Citation preview
1
GHz Sampling Design
Challenge
2© 2008 National Semiconductor Corporation
Target ApplicationsTest & MeasurementCommunications TransceiversRanging Applications (Lidar/Radar)
Set-top box direct RF down-conversion
Highest PerformanceHighest Dynamic PerformanceLowest Power ConsumptionInnovative Packaging technologyWide Bandwidth
National SemiconductorGhz Ultra High Speed ADCs
3© 2008 National Semiconductor Corporation
ADC081000
ADC08D1000
ADC08D500
ADC081500
ADC083000 3 GHz BWDDR, SBI
ADC08B3000 4K Buffer w/CMOS outputs
ADC08500
ADC08D10202 GHz BW
DES, DDR, SPI
SP
EE
D
Single Channel Dual Channel
ADC08D1500
http://www.national.com/appinfo/adc/ghz_adc.html
ADC08D15202 GHz BW
DES, DDS, SPI
8bit GSPS Family
Today
4© 2008 National Semiconductor Corporation
JFET
Ch 2
JFETCh 1
LMH6702 /3LMH6555/6552
LMH6515 /LMH6505 ADC08D1000/A
DC08D1500
DAC124S101
Key pad
Memory
+_
LMH7220/ LMH7322
DAC
Power Trigger
LMH6570
+_
DAC
DAC
DACTrigger
PLL+VCO
VCM
LMX2531
FPGA
CPUDisplayDiffVGAMuxBuff
Digital Oscilloscope Block Diagram
5
The Clock Circuitry
ADC08DxxxCircuit Design Considerations
6© 2008 National Semiconductor Corporation
Jitter: cycle-to-cycle variation in timing
Clock Jitter
Sample amplitude variation due to Jitter
InputSignal
ADCclock
Result: Output noise
Clock Jitter
7© 2008 National Semiconductor Corporation
Effect of Jitter
Sampled with “clean” Clock Sampled with Jittery Clock
8© 2008 National Semiconductor Corporation
High-Speed ADC Clock Considerations
• Maximum allowable jitter to prevent noise degradation:
• “ADC Resolution” & “Signal input frequency” have directly effect upon jitter-induced noise
tjmax =VIN(P-P)
2(n+1) * VFS * π * fin
9© 2008 National Semiconductor Corporation
0.001
0.010
0.100
1.000
10 100 1000 10000
Fu ll Scale In pu t Frequ en cy (MH z)
Jit
ter
(ps
)
16-Bit
14-Bit
12-Bit
10-Bit
169 MHz Input to ADC
To realize 12-bits of resolution for the ADC12DS065, the total aperture jitter must be less than 0.33 ps.
0.33 ps RMS Jitter
Data Converter ENOBFull Scale Input Bandwidth vs. Total Jitter
10© 2008 National Semiconductor Corporation
System Requirement to Clock Jitter
11© 2008 National Semiconductor Corporation
Spectral Considerations
Spurs that extend to higher frequencies may be visible and directly impact system jitter
12© 2008 National Semiconductor Corporation
* R12 & R13 is populated only for the ADC083000 and the ADC08B3000R15 is zero Ohms, R12 & R13 are open for others like ADC081500, ADC08D1500, ADC08D1520
1:2 Impedance
RatioBalun
C144.7nF
C154.7nF
Y1CLKOSC
3.3V
C31uF
C1100pF
C2100nF
R2150
R3 39
R4150
R549.9
C4100nF
R70.22
C6100nF
C810nF
C90.47uF
LD Control input from FPGA
C150100pF
3.3V
C166100nF
SDATASCLK
PLL_LEPLL_CE
R232.2k
R2014.3k
C25100nF
3.0V
3.0V
C17100nF
C184.7uFR113.3k
C19100nF
C7100pF
R13 *100
C16100pF
3.0V
C10100pF
3.0V
C110.47uF
R80.22
R912K
R101kC12
0.15uF
C13220pF
123456789
272625242322212019373839
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
U3LMX2531LQ1500E
R12 *100
R15 *71.5
Crystek# CCHD-950-25-60
60 MHz
to ADC CLK+
to ADC CLK-
To ADC
LMX2531LQ1500E Simplifies the PLL+VCO clock system
13© 2008 National Semiconductor Corporation
LMX2531 Phase Noise and jitter Performance
14
Effects of Time Interleaving
15© 2008 National Semiconductor Corporation
Correct Relative Clock Phasing
• Samples are in the proper place.
Sampled Signal
CLOCK forADC1
CLOCK forADC2
16© 2008 National Semiconductor Corporation
Incorrect Relative Clock Phasing
• Incorrect timing results with incorrect relative clock phasing
Sampled Signal
CLOCK forADC1
CLOCK forADC2
17© 2008 National Semiconductor Corporation
Distortion is the Result
• We get distortion when combining the data from time interleaved converters.
Reconstructed Signal
Read CLOCK forADC1 Data
Read CLOCK forADC2 Data
18© 2008 National Semiconductor Corporation
ADC08Dxxxx Block Diagram
19© 2008 National Semiconductor Corporation
Dual-Edge Sampling (Interleaving)
20© 2008 National Semiconductor Corporation
Offset Error Difference
• Spurs produced at fS/M
“M” is 1 to one less than the number of converters
Interleaved ADCs with 3 LSB offset spread (8 bit ADC)
21© 2008 National Semiconductor Corporation
Gain Error Difference
• Spurs atfs ± fIN
Interleaved ADCs with 3 LSB Gain Error spread (8bit ADC)
22© 2008 National Semiconductor Corporation
DNL Error Differences
• DNL differences raises the noise floor
Interleaved ADCs with DNL Error differences (8bit ADC)
23© 2008 National Semiconductor Corporation
Temperature Effect and On Command Calibration
ENOB vs. Junction Temperature, 249 MHz Input in ADC08D1000
24© 2008 National Semiconductor Corporation
• Calibrated ADC08D1500• DES (Dual Edge Sampling) Mode
National’s Ultra High Speed ADCs –Interleaved with Calibration
25© 2008 National Semiconductor Corporation
Circuitry for external
clock is much simplified.
Programmable Clock Phase Adjustment
ADC083000 / ADC08D1520/1020The simplified 6GSPS sampling system
26© 2008 National Semiconductor Corporation
ADC1 Input Clock
ADC1 Sample Edges
ADC2 Input Clock
• In SPI mode, the customer can program a delay on the ADC input clock to shift the sample clock phase relative to another ADC08B3000 so that two ADCs may be board-interleaved for a higher system sample rate. Ex. 1.25 GHz input clock: 2.5 GSPS per ADC (Auto DES), and now 5 GSPS through interleaving.
• The phase shift will only be in one direction, eg. increasing delay. The customer should determine which of two discrete ADCs is "ahead" and adjust its phase so that its sample edges are 180º between the other ADC's sample edges, as shown below:
ADC2 Sample Edges
Interleaved samples (non-adjusted)
Interleaved samples (adjusted)
ADC083000 / ADC08D1520/1020Programmable Clock Phase
27© 2008 National Semiconductor Corporation
Main Interleaving Challenges
• Sampling Clock phase adjustment– Normally for 2X interleaving ADC clocks must be time shifted by ½
clock period. But because the ADC083000 is an interleaved architecture, the clock frequency is half the sample rate, 1.5 GHz for 3GSPS. Therefore ADC input clock must be time shifted by ¼ clock period.
• Gain and offset mismatching– Gain & offset of each ADC input stage must be accurately matched.
• Synchronisation of digital outputs– ADC digital outputs must be synchronised for data capture.
28© 2008 National Semiconductor Corporation
Interleaving Challenges
• Sampling Clock phase adjustment
The clock phase can be adjusted manually through the Coarse & Fine registers (Eh and Dh).
Coarse Adjust Magnitude. Each LSB results in approximately 70ps of clock adjust.
Fine Adjust Magnitude. 9-bit, 512 steps gives 110ps adjustment so each LSB results gives approximately 0.2ps of non-linear clock adjust.
See datasheet for more details…
29© 2008 National Semiconductor Corporation
Interleaving Challenges :Gain and Offset Mismatching
• Gain & offset of each ADC input stage must be accurately matched.
• Up to 512 step adjustments in Full Scale Range over a nominal range of 560 mV to 840 mV. The input full-scale voltage or gain of the ADC can be adjusted linearly and monotonically with a 9-bit data value. The adjustment range is ±20% of the nominal 700 mVp-p differential value.
• Separate ±45 mV adjustments in 512 steps of offset adjustment range. The input offset of the ADC can be adjusted linearly and monotonically from a nominal zero offset to 45 mV of offset. Thus, each code step provides 0.176 mV of offset.
30© 2008 National Semiconductor Corporation
• ADC digital outputs must be synchronised for data capture.
• National Giga-sample series ADCs have the capability to precisely reset its sampling clock input to DCLK output relationship as determined by the user-supplied DCLK_RST pulse. This allows multiple ADCs in a system to have their DCLK (and data) outputs transition at the same time with respect to the shared CLK input that they all use for sampling.
Interleaving Challenges :Synchronisation of Digital Outputs
31
The Amplifier Front-End
ADC08DxxxCircuit Design Considerations
32© 2008 National Semiconductor Corporation
DC Coupled DesignSingle Ended Differential Conversion
The Test & Measurement industry requires a DC coupled front-end design.
The easiest approach is to use a differential amplifier with the appropriate gain bandwidth product and the ability to set the common mode output voltage (VCMO) from an external voltage.
LMH6552, LMH6555
33© 2008 National Semiconductor Corporation
More Gain Needed?Adding a Pre-Amplifier to the design
Two Stage Amplifier Input Stage
Wide band differential Op-Amps usually have limited gain, so depending on the application it may be necessary to add a pre-amplifier to the design to meet the necessary gain requirement as shown in this slide.
Fixed Gain
34© 2008 National Semiconductor Corporation
Features• Current Feedback Amplifier• 1.2 GHz bandwidth• 51 dBc THD at 750 MHz• 15 dB noise figure• 13.7 dB fixed gain• DC-Coupled Operation • 3.3V operation• Ideal match for 8-bit ADCs up to 1.5
GSPS, such as the ADC081000/1500 family
Applications• High BW Instrumentation• Differential ADC driver • Single ended to differential converter• Intermediate frequency (IF) amplifier• Communication receivers• Oscilloscope front end
LMH65551.2 GHz Fully Differential Amplifier
35© 2008 National Semiconductor Corporation
• 1.5 GHz SSBW (Av=1, RL=1kΩ, 0.2 Vpp)
• 1.25 GHz LSBW (Av=1, RL=1kΩ, 2Vpp)
• 450 MHz 0.1dB Flatness
• 500Ω load or lighter
• 3850 V/μs Slew Rate
• 10ns settling time to 0.1%
• −90 dB THD @ 20 MHz
• -74 dB THD @ 70 MHz
• 10 dB Noise Figure
• Single 5V, +/-3V or +/-5V operation
• Ideal Driver for 8 to 14 bit High Speed ADCs
• SOIC-8 and LLP-8 Packages
Gain (V/V) SSBW LSBW2 930 MHz 820 MHz4 810 MHz 740 MHz8 590 MHz 590 MHz
LMH6552 (RL=500Ω)
LMH6552 1.5 GHz Fully Differential Amplifier
36© 2008 National Semiconductor Corporation
Target Specs / Feature• RSPECL Output• Prop Delay (≥100 mV OD) 750 ps• Dispersion (10 mV OD) 75ps• Dispersion (100 mV OD) 5ps• Rise and Fall Times 150 ps• Max Toggle Rate 4Gbps• Supply Current ~17.8 mA/ch• Adjustable hysteresis 1 mv to100 mv• Rail-to-Rail Input• Supply Voltage 2.7V to 12V• Extended Temp Range -40ºC to +125ºC • Package 24-LLP
Separate supplies for level shifting applications --->
Ch. A
Ch. B
Trigger Solution : LMH7322 High Speed Comparator w/RSPECL Output
37
The Digital Data Capture (into an FPGA)
ADC08DxxxCircuit Design Considerations
38© 2008 National Semiconductor Corporation
NOTE: Advantages of LVDS…• LVDS allows for faster signals (smaller swing), • Lower EMI and switching noise, • Transmit data further
LVDS Signal Transmission
39© 2008 National Semiconductor Corporation
About Measurement Description in Specification
Sine or Square Wave ClockDefined measured differentiallyDifferential Clock Input Level
OutV=Gndsmaller amplitude
OutV=Vanormal amplitude
Measured differentiallyLVDS Data Output Voltage
LVDS Differential and Single Ended Signal measurements.So for example, 700 mV in differential means 350 mV each side.
40© 2008 National Semiconductor Corporation
ADC08Dxxxx Block Diagram
41© 2008 National Semiconductor Corporation
DDR & SDR
42© 2008 National Semiconductor Corporation
FPGA Internal Clock Manager
Data Capture Implementation Block Diagram
FPGA Data Capture Implementation
43© 2008 National Semiconductor Corporation
ADC08D1020/1520 Block Diagram
1:1 or 1:2 selectable DEMUX FPGA
Provide LVDS test mode
44