2012Annual Report

F R A U N H O F E R - E i N R i c H t U N g F Ü R M O d U l A R E F E s t k ö R p E R - t E c H N O l O g i E N E M F t

Editorial notes

published by:

Fraunhofer EMFT

Hansastrasse 27d

80686 München

Tel.: +49 (0) 89 54759-0

Fax.: +49 (0) 89 54759-550

director of the institution:

Prof. Dr. rer. nat. Christoph

Kutter

Tel.: +49 (0) 89 54759-506

Editors:

Pirjo Larima-Bellinghoven

Simone Brand

Tina Möbius

Articles were written by

Fraunhofer EMFT staff.

Publication of any material is

subject to editorial authori-

zation.

layout/typesetting:

Simone Brand

photography:

BPhoto copyright p. 39 MEV

database

All other photo copyrights

held by Fraunhofer EMFT

and Bernd Müller Fotografie,

Maximilianstrasse 56, 86150

Augsburg.

© Fraunhofer EMFT 2013

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F R A U N H O F E R E M F t

AnnuAl RepoRt 2012

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dear friends and partners of the Fraunhofer Research

institution for Modular solid state technologies EMFt,

dear readers,

A lot happened at the Fraunhofer EMFT last year. I took up my

position as institution director on July 1st. In August, the new

division director Prof. Maurer started setting up the „Circuits

and Systems“ area. In Autumn a strategy process was initiated

to sharpen the institution‘s profile: „Fraunhofer EMFT stands

for cutting-edge applied research into sensors and actuators

for man and the environment.“ Fraunhofer EMFT bases its

research initially on customer needs in the area of sensors and

actuators: The technology decision, whether to fabricate the

sensor in silicon of flexible technology comes second.

The following core competences form the basis of the research

work at Fraunhofer EMFT: silicon technology (individual

processes and integration), flexible electronics, chemical sensor

materials and the ability to create systems. Each of these core

competences in its own right allows new kinds of sensors and

actuators to be created. But the real strength of Fraunhofer

EMFT lies in the interaction between these areas: after all,

innovations often emerge where technologies reach their

borders and begin to cross-fertilize. For example, ultrathin

silicon chips can be integrated in foil to create new lab-on-

chip applications. Integration of chemical sensor dyes with

interdigital capacitors in silicon or polymer technology enables

electrical analysis of the optical signals emitted by the dyes.

It is often no longer sufficient to develop a good component:

the element must be capable of working within the system or

application, too. This is why system expertise and the ability

to integrate technologies and components are becoming

increasingly important to our institution.

The well-established network with universities in Munich

and Regensburg enables Fraunhofer EMFT to supplement its

expertise.

Dear readers, Fraunhofer EMFT is in a state of change. We are

moving towards:

• being more closely geared to applications: research

themes are derived from customer needs

• a clear profile: sensors and actuators for man and the

environment

• further expansion of the core competences: sensor

materials, individual silicon processes and integration,

flexible technologies and the ability to integrate systems.

I hope you enjoy reading our annual report and I would

eagerly look forward to the opportunity to collaborate on

many more joint projects next year.

Yours sincerely,

Prof. Dr. Christoph Kutter

Director of the Fraunhofer Research Institution for Modular Solid

State Technologies EMFT

FoReWoRD

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/ / t A B l E O F c O N t E N t s

tAble oF contents

// Overview 6

Fraunhofer EMFT 7

History 7

Profile 7

Organigram 8

Fraunhofer EMFT - Division directors 9

The institution in figures 10

Advisory Board 11

// Business Areas 12Business areas with examples of projects 13

Sensor Materials 13

Sensors and Actuators 14

Microdosage Systems 16

Flexible Systems 18

Design and Test 20

//core competences 22Overview of core competences 23

Functional Molecules and Surfaces 23

Silicon Processes, Device and 3D Integration 24

Heterointegration and Foil Technologies 25

Systems and Prototypes 27

// Research fields and services 28Fraunhofer EMFT range of services 29

Fraunhofer EMFT range of technologies 30

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// customers an cooperation partners 32Technology networks 33

Industry and project partners 34

European community projects 36

Universities 39

Visitors and delegations 41

Bavarian Innovation Clusters 42

// Highlights 44Special Events 45

Award of honorary doctorate 45

A scientific challenge met with excellence 45

// Events and youth development 46Events and workshops 47

Seminars and training programs 48

Trade fairs 49

Youth development 50

Careers at Fraunhofer EMFT 53

// press and media 54

// Academic puplications and talks 66

// patents 72

// Memberships and activities 74

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1 Fraunhofer EMFT

entrance

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9

FRAunhoFeR eMFt

History

Fraunhofer EMFT originales from the Fraunhofer Institute for

Solid State Technology IFT, which was founded in 1974.

Here, technologies were developed for the manufacture of

semiconductors.

Other areas of activity were sensor technology, communica-

tion technology and microstructure technology.

In 1999 the Fraunhofer IFT was dissolved and split into three

independent sections. The section located in Hansastrasse,

Munich - today‘s Fraunhofer EMFT - initially became part

of the Berlin-based Fraunhofer Institute for Reliability and

Microintegration IZM.

Fraunhofer EMFT was founded on July 1, 2010, as an inde-

pendent institution once again, created from the Fraunhofer

Institute for Reliability and Microintegration IZM, Munich

branch.

Profile

In its research and development work, Fraunhofer EMFT

focuses on sensors and actuators for man and the environ-

ment. Sensors already have a key role to play in our digitized

world and will become increasingly important in the years to

come as a result of the interconnection of devices („Internet

of Things“). People may not actually notice the sensors, but

they will make a significant contribution to improving the

quality of living - whether in health and nutrition, mobility or

material analysis. Fraunhofer EMFT actuators will be used in

micropumps and microvalves in medicine and industry, for

example.

In defining its research fields, Fraunhofer EMFT always

attaches priority to practical application. The institution gets

together with customers to assess areas which are important

for the market and where Fraunhofer EMFT can make a

significant contribution with its expertise. The aim of applied

research is to create value for society and the German econo-

my. This value consists of transferable work results, operatio-

nal components as well as systems and qualifiable prototypes.

Cutting-edge research means occupying a leading position in

global competition. Fraunhofer EMFT is a sought-after guest

on the relevant committees as well as at conventions and

conferences and is proactively involved organizing these.

The results of Fraunhofer EMFT‘s work appear in a wide range

of academic publications and attract a high level of interest in

the world of science.

Fraunhofer EMFT‘s most important asset is its highly-qualified

staff. The institution trains young scientists working on

bachelor‘s, master‘s and doctoral assignments and attaches

great importance to the ongoing professional development of

its regular employees. Due to its long history, the background

and experience of Fraunhofer EMFT staff is very broad,

allowing the employees an excellent knowledge of the world

of microelectronics and microsystem technology. Their high

level of motivation and the satisfaction they derive from their

work results in exceptional commitment and dedication,

ultimately producing good results.

Fraunhofer EMFT stands for appl ied research into sensors and actuators for man and the environment.

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Organigram

F R A U N H O F E R R E s E A R c H i N s t i t U t i O N F O R M O d U l A R s O l i d s tAt E t E c H N O l O g i E s E M F t

director: prof. dr. christoph kutter

1 View of the Fraunhofer

EMFT building

circuits

and

systems

Head:

Prof. Dr. L. Maurer

Nanomaterials,

devices and

silicon processes

Head:

Prof. Dr. I. Eisele

polytronics

and

Multifunctional systems

Head:

Prof. Dr. Dr. h.c. K. Bock

Heterogeneous system

integration

Head:

Dr. P. Ramm

Micromechanics,

Actuators and Fluidics

Head:

Dr. M. Richter

Analysis and test of

integrated systems

Head:

Dr. H. Gieser

wafer

technology

Head:

Dr. A. Klumpp

cMOs

integration

Head:

Dr. L. Nebrich

Multifunctional

technologies

Head:

A. Drost

polytronic

technology

Head:

G. Klink

substrate preparation

and treatment

Head:

C. Landesberger

sensor Materials

Regensburg

Head:

Dr. S.Trupp

Electronics and

Biomedical solutions

Head:

F. Wenninger

Administration

Head:

G. Würtz

pR,

Marketing:

Head:

P. Larima-Bellinghoven

Business

development

Head:

Prof. Dr. P. Kücher

circuit

design

Head:

N.N.

= Department

= Group

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Fraunhofer EMFt - division directors

A defining characteristic of Fraunhofer EMFT is the close collaboration between staff, scientists and management. Professor Kutter

is at the helm of Fraunhofer EMFT. The three division directors are:

division:

Nanomaterials, devices und silizium prozesses

Prof. Dr. Ignaz Eisele

Phone: +49 89 54759-189

division:

polytronics and Multifunctional systems

Prof. Dr.-Ing. Dr. h.c. Karlheinz Bock

Phone: +49 89 54759-506

division:

circuits und systems

Prof. Dr. Linus Maurer

phone: +49 89 54759-138

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Operating budget

The Fraunhofer EMFT operating budget continued to develop

positively last year. It amounted to 10,631,000 euros in 2012.

Industrial contracts generated a total volume of just under

2,000,000 euros. The percentage of earned revenue was

therefore approximately 20%. The planned operating budget

for 2013 is EUR 11,266,000, which will involve a further

increase in the institution‘s industrial earnings.

staff development

Fraunhofer EMFT currently employees a staff of 92. Of these,

68 work in the scientific area and another 24 in the areas

of administration, IT and technology. On average there are

over 35 students and research assistants from a wide range

of institutions working on their doctoral thesis, dissertation

or master‘s assignment at Fraunhofer EMFT at any given time

and who are involved in the various research areas.

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infrastructure

In the Fraunhofer EMFT building the following infrastructure

exists:

Cleanrooms: (640 m2)

according to DIN EN ISO 14644-1, ISO class 5 (previously 100

US FED standard) and 4 (previously 10 US FED standard)

• 200 mm line with complete range of standard silicon

CMOS equipment

• 150 mm line with complete range of standard silicon

MEMS equipment

Laboratories: (1600 m2)

Polytronics, microfluidics, bioanalytics, ATIS, guest companies

Office areas and meeting rooms: (2760 m2)

• Offices (1520 m2)

• 3 seminar rooms (50 m2, 55 m2 und 80 m2)

• 4 meeting rooms (190 m2)

• 1 video conference room for 15 people (50 m2)

The institution in figures

1 High-grade steel

micropump for application

in medical technology and

biotechnology

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Advisory Board

The Advisory Boards are external consult ing bodies attached to the inst i tutes and research inst i tut ions.

They are made up of representat ives from sc ience, bus iness and publ ic l ife. The approximately twelve

members for each inst i tute are appointed by the Fraunhofer Execut ive Board in agreement with the inst i -

tute management.

At least one member of the Execut ive Board attends the annual meet ings. The Advisory Boards advise the

inst i tut ion management on issues of research or ientat ion and structural change.

The members of the Fraunhofer EMFT Advisory Board are as follows:

• Dr. Hans-Jürgen Bigus, Hirschmann Laborgeräte GmbH & Co. KG

• Dr. Reinhard Fojt, KETEK GmbH

• Prof. Dr. phil. Merith Niehuss, Universität der Bundeswehr München

• Prof. Dr. -Ing. habil. Dr. h. c. mult. Ulrich Rohde, Synergy Microwave Europe GmbH & Co. KG

• Dr. Thomas Scheiter, Siemens AG Corporate Technologies

• Prof. Dr. rer. nat. Doris Schmitt-Landsiedel, Technische Universität München

• Dr. Peter Wawer, Infineon Technologies AG

• Dr. Stefan Wimbauer, Bavarian Ministry for Trade, Infrastructure, Transportation and Technology, Munich

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sensor Materials

sensors and Actuators

Microdosage systems

Flexible systems

design and test

1 Sensor glove changes

color as a hazardous

substance warning

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business AReAs With exAMples oF pRojects

Fraunhofer EMFT organizes i ts research and development programs into f ive business areas. These are

descr ibed below and their act iv i t ies presented based on selected pr ior i ty projects .

1

sensor Materials

Sensor materials are developed at Fraunhofer EMFT which in-

dicate the presence of analyte molecules by means of changes

in color or fluorescence. The materials are based on indicator

dyes and are tailored to the application concerned by means

of integration in polymers, foils, structured surfaces, micropar-

ticles or nanoparticles. For example, sensor particles are used

as nanosensors for analytics in cells. They can also be applied

to surfaces by means of coating or printing techniques.

In the area of textiles, nanosensors can be integrated using the

same techniques as those used for processing the pigments

commonly applied in this field such as screen printing. One

example of a textile application is sensor protective clothing:

if there are toxic or corrosive substances in the ambient air, the

clothing warns the wearer by changing color. Sensor materials

based on a color change to show detection of an analyte can

also be integrated in a range of everyday products. Food

monitoring is highly topical in this connection: here, sensor

packaging which changes color in response to spoilage

processes or high levels of contamination in food is both

highly effective and easy to handle. In the area of fluorescence

analytics, Fraunhofer EMFT develops sensor systems and mo-

dules which can be used in air or water analytics - for instance

by means of integration in measuring devices. In one current

project (ZIM KF2833201ZG1 and E830901ZG1), Fraunhofer

EMFT is collaborating with an industry partner (TriOS Mess-

und Datentechnik GmbH, Rastede) on an O2/CO2-measuring

device based on optical sensors for CO2 and O2. This system

will be designed to simultaneously measure O2/CO2 in water

samples on site in real time. It is based on the development

and combination of new fluorescence indicators to measure

the two analytes and their integration in suitable polymers.

The planned application makes high demands of the sensor

system, including fast response, high sensitivity and not least

a high level of stability and resilience to the impact of trans-

portation and varying storage conditions.

project example: „Hexanal sensor“

The sell-by date on packaging only gives the consumer some

idea of the freshness of the food contained in it. But errors

in packaging, disruptions in the refrigeration chain or leaking

packaging can cause foodstuffs to spoil during distribution or

in households.

Very often it is impossible to detect from the outside that the

food has spoiled or has become inedible or even harmful to

health. So to increase consumer safety, clear indicators would

be useful which show the actual quality of the food.

The „Hexanal Sensor“ project at Fraunhofer EMFT is dedicated

to developing intelligent packaging with color indicator

systems which visibly display the freshness of food products.

The initial aim is to demonstrate the general feasibility of such

indicator systems and create a basis for developing others.

The solution principle is based on the measurement of volatile

aldehydes (e.g. hexanal) in the gaseous phase.

The project specifically involves the creation of an indicator

system which can be visually analyzed to detect oxidative

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1 CO2- sensor chip on a

circuit board

quality changes - for example in packaged (and opened)

cooking oils and roasted nuts. The aim will then be to inte-

grate this indicator system in packaging foils or in closure

seals for bottles. The developments are of particular relevance

to manufacturers of products containing oil and fat which

spoil as a result of oxidation (e.g. oil mills, the confectionery

industry, manufacturers of baked goods). Additionally, they

are of great interest to end consumers.

The insights gained from this project will also be used as a ba-

sis on which to develop indicator systems for other foodstuffs

(e.g. meat, fish, ready-made products) and will be fed into the

area of sensor technology.

This project is run jointly with Fraunhofer IVV and is sponsored

as internal research geared towards small and medium-sized

companies (project no. 825 352) Concrete project outcomes

are expected in June 2014.

sensors and Actuators

The Sensors and Actuators business area includes the areas of

„Services“ and „Process and component development“.

Services provided include process development and small

series production of silicon-based sensors as well as the

qualification of process media. The aim is to establish close

collaboration with companies and ultimately benefit cus-

tomers: their own staff can make use of Fraunhofer EMFT‘s

cleanroom infrastructure as well as drawing on the expertise

of experienced Fraunhofer EMFT staff.

Small series production at Fraunhofer EMFT makes sense

wherever small volumes are not available on the global

market. A 200 mm CMOS line is available for this purpose,

supplemented by a 150 mm backend line.

Close collaboration also allows typical customer problems

to be solved such as increasing yield and throughput in

small series production. It is possible to jointly analyze the

impact of critical factors on the application so as to enhance

performance. In terms of product development, Fraunhofer

EMFT is currently involved in creating detectors for material

analysis by means of EDX and XRF analysis (Si-drift detector).

Another example is that of single X-ray photon detectors for

medical technology applications which take the form of silicon

photomultipliers and are based on the avalanche diode prin-

ciple. The spectral range can be covered by the properties of

the pure silicon material. For example, Fraunhofer researchers

are developing silicon photomultipliers (SiPM) in 200 mm

technology in collaboration with Ketek GmbH. Initial results

have been highly promising. Ketek GmbH is now seeking

17

to develop the jointly created SiPM to product maturity.

Fraunhofer EMFT is also evaluating use of the components in

other applications such as detection of weak light signals in

the field of analytics.

In the area of process media qualification, customers have the

opportunity to test silicon-based primary substances (gaseous)

or etching and cleaning gases on production-type equipment.

This makes it possible to analyze the purity of supplied

material in the target processes and potentially discover any

extraneous matter which may be present. Any undesirable

impact on production equipment can be tested and proposals

developed for the application. The support from experienced

Fraunhofer EMFT personnel is a key benefit here.

In developing processes and components, the focus is on

components which are distinct from those generally available

on the market due to their special parameters: through-flow

sensors for liquids, low-noise single transistors such as JFETs

and buried-channel HRFETs, gas concentrators and electro-

chemical sensors, just to mention a few. In combination with

device and process simulation and using special processes in

the front-end area of the technology line, concepts for novel

components with improved properties are created which are

adapted to industry specification profiles

1

project example: „components for high-frequency

applications“

The fundamental idea of the MST Bayern project „HRFET - low-

noise field-effect transistors with high-frequency capability“ is to

develop FET transistors which can be used in the GHz range and

are extremely low-noise.

Existing transistor concepts are not capable of meeting both

these specifications. The project is pursuing two concepts: Firstly,

the refinement of so-called JFETs (Junction FETs) - here the

HESDEK project already achieved excellent results in the MHz

frequency range; secondly a new type of CMOS concept with

buried-channel MOS transistors for applications running into the

GHz range.

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Microdosage systems

The handling and dosage of tiny quantities of liquids or gases

is crucial to a wide array of applications nowadays.

Fraunhofer EMFT offers its customers individually tailored

microdosage solutions, giving rise to new products and

applications in the following areas:

• Lubrication dosage

• Laboratory technology

• Medical technology

• Fuel cells

• Micro-cooling systems

• Scent dosage systems

• Analysis systems

For example, microlubrication systems can be used to apply

tiny quantities of lubrication oil (just 5 nanoliters per second)

to a bearing. This can save up to 98% of lubrication oil as

compared to conventional methods of lubrication. In labora-

tory technology, silicon micropumps can replace heavy ceramic

pistons in air displacement pipettes or microtiter plate robots,

making the systems lighter and easier to handle.

The field of medical technology offers a wide range of applica-

tions. One particular area here is medication dosage by means

of externally wearable or implantable systems. The latter can

be used in pain therapy (intrathecal or peridural), for treating

tinnitus (Lidocaine in the middle ear), in hormone therapy

(for treating fertility disorders), tumor therapy (direct dosage

of highly concentrated cytostatics into the tumor tissue) and

in diabetes therapy. There is particularly promising market

potential in the context of insulin treatment for diabetes

patients. All these applications require exact dosage of the

very tiniest amounts. At the same time, the dosage compo-

nents must be disposable and therefore very low-priced.

This is achieved by making microdosage systems out of plastic

or metal. Micropumps can be of valuable assistance in treating

chronic wounds: one example here is the use of innovative

and miniaturized plasters in vacuum therapy. Extremely

miniaturized dosage systems made of silicon are ideal for

implantable applications. For example, micropumps implanted

behind the eye could be used to reduce eye pressure and treat

glaucoma. The same method could help those suffering from

phthisis by preventing them from going blind. Somewhat

larger micropumps made of high-grade steel might replace

the sphincter muscle in the bowel or bladder by means of a

so-called cuff where a saline solution is pumped in (to close it)

or out (to open it).

Analysis systems (e.g. water analysis) use microdosage to

ensure that the analysis sensor is fed with precisely defined

media free of bubbles and particles, enabling exact measure-

ments to be made.

Microdosage technology is an innovative, future-oriented area

but it still poses a number of challenges. These include the

management of bubbles, particles and back pressure, monito-

ring the dosage of minute quantities and chemical resistance.

Fraunhofer EMFT works on all these issues so as to be able to

develop robust products for its customers.

1 Microdosage system

for microlubrication of

precision bearings in high-

performance spindles

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1

Project example: „Piezolub: Self-sufficient,

piezo-powered microdosage component for

lubricants“

Precise lubricant dosage is crucial to ensure smooth-

running production - especially in the case of fully auto-

mated processes: it guarantees a long equipment service

life, prevents premature wear and tear and extends the

maintenance intervals required.

Scientists at Fraunhofer EMFT have developed a new type

of micro-quantity lubricant system in cooperation with Paul

Müller Industrie GmbH & Co KG (GMN). It enables controlled

release of minute quantities of lubricant into precision ball

bearings in high-power spindles. The self-contained dosage

systems with integrated oil reservoir for an anticipated opera-

tional service life of approx. 20,000 hours are designed to be

mounted decentrally on cutter spindles.

Piezoelectrically powered silicon micromembrane pumps are

at the heart of the system, developed at Fraunhofer EMFT and

with a chip size of just 7 x 7 mm2. A new method of dosage

monitoring was also integrated in order to ensure reproducible

oil transport. This is based on a sensor principle for minute

conveyance volumes, likewise developed at Fraunhofer EMFT:

capacitive runtime monitoring of phase boundaries between

oil and air. Another particular area of focus was that of

solutions to avoid free-flow.

GMN supports development work by means of extensive tes-

ting on real machine tool spindles so as to assess the optimum

oil quantity for stable, efficient bearing lubrication. The newly

developed solution based on classic oil/air lubrication offers

several advantages as compared to commercially available

lubricant systems. For example, with dosage units of far less

than 25 μg per second in some cases, only a fraction of the

lubricant is used. In addition to making economic sense,

there is also an ecological bonus. It is also worth mentioning

the health benefit here: after all, it leads to a reduction in

oil contamination of the air in production halls. Less oil in

the bearing also means a lower coefficient of friction, which

in turn increases the efficiency of high-speed spindles.

1

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The Bavarian Polytronic Demonstration Center (BDP) was

established in 2002 for this business unit and in recent years

it has been fitted with state-of-the-art, production-related

equipment for the microfabrication of product demonstrators

on foils. For research projects and development work con-

tracted by industry, the facility now has machines which allow

modular processing of foil sheets or rolls with a width of

210 mm. A microsystems engineering line is also available

which can produce microsystems on a substrate size of

Ø150 mm in a cleanroom. This is used as a standard method

for processing silicon wafers on a service basis, but it is also

well suited to effective prototyping of foil processes under

ideal environmental conditions. Our development work in

the area of flexible systems currently focuses on functional

integration by combining functional materials with related

application-oriented processing. Here the spectrum of integ-

ration options ranges from large-area, flexible wiring systems

based on foil stacks with three-dimensional assembly and

connection structures as well as foil via technologies and the

assembly of optical and sensor components in foil technology

to produce organic printed circuits and systems. In terms of

product development, plastic foils offer a number of benefits

as a large-format substrate material. Firstly, they provide a

large-area, low-cost substrate that enables the creation of fle-

xible, bendable or rollable systems. But the interim stage of a

foil process can also add crucial improvements to non-flexible

applications, for example by thinning power semiconductors

and sensors or by transfer to the heat sink or device surface

by means of foil handling. Foils can also be processed as a

continuous substrate in the form of roll material. This type of

roll-to-roll technique enables highly efficient manufacturing

methods, providing high production volumes especially in

the area of low-cost electronics. A now classic example of

1 Foil-based flexible sen-

sor system used to monitor

various air parameters

Flexible systems

The area of foil systems, or FOLAE (flexible organic and large-

area electronics) has advanced continuously in recent years.

At Fraunhofer EMFT today, various products are developed

and in some cases produced, including sensors, solar cells,

integrated circuits, displays and entire flexible systems. This

has primarily been made possible by technological advan-

cements in the field of functional materials, especially those

based on organic substances (smart materials).

The conductive, semi-conductive, sensoric or luminous pro-

perties of these allow direct integration of the most diverse

components and functions on a wide variety of surfaces by

means of layering techniques. A key focus here is on the

extended pressure technologies and additive coating and

structuring technologies used to create flexible electronic sys-

tems - generally based on the familiar areas of use of printed

media. These techniques enable entirely new functionalities.

Classic electronics can also be integrated on flexible substrates

such as foils or textiles, for example high-performance com-

ponents based on existing wafer technologies such as silicon

CMOS or MEMS.

The relevance of this type of application is obvious: in many

microelectronic products, the trend nowadays is towards

increasingly thin semiconductor elements so as to enhance

performance or facilitate handling. Examples include silicon

chips for power electronics, solar cells, 3D-integrated chip

stacks, micromechanical sensors (MEMS) and also very thin

silicon components as have been used for many years in smart

labels for logistics applications and identification systems. Flat

and flexible multifunctional electronic systems on foil substra-

tes open up a whole new range of potential applications.

21

1

this kind of application is the manufacture of RFID systems in

which aerial coils are printed and fitted with transponder ICs

using a through-feed method.

Roll-to-roll processes have paved the way for new applications

in other areas, too, ranging from electronic paper and rollable

displays to intelligent sensor floors and disposable sensors.

project example: „polyOpto - multifunctional analysis

system for point-of-care applications“

On-site diagnostics in medical technology requires small,

portable and automated devices which can be manufactured

economically and in large numbers.

The project „PolyOpto“ saw Fraunhofer EMFT researchers

developing this kind of multifunctional analysis system,

incorporating electrical, optical and fluidic functionalities on

a plastic foil. Polymer foils as a substrate in combination with

roll-to-roll production techniques ensure material costs are

kept very low.

The individual components for an optical sensor system - light

source, photo transistor and fluid channel - are produced on

foil using layering techniques. The light source used here is an

electroluminescence component. An organic transistor based

on semiconductive TIPS pentacene serves as a light-sensitive

detector. The light source and the detector are produced on

the same foil, so no additional assembly stages are required.

In order to achieve the three-dimensional arrangement of the

sensor system, the foil is folded around a second foil with

fluidic contours. This creates a closed system in which the light

source and phototransistor are placed opposite each other and

are optically linked.

In this way, changes in the optical absorption between the

components can be electrically detected and measured.

Sensor layers can be inserted in the absorption path for this

purpose. In this particular case, laser processing of foils was

used to create a fluid channel enabling the change in optical

absorption to be detected in fluids. Researchers have refined

the system by adding a gas analysis module. For this purpose,

a chromatic gas sensor material was integrated on foil in mo-

dular form together with a pneumatic channel arranged in the

same way made of circular EL lighting and a coaxial pentacene

phototransistor. This allows the concentration of gases to be

determined by reading out color changes in the chromophore

based on the EL lighting and the pentacene phototransistor.

This optoelectronic system largely dispenses with any assembly

of individual components and can be produced by means of

one-sided processing. As mentioned above, roll-to-roll pro-

duction is essentially possible too, increasing manufacturing

efficiency so as to be able to handle large volumes. This type

of low-cost sensor system for one-off use is also of interest

to other areas in addition to medical technology, including

environmental analytics, for example.

This research is funded by the German Federal Ministry of

Education and Research (BMBF) and VDI/VDE Innovation +

Technik GmbH, Project PolyOpto FKZ 16SV3870

22

/ / B U s i N E s s A R E A s

1 CC-TLP electrode via

wafer (raised)

design and test

With its business unit „Design and Test“, Fraunhofer EMFT

offers its customers individually tailored solutions, ranging

from system design through to reliability assessment.

The services offered are as follows:

• Design of complete systems as devices, subsystems and

integrated components

• Multiparametric characterization of systems and

components

• Reliability prognoses with regard to the planned

application

Thereby commercially available technologies are used, as well

as technologies produced by Fraunhofer EMFT and adapted to

customers‘ specific needs. The leitmotif in this business area is

the duality of simulation and experiment.

The current focus area in design development is in the field of

microprocessor-controlled systems which use sensors to

capture, process, store specific parameters and/or ultimately

trigger actuators. One example of this is the microfluidic

systems including micropumps and microvalves which are

controlled by means of sensor measurement technology.

The design of integrated components, cells and circuits with

low integration density is currently being developed: here

Fraunhofer EMFT is focusing on the areas of analog and high

frequency. Using multiparametric characterization, it is

possible to simulate physical input variables such as voltage,

current, temperature, light, moisture, gases etc. under

laboratory conditions and compare the reaction of the

component to the variable on its own as well as collectively.

The results provide a basis for assessing measurement

precision and reproducibility. By means of appropriate load

tests which address success-related error mechanisms, it is

also possible to apply these methods to determine expected

reliability and lifetime. The range of services finally includes

systematic analysis of the causes of complex errors and relia-

bility problems in electronic components and systems as well

as their reproduction under laboratory conditions, including

identification of falsifications.

As mentioned above, Fraunhofer EMFT has its own in-house

developments which usefully complement commercially

available equipment.

One example of such a specialized system is the M-CDM ESD

tester. It is now also used directly by industry with specially ad-

apted software. The M-CDM ESD extension CC-TLP Capacitive

Coupled Transmission Line Pulsing and a bending machine for

flexible substrates have similar potential.

23

11

project example: „i-tex“

The FP7 project i-Tex „Intelligent and luminous textiles“

(www.i-tex.nl) researches and develops energy-efficient,

large-area lighting systems based on inorganic light-emitting

diodes (LED). As part of this project, Fraunhofer EMFT Working

Group ATIS runs the work package „Characterization and

Reliability“.

Since the lighting systems are initially to be used in architec-

ture and high-quality tents, there is particular focus on relia-

bility as well as the functional, technical aspects and aesthetic

properties of the lighting.

In addition to visual properties, investigation is carried out

into the conductivity of the electrical connections, insulation

between the conductors and the impact of temperature and

moisture, as well as tensile and flexural stress.

Particular importance is attached to electrostatic discharge

(ESD): after all, without the appropriate protective measures,

the load-sensitive LEDs would be exposed to dangerously high

levels of static voltage of many kilovolts even while being

woven into the textiles and during roll-to-roll coating.

As part of its i-Tex activities, the working group develops

methods and test devices for multiparametric electrical,

thermal and optical characterization and flexural stress. It also

produces computer-controlled, analyzable sensors for room

and lighting parameters as well as power sources to supply

test vehicles and demonstrators.

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1 Smart pigments

Functional Molecules

and surfaces

silicon processes, device

and 3d integration

Heterointegration and

Foil technologies

systems und

prototypes

sen

sor

Mat

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sen

sors

an

d

Act

uat

ors

Mic

rod

osa

ge

syst

ems

Flex

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des

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an

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25

Functional Molecules and surfaces

Fraunhofer EMFT possesses outstanding expertise in the selec-

tive synthesis of indicator dyes, in handling polymer systems

and in the creation of functional polymers and surfaces by

means of chemical modifications.

The knowhow in this area has produced a wide range of

application-related demonstrators such as optical sensor foils.

The production of responsive optical materials starts with

the selective synthesis of suitable indicator molecules for

fluorescence or absorption tests. The applications are stably

immobilized on surfaces so as to be able to adapt the indica-

tors to them.

This is carried out by embedding them in polymers (smart

dyes) or by bonding them to the surfaces of microparticles or

nanoparticles (smart pigments). Where such sensor particles

are synthetically structured, core-shell systems can be used to

combine multiple functions and generate properties such as

hydrophilicity, hydrophobia or polarity.

Optical sensor foils

Sensor foils can be used in a variety of different ways, in the

form of test strips in medical diagnostics, biotechnology,

environmental analytics and process characterization, for

example. They are likewise used in product authentication

by installing fluorescent indicators.

Sensor materials also have enormous potential in the textile

industry. Foil strips for integration in textiles (e.g. protective

oveRvieW oF coRe coMpetences

Fraunhofer inst i tutes offer se lected core competences a imed at tackl ing future technological chal lenges

fac ing society, bus iness and industry. Fraunhofer EMFT groups i ts areas of research and development ex -

pert ise into four core competence areas. These are descr ibed below.

1

gloves, laboratory clothing or protective suits) can change

color to indicate toxic substances in the environment or con-

tamination by aggressive chemicals.

In the area of food monitoring, sensor foils integrated in

packaging can determine and display the freshness of the con-

tents. This makes it possible to reliably identify the quality and

freshness of food (such as meat and fish products) - a simple

and effective method from which all those involved can bene-

fit - from the retail chain through to the end consumer.

Surfaces on vehicles and machines can also be coated with

sensor materials, allowing 3D imaging of physical parameters

such as pressure and temperature.

In addition to indicator modules, Fraunhofer EMFT also deve-

lops a range of optical measurement modules (e.g. incident

light module, fluorescence module) and adapts them to the

various properties of the sensor materials. In addition to detec-

ting optical signals, these modules also enable measuring data

to be stored and transmitted.

26

/ / c O R E c O M p E t E N c E s

1 Photodetector system

for sensoric lab-on-chip

applications integrated

by means of layering

technology

silicon processes, device and 3d integration

In addition to CMOS technology, this core competence breaks

down into the following areas of work:

• 3D integration / MEMS technology

• Thin wafer technology

• Epitaxy

A key feature of 3D integration by means of through-platings

through the silicon of a circuit (through silicon vias, TSV) is the

combination of tungsten vias with the structuring of sub-

systems based on intermetallic connections made of copper

and tin. The various electrical circuits are generally produced,

tested and supplied externally at wafer level, independently

of one another. At Fraunhofer EMFT they are then vertically

integrated by means of standard CMOS-compatible slice pro-

duction processes in a 3D subsystem (wafer level 3D system

integration). The flexibility of the technologies allows solutions

to be created which are specifically tailored to customer needs.

The following process modules are available:

• Structuring of silicon by means of STS TS Bosch etching

process

• Electrical through-plating based on tungsten CVD

• Low temperature processes on thinned wafers

• Solid liquid interdiffusion of Cu/Sn to assemble subsys-

tems (SLID bond)

MEMS technology is based on subsequent process modules

for the removal of oxides without adhesion of free-moving

MEMS structures.

• VS-RS proximity lithography (150, 200 mm)

• Wafer fusion bond (SFB)

• Electroplating for copper and tin (100, 150, 200 mm)

• Wet chemical Si structuring with KOH (150 mm)

• Release etching with HF steam (150 mm)

The combination of special processes offers an extensive

range of technological options - from flexible solutions

through to small wafer quantities. Another particular fea-

ture is the process sequence to SFB from structured silicon

wafers, allowing for complex MEMS components.

Technologies for the production of thin wafers are directly

linked to 3D integration. Here Fraunhofer EMFT is able to

supply any type of thin device at wafer level, drawing on

years of experience and expertise (also documented in the

relevant patents). Fraunhofer EMFT is excellently equipped to

carry out the relatively elaborate process sequence of thinning

technology: it has two grinders for fast material removal, a

spin etcher for wet chemical removal of strains, two systems

for polishing processes (CMP; chemical mechanical polishing)

as well as optical and capacitive thickness measurement to

monitor thinning results. Wafer cleaners are available for

cleaning purposes for use in follow-up processes.

The selection of processes for wafer thinning is based on

insights gained from material analytics and the flexure and

fracture response of thinned semiconductor substrates,

as developed at Fraunhofer EMFT over many years.

Fraunhofer EMFT offers the patented „dicing by

thinning“ method as a chip separation technique for

very thin semiconductor wafers: this allows efficient

manufacture of individual ultrathin chips with optimum

27

flexural strength. These techniques permit the production

of silicon chips with a thickness of 10 μm - 30 μm.

The required distribution of the wafers in chips is carried

out by means of dry etching systems which use the Bosch

process for high-rate silicon etching.

Other focus areas are silicon epitaxy for high-impedance,

intrinsic layers and SiGe epitaxy for selectively strained

layers or sacrificial layers. Combining Si and SiGe epitaxy

it is possible to make new components for microsystems

engineering such as NEMS (Nano Electro Mechanical Systems

with nanogaps). A low-temperature epitaxy system for

silicon and SiGe is currently being established as a consistent

refinement of the core competence. Depositions are to be

carried out at temperatures as low as - 450 °C, thereby

allowing further handling of ready-processed CMOS circuits.

Heterointegration and Foil technologies

With its laboratory facilities and technological experience in

the area of polytronic technologies - especially roll-to-roll ma-

nufacturing technology for foil systems - Fraunhofer EMFT has

at its disposal a unique technology platform for the develop-

ment of multifunctional electronic systems. One area of focus

here is heterointegration: the merging of distinct technological

worlds paves the way for new, effective solutions to produce

components and systems and to integrate systems in flexible

substrates. Fraunhofer EMFT combines developed print tech-

nologies with technologies and processes from various con-

ventional technological fields (e.g. silicon, MEMS or circuit

board technology). These technologies can be diversified and

supplemented as needed. What is more, the interfaces bet-

ween the technologies can be adapted to the application in

question. The processes can also be transferred to large-area

and large-volume production procedures for system integ-

ration and for product manufacture on flexible substrates.

Mobile electrostatic carrier

With its patented concept of the mobile electrostatic carrier,

Fraunhofer EMFT offers a technical solution which enables

simple and secure handling of very thin semiconductor wafers.

These so-called e-carriers draw on electrostatic forces to rever-

sibly fix a fragile circuit substrate. The carrier itself consists of

a silicon wafer of which the electrode surfaces on the front

can be electrically charged and discharged by means of

through silicon via (TSV) technology using the contact surfaces

on the back. In 2011 these carriers with bipolar electrode con-

figuration were also applied to silicon wafers with a diameter

of 200 mm for the first time.

1

28

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Multilayer and through-plating processes

Fraunhofer EMFT has many years of experience in the produc-

tion of high-density wiring systems on foils with conductor

path grids of 30 µm and less. These enable direct chip integra-

tion. However, several conduct path systems usually have to be

applied to achieve an efficient layout and increased packaging

densities. These are obtained either by means of a multilayer

structure on one substrate side or by using the back of the foil

for double-sided wiring for the latter. A process technique has

been developed at Fraunhofer EMFT which allows continuous

manufacture using the roll-to-roll method. Here a via bore is

carried out using a combination of laser processing and plas-

ma etching. Other key stages here are electroplating processes

to create a number of copper conductor paths several µm

thick as well as wall metallization of the through-platings.

Organic electronics

Organic semiconductors are regarded as the material of

the future for the production of electronics with additional

function since they can be handled using efficient plastics

engineering processes. Over a period of more than ten years,

Fraunhofer EMFT has acquired broad expertise in roll-to-roll

manufacturing - for example of contactless smart sensor

applications or complementary organic electronics applied

directly to foil substrates.

The institution‘s extensive expertise includes specially deve-

loped process stages used to advance the miniaturization of

organic components in the µm and sub-µm range; for ex-

ample, Fraunhofer EMFT is involved with transistors in this

area. For this purpose, novel structuring techniques such as

nanoimprinting and microcontact printing have been deve-

loped, as well as processes for the deposition of ultrathin

polymer dielectric layers on roll substrates.

When scaling transistor geometry down to smaller dimensions,

particular importance is attached to the dielectric medium for

gate insulation. In view of the increasingly thin layers, error-

free electrical insulation and a high voltage rating has to be

ensured. At Fraunhofer EMFT it is already possible to produce

layers with a thickness of just 200 nm and an extremely high

level of dielectric strength. Increasing miniaturization is a key

requirement in order to further raise the switching frequencies

of organic transistors, for example, which are currently at

100 kHz.

These issues were investigated as part of the EU-sponsored

projects INTERFLEX (ICT 247710), COSMIC (ICT 247681) and

POLARIC (ICT 247978).

1 „TUDOS“ microdosage

system for dosage of cytos-

tatics in tumor therapy

29

systems and prototypes

This core competence includes the subareas of system

development as well as the analysis and testing of systems.

Development expertise includes hardware and software,

electronics, mechanics, optics and fluidics with micropumps

and microvalves. It is based on the longstanding experience

of Fraunhofer EMFT staff in the development of complex

systems. Services provided by Fraunhofer EMFT in the field of

system development range from the initial concept through

to feasibility demonstrators and prototypes, according to

needs. Both microcontrollers and PCs are used for control

purposes.

In the area of analysis and testing, Fraunhofer EMFT has a

wealth of experience in investigating the causes of complex

errors and reliability problems in electronic components. The

institution has developed solutions for ESD and other reliability

tests for over 20 years, either under contract to customers or

in the context of joint projects.

Fraunhofer EMFT experts are able to support customers with

special methods of analysis, specialized equipment and ser-

vices to identify error causes and to harden technologies. The

expertise portfolio also includes multiparametric characteri-

zation on the wafer or in the system. Among other things,

high current pulses are generated with ps rise times and

measured with a single-shot bandwidth of up to 50 GHz.

The main application of this technology is the development

of high-performance ESD protection concepts based on

integrated, discreet protective elements. These devices can

also be used to determine system responses directly in time

domain to individual events which are difficult to reproduce.

CW high-frequency measuring technology can penetrate the

lower mm wave range with up to 110 GHz and is supple-

mented with field and circuit simulations using Agilent ADS.

Finding the causes of complex errors and reliability problems

in electronic components requires many years of experience

with the various development and manufacturing processes

throughout the entire supply chain as well as the stress

profiles occurring in the application.

The expertise of Fraunhofer EMFT staff also provides a

valuable basis for successful robustness validation as has

been established in automotive electronics.

1

30

/ / R E s E A R c H F i E l d s A N d s E R V i c E s

1 Chips on wafer connec-

ted by means of flip chips

2 Fraunhofer scientist in

the laboratory at the FCB3

bonder

1

31

FRAunhoFeR eMFt RAnge oF seRvices

studies

• Technology analyses

• Feasibility studies

• Assessment in the case of damage claims

seminars and training programs

• Orientation talks

• Customer-specific workshops

technology concepts and development

• Industrial contract research and development

• Customer-specific adaptations

• Prototype development through to small series

Modeling and simulation

• Manufacturing processes

• Overall process

• System response

Analysis and testing

• Problem cause and risk analysis

• Robustness and reliability

• Electrical and physical characterization and load

(e.g. ESD)

• Development of ESD protection structures and concepts

R&d for publicly funded projects

• Joint projects funded publicly or by industry, e.g. BMBF,

German federal states or the EU

• Coordination of industrial project consortia

• Consultancy for national and EU research applications

start-ups and joint ventures

• Creation of a new company through to

commercialization of products and systems

• Participation of industrial partners via joint ventures

Microelectronics and microsystems engineering are key innovation drivers in virtually all product areas and sectors of the economy.

This is why the areas of application at Fraunhofer EMFT are diverse, ranging from mechanical engineering, automotive electronics,

mobile phones and consumer electronics to medical technology and chemical process engineering. Benefits to companies in col-

laborating with Fraunhofer EMFT include the capacity to explore new types of functions and areas of applications, increased mini-

aturization, enhanced energy efficiency, low production costs and a high degree of reliability. Fraunhofer EMFT supports its clients

throughout the entire development process - from the initial idea right through to implementation. The range of services the ins-

titution offers its customers and partners includes the following:

2

32

/ / R E s E A R c H F i E l d s A N d s E R V i c E s

Cutt ing-edge infrastructure, a broad range of technologies and wel l -developed network of partners in

industry as wel l as among research inst i tutes (univers i t ies ) and publ ic author i t ies make Fraunhofer EMFT

an attract ive partner in research and development, of interest to smal l and medium-s ized companies as

wel l as larger-scale industr ia l enterpr ises. Market ing the results of research is general ly the responsibi l i ty

of the corporate partner. S ince 2007, Fraunhofer EMFT has a lso offered high-tech companies the oppor-

tunity to hire and ut i l ize i ts h igh-qual i ty fac i l i t ies (such as c leanrooms, laborator ies, workshops and

equipment) . Several companies have entered into strategic cooperat ion with Fraunhofer EMFT - inc luding

Siemens AG, Ketek GmbH, Panasonic, Süss MicroTec GmbH, Thin Mater ia ls and TÜV Süd. Framework con -

t racts are being prepared with a number of others companies. Here is a se lect ion of the technological

fac i l i t ies avai lable at Fraunhofer EMFT:

200 mm cMOs technology

• Wet chemical cleaning and etching processes

• Photolithography

• Epitaxy (Si, SiGe)

• Ion implantation and annealing

• Dielectric layers (thermic oxidation, LPCVD deposition of

SiO2 and Si3N4, PECVD of SiO2 and Si3N4)

• Highly conductive layers (Al/Si, Ti, W, doped poly-Si)

• Plasma etching processes (Si, SiO2, Si3N4, Al, W)

• Electroplating (Cu, Sn)

200 mm lithography cluster

• Proximity exposure

• Double-sided exposure

• Contact exposure

• Electron ray exposure

• Ion ray exposure

• i-line stepper

• Nanoimprint

1 Fraunhofer EMFT

scientist at simulation

system

FRAunhoFeR eMFt RAnge oF technologies

si-MEMs technology

• Cleanroom technology for 150mm wafers (silicon,

ceramics, glass)

• Metal coating (Cu, Ti, TiW, Pt, Au, Ni)

• Dielectric layers (SiO2, Si3N4, SiC, PI)

• Wafer bonding, bonding techniques by means of

adhesion

• Structuring with mask aligner 2 μm

Analytics and material characterization

• Atomic force microscope (AFM): measurements of surface

roughness and step measurements up to max. 6 μm

• In-line REM (Schottky emitter) and focused ion beam

(Ga-FIB) with EDX and gas injection system (GIS)

• Spectral ellipsometer: measurement of thin layers and

transparent materials

• Spectrometer: measurement of layer thickness of silicon

(thick layers) and infrared permeable layers

• Target grinding device for sample preparation (grinding

accuracy: ±2 μm)

33

Analysis and testing

• Semi-automatic wafer prober up to 300 mm using

thermoprint (-55°C to +300°C) and laser semiconductor

parameter analyzers

• Network analyzers MHz to 110 GHz and Simulator

Agilent ADS

• Generation and measurement of high-current pulses in

the ps and ns range

• Electrostatic discharge characterization and load (CDM,

HBM, TLP, VF-TLP, CC-TLP)

• 160 cc climate chamber

• Measuring station for biochemical/chemical sensors:

gases and liquids

• Electrochemical impedance spectroscopy

• Environmental test chamber 100 cc - moisture and gases

• Oscilloscope

substrate processing

• Wafer grinding

• Spin-etching

• Chemo-mechanical polishing (CMP)

• Wafer cleaning

• Contactless wafer thickness measurement

• Flexural and breakage test devices for thin substrates and

chips

11

• X-ray diffractometry (XRD): measurement of SiGe content

• CVD epitaxy system: quality control of ultrapure gases

• Plasma-supported etching and deposition systems to test

gas compounds

• Wafer prober for electrical characterization

Application of large-area electronics and flexible subst-

rates to foil sheets and using the roll-to-roll method

• Hot roll laminator for double-sided lamination

• In-line coating system for liquid coatings such as photo-

resist, dielectrics and passivation

• Sputter system for double-sided metallization of chrome

and copper

• UV lithography with high resolution (5 – 15 µm structure

width)

• Wet-chemical etching techniques for structuring metals

• Screen printing on foil sheets

• Screen printing using the roll-to-roll method

• Galvanic deposit of copper on premetallized foils

• Laser processing for cutting, marking and drilling various

materials

• Plasma process for surface conditioning and reactive

etching of polymers with nitrogen, oxygen and CF4

• Foil mounting and bonding technology

34

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/ / c U s t O M E R s A N c O O p E R A t i O N p A R t N E R s

1

1 Fraunhofer scientist

holding glass wafer

2 MOTT logo

35

-

technology netWoRks

In order to enable eff ic ient and effect ive col laborat ion with industry and develop product ideas into con-

crete appl icat ions more swift ly , Fraunhofer EMFT has establ ished three technology networks for specif ic

themes and research areas. These are a imed at longstanding customers and development partners as wel l

as new customers who wish to draw on expert support to implement their innovat ive product ideas.

Multifunctional On-top technologies (MOtt)

The development center for multifunctional on-top technolo-

gies (MOTT) for standard silicon and CMOS was founded in

2009. Building on the results of previous research into CMOS

circuits and 3D-integration, the Munich site offers a techno-

logy platform for microsystems and nanosystems engineering

which is designed to enable industry to carry out rapid system

development closely geared towards end products.

The platform supports modular integration of new functions

and components in existing silicon standard technologies, re-

sulting in cost-effective solutions even for small and medium-

sized companies.

center for Microsystem integration Munich (cMM)

Together with leading Bavarian companies, Fraunhofer EMFT

initiated the founding of the Center for Microsystem Inte-

gration Munich (CMM) in 2010.

Pooling of the extensive expertise of prestigious partners in

the field of technology and product development makes the

CMM a high-performance, efficient technology network in

the field of microsystems engineering. The CMM acts as the

nucleus for a microsystems engineering center and is looking

forward to further expansion as it is joined by further experts.

Bavarian polytronic demonstration center (Bdp)

Providing a networked environment geared towards human

needs (Ambient Assisted Living, AAL) requires cost-effective,

multifunctional, ubiquitous systems. In order to establish the

infrastructures needed for this purpose, electronic systems

have to be produced economically in large volumes on large-

area substrates.

The Bavarian Polytronic Demonstration Center is a technology

cluster which enables development of the necessary produc-

tion processes, including low-cost microsystems.

A large number of coating and structuring processes for

foils are developed in collaboration with industry focusing

on research projects and development activities for flexible,

organic and large-area electronics (FOLAE). The equipment

used is consistently designed to process rolls of foil.

Current focus areas are functional integration via active orga-

nic materials, the assembly of sensors in polymer technology

and the creation of large-area, flexible wiring systems.

2

36

inDustRy AnD pRoject pARtneRs

The success of Fraunhofer EMFT is founded upon strong industry and project partners and an above-

average level of customer sat isfact ion.*

/ / c U s t O M E R s A N d c O O p E R A t i O N p A R t N E R s

1 Fraunhofer EMFT

scientist at the wafer pro-

ber measuring station

37

1

* This double page shows the logos of some of our project partners. If you are a customer and you do not see your logo here but would like to be

included in the next annual report, please let us know!

38

euRopeAn coMMunity pRojects

i-Tex - ICT 288262

The FP7 project i-Tex - „Intelligent and luminous textiles“

(www.i-tex.nl) - researches and develops energy-efficient,

large-area lighting systems based on inorganic light-emitting

diodes (LED). Coated textiles with reliable integrated electronics

including LED, sensors and drivers open up a whole new range

of application scenarios both indoors and outdoors in archi-

tecture as well as facilitating user interaction. The aim is to

develop robust assembly and interconnection techniques for

commercial components and scale these to the roll-to-roll

processes and standards commonly applied in the textile

industry. This also includes demonstrating reliability.

POLARIC - ICT 247978

The aim of the project is to create high-performance organic,

integrated circuitry on large substrate areas. This means incre-

asing switching frequency into the MHz range and reducing

the supply voltage to battery level as well as reducing power

consumption and increasing production yield. A key element

of the POLARIC project is the miniaturization of organic circuits

in the sub-µm structure range using new structuring methods

such as nanoimprint. At the same time, the manufacturing

process is optimized with a view to achieving higher through-

put with roll-to-roll methods and large-area substrates.

/ / c U s t O M E R s A N d c O O p E R A t i O N p A R t N E R s

Fraunhofer EMFT is involved in a number of European Community projects , col laborat ing with partners

f rom sc ience and industry to research into and develop future-or iented solut ions tackl ing major chal len-

ges that face society today.

Interflex - ICT 247710

In the project Interflex, new assembly and interconnection

techniques are drafted and developed so as to be able to

produce multilayer foil systems in larger quantities. In order

to demonstrate that these technologies are application-ready,

Fraunhofer EMFT is involved in a consortium developing a

triple-layer foil-based, flexible sensor system which allows

various air parameters to be monitored in interior spaces

such as humidity, temperature and CO2 concentration. This

„system-in-foil“ is energy-autonomous and made up of vari-

ous subsystems providing the functions of energy harvesting

and storage, measurement data capture and analysis as well

as wireless data exchange via RF. Due to the temperature

sensitivity of the foil substrates, research work is focusing on

glue-based integration methods. In 2012, research activities

were geared towards reliability testing of the various foil com-

ponents and those assembled on foil substrates such as solar

cells, batteries, printed resistors, foil vias and foil microvias.

A key criterion for assessing integration technologies is relia-

bility under flexural stress. It has been demonstrated that the

components and laminates under examination well satisfy the

defined specifications in terms of resilience to flexural stress.

1 European flags in the

wind

39

COLAE - ICT 288881

Commercialization Clusters of OLAE (Organic and Large Area

Electronics) (COLAE) is a European initiative which promotes

the commercial use of organic and large-area electronics.

OLAE technology provides opportunities for new product

ideas, combined with low-cost manufacture, energy-efficiency

and environment-friendly materials and processes. Since this

is a young technology, there are currently very few companies

in Europe who are active in this field and working on product

development. COLAE therefore aims to raise the profile of

OLAE among potential end users in Europe and point the

way forward to innovative product developments. In order to

achieve this aim, demonstrators are developed and training

programs organized for potential industrial clients. COLAE

also seeks to open up new areas of application for OLAE as

well as identifying the main needs and challenges relating to

research and development.

COSMIC - ICT 247681

The project COSMIC has set itself the aim of developing the

electrical properties of organic thin-film transistors to achieve a

performance range required for application in ID tags, display

drivers or other integrated circuits. A key element of the project

is the development of a complementary and significantly more

robust circuit technology with p-type and n-type conductive

organic materials. Development is carried out on various pro-

duction platforms so as to cover the different fields - from

applications with a high degree of integration density through

to low-cost mass products. The results of the project can be

deployed in a diverse range of application areas such as medical

technology, environment, energy, leisure, security and mobility.

NanoMend - ICT 280581

The project NanoMend is dedicated to the development of

new technologies to reduce microdefects and nanodefects

on thin, coated, large-area foil substrates. Surface defects

can arise in various phases of the manufacturing process and

have a negative impact on the efficiency and yield of the

process as well as on the quality and lifetime of the products.

Conventional methods are not able to detect and repair such

defects on a micrometer and nanometer scale. For this reason,

the project focuses on identifying and characterizing as well as

eliminating and repairing this type of defects. These are used

in manufacturing such items as flexible illuminants, flexible

voltaics, coated packaging materials, billboards and screens.

SMART-EC - ICT 258203

The aim of the SMART-EC project is to develop energy-autono-

mous (EC) components. For this purpose, thin foil-based EC

transistors are integrated on flexible substrates with functio-

nalities for energy harvesting and storage. The primary goal

is to improve the energy efficiency of the components so as

to make the applications more convenient and reliable. The

results of the project can be used in such areas as automotive,

ID cards and smart packaging. On this project, Fraunhofer

EMFT is developing assembly methods for foil subsystems on

foil substrates. The aim will be automation using a pick-and-

place machine and optical quality control. A new method is

also being investigated to integrate ICs on foil.

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e-BRAINS - ICT 257488

The Fraunhofer EMFT is involved in the large-scale integrated

project e-BRAINS, funded by the European Commission.

e-BRAINS stands for „Best-Reliable Ambient Intelligent Nano-

sensor Systems by Heterogeneous Integration“.

The aim is to provide technologies for future applications in

the field of Ambient Assisted Living which require integration

of heterogeneous technologies. One of the main tasks here is

to develop suitable and reliable 3D integration technologies

for future MEMS/IC products. The e-BRAINS project also

involves selective evaluation of medical (DNA sensors and

active implants) and safety applications. The project partners

are Infineon Technologies (Project Coordinator), eesy-ID, ELA

Medical, IQE, Magna Diagnostics, SensoNor, Siemens, Vermon,

DMSC (majority owned by Intel Mobile Communications),

CEA, EPFL, IMEC, ITE, SINTEF, TUC, TUG, Fraunhofer IIS-EAS

and Fraunhofer EMFT (Technical Manager).

1 Fluorescence indicators

in solution

CONTEST - ICT 317 488

The FP7 ITN Marie Curie project CONTEST researches into and

develops technologies for the electronic skin as a synonym for

flexible, compliant electronic systems. The focus is on multi-

functional electronics, pliable and flexible large-area electronics

and the combination of organic and silicon-based solutions.

The electronic skin will simultaneously capture sensoric infor-

mation over large areas, significantly enhancing the cognitive

abilities of robots and the man-machine interface.

14 scientists are involved along with eight companies and

research institutes who are leaders in this field.

41

univeRsities

In order to pursue i ts research goals consistent ly , Fraunhofer EMFT engages in col laborat ive research and

projects with a number of univers i t ies in Germany and elsewhere in Europe.

Universität der Bundeswehr München

It was in 1973 that the first officers and cadets commenced

studies at Universität der Bundeswehr München (UniBwM),

one of the few campus universities in Germany. The 140 ha

premises house all the facilities required by students and

lecturers for successful learning, teaching and research.

The link between the UniBwM Faculty of Electrical Engineering

and Information Technology and Fraunhofer EMFT has been

intensified in recent years as a result of close staffing con-

nections. In addition to the Fraunhofer EMFT Director Prof.

Kutter (Professorship for Solid State Technologies), Prof. Maurer

(Professorship for Integrated Circuits and Electronic Compo-

nents) has also taught at UniBwM since 2012. The cooperation

originated under Prof. Eisele, who was appointed UniBwM‘s

first Emeritus of Excellence and also works at Fraunhofer EMFT.

The aim of the cooperation is to establish a development center

for Multifunctional On-Top Technologies for Standard Silicon

and CMOS (MOTT) for the modular integration of innovative

and new functionalities and components in existing standard

silicon technologies.

This cooperation allows UniBwM, Fraunhofer EMFT and

industrial companies to benefit mutually and jointly advance

development work - from high-risk research through to pro-

duct maturity and implementation. Fraunhofer EMFT‘s USP

lies in the area of add-on technologies and its ability to supply

the necessary expertise in combining these with standard

technologies.

technische Universität München

Fraunhofer EMFT deepened its ties with Technische Universität

München last year. Collaboration in the field of simulation

of processes, components and MEMS was started with Prof.

Wachutka‘s Chair. The aim of this partnership is to strengthen

Fraunhofer EMFT‘s expertise in this area. There are plans for

joint doctoral dissertations on various preliminary research

topics. Collaborative themes are also being discussed with

other Chairs.

University of Regensburg

The Fraunhofer EMFT Working Group Sensor Materials was

founded at the Regensburg site in May 2009. In close collabo-

ration with the University of Regensburg, the Sensor Materials

Working Group is being established with the financial support

of the Bavarian Ministry for Trade, Infrastructure, Transporta-

tion and Technology through the regional government of the

Upper Palatinate. Cooperative ventures are currently in place

with the Chair for Analytical Chemistry, Chemosensorics and

Biosensorics. Here, fundamental optical sensoric techniques

are being developed which can be integrated by joint transfer

in applications in the areas of health care, life sciences and

environmental analytics. This includes sensors for measuring

air pressure, temperature, oxygen, exhaust gas pollutants and

ozone. Trace analysis measuring techniques are developed to

determine analytes in the gas phase, in solutions and on the

surfaces of solid materials. The Chair for Analytical Chemistry,

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Chemosensorics and Biosensorics also possesses considerable

expertise in the field of biosensorics using physical transducers

such as plasmon resonance (SPR) and impedimetry.

The cooperation between the Sensor Materials Working

Group and the University of Regensburg is constantly

expanded through joint acquisition of sponsored projects,

participation in lectures and joint support for students.

Other research topics are in the areas of adhesion, inter-

diffusion barriers, electrical contacting of polymers and the

self-arrangement and selective electronic alignment of semi-

conductive polymers. The more stable and more efficient layer

systems thereby created serve to enhance the stability and

reliability of the components of which they form a part - after

all, many problems of reliability can be traced back to uncont-

rolled or impaired boundary layers.

technische Universität Berlin

Technische Universität Berlin and Fraunhofer EMFT are linked

by the Professorship for Polytronic Microsystems under

Professor Karlheinz Bock. The aim in this area is to conduct

research into the workings of polytronic components and sys-

tems. Polytronic microsystems are made up either partially or

wholly of active and passive organic materials for conductor,

semiconductor and functional layers (heterointegrated plastic

microsystems). This department is dedicated to research

into polymers, mainly low-cost coating technologies and

the characterization and control of polymeric surfaces and

boundary layers in polymeric material composites as well as

in hybrid multilayer technologies. Increased mobility of the

semiconductive polymer layers is of key importance here

and can be achieved by improving the short-range order

of semiconductive molecules. This can be brought about by

applying technological methods to influence surface states,

e.g. microstructuring and nanostructuring of the technological

surfaces by depositing molecular interface layers.

politehnica University of Bucharest (UpB), Romania

The University POLITEHNICA of Bucharest developed from

a polytechnic school dating back to 1864 and was named

POLITEHNICA in 1920. It is the most important technical

university in Bucharest and in the whole of Romania.

The University POLITEHNICA of Bucharest has traditionally

maintained collaborative links with Fraunhofer EMFT in

Munich through the Faculty of Electronics, Telecommunication

and Information Technology (ETTI) and the Department of

Electronic Technology and Reliability (TEF). This cooperation

allows several staff of the TEF Department to undertake sci-

entific internships at Fraunhofer EMFT. A number of doctoral

students from the TEF Department also use the experimental

facilities at Fraunhofer EMFT. The collaboration between the

two institutions has resulted in joint conference presentations

and publications.

1 Visit by Prof. Wu (Tongji

University, Shanghai) to

Fraunhofer EMFT. In at-

tendance: Prof. Bock, Prof.

Kutter, Prof. Wu, Dr. Ne-

brich (from left to right)

43

visitoRs AnD DelegAtions

A large number of v is i tors and delegat ions once again came to Fraunhofer EMFT in 2012 to engage in

d ia logue with Fraunhofer researchers and developers and take a c loser look at the inst i tut ion‘s out-

standing technological infrastructure.

• Student delegation, Postech Pohang University of Science

and Technology, Korea, February 3, 2012

• Prof. Peter Lieberzeit, Professor for Analytical Chemistry

at the University of Vienna, Austria, February 10, 2012

• Prof. Paul Svasta, Ph.D., Dr. h.c., „Politehnica“

University of Bucharest, Romania, Head of Center for

Technological Electronics and Interconnection Techniques,

March 19, 2012

• Assoc. Prof. Norocel Codreanu, Ph.D., „Politehnica“

University of Bucharest, Romania, April 13 - 18, 2012

• Center for Technological Electronics and Interconnection

Techniques, April 13 - 18, 2012

• Student delegation of the Institute of Electromechanical

Constructions, TU Darmstadt, June 14, 2012

• Business delegation from Turkey, Regional Innovation

Center in Konya , Turkey, June 25, 2012

• Delegation of the NSTC, Korea, under Dr. Lim,

June 28 - 29, 2012

1

• Delegation of students and lecturers from

Chonnam National University in Gwangju, Korea,

July 3 - 4, 2012

• Prof. Wu, Tongji University, Shanghai, China,

July 11, 2012

• Student delegation from the University of Lands-

hut, July 14, 2012

• Delegation from the University of Microelectronics

MIET, Moscow-Selenograd, October 22, 2012

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sensorics cluster

Sensors connect technology with our everyday world:

they trigger airbags in a fraction of a second, position

tiny computer components to the nearest thousandth of

a millimeter and measure the level of carbon dioxide in

the air. In anything from household appliances to high-

tech medicine, there is virtually no system that operates

without sensors - and the majority of sales in this sector

in Germany are generated by Bavarian companies. Bavaria

has rightly been referred to as „the number one site for

sensorics in Germany“ (source: Cluster Sensorik Bayern).

The organization Strategische Partnerschaft Sensorik e.V.

in Regensburg is the platform for sensorics as part of the

cluster offensive of the state of Bavaria. The association

has more than 50 members, including companies and

institutes from the worlds of business and science.

Fraunhofer EMFT is a founding member of the sensorics

cluster and regularly provides information and presen-

tations within the network as well as running its „Sensor

Materials“ Working Group at the Regensburg site.

Members of the Bavarian sensorics cluster are among

Fraunhofer EMFT‘s customers and cooperation partners.

Microsystems engineering cluster

Fraunhofer EMFT has been involved in in the microsystems

engineering cluster ever since it was set up. Several specialist

talks have been given at cluster events, for example, and a

presentation stand was provided to support the accompanying

exhibition at the MST symposium in Landshut. Links continued

to be cultivated in 2012 and talks were held to look at how

collaboration could be intensified or extended. As a result of

this, Fraunhofer EMFT has responded to the MST cluster‘s

endeavors to promote a more intensive networking process

by organizing meetings of cluster members in the companies

and institutions. Fraunhofer EMFT will be hosting a meeting

of members on April 23, 2013. Participants will be invited to

take a tour of the laboratories, inspiring them to make use

of the excellent resources available in the form of machines,

technological process engineering and staff experience.

Based on the belief that cooperative partnerships are ulti-

mately superior to competition, Fraunhofer EMFT has set itself

the goal of supporting Bavarian small and medium-sized com-

panies through this cluster.

bAvARiAn innovAtion clusteRs

The Bavar ian government runs a c luster offens ive to support the compet i t ive capacity of Bavar ian compa-

nies in 19 key sectors. For this purpose i t has set up c luster p latforms throughout Bavar ia to promote

networking among companies and research inst i tut ions. The c lusters help companies become involved in

jo int product development, opt imize internal processes and jo int ly conquer markets. Fraunhofer EMFT is

c losely involved in the fol lowing c lusters :

1 Fraunhofer EMFT

scientist in cleanroom at

the inline REM

45

NeZuMed - Network for innovative suppliers in medical

technology

The scientific institute for innovation and consultancy

„senetics Dr. Wolfgang Sening“ founded the network for

innovative suppliers in medical technology (NeZuMed) in 2011,

in collaboration with the East Bavaria innovation offensive (ISS)

initiated by the Bayreuth Chamber of Industry and Commerce

of Upper Franconia. The aim of the network is to establish an

innovative organization for research and development in

medical technology. The focus here is mainly on supporting

small and middle-sized companies based in Franconia, Bavaria

and Thuringia who have built up their expertise over many

years. Network collaboration will make it easier for them to

become established on a lasting basis within the inter-

disciplinary medical technology market.

The network is a platform on which to define and imple-

ment measures to serve the advancement of medical

technology and related fields. By involving all industrial

partners and the user side very early on, the aim is to

promote the development of market-oriented and inno-

vative components and products in medical technology.

The network also serves as an efficient information net-

work to solve interdisciplinary challenges and generate

economical, market-oriented solutions by using synergies.

Fraunhofer EMFT has been actively involved in NeZuMed

since the end of 2012. It takes part in events, trade fairs,

workshops, forums, symposiums and conferences.

By pursuing these activities, Fraunhofer EMFT aims to

generate technological innovations and R&D projects

1

by intensifying dialogue and knowledge exchange

with potential project partners.

This ensures that Fraunhofer EMFT and its project

partners are always „one step ahead“!

46

/ / H i g H l i g H t s

1 Interdigital capacitors on

glass wafer

2 Honorary doctorate

being awarded to Prof. Dr.

Dr. Bock

47

speciAl events

Award of honorary doctorate

The senate of Bucharest Polytechnic University awarded

Prof. Karlheinz Bock an honorary doctorate at a formal

session on November 27, 2012. The speech in his honor

was given by the Dean of the Faculty of Electronics, Tele-

communication and Information Technology.

Extract from the speech: „In recognition of his energy

and intellectual integrity, the ethical perseverance which

is so typical of him, his constant endeavor to advance the

developing field of polytronic multifunctional systems,

flexible systems applied using layering technology and

bioanalytical systems, for his outstanding contribution to

teaching and research and for his promotion of international

relations, it is a great honor for the University of Bucharest

to award Professor Karlheinz Bock an honorary doctorate

of our university here today: Doctor Honoris Causa

Vivat, Crescat, Floreat!”

L ife is never dul l at a research inst i tute. Specia l events are a l l part of a day‘s work.

A scientific challenge met with excellence

Thermogenerators on foil were developed and produced as

part of a project funded by the BMBF entitled OTEPS (Organic

thermogenerators for self-sustaining polytronic systems).

The newly developed paste systems were provided by the

project partners Institut für Mikrotechnik Mainz GmbH and

ESL ElectroScience. These paste system systems were used

by Fraunhofer EMFT to create three generations of thermo-

generators in hemispheric construction and one in meander

structure. The main challenge posed by the hemispheric con-

struction was to produce error-free through-platings by means

of screen printing for a thermogenerator. At Fraunhofer EMFT,

a special process and a new formulation of the paste by ESL

Electro-Science were used to demonstrate a high yield of

through-platings made by means of screen printing. 4,400

through-platings had to be printed without error in order to

produce a functioning thermogenerator on foil. For the mean-

der structure, a new technique of plasma structuring on PI foils

was developed as part of this project. For thermogenerators in

meander structure, thermogenerators have to be made through

the foil (through-platings). The plasma structuring etches the

through-plating in a single process stage, thereby creating the

necessary openings in the foil at the same time.

The thermogenerator foils developed in the project can be

integrated in solar collectors. This combination, for which a

patent has been applied (patent no.: DE 10 2012 209 322.2),

was set up as a demonstrator and implemented.

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1 Fraunhofer EMFT staff in

cleanroom

2 Scientist in the lab with

school students

1

49

events AnD WoRkshops

Autumn school

An event is held every year as part of the projects COSMIC,

Interflex, POLARIC and Smart-EC to allow dialogue between

the projects and present the results to a broader public.

From November 19 - 20, 2012 the latest results and fun-

damental insights from the projects were presented at

Fraunhofer EMFT in some 20 talks. The focus areas this year

were measurement and reliability of components in foil sys-

tems, materials for printed transistors on foil and materials

for electrochrome displays as part of printed electronics and

foil mounting.

Forum „Be-Flexible“

Fraunhofer EMFT has organized the international „Forum

Be-Flexible“ for over 10 years, inviting researchers, scientists,

industry partners and users to engage in a lively exchange.

In 2012, this event took place on the premises of Fraunhofer

EMFT on November 21 and 22. The event mainly focused on

the latest R&D results from the areas „Thin Semiconductor

Devices“ and „Flexible Electronic Systems“ along with their

product potential and future market prospects.

120 international participants visited the two-day event.

Fraunhofer EMFT organizes sc ient if ic events on i ts own premises every year, as wel l as present ing at

numerous external events. For example, the inst i tut ion regular ly presents i ts latest research and develop -

ment work at internat ional t rade fa i rs and congresses. Such events serve to attract new industr ia l projects

and cooperat ion partners, as wel l as a l lowing an exchange of information with potent ia l c l ients, interested

members of the publ ic and experts f rom other sc ient if ic inst i tut ions.

Here are some examples.

Fraunhofer day at Biopark Regensburg

Two Fraunhofer project groups work at the successful

Danube Innovation Center. One is Fraunhofer EMFT‘s

Sensor Materials Working Group founded in Regensburg

in 2009. The working group presented its research and

development results to the press and invited guests as part

of Fraunhofer Day on June 14, 2012. During the breaks,

experts from the Fraunhofer Board, Biopark, the University

of Regensburg and the two Fraunhofer institutes based at

Biopark made themselves available to answer questions and

engage in discussion with the approximately 60 guests.

2

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seMinARs AnD tRAining pRogRAMs

Esd device and design seminar

This training programs deals with the basics of characterizati-

on of integrated circuits in relation to electrostatic discharge

(ESD).

target group:

Specialists in the design and layout of I/O cells and those wor-

king in the field of measuring technology who are interested

in the ESD qualification of integrated circuits.

Microfluidics: Dosage of minute volumes

The seminar provides information on current developments in

the field of dosage modules for minute fluid quantities in the

nl range.

target group:

Specialists in analytics, medical technology, biotechnology,

mechanical engineering and process engineering.

training in cleanroom technology and cleanroom

practice, in cooperation with Vdi and tÜV sÜd

This program provides an overview of the norms and parame-

ters applicable to the design of cleanrooms. Personnel beha-

vior and test measurements in the cleanroom are illustrated

with examples.

target group:

Technologists and specialists in cleanroom technology.

1 Electronica,

Munich 2012

In order to support partners and customers, Fraunhofer EMFT offers seminars for profess ional develop -

ment, t ra in ing and information purposes which are e i ther open to the publ ic or e lse can be exc lus ive ly

ta i lored to companies‘ needs as in-house programs. Here is a smal l se lect ion of topics.

Manufacture and handling of thin silicon wafers

The seminar provides an overview of current technologies for

very thin silicon wafers and describes new concepts for car-

rier techniques based on a wide range of practical examples

from semiconductor technology.

target group:

Specialists in semiconductor technology and process

planning.

tensile strength testing of semiconductor materials

This seminar looks at current methods of analysis, the

influence of process technology on the tensile strength of

thin silicon wafers and process concepts.

target group:

Specialists in semiconductor technology, process planning

and process analysis.

self-assembly and surface programming

This seminar focuses on methods for surface programming,

analytics, practical experiments and examples of application.

target group:

Specialists in production technology and component

assembly.

51

tRADe FAiRs

3rd landshut symposium for Microsystems Engineering

Landshut, March 13 - 14, 2012

smart systems integration

Zurich, March 21 - 22, 2012

Hannover Messe

Hannover, April 23 - 27, 2012

sensor + test

Nuremberg, May 22 - 24, 2012

lOpE-c

Munich, June 19 - 21, 2012

Electronica

Munich, November 13 - 16, 2012

cOMpAMEd

Düsseldorf, November 14 - 16, 2012

Fraunhofer EMFT aims to go out to customers regular ly as wel l as draw attent ion to the sc ient if ic and

technological serv ices provided by the inst i tut ion at nat ional and internat ional events. The inst i tut ion was

represented once again at se lected trade fa i rs for th is purpose in 2012.

Here is an overv iew!

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youth DevelopMent

work experience for school students

Fraunhofer EMFT offers 5-day work experience placements for

school students. Here the institution cooperates with various

high schools, lower secondary schools and comprehensive

schools in Munich and the surrounding area. In March 2012,

students from the Willy-Brandt-Gesamtschule and Samuel-

Heinicke-Realschule visited the Fraunhofer EMFT in Munich to

gain a first-hand impression of the institution‘s work and the

everyday working lives of scientists with a mixture of talks and

practical tasks in the lab.

talent school

In the Talent Schools of the Fraunhofer-Gesellschaft, scientists

offer a range of different workshops for young people with

an interest in technology who enjoy tackling current scientific

issues. Talks with members of the Fraunhofer management

team provide insights into the everyday work of scientific

researchers both nationally and internationally.

The title of the Fraunhofer Talent School in 2012 was „Utopia

of moving images - on wallpaper, on the cornflakes packet or

in a photo album“: 10 school students had the opportunity to

find out about the technology for assembling foil displays.

In four different laboratories, screen printing was used to print

foils as display screens, structures were applied to wafer and

foil using lithography, a control circuit was assembled and

electronic components soldered. The components were then

measured and tested for functionality.

After a very busy and intense weekend, the students were

pleased with their self-made circuits and foils and were able to

take the items home with them.

Visit by students at tU darmstadt

A 15-strong delegation from TU Darmstadt visited Fraunhofer

EMFT in June 2012 including students (electrical engineering

and information technology micromechanics and precision

engineering), lecturers and doctoral candidates. In addition

to a detailed overview of the institution, the visitors were also

given a guided tour of selected laboratory areas. Institution

scientists also presented current work on radiation detectors.

The subsequent evaluation of the event confirmed experience

to date that young people are most interested in lab presenta-

tions and the introduction to specific research projects.

1 School girls on a career

orientation placement at

Fraunhofer EMFT

Fraunhofer EMFT has been involved in promoting opportunit ies for young people in technology for a

number of years. S ince 2009 the inst i tut ion has been a partner to the „Nat ional MINT pact - more women

in MINT profess ions“ (MINT = mathematics, IT, sc ience and technology) , offer ing young people an ins ight

into the opportunit ies for t ra in ing and study in technical profess ions.

53

2

pROMOtiNg wOMEN iN MiNt pROFEssiONs

One of the purposes of career orientation weeks at Fraun-

hofer EMFT is to train school girls to be contributors for

other youth development projects. They are then able to

go on and share their knowledge with other girls.

The following youth development activities in 2012 were

especially aimed at building enthusiasm for careers in tech-

nology and science among young women.

New: Fraunhofer EMFt Vacation Academy

Two groups of 31 Allgäu students each attended the first

Fraunhofer EMFT Vacation Academy organized in colla-

boration with Kempten University. A technology rally was

offered which ran through various of the institution‘s

themes. The rally stations were:

• „Live research“

• „Cleanroom chic - dressing up for cleanliness“

• „Vacuum you can touch“

• „A micro world enlarged“

• „Are foils afraid of water?“

In this context, female Fraunhofer researchers taught practi-

cal skills in the handling and separation of wafers as well

as the structured conditioning of polymer surfaces. They

also provided an overview of some of the research areas in

which Fraunhofer EMFT is involved. When he welcomed

the participants personally, the institution‘s director Prof.

Kutter particularly emphasized the importance of female

engineers for the far-reaching work to be done in research

and development for the future of society.

workshop for female students at tU München

16 female students from various departments visited Fraun-

hofer EMFT as part of the longstanding cooperation with

the TU München mentoring program. In addition to infor-

mation on Fraunhofer and the research areas in which

Fraunhofer EMFT is involved, the students were especially

interested in measures Fraunhofer has introduced to attract

women and support them in their career planning. After the

talks and a guided tour of the laboratories, the young wo-

men took the opportunity to engage in talks directly with

female research assistants.

The following issues were of particular interest to them:

• Which areas are available for master‘s and bachelor‘s

assignments?

• Which opportunities are available to gain insights into

a research institution through placements or student

activities?

• What do scientists have to say about their experience in

their job?

• How is it possible to make contact with individual

scientists?

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shadowing day

Another interesting event is „Shadowing Day“. This event

is organized by the European Commission in collaboration

with leading companies so as to take action against the lack

of women in the field of information and communication

technologies (ICT) and show young women that ICT is not just

for „computer freaks“. Information technology is ubiquitous:

it enriches our lives, connecting people all over the world -

everywhere and all the time. It even helps save lives!

Yet there are still not enough young people opting for a career

in information and communication technologies - in particular,

there are too few women.

In 2012, as in previous years, a school girl shadowed a female

scientist for an entire working day, later reporting on her

experiences in Brussels.

young prizewinners win Fraunhofer EMFt workshop

Their outstanding entry for the „Technology Scout“ compe-

tition was recognized by the Bildungswerk der Bayerischen

Wirtschaft with a special prize.

Five school girls in the 7th grade at Pirckheimer Gymnasium,

Nuremberg, won a day at Fraunhofer EMFT: they visited

various laboratories with their teacher and carried out hands-

on activities themselves in the institution‘s cleanrooms. The

technological highlight for the students was sawing wafers.

General excitement was caused by the impact of an unintenti-

onal wafer breakage in the spin dryer.

1 Scientists in the lab with

school students

55

1

cAReeRs At FRAunhoFeR eMFt

„I found out about training opportunities at Fraunhofer EMFT during an internship and put in an

application. I got in right away: I started training as an IT specialist for system integration in Sep-

tember 2009 and completed the course successfully last autumn. I especially liked the fact that my

trainers taught me much more than just the prescribed standard material - I now know a number

of practical tricks to solve awkward problems. All my colleagues were very friendly and they were

always willing to help out if I had a question. After three years at Fraunhofer EMFT I can definitely

say: I have turned my hobby into my profession.“

(Philipp Rhee, age 21, staff member in the IT department)

Many young people opt to begin their career at Fraunhofer EMFT. The inst i tut ion offers an excel lent start

for t ra inees in research, sc ience, technology and administrat ion. Students in the f ie ld of phys ics , e lectr ica l

engineer ing, process engineer ing, b iochemistry and re lated areas have the opportunity to be involved in

appl ied research at a pract ica l level . They can take an internship, work as a research ass istant, wr i te their

diploma/bachelor‘s /master‘s ass ignment or even a doctorate.

„I wrote my master‘s thesis on the topic of „Immobilization of DNA oligonucleotides on foil

substrates“ at Fraunhofer EMFT. For this I was able to draw on my two interdisciplinary courses

- biological engineering and a masters in microtechnology and nanotechnology - as well as contri-

buting some ideas of my own. I also thought it was great to be involved in putting on workshops

and mentoring programs for school and university students and inspire others to take up science.

(Stefanie Bauer, age 26, master‘s student in the Polytronics and Multifunctional Systems Division)

„After completing my degree in electrical engineering and information technology at TU

München in 2008 I really wanted to be able to apply my knowledge to the practical development

of systems, but still retain the freedom of scientific thinking.“ At Fraunhofer EMFT I was

offered the opportunity to establish system development expertise for microfluidic dosage

systems and use the insights gained for my doctoral thesis.“

(Sebastian Kibler, age 29, research assistant in the Micromechanics, Actuators and Fluidics Division)

56

/ / p R E s s A N d M E d i A

1 Sensor system for the

detection vof CO2 in the air

1

57

Technology Review, 26.07.2012

Süddeutsche Zeitung, 17.07.2012

Aktuel le Technik, 11.07.2012

58

/ / p R E s s A N d M E d i A

Laser Photonik, 07/2012

Elektronik, 05/2012

59

Donau-Post, 15.06.2012

60

/ / p R E s s A N d M E d i A

Mitte lbayer ische Zeitung, 15.06.2012

Interpharma, 27.01.2012

61

Ärztezeitung, 19.01.2012

Onl ine-Art ikel , DeviceMed, 22.08.2012

62

/ / p R E s s A N d M E d i A

Naturhei lkunde01/2012

Mitte lstandsWiki , 07.05.2012

63

Onl ine-Art ikel , Mediz in Aspekte 05/2012

Mediz inElektronik 05/2012

64

/ / p R E s s A N d M E d i A

Electronic Engineer ing T imes Europe 06/2012

Sensor Magazin 01/2012

65

tz-münchen, 10.04.2012

66

/ / p R E s s A N d M E d i A

PLUS, 04/2012

VµE,09/2012

67

Memminger Zeitung, 30.07.2012

Handelsblatt , 12.01.2012

68

Mikromechanisch prozes-

sierter Wafer für Höchstfre-

quenzanwendungen1/2 Multi-layer bonds of

a high-grade steel micro-

pump

1

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69

AcADeMic publicAtions AnD tAlks

publications

Ohlander, A.; Hammerle, T.; Klink, G.; Zilio, C.; Damin, F.;

Chiari, M.; Russom, A.; Bock, K.

dNA melting curve analysis on semi-transparent thin

film microheater on flexible lab-on-foil substrat

Proc. of the International conference on Miniaturized

Systems for Chemistry and Life Sciences (µTAS), Okinawa,

Japan, 2012, M. 8.180

Alberti, M.; Meixner, L.; Rückerl, A.; Eder, M.; Endres, H.-E.;

Bock, K.

Sensorfilter – ein intelligentes Mikro-Filtersystem in Fo-

lientechnologie für Anwendungen in prozesskontrolle,

Zellkultur und life sciences

Procedia Engineering 47, 2012, p. 212-215

Nebrich, L.

Effektivere diagnosen durch neues sensorelement

Fraunhofer VμE Microelectronic News, September 2012, p.16

Endres, H.-E.

Intelligenter Mikrofilter überwacht seinen Beladungs-

zustand

Fraunhofer VμE Microelectronic News, June 2012, p. 9

Communicat ive exchange is very important in sc ience and research. For this reason, Fraunhofer EMFT

sc ient ists once again publ ished their in ins ights in var ious forms in 2012. The fol lowing compi lat ion is a

smal l se lect ion of the academic publ icat ions and ta lks by Fraunhofer EMFT sc ient ists .

Richter, M.

Hochdruck-Mikropumpe für anspruchsvolle

Anwendungen

Fraunhofer VμE Microelectronic News, June 2012, p. 15

Landesberger, C.; Yacoub-George, E.; Bock, K.

Modular system integration on flexible film substrates

EE Times Europe, June 2012

Nettinger, K.; Schaber, U.; Drost, A.

Anwendung des plasma-ätzens in der Rolle-zu-Rolle

prozessierung von Folien

PLUS Nr: 4, May 2012, pp. 937-1208, Bd. 14, ISSN 1436-

7505

Bock, K.

Vor-Ort-diagnostik, neuartige lab-on-a-chip-Analyse-

systeme

GIT Labor-Fachzeitschrift 4/2012

Nebrich, L.; Wiest, F.

Hochempfindliche Strahlungsdetektoren für medizini-

sche Anwendungen

Tagungsband 3., Landshuter Symposium Mikrosystemtechnik,

March 2012, pp. 245-253

2

70

/ / A c A d E M i c p U B l i c A t i O N s A N d t A l k s

Endres, H.-E.; Alberti, M.

Sensorfilter: Intelligenter Mikro-Filter in Folientechnolo-

gie für Anwendungen in prozesskontrolle und Zellkultur

Sensor Magazin 1/2012 March 2012, p. 38

Nebrich, L.

X-ray detectors to discover dangerous substances

Fraunhofer VμE Microelectronic News, March 2012, p.11

Nebrich, L.; Wiest, F., Eisele, I.

Highly sensitive Radiation detectors for Medical Appli-

cations

Proc. Smart Systems Integration, Zurich, March 2012

Garrou P.; Jian-Qiang Lu, J.; Ramm, P.

three-dimensional integration

Handbook of Wafer Bonding, Wiley VCH, ISBN 978-3-527-

32646-4, Weinheim, 2012

Klumpp, A.; Nebrich, L.; Eisele, I.

Heterogene systemintegration von Halbleitersensoren

Microsystems Technology in Germany 2012 / Mikrosystem-

technologie in Deutschland 2012, Trias Consult Johannes

GmbH, 2012, pp. 34-35

Ramm P., Lu Jian-Qiang, Taklo M.M.V. (Eds.)

Handbook of wafer Bonding

Wiley VCH, ISBN 978-3-527-32646-4, Weinheim, 2012

Klumpp, A.; Ramm, P.

Temporary Adhesive Bonding with Reconfiguration of

known good dies for three-dimensional integrated

systems

Handbook of Wafer Bonding, Wiley VCH, ISBN 978-3-527-

32646-4, Weinheim, 2012

Landesberger, C.; Klumpp, A.; Bock, K.

temporary Bonding: Electrostatic

Handbook of Wafer Bonding, Wiley VCH, ISBN 978-3-527-

32646-4, Weinheim, 2012

talks

Ramm, P.

3D Integration – Where do we need to go now?

Panel “3D Integration”, International Wafer-Level Packaging-

Conference – IWLPC 2012, San Jose, California,

November 2012

Klink, G.

Advantages of Organic and large Area Electronics for

small area devices

Forum Be-Flexible, Munich, Germany,

November 21. - 22, 2012

Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.

Ageing behavior of printed flexible resistors by thermal,

mechanical and electrical stresses

COSMIC Autumn School 2012,

November 19. - 20, 2012

1 Basic unit of a high-

grade steel micropump

71

Landesberger, C.

High accuracy self-assembly of thin silicon dies

Forum Be-Flexible, Munich, Germany,

November, 21. - 22, 2012

Alberti, M.; Meixner, L.; Rückerl, A.; Eder, M.; Endres, H.-E.;

Bock, K.

Sensorfilter – ein intelligentes Mikro-Filtersystem in Fo-

lientechnologie für Anwendungen in prozesskontrolle,

Zellkultur und life sciences

4. GMM Workshop MNI, Berlin, Germany,

November 12. - 13, 2012

Ramm,P.

3d integration

Welcome Note, Proc. Sematech Workshop on Underfill

Challenges for 3D ICs, San Jose, USA, November 09, 2012

Klumpp, A.; Ramm, P.

low-temperature 3d integration processes for Reliable

Heterogeneous systems

e-BRAINS and ESiP workshop ESREF, Cagliari, USA,

October 01, 2012

Alberti, M.; Meixner, L.; Rückerl, A.; Eder, M.; Endres, H.-E.;

Bock, K.

„Sensor filter“ – Intelligent micro filter system in foil

technology

Eurosensors 2012, Krakau, Poland,

September 09. - 12, 2012

Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.

Ageing behavior of printed flexible resistors by thermal,

mechanical and electrical stresses

4th Electronics System Integration Technologies Conference

ESTC 2012, Amsterdam, Netherlands,

September 17. - 20, 2012

Landesberger, C.; Scherbaum, S.; Weber, J.; Bock, K.;

Hiroshima, M.; Oberhofer, B.

plasma dicing enables high accuracy self-alignment of

thin silicon dies for 3d-device-integration

4th Electronics System Integration Technologies Conference

ESTC 2012, Amsterdam, Netherlands,

September 17. - 20, 2012

Bose, I.; Ohlander, A.; Stich, M.; Kiesl, C.; Hemmetzberger, D.;

Klink, G.; Trupp, S.; Bock, K.

polymer opto-chemical-electronic based module as a de-

tection system for volatile analytes on a foil substrate

SPIE Organic Photonics + Electronics Conference, San Diego,

USA, August 16, 2012

Trupp, S.

sensor materials and integrated packaging for smart

systems

PTS, Munich, Germany, June 13, 2012

Endres, H.-E.; Alberti, M.; Bock, K.

plastic and silicon based (bio-)chemical transducers

8th Nano-Bio Conference, Varese,

Italy, June 18. - 20, 2012

1

72

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Endres, H.-E.

Elektrochemische sensoren für Umwelt und Medizin

Achema, Frankfurt, Germany, June 18. - 22, 2012

Richter, M.

TUDOS – Microdosing for Tumor Therapy

Innovationen aus Wissenschaft und Zuliefererindustrie für die

Medizintechnik, Erlangen, Germany, June 20. - 21, 2012

Trupp, S.

sensormaterialien für intelligente textilien

Innovationnetzwerk Textil e.V., Chemnitz, Germany,

June 19, 2012

Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.;

Ionescu, C.

Electrical stress on intrinsically conductive polymer

layer

ISSE 2012: 35th International Spring Seminar on Electronics

Technology, Bad Aussee, Austria, May 09. - 13, 2012

Endres, H.-E.; Rose, K.; Faul, R.; Yacoub-George, E.; Bock, K.

A flexible indoor air quality system

IMCS 2012 - The 14th International Meeting on Chemical

Sensors, Nuremberg, Germany, May, 20. - 23, 2012

Richter, M.

Bioreactors with microfluidic components for tissue

engineering

Strategies in Tissues Engineering, Würzburg, Gremany,

May 23. - 25, 2012

Eisele, I.

trends in der Mikrosystemtechnik

Innovationen in Mikrosystemtechnologie 2012, Bayern Innovativ, Nuremberg, Germany, May 15, 2012

Mohr, G. J.; Hezinger, A. F. E.; Trupp, S.; Stich M. I. J.; Schmidt, J.; Wenninger, F.; Meixner, L.; Neumaier, K.; Bock, K.Fabrication of Optical sensor Materials and Modules for Food Quality control

Europtode XI, XI Conference on optical chemical sensors and biosensors, Barcelona, Spain, April 01. - 04, 2012

Nebrich, L.; Wiest, F.

Hochempfindliche Strahlungsdetektoren für medizini-sche Anwendungen

3. Landshuter Symposium für Mikrosystemtechnik, Landshut, Germany, March 13. - 14, 2012

Wieland, R.; Xuan Anh Bui, T.; Merkel K.-R.; Al Kuzee, J.Optimization of dRiE-based tsVs for 3d/MEMsMAM 2012; Workshop Materials for Advanced Metallization, Grenoble, France, March 11. - 14, 2012

Klumpp, A.

Manufacturing of 3d integrated ics

Design, Automation and Test in Europe, Dresden, Germany, March 12. - 16, 2012

Faul, R.

FuE für flexible, polytronische Systeme3. Landshuter Symposium für Mikrosystemtechnik, Landshut, Germany, March 13. - 14, 2012

1 Piezo-electrically

powered membrane

actuator

73

Weber, J.; Klumpp, A.; Ramm, P.

3d-tsV integration heterogener Mikrosysteme

3. Landshuter Symposium für Mikrosystemtechnik,

Landshut, Germany, March 13. - 14, 2012

Endres, H.-E.; Alberti, M. ; Eder, M.; Rückerl, A.; Bock, K.

Intelligenter Mikrofilter für die Mikroalgenkultur

5. Bundesalgenstammtisch, Pullach, Germany,

March 26, 2012

Nebrich, L.; Wiest, F.; Eisele, I.

Highly sensitive Radiation detectors for Medical

Applications

Smart Systems Integration, International Conference and

Exhibition on Integration Issues of Miniaturized Systems,

Zurich, Switzerland, March 21. - 22, 2012

Yacoub-Georg, E.; Bock, K.

Multifunktionale Foliensysteme für textilien

TITV-Konferenz, Zeulenroda, Germany,

February 23. - 24, 2012

1

74

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1 Sensor foil for parallel

measurement of O2 and

CO2

1

75

pAtents

Verpackung

Gerhard Mohr, Anna Hezinger, Sabine Trupp, Jennifer

Schmidt, Matthias Stich

DE 10 2011 075 667.1

Verfahren und Vorrichtung zum justierten laminieren

von folienbasierten schaltungsträgern zur Herstellung

von flexiblen, mehrlagigen Schaltungssubstraten

Erwin Yacoub, Christof Landesberger

DE 10 2011 004 383.7

Flexibles, mehrschichtiges schaltungssubstrat und

Verfahren zur Herstellung desselben

Robert Faul, Andreas Drost

DE 10 2011003 622.9

kleidungsstück

Dr. Gerhard Mohr, Dr. Sabine Trupp, Dr. Matthias Stich

WO 2012 / 104328

Verfahren zur Herstellung eines chip-package

Christof Landesberger, Robert Faul

DE 10 2010 042 567.2

Organischer transistor und Verfahren zur Herstellung

desselben

Markus Burghart, Gerhard Klink

DE 10 2010 061 978.7

The fol lowing Fraunhofer EMFT patents were disc losed in 2012:

Microfluidic device, microfluidic dosing system

Martin Richter, Sebastian Kibler

WO 2012 031630

Method for manufacturing a three-dimensional electronic

system

Peter Ramm, Armin Klumpp

US 2010/0289146

76

1 Fraunhofer scientist

holding a MEMS wafer

2 MEMS microphone

wafer

/ / M E M B E R s H i p s A N d A c t i V i t i E s

1

77

MeMbeRships AnD Activities

prof. dr. rer. nat. christoph kutter

• IEEE Components, Packaging & Manufacturing Techno-

logy Society and Electron Devices Society: Member

• Deutsche Physikalische Gesellschaft: Member

• Association for Electrical, Electronic & Information

Technologies (VDE): Member

• VDE GMM (Gesellschaft für Mikroelektronik, Mikro-

mechanik und Feinwerktechnik): Deputy Chairman

• Innovationspreis der deutschen Wirtschaft: Member of

the awards advisory board

• VDI VDE IT GmbH: Member of the Supervisory Board

prof. dr.-ing. dr. h. c. karlheinz Bock

• AMA, AMA Wissenschaftsrat und AMA Sensor-Innovati-

onspreis: Member

• Arbeitsgemeinschaft Organic Electronics Association OEA,

VDMA: Member

• Compound Semiconductor Manufacturing Technology,

CS MANTECH, USA: Member of the Technical Program

Committee

• EITI – European Interconnect Techology Initiative: Member

• FlexTech Alliance, USA: International Advisory Board

• Forum MedTech Pharma, Bayern Innovativ: Member

• Institute of Electrical and Electronics Engineers IEEE: Member

• IEEE Components, Packaging & Manufacturing Techno-

logy Society and Electron Devices Society: Member

• International Electronic Components and Technologies

Conference, ECTC, USA: Sub-committee chair„Emerging

technologies“

• International Electron Devices Meeting IEDM, USA:

Member of the Executive Committee and European

Arrangement Chair

• International Conference on Flexible and Printed Electro-

nics (ICFPE), Japan: European Committee

• Micro- and Nanotechnology Journal der Bentham Science Pu-

blisher Ltd.: Member of the Board of Editors and Consultant

• MRS - Materials Research Society: Member

• Plastic Electronics Conference: Conference cochair for the

Integrated Smart Systems Conference part

• IEEE Electron Devices Letters EDL: Consultant

• Applied Physics Letters APL: Consultant

• German Israeli Foundation for Scientific Research and typo

Development (G.I.F): Consultant

• Electronics Systems Integration Technology Conference

ESTC, Technical Program Committee: Member

• Journal of Micromachines: Consultant

• VDE und Kerngruppe des Arbeitskreises für Mikroelektro-

nik und Feinwerktechnik: Member

• Smart Systems Integration Conference, SSI: Technical

Program Committee and Founding Member

• Design and Technology in Electronic Packaging

(SIITME): Member of the Steering Committee

• Interconnection techniques in Electronics (TIE contest):

Member of the Steering Committee

Fraunhofer EMFT staff promote the transfer of knowledge through membership of a wide range of diffe-

rent networks and cooperat ions. This enables them to tackle interdisc ip l inary tasks beyond the bounds of

the Fraunhofer inst i tut ion i tse lf .

2

78

// Mitgliedschaften und Aktivitäten

prof. dr. rer. nat. ignaz Eisele

• Robert Bosch Zentrum Reutlingen: Member of the

Advisory Board

• IHP, Frankfurt/Oder: Member of the Scientific Advisory

Board

prof. dr. techn. linus Maurer

• IEEE, Institute of Electrical and Electronics Engineers:

Member

• ITG Informationstechnische Gesellschaft im VDE: Member

• VDE Verband der Elektrotechnik Elektronik Informations-

technik e.V.: Member

• IEEE MTT-27 (wireless-enabled automotive and vehicular

applications): Member

dr. rer. nat. peter Ramm

• International Microelectronics and Packaging Society

iMAPS: Fellow of Society and Life Member

• Electronic Components and Technologies Conference

(ECTC): Sub-Committee Advanced Packaging

• International Microelectronics and Packaging Society

iMAPS: Award Committee

• iMAPS Device Packaging Conference (iMAPS DPC):

Technical Co-Chair 3D Packaging

• Sematech ITRS Interconnect Working Group:

Key Contributor

• SEMI North America: Committee Standards 3DS-IC,

Technical Committee

• Electrochemical Society (ECS): Symposium Organizer

• Institute of Electrical and Electronics Engineers IEEE:

Organizing Committee and Founding Member

3DIC Conference

• Future Fab International Magazine: Editorial Board

Member

• Advanced Metallization Conference (AMC): Executive

Committee

• Surface Mount Technology Association (SMTA): Technical

Committee Member IWLPC and 3D Integration Chair

dr.-ing. Martin Richter

• VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Fein-

• werktechnik (GMM), Fachbereich 2; Mikro- und Nano-

technik, Fachausschuss 2.4 „Mikroaktorik“: Member

• Association Multi Material Micromanufacturing (4M):

Head of division microfluidics

• MST Kongress: : Member of program committee

dr.-ing. detlef Bonfert

• IEEE, Institute of Electrical and Electronics Engineers:

Senior Member

• IEEE, Society: CPMT, EDS, CS, MTT: Member

• International Microelectronics and Packaging Society-

iMAPS: Member

• International Symposium for Design and Technology in

Electronic Packaging SIITME, Technical Program Commit-

tee Chair, Steering Committee and Scientific Committee

Member

• International Spring Seminar in Electronics ISSE: Steering

Committee Member

/ / / / M E M B E R s H i p s A N d A c t i V i t i E s

1 Fraunhofer scientist

with MEMS wafer

79

• Design of Electronic Modules and Assemblies, TIE:

Technical Committee Member

dieter Bollmann

• Fraunhofer-Gesellschaft: Elected Representative on the

Scientific Technical Council

dr.-ing. Hanns-Erik Endres

• Cluster-Offensive Bayern, Cluster Sensorik: Member and

Technical Advisor

• Fraunhofer-Netzwerk Elektrochemie: Member

Robert Faul

• Hochschule Landshut, Cluster Mikrosystemtechnik:

Technical Advisor

• Cluster-Offensive Bayern, Cluster Mechatronik und

Automation: Technical Advisor

dr.-ing. Horst A. gieser

• ESD-FORUM e.V.: Board Chairman and Founding Member

• Industry Council on ESD-Target Levels: Member

• EOS/ESD Association, USA: Member

• EOS/ESD Symposium, USA: Technical Program Committee

• International Electrostatic Workshop IEW: Management

Committee

• European Symposium on Reliability of Electron Devices,

Failure Physics and Analysis ESREF: Technical Program

Committee

• EOS/ESD Association, USA: Member

• EOS/ESD Symposium, USA: Technical Program Committee

• International Electrostatic Workshop (IEW): Technical

Program Committee

dr. rer. nat. Armin klumpp

• International Electron Devices Meeting IEDM, USA:

Technical Committee

christof landesberger

• Cluster-Offensive Bayern, Cluster Leistungselektronik:

Technical Advisor

sabine scherbaum

• ZAK-Zentrum für angewandte Kompetenz und Mentoring

der Frauenakademie München: Mentor

• mst|femNet meets Nano and Optics in: Nationalen Pakt

für Frauen in MINT-Berufen: Fraunhofer EMFT Advisor

dr.-ing. Heinrich wolf

• EOS/ESD Association, USA: Member

• EOS/ESD Symposium, USA: Technical Program

Committee

• International Electrostatic Workshop (IEW): Technical

Program Committee

Axel wille

• Deutsche Physikalische Gesellschaft: Member

• VDI Verein Deutscher Ingenieure: Member

1