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1.0 Chapter 01 (Introduction)

The components inside your PC generate heat. Your standard heat-sink-and-fan combo is usually

sufficient for the average user.

The term "liquid cooled" sounds automotive oriented; liquid cooling has been an integral part of

the common gasoline engine. Why liquid cooling is needed for Pc and server cooling. To find

out, we must compare air-cooling to liquid cooling. When comparing the effectiveness of

cooling methods, there are two properties that matter the most: thermal conductivity and specific

heat capacity.

Thermal conductivity is a physical property that describes how well a substance transfers heat.

The thermal conductivity of liquid water is about 25 times that of air. Obviously, this gives liquid

cooling a huge advantage over air-cooling because liquid cooling allows for a much faster

transfer of heat. Specific heat capacity is the other important physical property, which refers to

the amount of energy it takes to heat a substance by one degree. The specific heat capacity of

liquid water is about four times that of air, which means it takes four times the amount of energy

to heat water than it does to heat air. Once again, water's ability to soak up much more heat

energy without increasing its own temperature is a great advantage over air-cooling. Therefore

this researched property of water has made it the suitable working fluid in liquid cooling system

in Pc and servers to eradicate heat and to avoid heating problems.

Figure 1: typical liquid cooled cpu

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2.0 Chapter 02 (Literature Review)

2.1 Designing water cooling system

The design of the water cooling system that is suitable for PC and servers, both tasks will take some time

and effort every first time, walk through the details and help you avoid the mistakes that would take the

greatest toll on your system.

(www.maximumpc.com)

2.2 Pc liquid cooling system

The components inside PC and Servers generate heat. Standard heat sink and fan combo is

usually sufficient for the average user, but for tougher components,. If you want more than the

clock of your PC to the bleeding edge, you want to build a liquid-cooling system for your PC to

ensure that your precious components do not burn out. (www.pcworld.com)

2.3 Thermal effects of Processor

Average store-bought PC uses a system of fans to heat subtracting major components such as the

CPU (central processing unit), graphics processor and hard disks. Then, the hot air blown to the

rear of the machine. That works fine for most computers do most jobs. But it is not always ideal,

and it does nothing to impress your friends. The other option is to dissipate heat water cooling -

or rather, liquid cooling, using a combination of distilled water and propylene glycol is piped

through the guts of the machine. Installing a liquid cooling system is not that difficult, but it can

be intimidating. Who can really take advantage of this hot-rod project? Mainly, computer users

who like to overclock their PCs and run them hard for gaming applications, video processing,

sequencing the DNA of Amazonian tree frogs, and the like. Such people often work their

processors in a heated rage, so that the fans continue to work - and noisy.

(www.popularmechanics)

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3.0 Chapter 03 (Conceptualization & Research Methodology)

3.1 Problem Identification and Problem Formulation

Reduction in processing due to heating:-

CPU overheating can lead to computer crashes, reboots and possible damage to your processor

or other hardware components. A high CPU temperature can suggest a number of problems,

ranging from hardware issues to malicious software.

Decreasing product life:-

At elevated temperatures a silicon device can fail catastrophically, but even if it doesn't, its

electrical characteristics frequently undergo intermittent or permanent changes. Manufacturers of

processors and other computer components specify a maximum operating temperature for their

products. Most devices are not certified to function properly beyond 50°C-80°C (122°F-176°F).

However, in a loaded PC with standard cooling, operating temperatures can easily exceed the

limits.

Noise created by the air flow fans:-

The fans connected to the pc normally rotate at normal Rpm but as the heat increases during the

run time of the pc the fan speed increases and that causes noise.

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3.2 Objective of Study

1. provide proper cooling system for Pc and Servers:-

One of the advantages of most liquid cooling systems is that they are expandable and can

cool more components than the CPU alone. Even after passing through the CPU's cooling

block, the liquid coolant is still able to cool other components such as the motherboard's

chipset and VGA card. While these are the basics, it's possible to add even more

components to the system if desired, such as a hard drive cooling system. Every

component to be cooled simply requires its own cooling block, and perhaps a little

planning to make sure the coolant flows well.

2. Reducing the noise levels:-

Liquid cooling is a much more efficient system at drawing heat away from the processor

and outside of the system. This allows for higher clock speeds in the processor as the

ambient temperatures of the CPU core are still within the manufacturer's specifications.

This is the prime reason why extreme over clocker’s tend to favor the use of liquid

cooling solutions for their processors.

3. A suitable cooling system in different environment’s:-

water cooling system is not suitable for different kind of environment because if water

cooled in a cold environment the processing and other components might stop working

this issue is solved by using a temperature controlled chiller, the chiller does not operate

in cold temperature but it will automatically switched on by the temperature controller if

heat in the environment increases this then cools the heated liquid.

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3.3 Scope of Study

Temperature control of flow based system:

The system has been incorporated with a temperature sensor which detect the temperature rise

inside the pc system casing using pic micro controller which detects the temperature rise inside

and switches on the chiller which in turn it cools the water flowing through it and subsequently

the chiller will be switched off if the there is a decrease in the system temperature according to

the target temperature of below 650celsius.

These sensors use a solid-state technique to determine the temperature. That is to say, they don't

use mercury (like old thermometers), bimetallic strips (like in some home thermometers or

stoves), nor do they use thermistors (temperature sensitive resistors). Instead, they use the fact as

temperature increases, the voltage across a diode increases at a known rate. (Technically, this is

actually the voltage drop between the base and emitter - the Vbe - of a transistor. By precisely

amplifying the voltage change, it is easy to generate an analog signal that is directly proportional

to temperature. There have been some improvements on the technique but, essentially that is how

temperature is measured.

Because these sensors have no moving parts, they are precise, never wear out, don't need

calibration, work under many environmental conditions, and are consistent between sensors and

readings. Moreover they are very inexpensive and quite easy to use.

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Figure 2: analog voltage out

Lay out of all of the components of a water-cooling system they are listed below.

1. CPU water block (piece that directly cools the processor)

2. Pump

3. Radiator

4. Tubing

5. Coolant additives

6. Reservoir / T-Line

7. Fans

8. Hose clamps and other miscellaneous hardware

The main components of water cooling:

1. The CPU Water block:

Depending on which you choose you can gain up to 10 degrees centigrade (temperature drop)

from a poorly designed block to an efficiently designed one. The difference is not usually to such

extremes, but these variations do exist.

There are two basic designs used for water blocks today. One method is called impingement and

the other method doesn’t really have a defined name. The fundamental difference between the

two is that impingement needs a powerful pump to get good performance, and non-impingement

blocks are capable of good performance without a powerful pump. Well the impingement blocks

do perform better when fitted with a powerful enough pump.

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Impingent = highest performance but needs a strong pump to get there (Example Here (Swiftech

Storm): Outside Picture, Impingement Cups Impingement Jets)

Non-Impingement = good performance without much pump requirements (Example Here:

Internal picture)

2. The Pump:

The pump is also a very large determining factor in the performance of the cooling system.

Getting good flow in the system is essential for the components to function properly and

efficiently. There is a wide variety of pumps on the market for different tubing sizing and system

requirements. Here I will show you the basic types of pumps and the differences between them.

The head pressure is the amount of water that the pump can push in a vertical column. This with

a jet shot straight up in the air and the height of it measured.

3. Radiator / Fans

The radiator is an essential part of a water-cooling system, as it removes the heat in the water

deposited form the water blocks and the pump. Without it the system would overheat in a matter

of seconds. Radiators come in many different shapes and sizes. Some are better than others, but

it all depends on application and the fans chosen. There are two types of radiators that are

commonly used in water-cooling setups. The first are the purpose built radiators that are

designed to accommodate 120mm fans (some also use 80mm fans) and have different types of

hose barbs for a myriad of applications. The second are heater cores. Heater cores are the heating

elements used in car heating systems.

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4. Tubing

Tubing is what connects each component together no specific tubing is required, and it

comes in multiple shapes and colors. For perfect fitting inner diameter (ID) and outer

diameter (OD) are compatible with the inner diameter and outer diameter of the fittings.

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3.4 Deionized Water

Deionized water is water that has had its ions removed, including sodium, calcium, iron, copper,

chloride, and bromide. The deionization process removes harmful minerals, salts, and other

impurities that can cause corrosion or scale formation. Compared to tap water and most fluids,

deionized water has a high resistivity. Deionized water is an excellent insulator, which is why it

is used in the manufacturing of electrical components where parts must be electrically isolated.

Deionized water with pH at approximately 7.0 but will quickly become acidic when exposed to

air. The carbon dioxide in air will dissolve in the water, introducing ions and giving an acidic pH

of around 5.0. Therefore, when using water that is virtually pure, it is necessary to use a

corrosion inhibitor. When using deionized water in a recirculating chiller, special high purity

plumbing is needed. The fittings should be nickel-plated and the evaporators should be nickel-

brazed. When using deionized water in cold plates or heat exchangers, stainless steel tubing is

recommended.

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3.5 Chiller

There are two basic types of aquarium chiller.

The first is located next to the tank and an external probe is placed inside the aquarium. This

probe has the coolant gas passing through it to cool the surrounding water.

The second is plumbed into the aquarium filter hoses and water from the filter passes through the

unit back to the tank. These chillers work in a similar way to the domestic refrigerator.

Refrigerant gas is compressed and heats up as it is pressurized. As it passes through a radiator

grill at the back of the unit the heat is radiated into the room. As the gas cools it is then passed

through an expansion valve. The gas expands and becomes cooler still due to the pressure drop.

The cold gas is passed through coils, either inside the unit or in the external probe, where it

absorbs the heat from the aquarium water surrounding them. The cycle of gas circulation is then

repeated.

Figure 3: DIY aquarium chiller

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3.6 Power system

PC Power and Cooling has several power supply models The ultra-quiet, high performance

Silencer brand of power supply units is available in 360 watt, 470 watt, and 610 watt and 750

watt varieties. The 360 watt and 470 watt versions are also offered in Dell compatible models.

PC Power and Cooling also offers a maximum performance line of power supplies, the Turbo-

Cool units, which are available in 850 watt, 1000 watt, and 1200 watt versions.

A notable feature of PC Power and Cooling units is that their units use a lone, high-current

+12 V rail for DC output to the rest of the system, as opposed to multiple lower current rails that

run in parallel.

This single-rail configuration is reminiscent of high-end power supplies in the early to mid-2000,

before an industry shift towards using split +12V rails for reliability, stability, and economical

reasons.

The shift towards multi-rail power supplies can be seen as when new tech such as the Pentium4

or Athlon64 platforms, along with the introduction of GPU's which required more power than the

AGP/PCIe slot could provide, more and more power was needed for that progression. When

given a dedicated +12V rail for exclusive use by the GPU, and another dedicated rail for the rest

of the system, the increased power demand was met while maintaining a simple design, ideal for

(continued) mass production and cost control for a more complex unit.

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4.0 Chapter 04 (Data presentation & Analysis)

The equivalent ton on the cooling tower side actually rejects about 15,000 Btu/h due to the heat-

equivalent of the energy needed to drive the chiller's compressor. This equivalent ton is defined

as the heat rejection in cooling (1,500 pound/hour) of water 10°F, which amounts to 15,000

Btu/hour, or a chiller coefficient-of-performance (COP) of 4.0 - a COP equivalent to an energy

efficiency ratio (EER) of 13.65.

4.1 Heat Load and Water Flow

A water systems heat load in Btu/h can be simplified to:

h = cp ρ q dt

= (1 Btu/lbm oF) (8.33 lbm/gal) q (60 min/h) dt

= 500 q dt (1)

(www.engineeringtoolbox.com)

Where

h = heat load (Btu/h)

cp = 1 (Btu/lbm oF) for water

ρ = 8.33 (lbm/gal) for water

q = water volume flow rate (gal/min)

dt = temperature difference (oF)

The sensible heat in a heating or cooling process of air (heating or cooling capacity) can be

expressed as

hs = 1.08 q dt (1)

Where

hs = sensible heat (Btu/hr)

q = air volume flow (cfm, cubic feet per minute)

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dt = temperature difference (oF)

4.2 Latent Heat

The latent heat due to moisture in the air can be expressed as:

hl = 0.68 q dwgr (2)

or

hl = 4,840 q dwlb (3)

Where

hl= latent heat (Btu/hr)

q = air volume flow (cfm, cubic feet per minute)

dwgr = humidity ratio difference (grains water/lb dry air)

dwlb = humidity ratio difference (lb water/lb dry air)

1 grain = 0.000143 lb = 0.0648 g

4.3 Total Heat - Latent and Sensible Heat

Total heat due to both temperature and moisture can be expressed as:

ht = 4.5 q dh (4)

Where

ht= total heat (Btu/hr)

q = air volume flow (cfm, cubic feet per minute)

dh = enthalpy difference (btu/lb dry air)

Total heat can also be expressed as:

ht = hs + hl

= 1.08 q dt + 0.68 q dwgr (5)

Q = mc (T-Ti) (2)

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Where

Q = Heat in btus

m = mass in pounds

c = specific heat in btus/lb/F

T = Temperature of the substance after the heat is added.

Ti = Initial temperature of the substance in F

H = dQ/dt = A (Thot-Tcold)/R

Substitute T for Thot because that will be changing as the water cools, and substitute TA for Tcold

because A stands for the ambient air temperature outside the insulation.

dQ = (A(T-TA)/R) dt

Restating equation (2) using differentials:

dQ = mc dT

We can now equate the two dQ's, but we have to be careful because one is stated as a positive

and the other is really a negative, so we have to include a negative sign on one side:

mc dT = -(A(T-TA)/R) dt

Rearranging:

dT/(T-TA) = -(A/(mcR)) dt

Taking the indefinite integral of both sides’ yields:

ln(T-TA) = -(A/(mcR))t + C

Where C is the constant of integration.

Using each side as the exponent of e:

T-TA = C'e-(A/(mcR))t

Where C' is actually a different constant: C' = eC

So

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T (t) = TA + C'e-(A/ (mcR)) t

We can solve for C' by setting t=0:

T (0) = TA + C'

C' = T (0) - TA

But T (0) is actually the initial hot water temperature, call it TH

So C' = (TH - TA)

Finally:

T (t) = TA + (TH - TA) e-(A/ (mcR)) t

4.4 Cost analysis

Table 1: cost analysis

Components Allocated Cost Actual cost

Tubing 2,000Rs 1,850Rs

Reservoir 500Rs 850Rs

Copper Block 4,000Rs 3,250Rs

Machining 3,000Rs 3,000Rs

Chiller 3,000Rs 2,500Rs

Pump 15,00Rs 960Rs

14,000Rs 12,410Rs

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4.5 Hardware and software design control system

System Overview for Microcontroller

Most of the structures are made using the microcontroller. In this series, I would like to share the

microcontroller PIC 16F873A, features, description and diagram PIN so on.

Features

High-performance RISC CPU

All single cycle instructions except for program branches which are 2 cycle

Operating speed: DC - 20 MHz clock input DC - 200 ns instruction cycle

Up to 4K x 14 words of Flash Program Memory,

Up to 128 x 8 bytes of EEPROM data memory

Interrupt capability -up to 13 internal/external

Eight level deep hardware stack

Direct, indirect, and relative addressing modes

Power-on Reset (POR)

Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)

Watchdog Timer (WDT) with its own on-chip RC Oscillator for reliable operation

Programmable code-protection

Power saving SLEEP mode

Selectable oscillator options

Low-power, high-speed CMOS EPROM/EEPROM technology

Fully static design

In-Circuit Serial Programming (ICSP) via two pins

Only single 5V source needed for programming capability

In-Circuit Debugging via two pins

Processor read/write access to program memory

Wide operating voltage range: 2.5V to 5.5V

High Sink/Source Current: 25 mA

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Commercial and Industrial temperature ranges

PIN Diagram:

Figure 4: PIN diagram

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4.6 PIN description

Table 2: PIN description

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All microprocessor systems, regardless of their complexity, based on similar components.

These are shown in Figure 1 and consists of the following:

CPU - the part that makes all the logic functions and arithmetic

RAM - for storing programs and / or program variables

ROM - read-only segments of programs

I / O - connection to external devices

The CPU or microprocessor is the core component of any microprocessor and external demands

components such as ROM, RAM, I / O, etc. to achieve its purpose. A microcontroller is a

stripped-down version of the very same architecture, with all major features available in a chip.

The microcontroller system requires no additional input circuit, except a watch and may in many

cases, regional exits leading directly. The microcontroller will investigate is the PIC16F873A,

which is located at the upper end of mid-range series of microcontrollers developed by

Microchip Inc. Characterized by a RISC architecture instead of the CISC architecture used, for

example, the Motorola 6809.

(en.wikipedia.org)

4.7 Architecture of the PIC microcontroller

The history of the PIC microcontroller series began in 1965 when General Instruments (GI)

formed a part of Microelectronics, and used this section to create some of the first viable

EPROM and EEPROM memory architectures. DG also did a 16-bit microprocessor, called the

CP1600, in early 1970. Although this was a reasonable microprocessor, was not particularly

good at handling I / O. Therefore, about 1975, GI designed a Peripheral Interface Controller (or

Futures for short) for writing a very ¯ c application where good management I / O needed. Was

designed to be very fast, as it was I / O to handle a machine 16-bit, but do not need much of the

functionality, so micro coded instruction set was small. The architecture was PIC16C5x

essentially the architecture of today. The market for futures remained for a short the coming

years. During the 1980's GI restructure their businesses to focus more their main activity, which

was a power semiconductor. As a result of restructuring, the GI Microelectronics Division

became GI Microelectronics Inc (subsidiary) which, 1985, ¯ Nally sold to venture capitalists.

The sale includes a manufacturing unit Chandler, Arizona. The new owners decided to focus on

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pictures, serial and parallel -EEPROM and parallel EPROM. The decision was taken later to start

a new company, named Arizona Microchip Technology, integrated control with a di ® erentiator

from the rest of industry. Under this strategy, the family Futures redesigned to use one of the

other things that the company was good edging °, i.e. EPROM. With the addition of CMOS

technology and erasable EPROM program memory, PIC family as we know, was born. The

range of PIC microcontrollers are RISC processors with a battery (also called the employment

record, W), using the architecture Harvard3? Therefore the microcontroller has program memory

data bus and the memory data bus. Separate buses means that the simultaneous access program

and data can be done, which gives more bandwidth over traditional von Neumann architecture.

The separation of program and data memory, allowing instructions to be sized di ® erently from

the 8-bit wide data word. This separation means that the words may be teaching ideal size for

writing ¯ c CPU / application. This is necessary since RISC architectures require that the

instructions are the source and destination operands to be codified into teaching. The Futures op

codes for mid-range processors are 14-bits wide, and 14-bit wide bus program produces a

directive in a single cycle.

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4.8 Temperature sensor LM 35

The LM35 series are precision integrated-circuit temperature sensors, whose output voltage is

linearly proportional to the Celsius (Centigrade) temperature. The LM35 thus has an advantage

over linear temperature sensors calibrated in ° Kelvin, as the user is not required to subtract a

large constant voltage from its output to obtain convenient Centigrade scaling. The LM35 does

not require any external calibration or trimming to provide typical accuracies of ±¼°C at room

temperature and ±¾°C over a full -55 to +150°C temperature range. Low cost is assured by

trimming and calibration at the wafer level. The LM35's low output impedance, linear output,

and precise inherent calibration make interfacing to readout or control circuitry especially easy.

It can be used with single power supplies, or with plus and minus supplies. As it draws only 60

µA from its supply, it has very low self-heating, less than 0.1°C in still air. The LM35 is rated to

operate over a -55° to +150°C temperature range, while the LM35C is rated for a -40° to +110°C

range (-10° with improved accuracy). The LM35 series is available packaged in hermetic TO-46

transistor packages, while the LM35C, LM35CA, and LM35D are also available in the plastic

TO-92 transistor package. The LM35D is also available in an 8-lead surface mount small outline

package and a plastic TO-220 package.

(www.ti.com)

Features

Calibrated directly in ° Celsius (Centigrade)

Linear + 10.0 mV/°C scale factor

0.5°C accuracy guarantee able (at +25°C)

Rated for full -55° to +150°C range

Suitable for remote applications

Low cost due to wafer-level trimming

Operates from 4 to 30 volts

Less than 60 µA current drain

Low self-heating, 0.08°C in still air

Nonlinearity only ±¼°C typical

Low impedance output, 0.1 [Ohm] for 1 mA load

Figure: 5 1LM35 temp sensor

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Table 3: temperature sensors features

LM35

Supply Voltage (Min) (V) 4

Supply Voltage (Max) (V) 30

Iq (Typ) (uA) 56

Interface Analog Output

Sensor Type Local

Sensor Gain (mV/Deg C) 10

Local Sensor Accuracy (Max) (+/- C) 0.5

Output Impedance (Ohm) 0.4

Operating Temperature Range (C) -40 to 110,-55 to 150,0 to 100,0 to 70

Pin/Package 3TO, 3TO-92, 8SOIC

Approx. Price (US$) 0.56 | 1ku

Rating Military

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Figure 6: connection diagram

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4.9 Specification for temperature controller using PIC16F877A Sample specification for

the prototype development

A. The prototype should maintain the temperature within 60ºC to 65ºC.

B. If temperature exceeds 65ºC then the system should switch ON the Chiller.

C. If temperature falls below 60ºC then the system should switch OFF the Chiller.

D. The sensor data as well as the temperature should be displayed on LED Display for every

0.5seconds.

Hardware design for temperature controller using PIC16F877A

Block diagram

Figure 7: block diagram of chiller function

PIC 16F877A

LM 35 LED display

Chiller

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Figure 8: block diagram

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4.10 Software design for temperature controller using PIC16F877A

Flowchart

Figure 9: flow chart for temperature controller.

Start

ADC

Read

Temperature

Wait 0.5s

ON Chiller

LED Display

Tem A>65

Tem A<65

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4.12 Program

Figure 10: temperature controller program

Figure 11: temperature controller program

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4.13 Build successful

Figure 12: build successful

Figure 13: proto type

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5.0 Chapter 05 (Conclusion & Recommendation)

The most suitable method of cooling system according to design specification and customer

requirement is Compact Liquid Cooling System because this system is compatible with most of

the micro controllers and Pc components and this cooling system can cool more than two or three

Pc components and the effect of corrosion in this flow system is very less.

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6.0 References

Temperature sensor Avalable at : http://www.ti.com/lit/ds/symlink/lm35.pdf(assed on 1st feb

2013).

Pic microcontroller Available at: http://en.wikipedia.org(assed on 1st feb 2013).

Microprocessor settings Available at:

http://www.eng.uwi.tt/depts/elec/staff/feisal/ee25m/resources/ee25m-lect2.pdf (assed on 1st feb

2013).

Calculating Cooling Loads Available at: http://www.engineeringtoolbox.com/cooling-loads-

d_665.html(assed on 1st feb 2013).

POWER SYSTEM Available At

http://en.wikipedia.org/wiki/PC_Power_and_Cooling#Power_Supply_Models(assesd on 1st feb

2013).

Chiller Available at: http://www.ez-saltwater-aquarium.com(Assed on 1st feb 2013).

Tools and technique Available at: http://www.lytron.com/Tools-and-Technical-

Reference/Application-Notes/The-Best-Heat-Transfer-Fluids-for-Liquid-Cooling(assed on 1st feb

2013).

Radiator and fans Available at:http://www.xtremesystems.org/forums/showthread.php?54331-

Guide-To-WaterCooling-and-Leak-Testing-ALL-New-WaterCooler-s-Read-Before-

Posting!(Assed on 1st feb2013).

Water block available at http://www.engineersgarage.com/articles/temperature-

sensors?page=2(Assed on 1st feb2013).

System reliability Available at http://www.pcpower.com/technology/optemps/(Assed on 1st feb

2013).

What is liquid cooling Available at http://compreviews.about.com/od/cpus/a/LiquidCooling.htm(Assed on 1st feb

2013).

Operating temperature Available at: http://www.pcpower.com/technology/optemps/(assed on 1st feb 2013).

Why My CPU Temperature Is Too High Available at: http://www.ehow.com/facts_7576368_cpu-

temperature-high.html (assed on 1st feb 2013).

Guide for water cooling, Available at: http://www.tomshardware.com/reviews/a-beginners-

guide-for-watercooling-your-pc,1573.html(assed on 28th

Jan 2013).

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Water cooling goes wrong, implementing flow available

at:http://www.pcpro.co.uk/blogs/2011/02/03/why-you-should-be-wary-of-water-cooled-

pcs/(Assessed 22nd

august 2012)

IBM Research, Hot water cooled – super computer available at:

http://www.zurich.ibm.com/news/12/superMUC.html(Assessed 22nd

august 2012)

Water cooling set up, Tubing available

at:http://www.overclockers.co.uk/productlist.php?groupid=962(Assessed

Designing water cooling

system:http://www.maximumpc.com/article/howtos/howto_water_cool_your_pc:(Viewd and

Assed on 27/9/2012).

Pc liquid cooling system:

http://www.pcworld.com/article/227964/pc_liquid_cooling_system_do_it_yourself.html(Viewd

and assed on 27/9/2012).

Thermal effects of Processor:

http://www.popularmechanics.com/technology/how-to/build-pc/4213273(viewd and Assed on

29/9/2012).

Water cooling goes wrong, implementing flow available at:

http://www.pcpro.co.uk/blogs/2011/02/03/why-you-should-be-wary-of-water-cooled-

pcs/(Assessed 22nd

august 2012)

Water cooling set up, Tubing available

at:http://www.overclockers.co.uk/productlist.php?groupid=962(Assessed 23rd

august 2012)

FINAL PROJECT REPORT December 15, 2012

ICBT Page 33

7.0 Appendices

MPLAB Programmer

#include <pic.h>

#define _XTAL_FREQ 4000000

// ****select variables*******

unsigned int count;

unsigned int a2d_result;

unsigned int value;

unsigned char dig1;

unsigned char dig2;

unsigned char dig3;

unsigned char

dig_value[10]={0x3F,0x06,0x5B,0x4F,0x66,0x6D,0x7D,0x07,0x7F,0x6F};

double temp;

void get_result();

void dis_value();

void b2d_convesion();

void data_out(unsigned char tx_data);

void tx_data();

void main(){

// ******A to D conveter pin select********

TRISB=0; // PORTB output

PORTC=0;

TRISA=0x20; // RA5/AN4(7pin) input

TRISC=0x80; //RC7 input, RC6 output(Tx & Rx)

ADCON0= 0B01100001; // Fosc/8, RA5/AN4 input, AD on

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ICBT Page 34

ADCON1= 0B10001001; // right justify, RA5/AN4 Pin analog In put (Vdd

& Vss ref)

OPTION=0x07; // Timer0 on

TMR0=0;

TXSTA=0x24; // Tx enable, BRGH=1(High speed)

SPBRG=25; // 9600bps baud rate (BR=Fosc/16(X+1))

RCSTA=0x90; // RX enable, continuous receive

//// ***********Timer select**********

TMR1CS=0; // Internal clock (Fosc/4)

T1CKPS1=1; // Prescaler 1:8

T1CKPS0=1;

TMR1H=0x0B;

TMR1L=0xDC;// 3036 load to timer1 (65536-62500=3036)/get 0.5 second

count=0;

TMR1ON=1; // Timer1 on

TMR1IF=1;

while(1){

get_result();

dis_value();

if(TMR1IF==1){ //Timer1 overflow?

TMR1H=0x0B;

TMR1L=0xDC; //reload timer value

count++; // count=count+1

if(count==7200){ // 2 count=1second because

7200coont=1hour

tx_data(); // send deta to PC

count=0;

}

}

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}

}

void get_result()

{

if(T0IF==1){ // wait for cap charge?

ADGO=1; // A2D coversion start

while(ADGO==1){ //wait for "GO bit 0"

}

a2d_result=0;//right justify the analog result in 10 bit

a2d_result=ADRESH;

a2d_result=a2d_result<<8;

a2d_result=a2d_result+ADRESL;

temp=((double)999/(double)1023)*a2d_result; // get point value

value=(unsigned int)temp; // to get real value

b2d_convesion(); // call new funtion

T0IF=0; //ready to get new analog result

}

}

void b2d_convesion()/ analog result devide to 3 7-segment display

{

dig1=value/100;

value=value%100;

dig2=value/10;

dig3=value%10;

}

void dis_value() //display the tempreger

value on 7 segments

{

FINAL PROJECT REPORT December 15, 2012

ICBT Page 36

PORTA=0; //digits off

PORTB=dig_value[dig1];

RA1=1; //digit1 on

__delay_ms(1);

RA1=0; //dig1 off

PORTB=dig_value[dig2];

RA2=1; // digit2 on

RB7=1;

__delay_ms(1);

RA2=0; //dig2 off

PORTB=dig_value[dig3];

RA3=1; // digit3 on

__delay_ms(1);

RA3=0; //dig3 off

}

void tx_data()

{

data_out(dig1+0x30); //display temreture value in computer

data_out(dig2+0x30);

data_out('.');

data_out(dig3+0x30);

data_out(' '); //display "Celsius" in computer

data_out('C');

data_out('e');

data_out('l');

data_out('s');

data_out('i');

data_out('u');

data_out('s');

data_out(' ');

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ICBT Page 37

data_out(' ');

}

void data_out(unsigned char tx_data)

{

while(TXIF==0){ //buffer empty?

}

TXREG=tx_data;

}

****************END***************************

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ICBT Page 38

FINAL PROJECT REPORT December 15, 2012

ICBT Page 39

Water cooling system for Pc and servers

8.0 Time plan for the project

Table 4: time plan

Months

Work AUG SEP OCT NOV

Selecting Relevant Project title

and report submission

Identifying problems and

Preparing the report

Identifying Design Parameters

Identifying Conceptual designs

Identifying the Optimum

operating Conditions

Applying relevant Mathematical

Modeling

Finding relevant Workshop to

Manufacture components

Finishing Manufacturing and

Machining Works

Finishing design with Assemble

and Testing

Evaluation and cost analysis

Final project report

Final Presentation

1 2 3 4 1 2 3 4 1 2 4 1 2 3 4 3