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LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Electronics Manufacturing ESD Control Fundamentals
Ver. 2.0 (2017)
Copper Hou (CTO)
iNARTE (US) Certified ESD Engineer (ESD-00583-NE)
ESDA (US) Registered Member (20160044)
LEAN ESD Technology Corporation Limited
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Outline
Device Electrical Induced Failures
Device Electrical Failure Modes
Static Electricity and ESD
ESD Mechanism
How ESD Impact on Electronic Devices
Present ESD Event Types in Manufacturing
Device ESD Protection Strategies
Manufacturing ESD Control Approaches
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Device Electrical Induced Failures
Catastrophic FailureDevices exhibit functional failures due to physical damage by
electrical stress, often detected with metal melting open, metal
melting short, PN junction breakdown, etc.
Parametric FailureDevices still functions well even if slight damage occurred due to
electrical stress, but one or more parameters exceeding the designed
control limit.
Latent FailureDevices do not exhibit functional and parametric failures after
stressed by electrical signals, however, usually found parametric or
functional failures at very earlier time during normal operations.
VCSEL LIV reliability test
MR head MRR
parametric changeNormal NG
Updated page
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Device Electrical Failure Modes
Energy Failure Mode
The current flow through devices when
electrical signal stressed on energy
susceptible devices. Thermal failure
would occur upon the current reach to
the maximum withstanding level.
Voltage Failure Mode
Dielectric materials contained in voltage
susceptible devices would be broken
down when the voltage applied reach to
the maximum withstanding level.
Failure mode Analogy
ESDTR50.0-03-03
ESDTR50.0-03-03
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Typical Device Electrical Failure Cases
Typical Device Energy Failures by ESD/EOS
Typical Device Voltage Failures by ESD/EOS
MOSFET IC RF IC
MCU IC
SAW Filter IC
TFT line of LCD panel
TFT line of LCD panel
Added page
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Static Electricity and ESD
Static Electricity
Also referred to Electrostatic
Charge
Refer to electric charge at
rest.
ESD
Electro-Static Discharge
Refer to the spontaneous
electrostatic charge
transferring induced by an
electric field
There always exists electric
charges in the atmosphere,
named as Electro-Static charge.
Lighting is caused by numerous
electrostatic charges transferring in
a very short time, named as ESD.
VS
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
ESD Mechanism
ESD will not occur until both conditions met
The presence or accumulation of electrostatic charges
The available path for charge transferring
ESD Mechanism Formula
Q (Charge) + M (Transfer Path) = ESD
Either Q or M not met, ESD will not occur.
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
The Threats of ESD to Electronic Devices
ESD would typically produce either threat
Rapid (ns-us) and big discharge currents (usu. over 100mA)
Great potential difference (usu. over 50 V) across dielectric
material within device structure
Induce Energy Thermal Failures
Induce Voltage Breakdown Failures
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
How ESD Impact on Electronic Devices?
The ways ESD impact on electronic devices
Highly charged objects discharge to devices
Highly charged devices discharge to other objects at ground
or other different potentials
Devices exposed in high electrostatic fields may induce
voltage difference or current flow within device circuitry.
TFT-LCD:
Typical field
sensitive
Updated page
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Present ESD Failure Types in Manufacturing
Charged Personnel discharge to Device/PCBA
Charged tools discharge to Device/PCBA
Charged Cable discharge to PCBA
Charged Device/PCBA discharge to grounded tools
HBM System level HBM
MM
CDM CBM
CDE
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Device ESD Protection Strategies
Q (Charge) + M (Charge Transfer Path) = ESD
Strategy 1
Charge Generation/
Accumulation Control
1.Prefer to select low
charging materials
2.Eliminate/limit insulators
3.Use charge elimination/
neutralization
Strategy 2
Discharge Path
Control
1.Avoid non process
required contact with device
leads, eps. metal contacts
2.Always take static
dissipative surface for
Device intimate contact
Strategy 3
Device ESD Protection
1.Add built in ESD
protection circuitry
2.Take ESD protective
packaging for devices
during handling, storage or
transportation
Electrostatics CANNOT be avoided, but ESD damage CAN!
Updated page
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Manufacturing ESD Control Approaches
Construct EPA for ESD sensitive
devices operations
Set up ESD protective
workstations for ESD sensitive
devices operations
Establish ESD grounding/
equipotential bonding for each
ESD workstation
Operator shall be grounded/
bonded for ESD sensitive
devices handlings
Eliminate/ limit insulators within
each ESD workstation
Prefer to use dissipative
materials for ESD sensitive
device intimate contact
Take ionization as secondary
option to eliminate/ control
charges
Take ESD protective
packaging for ESD sensitive
devices during handlings,
storage and transportation.
Take appropriate ESD caution
awareness for easy personnel
ESD control identification
LEAN ESDTM Technology (Guangzhou) Co., Ltd.
Revision Change History
Version 1.0
First release in 2016.
Version 2.0
2nd updated release in 2017.
Added actual device failure cases of parametric and latent
failures;
Added the page of typical device energy and voltage failures;
Added typical field sensitive device, TFT of LCD panel;
Updated ESD protection strategy;
Added revision change history page.
Added page