EE 229 Final Report

8/8/2019 EE 229 Final Report

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EE 229 : Research Topic Proposal

INTEGRATIONOF SILICON PHOTONICSIN CMOS TECHNOLOGYFORTHE

APPLICATIONOF DLP TELEVISION

Edward Lau

006433401

Abstract

This report details the proposal of integrating silicon photonic circuits with

electronic circuits in CMOS technology processes for the application ofDigital Light Processing Televisions (DLP TV) in 3D. By implementing

photonic circuits with electronic circuits, we can increase data rates and

improve control over a single DLP unit to create better picture for such

technology as 3D picture. Photonic integrated circuits have gained interest

the past few years due to the emergence of various fabrication techniques

using conventional CMOS processes to allow for simple and economical

fabrication of photonic circuits using well understood fabrication techniques.

Silicon photonics have shown to provide data rates of 25Gb/s much higher

than what electronic circuits can provide. With these high data rates, control

system units used for DLP units can now receive and process larger amounts

of data at higher speeds, and therefore allowing higher control of DLP units

for better picture in DLP Television.


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1. Topic : Silicon Photonic Circuits and its application in DLP

Television

a. Objectives of Proposed Work

The objective of this proposal is the integration of photonic circuits with

electronic circuits using streamlined CMOS silicon processes and without the

use of expensive or exotic materials such as GaI, InP, et al. By integrating

photonic circuits with electronic circuits, the first objective is to show a

circuit can get higher data rates. These data rates will be compared against

state-of-the-art electronic circuits to compare data rates. The second

objective, the application of the first objective, is to control a single Digital

Light Processing (DLP) unit and observe if integrated photonic and electronic

integrated circuits can better control a single DLP unit, using conventional

control systems analysis as a meter.

The application of high performance control systems for control of DLP units

can be found in television, notably 3D television. This report will further

detail the limitations and motivations for higher performance picture in

television and its part in the growth of 3D television.

b. History of Photonics

Photonics is the scientific field dealing with the manipulation of light, by

means of emission, detection, transmission, sensing, et al. The field of

photonics began in the 1960's (1) with the finding of the first LASER (Light

Emission by Stimulation Emission of Radiation) followed by the finding of the

first laser diode in the 1970's. Since then, various photonic devices and

means of transmission have been researched and developed to give

photonic engineers the ability to manipulate and control light for applications

ranging from signal processing, to imaging to aid in research, and to

research for their unique abilities. Since the 1970s, photonics has been one


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of the fastest growing fields, driven by demands in industries such as

information, communication, manufacturing and life sciences (2).

Why photonics? What advantages does it offer over electronics? The simplest

answer is speed. Light travels at the speed of light. Unlike electrons in

conventional electronics, photons have no weight and create no resistance

(3). At high speeds, light can carry far more data and carry high amount of

energy within a small amount of focused light with a much higher bandwidth

(4). When comparing a voltage pulse to a laser pulse, a laser pulse is on the

order of magnitude of one quadrillionth (10^-15) of a second for an atomic

reaction to take place (5). Light also does not suffer from environmental

limitations that electronics suffers from, such as temperature affecting itsperformance (6). In short, the limitations of electronics are starting to get

taken away when using photonics to the overall integration of electronic and

photonic integrated circuits.

c. Myth: Limitations of Silicon in the application of

photonics

In the last decade, the field of photonic integrated circuits (PIC) has been of

particular interest. Compared to its counterpart movement of electrons in

electronics photonics offers higher speed, higher bandwidth and lower

power possibilities. However, silicon's relatively large bandgap (1.3um to

1.5um) has seemingly rendered it non-transparent for photonic application

until recently (7). As a result, photonics has historically suffered from the

reputation of being expensive, which will be explained in Section 3.2.

Electronics, on the other hand, has taken off with Moore's Law as CMOSprocesses using silicon have pushed the development of electronic

integrated circuits to double the number of transistors every 18 months (8).

d. State of the Art: Integrated Photonic Circuits


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A photonic integrated circuit consists of a laser, a waveguide a modulator

and a photodetector. As previously stated in Section 1.c, silicon has been

thought of to be inadequate for photonic applications and photonics has

been historically suffered from the reputation of being expensive in both

fabrication and its usage of exotic materials. However, all is not grim for the

usage of silicon as a material for use in photonics. Silicon material offers high

index contrast between silicon (n=3.45) and SiO2 (n = 1.45) making it

possible to scale down photonic devices at the nanometer scale for state-of-

the-art sub-micron CMOS processes (9). The high index contrast makes

silicon desirable for using 3rd order nonlinear interactions, namely, the

Raman and Kerr effect (10). Silicon also offers high thermal conductivity and

high optical damage threshold making it desirable to use for photonic circuits

as well (11).

Considering the silicon laser first, silicons indirect bandgap makes the

design for its usage as a laser a challenge. As a result of its indirect bandgap,

specific phonons must be emitted or absorbed to conserve momentum;

otherwise, the resulting transition will suffer from hysteresis resulting in

electrical-to-optical conversion efficiency of 10-4 to 10-3 in even the highest

purity of silicon (12). To overcome this limitation, many approaches have

been considered with only the Raman scattering approach has been proven

successful, first proposed in 2002, demonstrated in 2004 as a pulse mode

laser followed by a demonstration as a continuous-wave (CW) laser in 2005

(13).Intel has demonstrated the first cascaded Raman silicon laser up to

mid-IR (1.848um) emitting mW magnitudes of power, enabling the possibility

for cheap powerful semiconductor lasers to be used (14). The main

challenges for silicon Raman devices are to overcome the loss of free

carriers due to 2-photon-absorption (15). The carrier density can be reduced

by using a reverse-bias p-n junction to sweep carriers out (thus, CW gain);

however, the free-carriers screening occurs in high power saturation

intensities, in addition to heat being produced (16).


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Unfortunately, silicon lasing has only been demonstrated using Raman

amplification thus far and does not allow for laser packaging on-chip (i.e.

Raman amplification requires optical pumping) (17). Off-chip laser sources

are relatively high cost and large for packaging with the silicon chip (18).

(Note that there are advantages to having the laser off-chip, such as heat

dissipation.) Another method is bonding or soldering low-cost lasers onto the

chip; however, this requires submicron alignment accuracy to couple into

single-mode waveguides (19). While the optically pumped laser off-chip is a

major step in the developments towards a photonic-integrated circuit, an

electrically pumped silicon laser is desired (20). The most recent proposal is

a hybrid approach of wafer-bonding processes (21). Multiple hybrid lasers

are fabricated simultaneously across the patterned silicon wafer, so that

alignment is unnecessary between the III-V wafer and the patterned silicon

wafer (22). Fabrication can then take place at the wafer, partial-wafer or die-

level.

The next consideration is the silicon modulator. While silicon does not offer

the same electro-optic effects as LiNbO3 offers due to silicons centro-

symmetric crystal structure, silicon can make use of plasma dispersion to

achieve high speed modulation (23). Plasma dispersion makes use of

changing the real and imaginary parts of the refractive index of the free

carriers in silicon, mimicking that of a MOS capacitor. When a positive

voltage is applied to the p-type silicon, charge carriers accumulate at the

oxide interface and thus change the refractive index to encode the binary

data of an incoming optical beam (24). The liming factor in speed is due to

the parasitic capacitance in silicon (i.e. RC time constant) but mitigated by

making use of co-propagation of electrical and photonic signals through a

waveguide to lower the RF attenuation (25). In 2008, Intel was able to reach

speeds of 30GHz (40Gb/s) with the goal of reaching 1Tb/s (26).


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The next component to consider is the silicon photodetector. Recently,

Luxtera has developed a silicon-germanium photodetector to be integrated

in large-scale integration for applications in infrared wavelength, useful for

silicon applications (27). By depositing small amounts of pure germanium to

a silicon wafer where light-to-electron conversion is required, silicon can now

be effectively used as a photodetector (28). This process gives the

advantage of being low cost production, highly reliable and high yield.

Current downsides include thermal budget for fabrication and an inherent

mismatch in lattice constant between germanium and silicon, making it

difficult to achieve low dark current in the photodetector (29).

Fig XX : Description of the components comprising a photonic integrated

circuit. Image courtesy ofhttp://memebox.com/futureblogger/show/1461

The current state of the art in the application of silicon photonics are found in

Nortals add/drop multiplexors for optical attenuators (30), Luxteras wave-

division multiplexing transceivers and optical interconnects in Sony

Playstation 3 (31). In the current research, IBM has introduced silicon

nanophotonics targeted towards on-chip integration of ultra-compact

nanophotonic circuits for computer chips (32).

e. Application: 3D and DLP Television
http://memebox.com/futureblogger/show/1461http://memebox.com/futureblogger/show/1461


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Fig XX : Description of the operation of a DLP unit and how it is used to project

an image on a screen for televisions. Image courtesy of

http://www.pctechguide.com/57Projectors_DLP.htm

The 2009-release of the American Film Avatar has shown early signs of

positive growth in the industry of 3D television. Previous to the release of

Avatar, 3D productions had been released, but one of the major limitations

was the quality of picture for 3D. Lack of sharpness, missing features, offset

polarized picture all contribute to a disagreement between what the humaneyes see and what the brain interprets, leading to headaches for many

viewing 3D productions (33). In a competitive and action-driven industry,

televisions and films are driven by high quality picture and contrast. This can

be seen in television going from cathode ray tubes to Plasma or LCD (Liquid

Crystal Displays) to DLP (Digital Light Processing), television broadcast going
http://www.pctechguide.com/57Projectors_DLP.htmhttp://www.pctechguide.com/57Projectors_DLP.htm


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from analog to digital and storage media from limited memory CD's

(Compact Disc) to DVD (Digital Versatile Disc) to Blue-Ray - all with the

underlying trend of more data, more contrast, more quality, and soon, in 3D.

2. Hypothesis

a. Motivation for Silicon Integrated Photonic Circuits

Since 1965, Moore's Law detailing the exponential growth of CMOS

technology has proven true (34). However, as we push transistor dimensions

of less than 20nm (grain size of polysilicon) we are starting to see the

limitations of Moore's Law for electronics in CMOS technology, leading rise to

the motivation for other possible sciences to supplement or replace current

designs in CMOS technology. Several research options ranging from carbon

nanotubes to spintronics to plasmonics to spinplasmonics have offered

various opportunities to solve the limitations of electronics in CMOS

technology; However, most of these options are limited in their application

for various reasons, ranging from their ability to be mass produced in a

realistic process, other technologies required for their operation or

downsides to the application of their respective science..

Silicon Photonics may be one solution to the question of what will be the next

step when electronic integrated circuits can't be made any smaller. Silicon

has been the primary semiconductor in which a whole generation of

electronics has been built upon (35): Silicon wafers have the lowest cost per

unit area (36) and its fabrication techniques and platforms are well

understood and established for large scale integration (37). Despite its

indirect bandgap, silicon offers some desirable photonic qualities. Its high

index contrast between silicon and silicon dioxide (n-3.45 and n-1.45,

respectively) make it possible to scale down photonic devices to nanometer

scale and making high optical intensities easily observable for on-chip

devices to the 3rd order (i.e. Raman and Kerr effects). Silicon's high thermal


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conductivities and high optical damage threshold also make it desirable in

the application of photonics in silicon.

b. Motivation: Application of 3D Television

The motivation for the application of integrating photonic circuits with electronic

circuits is to provide higher data rates to DLP control systems to show higher

performing control systems for a single DLP unit. Should the experiment show that

the use of photonic integrated circuits improve control systems for a single DLP

unit, it will be possible to further implement the integration of photonic circuits to

get higher quality picture in DLP TV (38), paving way for the growth of 3D in not just

movies, but household TV's.

c. Hypothesis

Develop the integration of silicon photonic integrated circuits (PIC) with

silicon electronic integrated circuits on a single chip for the application for

the integration of 3D television (Using high-precision DLP control) with large-

volume storage media. Various silicon photonic components will be explored

(i.e. silicon modulators, silicon photodetectors, silicon multiplexors, et al) to

overcome the limiting factor in data rates. Using higher speed, large volumedata transmission using optical interconnects similar to Sonys Playstation 3

(25Gb/s), future large volume storage media will enable higher frequency

control over DLP for higher precision detail for 3D. As a result, conventional

issues playing 3D such as lack of precision and visual distortion causing

headaches can be mitigated. Particular attention will be focused on

determining what are the limiting factors in controlling the response of the

DLP. By improving the frequency of DLPs refresh rate, the DLP can more

accurately detail the wavelength of light emitted for each cell by receiving

the data early and using conventional control system methods in electronic

ICs.


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3. Procedure (3 / 2-4 pages)

a. Test

The test for positive results will be broken two components.

1. Observe the transient and frequency response of the circuit (photonic

components complementing electronic components) and compare its

results against current industry results against current technology

using only electronics for DLP TV. The results to be measured include

data rates (bit/sec), frequency response, stability, noise and linearity. A

bus of a train of pulses will be fed into the input of the circuit. The

number of bits, and the data rate being fed into the circuits input will

be gradually increased, and measurements will be taken at the output.

These results are to be done in silicon test.

2. Using the data in (1), the signal is to be fed into a produced control

systems unit for DLP (which can take data rates up to the maximum

data rate done in (1) to control the movement of a single DLP unit. The

angle and percent overshoot of the DLP will be measured in intervalsas short as possible to analyze the response of the DLP for both

settling time at a desired percent overshoot and percent overshoot at

a desired settling time.

b. Measuring Metric

Similar to the description of the test, (1) and (2) will have measurement

metrics to show correlation between the output of the circuit and controlover the DLP.

c. Procedure

Experiment : Test 1


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The first test will be to test the data rates of the circuit. After the hybrid

silicon/electronic integrated circuit, and its peripherals have been designed

and fabricated, a silicon test will be done to observe its performance. The

entire system will be designed to perform the same function as the current

functions performed by DLP systems, that is, the current state-of-the-art for

controlling a single DLP unit. A large package of data (i.e. 100TB) of data will

be sent into the black box and the output will be measured for how long it

takes for the data to reach the output. This will demonstrate the speed of

data rate transmission for the silicon/electronic integrated circuit.

Aside from measuring data rates, distortion, linearity, et al will be measured

to evaluate how accurate the data is. By knowing the input data, and theexpected output data, the evaluated output will be compared against the

theoretical output to evaluate the bit error rates. Signal-to-noise will also be

measured to evaluate how well the overall system discriminates signals from

noise generated in the system. During the design, tap-out pads will be

placed at intervals of stages to evaluate the signal integrity at each tap-out

so that sub-systems can be analyzed for its limitations.

Experiment : Test 2

In this experiment, the hybrid photonic/electronic system will be connected

to a single DLP unit and designed and programmed to control a single DLP

unit. During this experiment, data rates similar to that of a movie will be

input into the system and performance of the DLP unit will be evaluated. A

Matlab and Simulink model will be used to gather data of the DLP unit. The

Matlab-Simulink setup will measure how fast the system responds to inputdata, to determine how fast the DLP unit has taken to reach 1% of its

expected settling angle (in 3-dimensions (x-y-z). We note that the 1%

overshoot or undershoot is of all 3 dimensions versus 1 dimension.


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A physical setup will also be used to measure the wavelengths of light

emitted. A spectrophotometer will be used to measure the lights intensity for

particular wavelengths. Experimental results for wavelengths intensity of

light will be compared theoretical expected wavelengths intensity based on

the input data in the system to see how well the DLP is able to reflect (or

emit) the desired colour of light. Deviations from its expected value will be

used to generate a percentage error on how closely a DLP unit is able to

match the desired colour of light, and these deviations will be plotted against

the wavelengths in the visible spectrum to present forth the accuracy and

clarity in which the DLP system with hybrid photonic/electronic control

systems are able to display desired colour. This test (i.e. test for the output

wavelength of light) will be repeated multiple times (i.e. 100 times) to show

the mean and deviation of the spectrum of output wavelengths to observe

the overall accuracy of the entire system.

d. Analysis

The first part of the experiment will be to determine the data rates of the

hybrid silicon/electronic integrated circuit, performed as a system. As

described in Section 3.c, a large package of data (i.e. 100TB) will be sent into

the output and the amount of time it takes to process the data will determine

the data rate of the hybrid integrated circuit, found by dividing the amount

of data over the length of time to get the data rate.

The second part of the experiment will make use of Matlab Simulink to

acquire and process data, in its entirety, for the specification listed in Section

4.b. The hardware to be used will be an Analog Plant Simulator (APS) tostudy the behavior of the dynamics of a DLP unit (39). Data Acquisition

Systems will also be used to measure the digital-to-analog conversion, i.e.

the digital data package and the analog response signal. A universal power

module will also be required to power the overall system.


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Matlab/Simulink with Control Systems Toolbox will be the software used to

simulate acquire the data through a block-diagram connections (40). WinCon

offers real-time control systems to run the Matlab/Simulink generated code

to acquire data real time to a computer (41).

Finally, a photodiode will be connected to the output of DLP unit to read the

electromagnetic spectrum generated by the DLP unit. Data results will be

taken using LabView (42).

e. Evaluation

i. Positive Results

Positive results expected here will be that the photonic/electronic circuit can

process higher data rates for test 1, and as a result, a faster and faster and

higher precision response will be measured in the rotation of the DLP unit.

ii. Negative Results

Possible negative results that are not being heavily considered (but are

being measured) includes the frequency response, linearity and the noise of

hybrid electronic/photonic circuit that ma degrade the performance of the

control system. Should higher data rates (expected from test 1) not correlate

to higher precision DLP (in test 2) the data analyzed for frequency response

and stability should be analyzed to refine or disprove the hypothesis.

iii. Range of Results

The range of uncertainty will rely in the other factors (than data rates)

contributing to the amount of control of the DLP control system, as noted

above in Negative Results. While the hypothesis suggests that hybrid

electronic/photonic circuits will improve DLP performance, other observations


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are to be recorded and analyzed to consider the overall performance of the

hybrid circuit.

f. Qualifications

I believe I am qualified to perform the research topic on silicon photonics

because my BSc Electrical Engineering specialization was in the field of

photonics and MEMS/nanotechnology. I have studied extensively in

photonics, starting from the fundamentals of how electromagnetic waves

propagate through mediums and materials, optics of beams and components

to manipulate electromagnetic waves, light-matter interaction with both

laser optics and plasma. I also have studied laser systems ranging from

specific properties of laser light to its photon lifetime, laser oscillators and it

s respective threshold properties and conditions, and different light beams

with focus on the more conventional Gaussian beams and its gain saturation

over its photon lifetime.

I also have experience working with the production of MEMS (micro-

electrical-mechanical machines) for the understanding and analysis of a DLP

unit. I have fabricated both passive and active components in

microfabrication facilities in the full entirety of the fabrication process in

conventional CMOS fabrication processes. I also performed tests and

experiments on my fabricated active components to understand the

interaction between applied electrical signals on the mechanical movement

of MEMS. I have also worked at a microfabrication facility in the

development of MEMS, and have experience understanding the process

considerations and failures in the fabrication of MEMS.

I hope to put my knowledge and understanding of both photonics and MEMS

together to perform the research and experiment detailed in this report.


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4. Plan (2 / 2-4 pages)

a. Scope

The scope of the work will be two-fold. The first will be to design a integratea photonic-electronic circuit for a DLP unit control system and observe the

data rates, while also recording its transmission performance and comparing

it against conventional CMOS electronic circuits. The second scope of work

will be to control a single DLP unit and observe how the control system

performances for a single DLP unit, using control systems theory and

knowledge to observe the test and compare it against conventional CMOS

electronic circuits.

b. Specifications

Test 1 : Data Rates

Data Rate for the hybrid photonic/electronic integrated circuit,

compared to the electronic integrated circuit.

Test 2: Control Systems Analysis

Slew Rate using conventional metrics (10% to 90%)

Percent overshoot over incremental settling times

Frequency Response of the system; Flatness (i.e. amount of ripple) of

the system to its -3dB pt

Stability of the system (Measured by Bode Plots and s-plane for poles

and zeros)

Linearity Measurements for a slow ramping signal over its input range


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Noise analysis in the frequency domain, in terms of its input-referred

noise.

The settled angle the DLP unit has settled will be compared against the

theoretical or expected angle to show better control over the DLP

unit.

c. Expected Results

In Test 1, the expected result is that the data rates the hybrid

photonic/electronic circuit will increase, as predicted in the hypothesis.

In Test 2, we will analyze the system using control systems theory. With

improved data rates, it is hypothesized that we can improve the accuracy of

the feed-back transfer function (as well as the feed-forward transfer function

for an overall accurate closed-loop transfer function. This should improve the

slew rate and minimize the percent overshoot (i.e. improve the settling

time). Stability and frequency response should not change as a as the

function remains constant, and linearity should not change as the signal

processing is performed using the same logic using CMOS electronics. Inputreferred noise should also remain the same, as the same CMOS electronic

integrated circuits will be used as before.

The final expected result is whether the experiment improves control of a

single DLP unit. A signal will be fed into the overall system (i.e. the hybrid

photonic/electronic integrated circuit) and the output will be the wavelength

of light emitted. This output wavelength of light will be carried out multiple

times, and compared against the desired result to show whether the

experiment was a success.

5. Conclusion


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This report details the proposed application of silicon photonics in DLP

Television to improve television quality and 3-Dimensional presentation. By

integrating photonics with electronic integrated circuits in conventional

CMOS fabrication processes, the hybrid integrated circuit can achieve high

speed operation and deliver high data rates without many of the limitations

facing conventional electronics. By increasing the data rates offered by the

hybrid integrated circuit, more data can be provided and used in the control

systems for the control of a single digital light processor unit (DLP) used in

DLP Television. It is proposed in this report that by increasing the amount of

data at higher speeds, we can improve both the accuracy and the speed of

the control system for the DLP to emit a more accurate wavelength of a

single pixel on a television. As a result, improving the accuracy of a DLP unit

improves the quality of picture shown on an overall DLP Television, taking

away limitations and paving way for the continued growth of 3D Television.


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References (40 references)

1. Photonics - History of photonics . Spiritus-Temporis.com. [Online] 2005. [Cited:

May 4, 2010.] http://www.spiritus-temporis.com/photonics/history-of-photonics.html.

2. Dr Dietmar Knipp. Photonics and Optical Communications. InternationalUniversity Bremen. [Online] 2007. [Cited: May 4, 2010.] http://www.faculty.iu-

bremen.de/dknipp/c320352/Syllabus/Syllabus%20Photonics%20and%20Optical

%20Communication.pdf.

3.Jorg Niehoff, T.P. Pearsall. Photonics for 21st Century. [Online] [Cited: May 4,

2010.]

ftp://ftp.cordis.europa.eu/pub/ist/docs/dir_c/mnoc/photonics_for_the_21st_century_e

n.pdf.

4. Compressing photonic signals for greater bandwidth. [Online] Nov 3, 2009.

[Cited: May 4, 2010.] http://www.physorg.com/news176486984.html.

5. Lasers Could Speed Cancer Testing. Photonics.com. [Online] Feb 18, 2010. [Cited:

May 4, 2010.] http://www.photonics.com/Article.aspx?AID=41015.

6. Silicon Photonics Technologies for Monolithic Electronic-Photonic Integrated

Circuit. www.electrochem.org. [Online] [Cited: May 4, 2010.]

http://www.electrochem.org/meetings/scheduler/abstracts/217/0914.pdf.

7. Collins, Peter J. Band Gap Energy in Silicon. [Online] April 16, 2008. [Cited: May

4, 2010.] http://www.ajur.uni.edu/v7n1/Low%20et%20al%20pp%2027-32.pdf.

8. Moore's Law: Made by Intel innovation. [Online] [Cited: May 4, 2010.]

http://www.intel.com/technology/mooreslaw/.

9. Akiyama, Shoji. DSpace@MIT : High index contrast plateform for silicon

photonics. [Online] 2004. [Cited: May 4, 2010.]

http://dspace.mit.edu/handle/1721.1/28882.

10. Silicon Photonics. Fathpour, Jalali B. 12, s.l. : IEEE Journal of Lightwave

Technology, 2006, Vol. 24.

11. Silicon Photonics: CMOS Going Optical. Tsybeskov, L. Lockwood, D.J.

Ichikawa, M. 7, s.l. : Proceedings of the IEEE, 2009, Vol. 97.

12. Walters, Robert J. Silicon Nanocrystals for Silicon Photonics. California

Institute of Technology. [Online] May 24, 2007. [Cited: May 4, 2010.]

http://rwalters.caltech.edu/thesis.pdf.


19/21

13. Rong, Haisheng, Jones, Richard, Liu, et al. A continuous-wave Raman

silicon laser. [Online] Feb 17, 2005. [Cited: May 4, 2010.]

http://www.nature.com/nature/journal/v433/n7027/full/nature03346.html.

14. Rong, Haisheng, Liu, Ansheng, et al.

http://techresearch.intel.com/UserFiles/en-us/photonics/R817-nature03273.pdf.[Online] Jan 20, 2005. [Cited: May 4, 2010.]

http://techresearch.intel.com/UserFiles/en-us/photonics/R817-nature03273.pdf.

15. Dum, Belle. All-silicon laser makes its debut. [Online] Jan 5, 2005. [Cited: May

4, 2010.] http://physicsworld.com/cws/article/news/21163.

16. Can silicon change photonics?Jalali, B. 2, LA : physica status solidi (a), 2008,

Vol. 205.

17.Jones, Richard, Cohen, Oded, et al. A Hybrid Silicon Laser.photonics.com.

[Online] Jan 2007. [Cited: 04 06, 2010.] http://www.photonics.com/Article.aspx?

AID=27801.

18. Paniccia, M,. Koehl, S. IEEE : The Silicon Solution. The Silicon Solution.

[Online] Oct 2005. [Cited: May 6, 2010.]

http://spectrum.ieee.org/semiconductors/design/the-silicon-solution/0.

19. Integrated Photonics. Paniccia, M., Morse, M., Salib, M. s.l. : Springer Berlin /

Heidelberg, 2004, Vol. 94/2004. 978-3-540-21022-1.

20. Electrically pumped hybrid AlGaInAs-silicon evanescent laser. Fang, A., Park,

H., et al. 20, s.l. : OSA, 2006, Vol. 14.

21. Semiconductor Today - First electrically pumped hybrid silicon laser.Juno

Publishing and Media Solutions Ltd. [Online] Sept 19, 2006. [Cited: May 6, 2010.]

http://www.semiconductor-today.com/news_items/SEPT_06/INTELUSB_190906.htm.

22. Hybrid silicon integration.Jones, R., Park, H.D., et al. 1, s.l. : Springer New

York, 2009, Vol. 20. 0957-4522 (Print) 1573-482X (Online).

23. Recent development in a high-speed silicon optical modulator based on reverse-

biased pn diode in a silicon waveguide. Liu, A., Liao, L., et al. 6, s.l. :

Semiconductor Science and Technology , 2008, Vol. 23.

24. Electro-Optical Modulators in Silicon. Libertino, S., Sciuto, A. s.l. : SpringerBerlin / Heidelberg, 2007, Vol. 119/2006. 0342-4111 (Print) 1556-1534 (Online).

25. Liu, A., Liao, L., et al. High-speed optical modulation based on carrier

depletion in a silicon waveguide. [Online] [Cited: May 6, 2010.]

http://regmedia.co.uk/2007/01/27/intelsp.pdf.


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26. Recent Progress in Silicon Photonics. Paniccia, M., Liao, L., et al. Hawaii :

Fifth International Symposium on Advanced Science and Technology of Silicon

Materials, 2008.

27. High-Speed Near Infrared Optical Receivers Based on Ge Waveguide

Photodetectors Integrated in a CMOS Process. Gianlorenzo, M., Sahni, S., et al.196572, Carlsbad : Advances in Optical Technologies, 2008, Vol. 2008.

28. Silicon Detectors for Low Energy Particle Detection. Tindall, C.S., Palaio, N.P.,

et al. Berkeley : IEEE Nuclear Science Symposium Conference Records, 2006.

29. Development of CMOS-Compatible Integrated Silicon Photonics Devices.

Izhaky, N., Morse, M.T., et al. 6, Haifa : IEEE, 2007, Vol. 12. 1077-260X .

30. Silicon Photonics.Jalali, B., Fathpour, S. 12, s.l. : Journal of Lightwave

Technology, 2006, Vol. 24. 4600-4615.

31. Inquirer, By The. Intel's new hybrid photonic chip shines. [Online]http://www.atomicmpc.com.au/, Feb 12, 2009 . [Cited: May 6, 2010.]

http://www.atomicmpc.com.au/News/136996,intels-new-hybrid-photonic-chip-

shines.aspx.

32. Kincade, K. OPTOELECTRONIC APPLICATIONS: NANOPHOTONICS - Silicon

photonics sets the stage for optical datacom. [Online] OptoIQ, March 1, 2008.

[Cited: May 6, 2010.] http://www.optoiq.com/index/display/article-

display/322026/articles/laser-focus-world/volume-44/issue-

3/features/optoelectronic-applications-nanophotonics-silicon-photonics-sets-the-

stage-for-optical-datacom.html.

33. DrWes. How 3D TV Can Affect Your Health. getbetterhealth.com. [Online]

Better Health Network, Health Tips, Opinion, Research, 29 April, 2010. [Cited: May

6, 2010.] http://getbetterhealth.com/how-3d-tv-can-affect-your-health/2010.04.29.

34. Moore, G.Cramming more components onto integrated circuits. s.l. : Intel,

1965.

35. Huff, H.Into the Nano Era. NY : Springer Series in Material Science, 2009. 978-

3-540-74558-7.

36.A novel low-cost, high-efficiency micromachined silicon solar cell. Weber, K.J.

Blakers, A.W., et al. 1, Canberra : Electron Device Letters, IEEE , 2004 , Vol. 25.

0741-3106.

37. The large-scale integration of high-performance silicon nanowire field effect

transistors. Li, Q., Zhu., X., et al. 41, Fairfax : Nanotechnology , 2009, Vol. 20.

10.1088/0957-4484/20/41/415202.


21/21

38. 3d TV - 3D DLP. [Online] Texas Instruments. [Cited: May 6, 2010.]

http://www.dlp.com/hdtv/dlp-features/3d-hdtv.aspx.

39. Quanser: Analog Plant Simulator. [Online] Quanser. [Cited: May 6, 2010.]

http://www.adeptscience.co.uk/products/controls/quanser/p_quan_M_analog_plant_s

imulator.html.

40. Control System Toolbox 8.5. [Online] Mathwords. [Cited: May 6, 2010.]

http://www.mathworks.com/products/control/.

41.A MATLAB-Based Control Systems Laboratory Experiance for Undergrad

Studnets: Towards Standardization and Shared Resourcesq. Dixon, W.E., Sawson,

D.M., et al. 3, s.l. : IEEE Transactions on Education, 2002, Vol. 45. 0018-9359-02.

42. Measure Light Intensity using Photodiode. [Online] EMANT Pte Ltd. [Cited: May

6, 2010.] http://www.emant.com/324003.page.

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