Dicing saw Disco DAD 3650 user manual - 東京大学eric/Equipments/...Dicing saw Disco DAD 3650 user manual (2018/06/12) Open the sliding door (slide it to the right). Check visually

Dicing saw Disco DAD 3650 user manual

Eric Lebrasseur (Mita lab) 2018/06/12 from Japanese versionLeave this manual here. You can find an electronic version in the TakedaCR Wiki: http://takeda-cr.t.u-tokyo.ac.jp

1. Before use1.1. Sample protection

Particles produced by the dicing operation may damage the sample surface or may be difficult to remove. Thusit is highly recommended that you protect your sample with at least 1-2um of photoresist. You can use thephotoresist spin coater in CR1 for that. You can remove the photoresist after cutting in an acetone bath. Typicalresist and recipe are JSR 7790g-27cp, 3000rpm 1min spin coating, 110°C 90s bake.

1.2. About installed bladesThis dicer is equipped with two types of blades (cf. §14 and §15 for shared blades specifications):

1.2.1. One blade for glass on Z1 side (right) (VDG): AAA (P1A861 SDC320N100CR10) 59X0.3X40 bladethickness 0.3mm

1.2.2. One blade for Si on Z2 side (left) (VDS): 27HEED (NBC-ZH-2050-SE-27HEED) blade exposure0.89~1.02mm, kerf width 0.03~0.035mm.

Each blade has its own ID number (e.g. VDG###). The installed blade ID is written on the blade box at the leftside of the machine. The stock is stored on the metal rack at the right hand side of the machine. When only oneblade is left in the stock, contact the management team ([email protected]).

1.3. About device dataThe maximum number of folders for device data is fixed to 30 in this machine. This number would be reachedrapidly if each laboratory was creating its own folder. As a consequence, new device data have to be created inthe “share” folder. Be sure to include your lab name or you own name in the name or ID of the recipe.

1.4. About hairline alignmentThe hairline alignment is the alignment of the green line shown on the screen that is representing the expectedcutting line position (called hairline) with the actual cutting line position after dicing. It is not mandatory (exceptafter changing blade), but it is recommended if you need a good accuracy. It can be done either on a region ofthe sample that you can spare, or if you don't have such a region, on a dummy sample (you can use the oneprovided by nanoplat).The hairline alignment must be done after changing a blade.

1.5. About software languageIt is possible to change the language of the software to English. If you do so, be sure to set it back to Japaneseafter use. Do the following to change the language:

1.5.1. From the top menu, press “F7　エンジニアリングメンテナンス” エンジニアリングメンテナンス” ” (F7 engineering maintenance),1.5.2. Press “F4 ユーザー設定データ” データ” ” (F4 user setup data),1.5.3. Select the language in the field “言語切り替え” り替え” 替え” え” ” (language change),1.5.4. Press “Enter”

The translator has not experienced yet dicing in English mode, so the translations of the menu terms in thismanual may be different from the translations in the control software.

2. Starting upFill out the log sheet,

2.1. Switch on the tape mounter (Fig. 1, red button), and switch on the pump bellow the tape mounter table (Fig. 2),2.2. Switch on the dicer breaker in the distribution Board B2P-7,2.3. On the wall behind the machine (left side), open the valves 1, 2, 3 (air, cutting water, cooling water) (Fig. 3),2.4. Switch on the breaker on the back side of the machine (Fig. 4),2.5. Turn the key labeled POWER in front of the machine until it start (Fig. 5). If the lamp inside the machine is turned

off, you can turn it on by pressing SW,

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Dicing saw Disco DAD 3650 user manual (2018/06/12)

Fig. 1: Tape mounter Fig. 2: Vacuum pump

Fig. 3: The 3 valves Fig. 4: Breaker on the back sideof the machine

Fig. 5: POWER key

2.6. Wait until the software is launched,2.7. Press "シス” テムイニシャル" (System Initial) button (Fig. 8-2.7.) and wait until the message “シス” テムイニシャ

ルを終了しました” 終了しました” しました” ” (system initial is finished) appears in the top part (Fig. 8-Message)2.8. In the top menu, press [F4 ブレードメンテナンス” → F6 ブレード情報 (4.6)] (F4 Blade Maintenance → F6

blade information) to check the blade information (cf. §13). If the type of blade (品種) is not standard, correct itaccording to §2.9. Then press EXIT.

2.9. In the blade maintenance screen (ブレードメンテナンス” ), press [F1 ブレード交換] (F1 Blade exchange). Theprocess chamber door opens.If it is necessary to correct the type of blade, press [F5 ユーザーブレード選択→ ブレードセレクタ” (4.1.5)] (F5select user blade → blade selector) and change the type of blade according to the blade exchange manual§3.15.

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Fig. 6: Blade exchange area


Open the sliding door (slide it to the right). Check visually the blade that you plan to use. Fig. 7 shows someexamples of a new blade and a defective blade.

If the blade is damaged, or if you want to use your own blade, change the blade now (cf. Blade exchangemanual). If there is no problem, close the sliding door and press [ 顕微鏡部カバーオープン／クローズカバーオープン／クローズ ](Microscope part open/close) → EXIT → EXIT → EXIT.

2.10. In the low part of the top menu, press “ス” ピンドル” (spindle) and “切り替え” 削水” ” (cutting water) (Fig. 8). If youneed an accuracy as good as few micrometers, it is recommended to keep this state for 30 minutes. During thistime, you can set the device data (§4) and set up the sample (§5 until §5.8).

Fig. 8: Top menu (トップメニュー) Fig. 9: Machine maintenance screen (マシンメンテナンス)

2.11. Adjustment of the cutting and cooling water flow (added on 180205)

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Fig. 7: Example of new blade (left) and deflective blade (right)


If necessary, it’s possible to adjust the cutting and cooling water flow during warming up.However, be aware that if the flow is very low, there may remain a lot of Si particles on the sample after cutting.It’s necessary to be careful of the water flow as there may be some daily variations.At the left side of the screen, there are four flow-meters with adjusting knobs. The flow will increase if you turncounterclockwise. Rotate gently until reaching the desired flow. Sometime it’s impossible to reach BLADE=1.0.Don’t rotate too strongly or it may BREAK!!The desired values are the following: BLADE = 1.0 SHOWER > 0.8

Before adjustment: bad example, when thewater is brown (dirty) after cut with Z2

After adjustment: the water is clear aftercutting

3. Chuck installation

Fig. 10: Porous chuck Fig. 11: Universal chuck

3.1. In the top menu, click “F6 マシンメンテナンス” ” (machine maintenance),3.2. Input the password: 123. The numeric keypad appears by pressing “123” button and the alphabetic keyboard

appears by pressing “qwe” button (Fig. 8-keyboard),3.3. Press “F1:C/T 取り外し” り替え” 外し” し” (F1:C/T removal) (Fig. 9-3.3.),3.4. Open the stage lid and install the chuck in the machine. There are two kinds of chuck: the 6inch/8inch porous

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chuck (Fig. 10) and the 8inch universal chuck (Fig. 11). 3.5. After chuck installation, press again “F1:C/T 取り外し” り替え” 外し” し” (F1:C/T removal) (Fig. 9-3.5.),3.6. In the center of the screen, in the “ チャックテーブル交換 ” (change chuck table) area, set the data

corresponding to the installed chuck and press “ENTER” (Fig. 9-3.6.),3.7. Press “F4 フォーカス” メンテナンス” ” (F4 Focus maintenance) (Fig. 9-3.7.). The focus maintenance screen

appears. Check that the chuck data are corrects,3.8. Press “F6 測定データ” 実行” ” (measurement execution),3.9. When the measurement is finished, press “F12 登録” ” (F12 recording). The message [データ” を終了しました” 変更しましたしました” ]

(data has been changed) appears. Press EXIT 2 times to go back to the top menu.3.10. At the bottom left of the top menu, press [ブレードセットアップ → チャックテーブルセットアップ (4.3.1) ]

(Blade setup → Chuck table setup) (Fig. 12)

Fig. 12: Blade setup

3.11. Press [Z1Z2 ス” タ” ート] (Z1Z2 start) at the right side of the chuck table setup screen (Fig. 13).

Fig. 13: Z1Z2 start

After the setup is finished, the result is displayed in the message box (Fig. 14). If the wear (摩耗量) is larger thannormal values (0.000 ~ 0.009mm 0.010mm), it may means that there is a mistake in the input data, or that theblade is damaged. In this case, check that there is no mistake in the data and that the blade is not damaged. Ifthe blade is damaged, press [F4 ブレード交換] (F4 Blade exchange) (Fig. 13) and change the blade according tothe blade exchange manual.

3.12. If there is no problem, press EXIT to return to the top menu.

4. Device data4.1. Press “F3 デバイス” データ” ” (F3 device data) in the top menu,4.2. If you want to make a new device data, we recommend that you copy the “4inchSi-sample” (for Si) or the

“5inchMASK-sample” (for glass) device data that are in the ROOT directory and modify the copy in order toadapt the program to your work. Select the device data that you want to copy, then press “F2 コピー” (F2 copy)(Fig. 15), select the directory where you want to save the copy, enter the name of the copy (Fig. 16) and pressENTER → EXIT.

4.3. Select your own device data and press ENTER,4.4. Set up the device data. There are two ways to do that: an intuitive basic mode and a more complete

advanced mode. Click “F5” at the bottom of the screen to change the mode.

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Fig. 14: Setup completed


Fig. 15: Device data screen Fig. 16: Copy screen. Input data name, etc. in thered square area.

4.5. Glossary:In this paragraph are explained the main parameters in a device data. Modify your device data according tothose explanation. !!! Be sure to press “ENTER” each time you modify a parameter in order to save it !!!

4.5.1. ID comment field (ID コメント) → write some explanations about this recipe,4.5.2. Work shape and size (ワーク形状、ワークサイズワークサイズ) → fix the shape and the size of the sample. You can

select either round (円形) or square (四角形). As for the size, it's better to set it a little bit larger than thesample size, for margin.

4.5.3. Index (インデックス” ) → distance in mm between cutting lines4.5.4. Cut type, cut direction (カット方法、ワークサイズカット方向)

Stage Screen

Rear

Front

The type of blade used depends on the selected cut type. Use Z1 when you cut glass and Z2 when you cut Si.As for the cut direction, “FRONT” means Z1 → Z2 (from top to bottom on the screen) and “REAR” means Z2→ Z1 (from bottom to top on the screen). In the semi auto mode, it is possible to change the cut directionbefore starting to cut. It is not possible to select the cut direction in the basic mode (単純モードモード).

4.5.5. Feed speed (送り速度り替え” 速度), spindle rotation rate (回転数)The feed speed is the same as the cutting speed. The spindle rotation rate is the same as the blade rotationrate. You may use the values defined in the sample device data or specify your own values.

4.5.6. Work thickness (ワーク厚みみ), tape thickness (タ” ープ厚みみ)The work thickness is the thickness of your sample.The tape thickness is the thickness of the tape on which the sample is fixed. The tape that we are using inTakeda CR is 0.08mm thick.

4.5.7. Blade height (ブレードハイト)This is the distance between the chuck and the edge of the blade during cutting. It is typically set to0.075mm.

4.5.8. Channel (チャンネル)Here are set the cutting directions, the number of cutting lines, the distance between cutting lines (index),etc. There is a maximum of 4 channels available.If the number of cutting lines is set to 0, the number of lines is calculated automatically as a function of thesample size and the index. In the basic mode, it is fixed to 0 and can't be changed.

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The used channels and the cutting order is set in the cutting sequence field (カット順序). For instance, “12”means cutting channel 1 (CH1) first, then channel 2 (CH2). In the basic mode, this is fixed to CH1 (0°, 0 lines)and CH2 (90°, 0 lines).

4.6. When the setup is completed, press ENTER to save the changes, then press EXIT → F10 デバイス” 確定データ” (deviceconfirmation) to register the data.

Fig. 17: Cutting data (カットデータ)

5. Setting sampleThis paragraph describes how to set the sample on a plastic film using the film mounter.

Fig. 18: Setting metallic frame on the film mounter Fig. 19: Fixing the sample on the plastic film

5.1. Wait until the temperature displayed on the tape mounter reaches 50°C,5.2. Open the tape mounter lid and place the metallic frame on the mounter, matching the frame notches with

the bumps on the mounter (Fig. 18),5.3. Switch on the vacuum switch, the chuck absorption switch and the film absorption switch on the front side of

the mounter,5.4. Put the sample in the center of the frame, the side that will be attacked by the blade facing down. The right

side corresponds to the lower part of the screen (rear) (Fig. 19),5.5. Pull the film to the front and fix the film to the metallic frame with the roller,5.6. Cut the film with a cutter in a circle, over the frame,5.7. Separate the pulled film from the large film roll with the cutter and throw away the leftover film,5.8. If there are some big air bubbles at the back of the sample, make a hole with the cutter to empty it,5.9. Take the frame with the sample, open the stage lid and put the frame on the chuck. Be sure to match the

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frame notches with the chuck bumps,5.10. Close the lid, press “C/T バキューム” (C/T Vacuum) at the bottom part of the top menu screen and check

that the light turns blue.If you use the dummy Si wafer for airline alignment, install it now.

6. Hairline alignment (mandatory after blade change, otherwise optional)Recommended if you need high accuracy, mandatory after bladechange. An incision is done at the surface of the sample. The bladeheight is fixed to 0.3mm, but you can change this value if necessary.

6.1. In the top menu, press “F4 ブレードメンテナンス” ” (F4 blademaintenance),

6.2. In the blade maintenance menu, press “F5 ヘアライン合わわ

せ” ” (F5 hairline alignment),6.3. Fill out the thickness of the sample (ワーク厚みみ). In case of

Z2 axis, if the cutting speed is to slow, it may damage the blade.Thus, set the Z2 axis (Si) speed to 4.000mm/s.

6.4. In the hairline alignment screen, proceed to alignment thesame way as described in §8 and set the position to the placeyou want to cut,

6.5. Check the designation of Z1/Z2 and press “START”. Thecutting starts,

6.6. When the cutting is finished, align the real cutting line with the hairline on the screen and press “F12　エンジニアリングメンテナンス” ヘアラ

イン補” ” (F12 hairline correction) at the bottom of the screen. The hairline width can be adjusted with “F4 ヘアラ

イン狭” ” (F4 narrow hairline) and “F10 ヘアライン広” ” (F10 widen hairline),6.7. Click EXIT to go back to the top menu. If you used a dummy wafer to do hairline alignment, press [C/T バ

キューム] (C/T vacuum), exchange the dummy wafer with your own sample, and press again [C/T バキューム](C/T vacuum).

7. Cutting selectionThere are two types of cutting. Select the one convenient for you.

7.1. Press “F2 マニュアルオペレーショ” (F2 manual operation),7.2. In the manual operation menu, press “F4 セミオートカット” (F4 semi auto cut) or “F3 オートカット” (F3

autocut),7.2.1. F3 autocut: after aligning each channel, the cut is done in one go according to the device data,7.2.2. F4 semi auto cut: alignment is done for each channel, it is possible to change the direction and number

of cutting line right before the cut, and it is possible to stop the cut by pressing stop button.

8. Alignment8.1. Press “F4 マニュアルアライメント（2,4,4）” (F4 manual alignment) at the bottom of the screen,8.2. Align CH1. Change the magnification to low (LO) by pressing “F11 倍率変更しました” (F11 change magnification).

Adjust the light intensity if necessary (光量),

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Fig. 20: Manual alignment screen

8.3. Press “F9 フォーカス” ” (F9 focus) → “オートフォーカス” ” (autofocus) to adjust the focus.8.4. Perform θ alignment (Fig. 21):

8.4.1. Align the hairline with the line on the sample that you want to cut or a line parallel to the line that youwant to cut.About displacement on the screen:

If you touch the image on the screen, the center of the image will moves to the place you touched. Forprecise displacements, you can use the arrow's keys in the scan field at the bottom right of the screen.You can move by unit of index (the values that you defined in the device data) by pressing the arrow's keyin the index field.

8.4.2. After having aligned the first end of the line, press “F5 θ合わわせ” ” (F5 θ alignment). The image will moveto the opposite end of the line. Align again the hairline with the line on the sample,

8.4.3. Press again “F5 θ合わわせ” ” (F5 θ alignment). The image moves back to the first end of the line. The lowmagnification alignment is completed.

Fig. 21: θ alignment

8.5. Press “F11 倍率変更しました” (F11 change magnification) to move to the high (HI) magnification. Adjust the lightintensity if necessary (光量),

8.6. Perform θ alignment again,8.7. Move the hairline to the position of the first cutting line and press “ENTER” . In the semi auto cut mode, or if

there is only one channel (CH1), it goes back to the cut screen.8.8. If there is a second channel (CH2) or if you are in auto cut mode, you have to do CH2 alignment now, the

same way you did CH1 alignment. Then move the hairline to the position of the first cutting line and press“ENTER”. It goes back to the cut screen.

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9. Start cutting9.1. In auto cut mode, press “START”. The cutting starts. When the cutting is finished, an alarm rings. Press “ ア

ラームクリア” (alarm clear).In semi auto cut mode (Fig. 22), press “F12 FRONT” or “F6 REAR” at the bottom of the screen to select thedirection of the cutting, then press “START”. The cutting starts. When the cutting is finished, an alarm rings.Press “アラームクリア” (alarm clear).In semi auto cut mode, if you use a second channel (Fig. 23):

9.1.1. Click on the wafer mark at the bottom right of the screen,9.1.2. Press IDX button at the bottom left,9.1.3. Click the right arrow to rotate by 90°,9.1.4. Click again on the wafer mark at the bottom right of the screen,9.1.5. Press [F4マニュアルアライメント]. The current channel is set to CH2. Adjust the focus and do θ alignment

as you did with CH1 (§8.3 and §8.4). Move to the starting position of the cut and start cut (cf. §9.1).

Fig. 22: Start cutting

Fig. 23: Sample rotation

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10. Unloading sample10.1. Press “EXIT” 2 times to return to the top menu,10.2. Press “C/T バキューム” (C/T vacuum) at the bottom side of the screen. The sample comes at the front of

the machine,10.3. Open the lid and take back the sample. Dry the sample and the chuck with the air gun at the right hand side of

the machine (this gun blows pressurized air, not nitrogen, so if you want to blow nitrogen, use the draft air guns).

Fig. 24: air gun

10.4. In case the sample has flown away:10.4.1. Stop the spindle,10.4.2. Press “顕微鏡カバーオープン/クローズ” (Open/close microscope cover),10.4.3. Open manually the sliding door,10.4.4. Look for the sample. It may have been taken away to the tray at the left back. It is possible to take out

this tray in order to check if there are samples inside.10.4.5. After taking back your sample, close the sliding door,10.4.6. Press “顕微鏡カバーオープン/クローズ” (Open/close microscope cover).

11. Shutting down (shut down while filling out the log sheet)If you used your own blade, set back the shared blade and input the information about the sharedblade in the blade exchange menu (cf. Description of blade exchange process and blade type setupprocess).

11.1. Dry the chuck area with the air gun,11.2. In the top menu, press “F6 マシンメンテナンス” ” (F6 machine maintenance), then press “F1 C/T 取り外し” り替え” 外し” し”

(F1 C/T removal),11.3. Take out the chuck, dry the back side with the air gun and put it back to it's storage place,11.4. Dry the stage on which was set the chuck and close the lid. Fill out the log,11.5. Press “EXIT” to go back to the top menu,11.6. Switch on the “ス” ピンドル” (spindle) and “切り替え” 削水” ” (cutting water) in order to clean the blade. Clean for

5min,11.7. Switch off the “切り替え” 削水” ” (cutting water) only. Let the spindle dry for 15min,11.8. Switch off the “ス” ピンドル” (spindle). If the machine is shut down without switching off the spindle, the

spindle will be damaged, so be sure to switch off the spindle.11.9. Press "シス” テムイニシャル" (System Initial) button (Fig. 8-2.7.) and wait until the message “シス” テムイニ

シャルを終了しました” 終了しました” しました” ” (system initial is finished) appears in the top part (Fig. 8-Message). Fill out the log sheet,11.10. Turn off the key labeled POWER in front of the machine (Fig. 5). Wait until it is shut down,11.11. Switch off the breaker on the left side of the machine (Fig. 4),11.12. On the wall behind the machine (left side), close the valves 1, 2, 3 (air, cutting water, cooling water) (Fig. 3),11.13. Switch off the dicer breaker in the distribution Board B2P-7,11.14. Switch off the pump bellow the tape mounter table (Fig. 2),11.15. Switch off the tape mounter (Fig. 1, red button),

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11.16. Fill out the log sheet, and the ipod log.If you broke more than one blade, you have to pay for the broken blades (starting form the second one). Inthe log system, select “broke more than 2 VDS (or VDG) blakdes on the same day” (cf. Fig. 25)

Fig. 25: Log system

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12. Annex 1: example of sample data file

The blade height is the distance from the top of the chuck to the bottom of the blade (uncut part)

Fig. 26: 4 inch Si

Fig. 27: 5 inch mask

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13. Annex 2: blade information (ブレード情報) example: when installing the standardblade.

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14. Annex 3: Standard blade for Si NBC-ZH-2050-SE-27HEED

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15. Annex 4: Standard blade for glass R07-SDC320-BB200-75 (58X0.3A2X40) (since2017/11/09)

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Documents

Dicing saw Disco DAD 3650 user manual - 東京大学eric/Equipments/...Dicing saw Disco DAD 3650 user manual (2018/06/12) Open the sliding door (slide it to the right). Check visually