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Department of Garments Manufacturing
Submitted By:
Submitted To:
Sir Qaisar Mushtaq
Types of Processor & RAMs in Current System units
Friday, August 30, 2013
Types of Processor
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Assignment # 2 Types of Processor & RAMs in Current System Units
Dual core:
Dual-core refers to a CPU that includes two complete execution cores per physical
processor. It has combined two processors and their caches and cache controllers onto a single
integrated circuit (silicon chip). Dual-core processors are well-suited for multitasking
environments because there are two complete execution cores instead of one, each with an
independent interface to the frontside bus. Since each core has its own cache, the operating
system has sufficient resources to handle most compute intensive tasks in parallel.
Core 2 Duo:
The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo with
two processor cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These
come in a wide range of performance and power consumption, starting with the relatively slow
ultra-low-power (10 W) and low-power (17 W) versions, to the more performance oriented (25
W) and (35 W) mobile versions and the (65 W) desktop models. The mobile Core 2 Duo
processors with an 'S' prefix in the name are produced in a smaller FC-BGA 956 package,
which allows building more compact laptops.
Within each line, a higher number usually refers to a better performance, which depends
largely on core and front-side bus clock frequency and amount of second level cache, which are
model-specific. Core 2 Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB
available in the specific stepping of the chip, while versions with the amount of cache reduced
during manufacturing are sold for the low-end consumer market as Celeron or Pentium Dual-
Core processors. Like those processors, some low-end Core 2 Duo models disable features such
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as Intel Virtualization Technology. Core 2 Duo was the first family of desktop-class
microprocessors based on Core microarchitecture. While the first Core 2 Duo processors had
much lower core frequency and approximately the same FSB frequency and level 2 cache size as
Pentium D microprocessors, they had better performance than the fastest Pentium D 960 due to
much more efficient microarchitecture. The only exception to this were the slowest (less than 2
GHz) Core 2 Duo CPUs, that could perform slightly worse in some benchmarks. Newer dual-
core CPUs have such improvements as higher core and FSB frequency, larger level 2 cache size,
and lower power consumption. All Core 2 Duo processors use the same socket 775 package
Core i3:
Intel intended the Core i3 as the new low end of the performance processor line from
Intel, following the retirement of the Core 2 brand.The first Core i3 processors were launched on
January 7, 2010. The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU
and two cores. The same processor is also available as Core i5 and Pentium, with slightly
different configurations.
The Core i3-3xxM processors are based on Arrandale, the mobile version of the
Clarkdale desktop processor. They are similar to the Core i5-4xx series but running at lower
clock speeds and without Turbo Boost. According to an Intel FAQ they do not support Error
Correction Code (ECC) memory. According to motherboard manufacturer Supermicro, if a Core
i3 processor is used with a server chipset platform such as Intel 3400/3420/3450, the CPU will
support ECC with UDIMM. When asked, Intel confirmed that, although the Intel 5 series chipset
supports non-ECC memory only with the Core i5 or i3 processors, using those processors on a
motherboard with 3400 series chipsets it will support the ECC function of ECC memory. A
limited number of motherboards by other companies also support ECC with Intel Core ix
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Assignment # 2 Types of Processor & RAMs in Current System Units
processors; the Asus P8B WS is an example, but it does not support ECC memory under
Windows non-server operating systems.
Core i5:
The first Core i5 using the Nehalem microarchitecture was introduced on September 8,
2009, as a mainstream variant of the earlier Core i7, the Lynnfield core. Lynnfield Core i5
processors have an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel
DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors with
different sets of features (Hyper-Threading and other clock frequencies) enabled are sold as Core
i7-8xx and Xeon 3400-series processors, which should not be confused with high-end Core i7-
9xx and Xeon 3500-series processors based on Bloomfield.
The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm
Westmere shrink of the Nehalem microarchitecture. Arrandale processors have integrated
graphics capability but only two processor cores. They were released in January 2010, together
with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in Core i5-
5xx processors is reduced to 3 MB, while the Core i5-6xx will use the full cache and the Core i3-
3xx will have no support for Turbo Boost. Clarkdale, the desktop version of Arrandale, is sold as
Core i5-6xx, along with related Core i3 and Pentium brands. It has Hyper-Threading enabled and
the full 4 MB L3 cache.
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Core i7:
Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64-
bit x86-64 processors using the Nehalem, Westmere, Sandy Bridge and Ivy Bridge
microarchitectures. The Core i7 brand targets the business and high-end consumer markets for
both desktop and laptop computers, and is distinguished from the Core i3 (entry-level consumer),
Core i5 (mainstream consumer), and Xeon (server and workstation) brands.Intel introduced the
Core i7 name with the Bloomfield Quad-core processor in late 2008. In 2009 new Core i7
models based on the Lynnfield desktop quad-core processor and the Clarksfield quad-core
mobile were added, and models based on the Arrandale dual-core mobile processor were added
in January 2010. The first six-core processor in the Core lineup is the Gulftown, which was
launched on March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as
five stars in the Intel Processor Rating. In January 2011, Intel released the second generation of
Core i7 processors. Both the first and second generation of Intel Core i7 processors are rated as 5
stars in the Intel processor rating. The second generation of Intel core processors are based on the
"Sandy Bridge" core and were updated in April 2012 with "Ivy Bridge".In each of the first three
microarchitecture generations of the brand, Core i7 has family members using two distinct
system-level architectures, and therefore two distinct sockets (for example, LGA 1156 and LGA
1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same
socket and QPI-based architecture as the low-end Xeon processors of that generation, while
lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the
Core i5."Core i7" is a successor to the Intel Core 2 brand Intel representatives stated that the
moniker Core i7 is meant to help consumers decide which processor to purchase as the newer
Nehalem-based products are released in the future.
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Assignment # 2 Types of Processor & RAMs in Current System Units
Types of RAMs
Static RAM:
Static random-access memory (SRAM) is a type of semiconductor memory that uses
bistable latching circuitry to store each bit. The term static differentiates it from dynamic RAM
(DRAM) which must be periodically refreshed. SRAM exhibits data remanence, but it is still
volatile in the conventional sense that data is eventually lost when the memoryis not powered.S-
RAM retains stored information only as long as the power supply is on. Static RAMs are
costlier and consume more power. They have higher speed than D-RAMs. They store
information in Hip-Hope.In static RAM, a form of flipflop holds each bit of memory. A flip-flop
for a memory cell takes four or six transistors along with some wiring, but never has to be
refreshed. This makes static RAM significantly faster than dynamic RAM. However, because it
has more parts, a static memory cell takes up a lot more space on a chip than a dynamic memory
cell. Therefore, you get less memory per chip, and that makes static RAM a lot more expensive.
Static RAM is fast and expensive, and dynamic RAM is less expensive and slower. Static RAM
is used to create the CPUs speedsensitive cache, while dynamic RAM forms the larger system
RAM space.
Dynamic RAM:
Dynamic RAM loses its stored information in a very short time (for milli sec.) even when
power supply is on. D-RAMs are cheaper & lower. Similar to a microprocessor chip is an
Integrated Circuit (IC) made of millions of transistors and capacitors.In the most common form
of computer memory, Dynamic Memory Cell, represents a single bit of data. The capacitor holds
the bit of informationa 0 or a 1. The transistor acts as a switch that lets the control circuitry on
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the memory chip read the capacitor or change its state. A capacitor is like a small bucket that is
able to store electrons. To store a 1 in the memory cell, the bucket is filled with electrons. To
store a 0, it is emptied. The problem with the capacitors bucket is that it has a leak. In a matter
of a few milliseconds a full bucket becomes empty. Therefore, for dynamic memory to work,
either the CPU or the Memory Controller has to come along and recharge all of the capacitors
holding it before theydischarge. To do this, the memory controller reads the memory and then
writes it right back. This refresh operation happens automatically thousands of times per second.
This refresh operation is where dynamic RAM gets its name. Dynamic RAM has to be
dynamically refreshed all of the time or it forgets what it is holding. The downside of all of this
refreshing is that it takes time and slows down the memory.
DDR1:
Double Data Rate-SDRAM, or simply DDR1, was designed to replace SDRAM. DDR1
was originally referred to as DDR-SDRAM or simple DDR. When DDR2 was introduced, DDR
became referred to as DDR1. Names of components constantly change as newer technologies are
introduced, especially when the newer technology is based on a previous e one. The principle
applied in DDR is exactly as the name implies double data rate. The DDR actually doubles the
rate data is transferred by using both the rising and falling edges of a typical digital pulse. Earlier
memory technology such as SDRAM transferred data after one complete digital pulse. DDR
transfers data twice as fast by transferring data on both the rising and falling edges of the digital
pulse.
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Assignment # 2 Types of Processor & RAMs in Current System Units
DDR2:
DDR2 is the next generation of memory developed after DDR. DDR2 increased the data
transfer rate referred to as bandwidth by increasing the operational frequency to match the high
FSB frequencies and by doubling the prefetch buffer data rate. There will be more about the
memory prefetch buffer data rate later in this section.DDR2 is a 240 pin DIMM design that
operates at 1.8 volts. The lower voltage counters the heat effect of the higher frequency data
transfer. DRR operates at 2.5 volts and is a 188 pin DIMM design. DDR2 uses a different
motherboard socket than DDR, and is not compatible with motherboards designed for DDR. The
DDR2 DIMM key will not align with DDR DIMM key. If the DDR2 is forced into the DDR
socket, it will damage the socket and the memory will be exposed to a high voltage level. Also
be aware the DDR is 188 pin DIMM design and DDR2 is a 240 pin DIMM design.
DDR3:
DDR3 was the next generation memory introduced in the summer of 2007 as the
natural successor to DDR2. DDR3 increased the pre-fetch buffer size to 8-bits an increased the
operating frequency once again resulting in high data transfer rates than its predecessor DDR2.
In addition, to the increased data transfer rate memory chip voltage level was lowered to 1.5 V to
counter the heating effects of the high frequency. By now you can see the trend of memory to
increase pre-fetch buffer size and chip operating frequency, and lowering the operational voltage
level to counter heat.The physical DDR3 is also designed with 240 pins, but the notched key is in
a different position to prevent the insertion into a motherboard RAM socket designed for DDR2.
DDR3 is both electrical and physically incompatible with previous versions of RAM. In addition
to high frequency and lower applied voltage level, the DDR3 has a memory reset option which
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DDR2 and DDR1 do not. The memory reset allows the memory to be cleared by a software reset
action. Other memory types do not have this feature which means the memory state is uncertain
after a system reboot. The memory reset feature insures that the memory will be clean or empty
after a system reboot. This feature will result in a more stable memory system. DDR3 uses the
same 240-pin design as DDR2, but the memory module key notch is at a different location.