Department f Garments Manufacturing

7/30/2019 Department f Garments Manufacturing

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Department of Garments Manufacturing

Submitted By:

Submitted To:

Sir Qaisar Mushtaq

Types of Processor & RAMs in Current System units

Friday, August 30, 2013

Types of Processor


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Assignment # 2 Types of Processor & RAMs in Current System Units

Dual core:

Dual-core refers to a CPU that includes two complete execution cores per physical

processor. It has combined two processors and their caches and cache controllers onto a single

integrated circuit (silicon chip). Dual-core processors are well-suited for multitasking

environments because there are two complete execution cores instead of one, each with an

independent interface to the frontside bus. Since each core has its own cache, the operating

system has sufficient resources to handle most compute intensive tasks in parallel.

Core 2 Duo:

The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo with

two processor cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These

come in a wide range of performance and power consumption, starting with the relatively slow

ultra-low-power (10 W) and low-power (17 W) versions, to the more performance oriented (25

W) and (35 W) mobile versions and the (65 W) desktop models. The mobile Core 2 Duo

processors with an 'S' prefix in the name are produced in a smaller FC-BGA 956 package,

which allows building more compact laptops.

Within each line, a higher number usually refers to a better performance, which depends

largely on core and front-side bus clock frequency and amount of second level cache, which are

model-specific. Core 2 Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB

available in the specific stepping of the chip, while versions with the amount of cache reduced

during manufacturing are sold for the low-end consumer market as Celeron or Pentium Dual-

Core processors. Like those processors, some low-end Core 2 Duo models disable features such


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as Intel Virtualization Technology. Core 2 Duo was the first family of desktop-class

microprocessors based on Core microarchitecture. While the first Core 2 Duo processors had

much lower core frequency and approximately the same FSB frequency and level 2 cache size as

Pentium D microprocessors, they had better performance than the fastest Pentium D 960 due to

much more efficient microarchitecture. The only exception to this were the slowest (less than 2

GHz) Core 2 Duo CPUs, that could perform slightly worse in some benchmarks. Newer dual-

core CPUs have such improvements as higher core and FSB frequency, larger level 2 cache size,

and lower power consumption. All Core 2 Duo processors use the same socket 775 package

Core i3:

Intel intended the Core i3 as the new low end of the performance processor line from

Intel, following the retirement of the Core 2 brand.The first Core i3 processors were launched on

January 7, 2010. The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU

and two cores. The same processor is also available as Core i5 and Pentium, with slightly

different configurations.

The Core i3-3xxM processors are based on Arrandale, the mobile version of the

Clarkdale desktop processor. They are similar to the Core i5-4xx series but running at lower

clock speeds and without Turbo Boost. According to an Intel FAQ they do not support Error

Correction Code (ECC) memory. According to motherboard manufacturer Supermicro, if a Core

i3 processor is used with a server chipset platform such as Intel 3400/3420/3450, the CPU will

support ECC with UDIMM. When asked, Intel confirmed that, although the Intel 5 series chipset

supports non-ECC memory only with the Core i5 or i3 processors, using those processors on a

motherboard with 3400 series chipsets it will support the ECC function of ECC memory. A

limited number of motherboards by other companies also support ECC with Intel Core ix


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processors; the Asus P8B WS is an example, but it does not support ECC memory under

Windows non-server operating systems.

Core i5:

The first Core i5 using the Nehalem microarchitecture was introduced on September 8,

2009, as a mainstream variant of the earlier Core i7, the Lynnfield core. Lynnfield Core i5

processors have an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel

DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors with

different sets of features (Hyper-Threading and other clock frequencies) enabled are sold as Core

i7-8xx and Xeon 3400-series processors, which should not be confused with high-end Core i7-

9xx and Xeon 3500-series processors based on Bloomfield.

The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm

Westmere shrink of the Nehalem microarchitecture. Arrandale processors have integrated

graphics capability but only two processor cores. They were released in January 2010, together

with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in Core i5-

5xx processors is reduced to 3 MB, while the Core i5-6xx will use the full cache and the Core i3-

3xx will have no support for Turbo Boost. Clarkdale, the desktop version of Arrandale, is sold as

Core i5-6xx, along with related Core i3 and Pentium brands. It has Hyper-Threading enabled and

the full 4 MB L3 cache.


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Core i7:

Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64-

bit x86-64 processors using the Nehalem, Westmere, Sandy Bridge and Ivy Bridge

microarchitectures. The Core i7 brand targets the business and high-end consumer markets for

both desktop and laptop computers, and is distinguished from the Core i3 (entry-level consumer),

Core i5 (mainstream consumer), and Xeon (server and workstation) brands.Intel introduced the

Core i7 name with the Bloomfield Quad-core processor in late 2008. In 2009 new Core i7

models based on the Lynnfield desktop quad-core processor and the Clarksfield quad-core

mobile were added, and models based on the Arrandale dual-core mobile processor were added

in January 2010. The first six-core processor in the Core lineup is the Gulftown, which was

launched on March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as

five stars in the Intel Processor Rating. In January 2011, Intel released the second generation of

Core i7 processors. Both the first and second generation of Intel Core i7 processors are rated as 5

stars in the Intel processor rating. The second generation of Intel core processors are based on the

"Sandy Bridge" core and were updated in April 2012 with "Ivy Bridge".In each of the first three

microarchitecture generations of the brand, Core i7 has family members using two distinct

system-level architectures, and therefore two distinct sockets (for example, LGA 1156 and LGA

1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same

socket and QPI-based architecture as the low-end Xeon processors of that generation, while

lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the

Core i5."Core i7" is a successor to the Intel Core 2 brand Intel representatives stated that the

moniker Core i7 is meant to help consumers decide which processor to purchase as the newer

Nehalem-based products are released in the future.


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Types of RAMs

Static RAM:

Static random-access memory (SRAM) is a type of semiconductor memory that uses

bistable latching circuitry to store each bit. The term static differentiates it from dynamic RAM

(DRAM) which must be periodically refreshed. SRAM exhibits data remanence, but it is still

volatile in the conventional sense that data is eventually lost when the memoryis not powered.S-

RAM retains stored information only as long as the power supply is on. Static RAMs are

costlier and consume more power. They have higher speed than D-RAMs. They store

information in Hip-Hope.In static RAM, a form of flipflop holds each bit of memory. A flip-flop

for a memory cell takes four or six transistors along with some wiring, but never has to be

refreshed. This makes static RAM significantly faster than dynamic RAM. However, because it

has more parts, a static memory cell takes up a lot more space on a chip than a dynamic memory

cell. Therefore, you get less memory per chip, and that makes static RAM a lot more expensive.

Static RAM is fast and expensive, and dynamic RAM is less expensive and slower. Static RAM

is used to create the CPUs speedsensitive cache, while dynamic RAM forms the larger system

RAM space.

Dynamic RAM:

Dynamic RAM loses its stored information in a very short time (for milli sec.) even when

power supply is on. D-RAMs are cheaper & lower. Similar to a microprocessor chip is an

Integrated Circuit (IC) made of millions of transistors and capacitors.In the most common form

of computer memory, Dynamic Memory Cell, represents a single bit of data. The capacitor holds

the bit of informationa 0 or a 1. The transistor acts as a switch that lets the control circuitry on


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the memory chip read the capacitor or change its state. A capacitor is like a small bucket that is

able to store electrons. To store a 1 in the memory cell, the bucket is filled with electrons. To

store a 0, it is emptied. The problem with the capacitors bucket is that it has a leak. In a matter

of a few milliseconds a full bucket becomes empty. Therefore, for dynamic memory to work,

either the CPU or the Memory Controller has to come along and recharge all of the capacitors

holding it before theydischarge. To do this, the memory controller reads the memory and then

writes it right back. This refresh operation happens automatically thousands of times per second.

This refresh operation is where dynamic RAM gets its name. Dynamic RAM has to be

dynamically refreshed all of the time or it forgets what it is holding. The downside of all of this

refreshing is that it takes time and slows down the memory.

DDR1:

Double Data Rate-SDRAM, or simply DDR1, was designed to replace SDRAM. DDR1

was originally referred to as DDR-SDRAM or simple DDR. When DDR2 was introduced, DDR

became referred to as DDR1. Names of components constantly change as newer technologies are

introduced, especially when the newer technology is based on a previous e one. The principle

applied in DDR is exactly as the name implies double data rate. The DDR actually doubles the

rate data is transferred by using both the rising and falling edges of a typical digital pulse. Earlier

memory technology such as SDRAM transferred data after one complete digital pulse. DDR

transfers data twice as fast by transferring data on both the rising and falling edges of the digital

pulse.


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DDR2:

DDR2 is the next generation of memory developed after DDR. DDR2 increased the data

transfer rate referred to as bandwidth by increasing the operational frequency to match the high

FSB frequencies and by doubling the prefetch buffer data rate. There will be more about the

memory prefetch buffer data rate later in this section.DDR2 is a 240 pin DIMM design that

operates at 1.8 volts. The lower voltage counters the heat effect of the higher frequency data

transfer. DRR operates at 2.5 volts and is a 188 pin DIMM design. DDR2 uses a different

motherboard socket than DDR, and is not compatible with motherboards designed for DDR. The

DDR2 DIMM key will not align with DDR DIMM key. If the DDR2 is forced into the DDR

socket, it will damage the socket and the memory will be exposed to a high voltage level. Also

be aware the DDR is 188 pin DIMM design and DDR2 is a 240 pin DIMM design.

DDR3:

DDR3 was the next generation memory introduced in the summer of 2007 as the

natural successor to DDR2. DDR3 increased the pre-fetch buffer size to 8-bits an increased the

operating frequency once again resulting in high data transfer rates than its predecessor DDR2.

In addition, to the increased data transfer rate memory chip voltage level was lowered to 1.5 V to

counter the heating effects of the high frequency. By now you can see the trend of memory to

increase pre-fetch buffer size and chip operating frequency, and lowering the operational voltage

level to counter heat.The physical DDR3 is also designed with 240 pins, but the notched key is in

a different position to prevent the insertion into a motherboard RAM socket designed for DDR2.

DDR3 is both electrical and physically incompatible with previous versions of RAM. In addition

to high frequency and lower applied voltage level, the DDR3 has a memory reset option which


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DDR2 and DDR1 do not. The memory reset allows the memory to be cleared by a software reset

action. Other memory types do not have this feature which means the memory state is uncertain

after a system reboot. The memory reset feature insures that the memory will be clean or empty

after a system reboot. This feature will result in a more stable memory system. DDR3 uses the

same 240-pin design as DDR2, but the memory module key notch is at a different location.

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