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Contents

NO TITLE Page

1. INTRODUCTION 3

2. DESCRIPTION 3

3. CHIP ORGANIZATION 3

4. BLOCK DIAGRAM 5

5. DESIGN 5

6. CHIP COST CALCULATION 8

7. COMPARISON WITH CUSTOMER SPECIFICATIONS

8. CONCLUSION

. REFERENCES

1!. GRADING DECLARATION 1!11. APPENDI"

I# SCHEMATIC OF BASIC COMPONENTS

II# LA$OUTS OF BASIC COMPONENTS

III# MISCELLANEOUS

1!

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Introduction

T%& '&&( )*+ ),-&+/ 0* *&+ -,& &*+ (&&- )*+ 9-& ,- ,' -*+,:& %,- ;&&' +&,0-

+&?9+&&'- & %,& (&-:'&( %& &*+ * ;& ,- ),-/ -,00/ ,'( &*'*,0 ,- *--;0&. W& 9-&(

C,(&'& (&-:' **0 * (+, %& -%&, ,'( -;*0- *) ,00 %& -9; &00-. T+,'--*+ -

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Pin Configurations

Pin Descriptions

Pin Name Pin Function

A! A((+&-- L'&

A1 A((+&-- L'&A2 A((+&-- L'&

D! D,, L'&

D1 D,, L'&

D2 D,, L'&D3 D,, L'&(( P*&+ S90GND G+*9'(CE C% E',;0& C% S&0&

RW> R&,( E',;0& W+&

CLK C0*

A! A1 A2

D! D1

CE BMNP2! D2

CLK D3

GND RW> ((

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B"oc# Diagram

! RS !

.

!$ .

.

!2 RS 4

%&'(

CE

Design

T%& SRAM % %,- -&&' ;,- **'&'-. T%& ,+& %& ;,- &*+ &00/ %& +* (&*(&+/ %& -&'-&

,0)&+/ '9 +9+/ ; 0'& *'(*'&+/ ;9))&+- ,'( ,(-. T%& (&-:' *'-(&+,*'- *) &,% *) %&-&

**'&'- ,'( %& &,'- ; %% %& &+& -,-)&( ,+& (-9--&( ' %& )*00*': -&*'-.

)%!M Memor* Ce""s

T%& &*+ &00 - , 6+,'--*+ +9 %% - , )0 )0* *+-': * +*--*90&( '&+&+- ,'(

* ,&-- +,'--*+-/ %& ,&-- +,'--*+- 9+' *' %&' %& *+( 0'& - -&0&&( @%:% ,'( - *0,:&

+-&- * ((/ ,'( %& *''& %& )0 )0* * %& ; 0'&-. S

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B 0'&- -% +,0 * +,0 -9&--)900

R&,( *&+,*' (*&- '* (&-+* %& -*+&( ')*+,*' ' %& &00

M*(),*' *) %& -*+&( ')*+,*' (9+': %& (,,+& %,-& ;& ,00*&( C+9 - 9'& )+* '*-& ' &+,' +,':&

T%- -

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)ense !mp"ifier

T%& -&'-& ,0)&+ - *+,' ' %& *,0 &+)*+,'& *) %& SRAM % -'& %& -&'-& (&0, &

(+&0 ,))&- %& ,&-- &. S&'-& ,0)&+ - 9-&( * -&'-& %& -,00 %,':&- ' *0,:& %, +&-90-%&' , ,+90,+ &00 - -%&( *'* %& ; 0'&. O'& -,:& ())&+&',0 ,+ *) -&'-& ,0)&+ - 90

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Comparison of design resu"ts 4ith re6uired specifications

Memor* Capacit*7 T%& 9-*&+ '&&(- * -*+& 2! ;- *) ')*+,*' ,'( *9+ % +*(&- %&+&?9+&( &*+ ,,. M&*+ ,, ,' ;& &&'(&( * 4! ;- % , *+( 0&':% *) 8 ;- ;

*''&': * %- ' ,+,00&0.

%ead Time7 T%& ,9 +&,( & & :& ' *9+ (&-:' - ,+*,&0 1'- %% - &00 ;&0*%& 9-*&+>- -&),*'.

'rite Time7 T%& ,9 +& & & :& ' *9+ (&-:' - ,+*,&0 1'- %% - &00;&0* %& 9-*&+>- -&),*'.

Load Capa/i"it*7 O9+ (&-:' - ,,;0& *) (+': , 2F 0*,( %% ,%&- %& 9-*&+>--&),*'.

Po4er )upp"*7 P*&+ -90 +&?9+&&' *) 3 , ;& -90&( ; * D &00 ;,&+&-.

Temperature %ange7 O9+ (&-:' %,- ;&&' -9&--)900 &-&( *&+ , &&+,9+& +,':& *) !C *5!C * -,-) %& 9-*&+>- +&?9+&&'-.

)ize and Cost7 W& %,& (&-:'&( *9+ % * ;& &+&&0 -,00 ,'( *- &))&& %*9*+*-': ,' *) %& 9-*&+>- +&?9+&&'-.

Po4er Consumption7 S'& *9+ (&-:' &0*- CMOS 0*:/ %& -, *&+ *'-9*' -*'-(&+,;0 +&(9&(. T%& % &',;0& 0*: 9-&( ,0-* ,(- ' +&(9': %& *&+ ; (-,;0': %& -&'-&

,0)&+ +9 %&' %& % &',;0& 0'& :*&- %:%.

Conc"usion

T%& !.25+*' &%'*0*: CMOS (&-:' *) %& 2!; S, R,'(* A&-- M&*+ ,- -9&--)900

*0&&( * -,-) ,00 *) %& +&?9+&( -&),*'-. R&,( & ,'( W+& & *) %& SRAM % - 1'-

,'( 1'- %% ,+& ),+ ;&0* %& +&?9+&( -&),*'. T%& &*+ ,, ,' ;& &,'(&( * -*+& 4!;- *) ')*+,*' ; *''&': * %- ' ,+,00&0.

%eferences

1. ,' M. R,;,& & ,0./Digital Integrated Circuits: A Design Perspective/ 2'(E(*'/ P+&'& H,00/ 2!!3

2. IEEE *9+',0 *) S*0(S,& C+9-/ *0.SC1/ N*.5 O*;&+ 1843. IEEE *9+',0 *) S*0(S,& C+9-/ *0.SC2!/ N*.5 O*;&+ 185

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!ppendi8

I9 )chematics of Basic Components

!$7S%&, *) SRAM %!27S%&, *) R* D&*(&+

!37S%&, *) R&,( C+9

!.7S%&, *) W+& C+9

!,7S%&, *) D,, B9))&+ @F+- S,:&

!:7S%&, *) D,, B9))&+ @S&*'( S,:&

!;7S%&, *) D))&+&',0 A0)&+

II9 La*outs of Basic Components

B$7L,*9 *) SRAM % % IO P,(-

B27L,*9 *) SRAM %

B37L,*9 *) R* D&*(&+B.7L,*9 *) R&,( C+9

B,7L,*9 *) W+& C+9

B:7L,*9 *) D,, B9))&+ @F+- S,:&

B;7L,*9 *) D,, B9))&+ @S&*'( S,:&

B