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8/10/2019 Automation systems at Intel fab
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Automation Systems & ITAutomation Systems & ITwithin Intelwithin Intel s High Volumes High Volume
ManufacturingManufacturing
2006 MIT Manufacturing Summit2006 MIT Manufacturing SummitBimal Dey / Anthony MaggiBimal Dey / Anthony Maggi
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AGENDAAGENDA IntelIntel s Manufacturing Environments Manufacturing Environment
Automation Drivers/DomainsAutomation Drivers/Domains Focus Topic: AutomatedFocus Topic: Automated MatMat ll HandlingHandling
Focus Topic: Process Control SystemsFocus Topic: Process Control Systems
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IrelandIreland
Fab 14/24Fab 14/24
IsraelIsrael
Fab 8/18/28Fab 8/18/28
OregonOregon
Dev D1C/D1DDev D1C/D1DFab 15/20Fab 15/20
CaliforniaCalifornia
Dev D2Dev D2
ColoradoColorado
Fab 23Fab 23
Ar izonaAr izona
Fab12/22/32Fab12/22/32
New MexicoNew Mexico
Fab 7/11/11XFab 7/11/11X
Mass.Mass.
Fab 17Fab 17
Costa RicaCosta RicaSan Jose A/TSan Jose A/T
A/T DevA/T Dev
MalaysiaMalaysia
Penang A/TPenang A/TKulim A/TKulim A/T
ChinaChina
Pudong/ChenduPudong/ChenduA/TA/T
PhilippinesPhilippines
Manila A/TManila A/TCavite A/TCavite A/T
WashingtonWashington
Systems MfgSystems Mfg
Board MfgBoard Mfg
Kulim Board/Module MfgKulim Board/Module Mfg
BrazilBrazilSub-con Mfg.Sub-con Mfg.
ThailandThailand
Sub-con MfgSub-con MfgVietnam-ATVietnam-AT
Sub-con MfgSub-con Mfg
TaiwanTaiwan
Sub-con MfgSub-con Mfg
Sub-con MfgSub-con Mfg
Environment: Highly GlobalEnvironment: Highly Global
Wafer FabWafer Fab
Systems/Sub-conSystems/Sub-con
Assembly/TestAssembly/Test
Challenge: Deploy CE! IT capabilities across the globe
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Manufacturing Environment VectorsManufacturing Environment Vectors
AutomationAutomation
reliabilityreliability
ComputingComputing
securitysecurity
TechnologiesTechnologies
SupplySupply
chainchainoptimizationoptimization
AffordabilityAffordability
18 month18 month
cyclescycles
GlobalGlobal
dispersiondispersion
QualityQuality
expectationsexpectations
Cost ofCost ofexcursionsexcursions
CompetitiveCompetitive
challengeschallenges
Each are drivers as well as opportunities for IT
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IT Infrastructure Challenges in MfgIT Infrastructure Challenges in MfgEnvironmental vectors are confound by keyEnvironmental vectors are confound by key
challenges includingchallenges including
ComplexityComplexity
Exploitation of security vulnerabilitiesExploitation of security vulnerabilities
Explosive usage growth of products andExplosive usage growth of products andservicesservices
Equates to continued cost pressures
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AGENDAAGENDA
IntelIntel s Manufacturing Environments Manufacturing Environment
Automation Drivers/DomainsAutomation Drivers/Domains
Focus Topic: AutomatedFocus Topic: Automated MatMat ll HandlingHandling
Focus Topic: Process Control SystemsFocus Topic: Process Control Systems
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WIP Matchedto Current
Needs
Error free
processing
Higher
People
Productivity
Zero set
up time
Rapid New
Product Switch
over
Lot sizereduction
Key Automation Drivers for MfgKey Automation Drivers for MfgRapid
Factory
Cycle Time
Optimized Space
Management
High
Equipment
Availability &
Utilization
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AGENDAAGENDA
IntelIntels Manufacturing Environments Manufacturing Environment
Automation Drivers/DomainsAutomation Drivers/Domains
Focus Topic: AutomatedFocus Topic: Automated MatMat ll HandlingHandling
Focus Topic: Process Control SystemsFocus Topic: Process Control Systems
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Automation/IT role in 300mm MfgAutomation/IT role in 300mm Mfg
Com
municationBus
OHT
Process Equipment
Process Equipment
Litho Etch Films
Thermal Planar Metrology
Remote Command Centers
100% AMHS
Automated
Dispatching
Factory Wide User
Interfaces
Yield Analysis
CYBER SECURITY
Remote Diagnostics
Wafer/Unit Trace
New MES
Pervasive
FDC / SPC
Run to Run Control
with APCFramework
Tool Reliability Tracking
Real Time
Tool View
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Scheduler /
Dispatcher
Information Bus
Reticle
TrackingManufacturing Execution
System (MES)
Execution
Control (EC)
AMHS ComponentsAMHS Components
Process Equipment
I/Fs
E-5-SECS II
E-30-GEM
E-37 HSMS
E-87 Carrier Mgmt
E-90 Substrate Tracking
E-40 Process Job Mgmt
E-84 Parallel I/O forOHV
E-94 Control Job Mgmt
Process orMetrology
Equipment
Tool
Embedded
Controller
OHV
FOUP
Station
Controllers
Interbay
transport
AMHS Equipment I/Fs
E5 SECS II
E30 GEME37 HSMS
Stocker
Equipment
Interbay
controller
Intrabay
controller
Material Control
System (MCS)
E82 IBSEM
E84 Parallel I/OE88 Stocker SEM
Key Points:
1. Production Equipment standards and capabilities
were Critical to achieving 100% Intrabay
Automation
2. AMHS Standards enable mix and match of suppliertools to get Best In Class equipment
3. Major time focus was spent integrating software
capabil ities with Production and AMHS Equipment
4. All in-line process and metrology equipment must
be [and has been] connected to the AMHS
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Goal: Direct Tool to Tool WIPGoal: Direct Tool to Tool WIP
Movement without humanMovement without human
interventionintervention
300mm Automation300mm AutomationFully IntegratedFully Integrated
F11xF11x 2.6miles of track2.6miles of track
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Remote Operations Center in F11xRemote Operations Center in F11x
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AMHS SummaryAMHS Summary
Intel has achieved 100% Integrated IntrabayIntel has achieved 100% Integrated IntrabayAMHS in its 300mm FabsAMHS in its 300mm Fabs
100% integrated intrabay could not have been100% integrated intrabay could not have beenachieved in the same timeframe without openachieved in the same timeframe without openindustry standardsindustry standards
Rapid throughput AMHS transport systems areRapid throughput AMHS transport systems are
needed to meet demanding lot cycle times, fastneeded to meet demanding lot cycle times, fastrun rate production equipment, and complexrun rate production equipment, and complexprocess technology scenariosprocess technology scenarios
Future capabilities are planned to extend theFuture capabilities are planned to extend thecurrent technology to fully (near 100%)current technology to fully (near 100%)automated decision making for intrabayautomated decision making for intrabayscheduling and dispatchingscheduling and dispatching
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Overview of Process Control SystemsOverview of Process Control Systems
Metrology
Equipment
UI
Process
Equipment
UI
Metrology
Equipment
Step N-1 Step N+1Step N
Run to Run APC- Use feedback and feed forward
metrology and sensor data to adjust processing at the lot
and wafer level. Drive for multi -step control.
Various % - Decision is based on problem being solved
UI
FDC Monitor equipment
event and time series data.Stop tool when ranges or
profiles are exceeded
Pervasive Implementation
SPC Monitor statist ical
data and stop the tool if
trending to OOC
100% of the Fab
Essential Datastandards include SEMI
E40, E94, E90 for waferlevel control & tracking
Typical Usage of Process Control at a Process ToolTypical Usage of Process Control at a Process Tool
Sensors Use 3rd
party and embedded
sensors to provide
FDC & R2R APC data
Various % - Decision
is based on problembeing solved
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Evolution of Intel Process ControlEvolution of Intel Process Control
200mm
Gen 1
200mm Wafers
1st Generation
(1993)
Capabilityand
Efficiency
Time axis
200mmGen 3
Factory wide systems &usage of SPC & FDC
Point Solutions for Runto Run APC
Basic FDC & APCControl & Yield Analysis
300mm
Gen 4
200mm Wafers
3rdGeneration
(1999)
300mm Wafers
4thGeneration
(2007)
300mm Wafers
2ndGeneration
(2006)
Point solutions for SPCspread across the factory
Ad hoc and limi ted FDCand Run to Run APCControl Systems
Rudimentary ControlAnalytics
300mm
Gen 2
Factory wide systems &usage of SPC & FDC
Maturing FDC & APCControl Analytics
Reusable Run to RunAPC Framework withlitho coverage
Advanced YieldAnalysis and Analyt ics
Factory wide systems
and usage of PCS (SPC+ FDC + APC)
Advanced FDC & APCControl Analytics
Advanced YieldAnalysis and Analyt icsmoving towardpredictive models
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SUMMARYSUMMARY High Volume manufacturing in SemiHigh Volume manufacturing in Semi
industry presents many uniqueindustry presents many unique
challengeschallenges Advances in AMHS and PCS has beenAdvances in AMHS and PCS has been
key to addressing some of thesekey to addressing some of these
challengeschallenges Continued advances needed in theseContinued advances needed in these
two areas to keep pace with thetwo areas to keep pace with the
MooreMoores laws law and rapid pace of theand rapid pace of the
Semi technologySemi technology
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QuestionsQuestions
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ReferencesReferences
J. Wu, O. Rozmarin and B. Li,J. Wu, O. Rozmarin and B. Li, A Flexible Execution Control Framework forA Flexible Execution Control Framework for300mm Factory Automation300mm Factory Automationin Semiconductor Manufacturing, 2003in Semiconductor Manufacturing, 2003
Nimish Shah ,Nimish Shah , ASMC Keynote Presentation 2005ASMC Keynote Presentation 2005
E. Bass, D. Pillai, J. Dempsey,E. Bass, D. Pillai, J. Dempsey, 300mm Full-Factory Simulations for 90nm300mm Full-Factory Simulations for 90nmand 65nm IC Manufacturingand 65nm IC Manufacturingin Proceedings of the International Symposiumin Proceedings of the International Symposiumof Semiconductor Manufacturing (ISSM), 2003of Semiconductor Manufacturing (ISSM), 2003
B. Li and J. Wu,B. Li and J. Wu, Factory Throughput Improvement Through IntelligentFactory Throughput Improvement Through IntelligentIntegrated Delivery in 300mm Wafer ManufacturingIntegrated Delivery in 300mm Wafer Manufacturingin Proceedings of thein Proceedings of theInternational Symposium of Semiconductor Manufacturing (ISSM), 2003International Symposium of Semiconductor Manufacturing (ISSM), 2003
J. Wu and R. Madson,J. Wu and R. Madson, APF in IntelAPF in Intels 300mm Execution Control Strategys 300mm Execution Control StrategyininBrooks Worldwide Automation and Performance Symposium, 2002Brooks Worldwide Automation and Performance Symposium, 2002
J. Pettinato and M. Honma,J. Pettinato and M. Honma, Factory Integration RoadmapFactory Integration Roadmapat theat theInternational Technology Roadmap for Semiconductors (ITRS) Conference,International Technology Roadmap for Semiconductors (ITRS) Conference,20022002
B. Sohn, D. Pillai, N. Acker,B. Sohn, D. Pillai, N. Acker, 300mm Factory Design for Operational300mm Factory Design for Operational
EffectivenessEffectiveness, IEEE/ASMC Conference, SEMICON, IEEE/ASMC Conference, SEMICON EuropaEuropa, Munich,, Munich,Germany, April 2000eGermany, April 2000e