ANALYST PRESENTATION18 JUNE 2015

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of our business thatconstitute forward-looking statements, which are found in various places throughout the press release, including , but notlimited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing ofpurchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use ofwords such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward lookingstatements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forwardlooking statements. While these forward looking statements represent our judgments and expectations concerning thedevelopment of our business, a number of risks, uncertainties and other important factors could cause actual developmentsand results to differ materially from those contained in forward looking statements, including the discovery of weaknesses inour internal controls and procedures, our inability to maintain continued demand for our products; the impact on ourbusiness of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipatedorders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand forsemiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts ofterrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing andprotect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; thoseadditional risk factors set forth in Besi's annual report for the year ended December 31, 2014 and other key factors thatcould adversely affect our businesses and financial performance contained in our filings and reports, including our statutoryconsolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter ourforward-looking statements whether as a result of new information, future events or otherwise.

June 2015 2

Agenda

I. Company Overview

II. Market

III. Technology Update

IV. Operations Review

V. Financial Review

3June 2015

I. COMPANY OVERVIEW

4June 2015

Besi Overview

• Leading assembly equipment supplier with #1 and #2 positions in key products. 28.5% addressable market share

• Broad portfolio: die attach, packaging and plating• Strategic positioning in substrate and wafer level packaging • Global mfg. operations in 7 countries; 1,680 employees

worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• LTM revenue and net income of € 403.7 and € 81.6 million• Cash at 3/31/15: € 161.6 million• Total debt at 3/31/15: € 28.4 million• € 114 million of dividends and share repurchases since 2011

Financial Highlights

• Growth of <20 nano advanced packaging, smart phones, wearable devices, auto electronics, IoT and market share gains offer revenue upside

• Significant unrealized earnings potential from optimization of Asian production, supply chain efficiencies and development of common parts/platforms

Investment Considerations

5June 2015

Stock Price Information

• Approximate € 900 million market capitalization• Upgraded to Euronext AMX mid cap index on March 23, 2015

Market profile has improved significantly:

• Average daily volume:• 2013: 99,811• 2014: 117,084• 2015: 219,887

Liquidity has increased over past three years:

• Top 10 shareholders = 30% of shares outstanding. Down from 60% in 2011• Largest shareholder less than 7% currently

Share concentration has reduced:

• 40% NL• 30% US• 30% Europe ex NL

Geographic ownership has diversified:

• 6.6% currently• Dividend payout ratio of between 40-80% net income per annum

Highest dividend yield among peers

6June 2015

Summary Strategy

• Continue enhancing best in class <20 nano assembly equipment portfolio• Expand tech capabilities and applications for TCB line• IoT and wearables have potential to significantly expand addressable market

Develop new products and markets

• Leverage <20 nano expertise in flip chip, molding, multi module attach to further penetrate largest smart phone supply chains and expand in Chinese handset market

• Apply TCB tech advantage to more mainstream applications• Flip Chip/Wire Bond conversion for advanced applications can further grow market share

Increase market share in addressable markets

• Expand Asian materials sourcing and direct shipments• Expand Malaysian and Singapore operations. Increase Chinese die bonding production• Develop common platforms, common modules and common parts • Continue to reduce euro based costs. Better align USD/CHF/EUR exposure

Achieve a more scalable, flexible and lower cost manufacturing model

• Expand tech leadership in advanced packaging including wafer level assembly

Acquire companies with complementary technologies and products

7June 2015

II. MARKET

8June 2015

Die Bonding39.7%

Flip Chip15.8%

Die Sorting3.0%

Singulation9.3%

Presses11.2%

Molds13.5%

Lead Trim & Form5.5%

Plating2.0%

Assembly Equipment Market Composition

• Half of assembly market represented by die attach and wire bonding equipment

• Die Attach represents Besi’s largest addressable market

Die Attach 59%

Packaging 39%

Plating2%

Assembly Equipment Market * (2014: $4.0 billion)

Besi Addressable Market *(2014: $1.7 billion)

* Source: VLSI May 2015

Wire Bonding21.7%

Die Attach29.7%Packaging

21.8%

Plating0.9%

Other Assembly

(Inspection, Dicing)25.9%

9June 2015

Assembly Equipment Market Trends

• VLSI forecasts flat growth in 2015 and 2016 after big 2014 increase as capacity digested• Growth reaccelerates in 2017 and 2018• Besi revenue growth exceeding assembly market in 5 of past 6 years

326.9

273.7 254.9

378.8

70.0 94.9-16.3%

-6.9%

48.6%35.6%

-50%

0%

50%

100%

150%

-

100.0

200.0

300.0

400.0

2011 2012 2013 2014 YTD 2014 YTD 2015

(€m

illio

ns)

Besi Revenue Revenue YoY Growth Rate

4.44.0

3.1

4.0 4.0 3.94.6

4.9 4.8

-9.2%

-22.4%

29.1%

1.6%-2.5%

16.3%

7.7%

-2.3%

-30%

-20%

-10%

0%

10%

20%

30%

40%

0.0

1.0

2.0

3.0

4.0

5.0

6.0

2011 2012 2013 2014 2015F 2016F 2017F 2018F 2019F

(US

$ bi

llion

s)

Assembly Equipment Market Size YoY Growth Rate

Source: VLSI May 2015

10June 2015

Advanced Packaging Unit Volume and MarketShare Are Increasing

• Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process

• In growth phase with move to <20 nano internet device applications

Source: VLSI February 2015

10%13%

19%

26%

31%32%

34%35% 37% 38%

0%

5%

10%

15%

20%

25%

30%

35%

40%

-

5

10

15

20

25

30

35

40

45

2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

AP

Mar

ket S

hare

%

M w

afer

s, 3

00M

M E

q.

Advanced Packaging Silicon Demand Growth & Market S hare 2010 - 2019

Advanced Packaging Wafers

Advanced Packaging Unit Market Share (%)

CAGR 2010-2019: 21.1%CAGR 2014-2019: 10.3%

11June 2015

Driven Primarily by Growth in Internet Connected Devices

• 35% CAGR device growth forecast over next 5 years

• Powered primarily by devices used for IoT

• Positive trajectory for smart phones, tablets, wearables, and automotive

• Significant potential revenue growth driver

12June 2015

• Spending on <25 nano nodes has increased from ~15% in 2011 to an estimated 70% of total spending in 2015

• Node shift below 20 nano = new assembly equipment capacity

Which Has Significantly Increased Semi Equipment Spending for < 25 Nano Nodes

13June 2015

New Smart Phone Designs Increase Besi’s Addressable Market Potential

• Besi systems can assemble 50% of 2012 generation components and 70% of 2014 generation components

- NewMain Components

Generation

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM

DRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSL

NAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LM

Power Management

Apple PM IC X Dialog Dialog 2100sD

PMIC X X Qualcomm N/A

M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LM

Accelerometer/Gyroscope/Barometric

Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL

3-ax accelerometer X Bosch Bosch evo

barometric sensor X Bosch Bosch evo

CommunicationsGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Wifi/NFC

Wifi module X X Murata Murata Murata's equipment

NFC X NXP Amkor 8800FCQ, AMS-W/LM

NFC Booster IC X AMS Daca N/A

LTE

LTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LM

Low Band LTE PAD X Skyworks Skyworks 2200evo, FSL

Mid Band PAD X Skyworks Skyworks 2200evo, FSL

High Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM

Receiver/TransceiverRF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LM

RF Receiver X X Qualcomm N/A

Envelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM

Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD

PA

PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM

PA Module X Triquint ASE 2200evo, 2100sD

Video/AudioGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Camera

Back side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evo

Front 1.2M X X Apple Cowell, Sony 2200evo

Finger print sensor X Apple ASE 2200evo

Audio

2+4 microphones X ST ST 2100 xp

Audio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM

Touch screen control

Touch screen control X X Broadcom Signetics 2100sD

Touch Transmitter X TI TI FCL

14June 2015

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI May 2015

15

• Move to <20 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 29% currently of total potential market of $1.2 billion

• Flip chip expected to gain share over next 5 years

• Growth could accelerate depending on adoption rates by key IDMs/subcons

CAGR 2014 - 2019*Flip Chip 7.4%Wire Bond 2.9%

Flip Chip$508 34%

Wire Bonding

$994 66%

2019*

Flip Chip$356 29%

Wire Bonding

$861 71%

2014*

June 2015

Besi Has Gained Share In Its Addressable Markets

• Gaining share in fastest growing segments of the assembly equipment market:• Flip chip and multi module die attach and ultra thin molding for advanced

packaging applications

Besi Market Share

Source: VLSI, May 2015 and Besi estimates 2012 2013 2014

Total Assembly Equipment Sales 8.6% 10.6% 12.7%

Besi Addressable Market 21.4% 26.0% 28.4%

Total Die Attach Equipment 26.8% 31.2% 34.7%

Die Bonding 29.7% 39.2% 38.7%

Flip Chip 22.2% 24.4% 31.8%

Other 17.1% 4.8% 9.1%

Total Packaging Equipment 11.1% 15.9% 16.4%

Molds 12.0% 19.1% 19.5%

Lead Trim & Form 15.0% 17.6% 19.0%

Singulation 5.3% 5.1% 6.8%

Total Plating 75.8% 82.3% 75.4%

16June 2015

• Customers are largest semi mfrs. • Engaged in most advanced packaging applications

• Strong customer market shares:• ≈ 50 - 100% of die attach requirements

• ≈ 25 - 100% of packaging requirements

• Customer market shares p.a. vary based on capacity needs and purchasing cycles

• Primary competition:• Die Attach: ASM-PT, Hitachi,

Shinkawa, Panasonic, Toray• Packaging: Towa, Hanmi,

ASM-PT

And With Leading Edge Technology Customers

N/B No reported bookings for Besi or its competitorsa) Year to date through April 30, 2015b) Merger pendingc) Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly

production done by subcontractorsd) In general, Samsung satisfies approximately 50% of its equipment needs internally

Die Attach PackagingIn USD 2012 2013 2014 2015 (a) 2012 2013 2014 2015 (a)

SubcontractorsASE 67% 59% 69% 74% 36% 65% 36% 28%Amkor 75% 84% 89% 100% 45% 11% 22% 38%JCET (b) 75% 48% 67% N/B 0% 8% 0% N/BSTATSChippac (b) 95% 100% 85% N/B 28% 100% 100% N/BSPIL 47% 93% 89% 100% 37% 76% 19% 38%Nantong Fujitsu N/B 72% 100% 100% N/B 14% 0% 100%UTAC N/B N/B 100% 100% N/B 100% N/B 100%Unisem 92% 84% 100% 100% N/B N/B N/B N/BCowell/Foxconn

100% N/B 100% 100%(Camera Modules) N/B N/B N/B N/B

IDMs (c)Skyworks 100% 96% 100% N/B 13% 24% 38% 100%ST Micro 91% 72% 78% 94% 44% 76% 42% 46%Infineon 81% 97% 100% 100% 0% 24% 90% 100%Micron 86% 100% 43% 42% 50% N/B 100% 100%NXP N/B 100% 100% 100% N/B 7% 100% 86%Samsung (d) 5% 0% N/B N/B 0% 100% N/B N/B

% of product revenue 49% 52% 64% 51% 54% 70% 65% 70%

17June 2015

Besi 2015/2016 Growth Drivers

18June 2015

• Significant growth < 20nm end user applications: IoT, wearables• Increased TCB usage: memory applications currently, logic devices next

World tooling up for new tech cycle

Larger addressable market from increased smart phone functionality and new device introductions

• Chinese handset market: IDMs/Xiaomi, Mediatek, Huawei. Subcons/JCET, Nantong Fujitsu, ASE, Amkor

Increased market penetration

• In key electronics supply chains• Primarily at expense of Japanese suppliers lagging in innovation cycle• Flip chip and TCB gaining share from Wire Bond assembly processes• Consolidation offers positive opportunities with semi manufacturers

Increased market share

III. TECHNOLOGY UPDATE

19June 2015

Best in Class Product Portfolio

• Molding- AMS series- AMS LM 95- MMS series- FML

• Die Bonding- 2100 xPplus

- 2100 sDplus

- 2100 sD PPPplus

- 2100 hS- 2009 SSI- 2100 DS- 2100 SC

Die Attach Packaging & Plating

• Multi Module Die Attach- 2200 evo- 2200 evo plus

• Flip Chip- 8800 FCQ Sigma- 8800 CHAMEO- 8800 TCB - 2100 FC

• Trim & Form- Compact series- Power series- Compact Line XHD New

• Plating- Leadframe- Solar- Film & Foil

In Development

•Next generation Die Attach

•Next generation Packaging

•Common modules

Datacon/Esec

Datacon

Esec

Fico

Meco

Fico

New

Fico

• Singulation- FSL

New

New

• Die Sorting- DS 9000E- WTT- TTR- DLA

Datacon

NewNew

New

New

20June 2015

New

New

Besi Assembly Process Technology Steps

• Sorting and mounting chipson substrate materials

• Establish electrical interconnects

• Molding/encapsulation in packages

• Singulation/trim and form of packages

• Electro plating of leadframes, substrates and solar cells

• Flip chip, TCB and multi module die bonding and ultra thin molding are key core competencies

21June 2015

Internet of Everything is Driving Advanced Packaging Growth

22June 2015

Source: Intel

Key End Use Applications:

• Mobile internet devices

• Connectivity

• Computing power

• Big Data Analytics

• Automotive

Source: Nvidia

Requiring Changes in Process/Equipment Development

23June 2015

Today=> TomorrowFront End

Transistor Scaling

Lithography

New Structures 3D

Back End

More Contacts

Smaller Pitches

Thinner/densermore complex packages

Stacked Structures 3DFrom Simple Wire Bond to BGA/Flip Chip to Complex 3D structures with TSVs,

Microbumps and thin dies

Thin Die Usage Is Becoming Increasingly More Important in Key End Use/Process Applications

24

Memory Power Flip ChipDrivers Increased volume

Increased density

Vertical stacking to compensate for slower lateral shrink

Thermal ConductivityLower resistance

Thinner packages

Current Die Thickness

22 um 40 um 100 um

Future spec < 15 um 25 um 50 um

Examples

• Die thickness anticipated to reduce by 35-50% over next 3 years

June 2015

Besi Is Winning in Thin Die ArenaDB 2100 Example

2100 sDplus / 2100 sD PPPplus

June 2015 25

Technology Besi Spec Competition

Disc basedThin Die Ejector

No

Dual StepFusionDie Bonding

No

Fast ChangeoverDual Mode

No

Die CrackDetection

No

High Speed &High Accuracy

15.000& 10 um

No

Thermo Compression Bonding Is An Emerging Assembly Technology

TCB: Next Die Bonding Process Evolution:

• Besi has most advanced concept in the industry

• 7 Axis bondhead• 2 bond heads per system• High throughput => 2x competition• Compact design • User friendly

• Orders/production significantly expanded in 2015• Memory producers first adopters

• Principal competition: ASM PT, KLIC (in development) TORAY SHINKAWA

• Production transferred to Besi APac to reduce cost

• Added control functions and production features

26June 2015

TCB Solution in Advanced Memory Cube Application

June 2015 27

Per

form

ance

Time

Issue: Memory performance lags CPU performance

Solution: Advanced stacking design using TCB with TSV capabilities

• 15x Higher transfer speeds• 70% Less energy per bit• 90% Less space• Wire bonding process eliminated

Connected using Thermal Compression Bonding

GapIn performanceCPU-Memory

Wire Bond connections replaced by direct connection

Wire Bonded BGA Stacked Die Memory Device

TSV TCB Memory Cube

eWLB Is Another Emerging Die Bonding Technology

28June 2015

eWLB = Embedded Wafer Level Ball Grid Array

Utilized for extremely small form factors such aslogic processors

Besi Chameo FC 8800 only proven system torelocate up to 40,000 chips on carrier very precisely over whole 12“ wafer at high speed and accuracy (<2um)

• Besi‘s expanded wafer size thin molding and exposed die molding eliminates mold back grinding

Besi Packaging Technology Update

29

Key Packaging Trends

Besi Spec Competition

Ultra thin molding .12 mm One stepNo warpage

.2 mm2 stepsNegative

Narrow underfill 30 um proven 40 um

Exposed dies Foil based, no further process steps

Back grinding step required

Shielding Flexible FSL concept Limited flexibility

Larger wafer sizes 340x340 mm Same

Odd mold formats Ultra precise molding Less precise

June 2015

Besi Offers Leading Edge Molding Technology

First Generation

Product designed around SMT board and standard package

• Package is square or right angular

• Standard functionalities

Current Generation

SMT board dictated by product design. Packages become thin and multifunctional

• Very thin moldcap (<120 um)

• Narrow underfill for flip chip packages (<30um)

Next Generation

Package is defined by product

• Package has odd shapes to fit in device

• More MEMS devices => exposed die

• Shielding of products to prevent communication interference

30June 2015

First Generation

Current Generation

Evolution

Integration

Next Generation

Ultra Thin Molding Is Critical Assembly Packaging Process Technology

• Shift to <28 nano advanced electronics applications has increased Besi’s AMS-LM revenue by 100%+ over past two years

• Besi AMS-LM only system which can deliver these specs

• Currently qualified for ALL 2015 tablet and smart phone platforms

Key Features:

• Can reach .12 mm overall package thickness

• One step molding of molded underfill and bleed free products

• Flash and bleed free product

• No warping

• Mold cap polarities of +/- 5 um

31June 2015

Ultra Thin Molding exposed die with underfill TCB

Wafer and Large Area Molding Is Another Important Process Development

Besi has most advanced molding capabilities inthe industry:

• Large area molding up to 340 mm x 340 mm

• eWLB and C2 wafer applications

• Overmolded and exposed capabilities

• Exposed solder balls

• Glass and silicon interposer molding

• Thin moldcap moving to <250 mm

32June 2015

Key Development Objectives - Timetable

Development Objectives

Advanced TCB die bonding development

Introduction of next generation packaging systems

Common parts/platform activities

2015 2016

33June 2015

Summary

• Semiconductor packaging plays an increasingly important role in electronicsas IC devices get smaller, denser and more complex with increasedfunctionality

• In new technology cycle due to the Internet of Everything

• Besi product portfolio and process technology is at forefront of advanced packaging trends

34June 2015

IV. OPERATIONS REVIEW

35June 2015

Current Operational Profile

as of 31 March 2015

Europe/NA Asia

Revenue (MMs) € 33.2 35.0% € 61.7 65.0%

Headcount 664 39.5% 1,016 60.5%

• Development activities in Europe

• Production and sales/service activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

ChengduShanghai

Korea

Taiwan

PhilippinesMalaysia

Singapore*

Suzhou

Radfeld, (Austria)*Cham,(Switzerland)*

Duiven & Drunen,(The Netherlands)*

Chandler

Shenzhen

36June 2015

Asian Production Has Significantly Expanded

396

487

658 673

963

170

331

553 579

927

42.9%

68.0%

84.0% 86.0%

96.3%

0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

-

200

400

600

800

1,000

1,200

2010 2011 2012 2013 2014

% D

irect

Shi

pmen

ts

Shi

pmen

ts

Total Asian Shipments Direct Asian Shipments % Direct

37June 2015

Leading to Lower European Headcount

• Fixed European/North American headcount reduction:• Down 19.4% since 2011• Declined from 56% of total in 2009 to

39% at Q1 2015

741 680 624 602 597

802 799

810 908 933

1,543 1,479

1,434 1,510 1,530

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2011 2012 2013 2014 Q1 2015

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC Total

52%

48%

54%

46%

56%

44%

60%

40%

38

61%

39%

June 2015

And Also Reduced Break Even Revenue Levels

270

235

212 207

-

50

100

150

200

250

300

2011 2012 2013 2014

(€m

illio

ns)

(13.0%)

(9.8%)(2.4%)

39June 2015

Key Operational Objectives

Operational Objectives

Transfer of certain Swiss Die Attach software, logistics and administrative

functions to Singapore

Transfer of certain die bonding production from Malaysia to China

Transfer of Plating Production from NL to Malaysia

Further reduction of European based costs

Expansion of Asian supply chain. System module outsourcing

2015 2016

40June 2015

Besi Switzerland/Singapore Function Transfer

41June 2015

• Transferring certain die attach software engineering, logistics and related admin functions by end of Q4-15

• Swiss headcount to be reduced by 55 people or 40%

• Singapore headcount to increase from 75 to 125 people

• Current Singapore facility of 17,800 sq. ft. Minimal additional capex necessary

• Annualized cost savings of approximately € 6.5 million • Includes € 0.5 million of Cham CH facility savings

• Total net pre-tax restructuring benefit of € 3.7 million recorded in Q1-15• Pension related curtailment gain of € 5.3 million• Partial offset: restructuring charges of € 1.6 million• Minimal Q2-15 impact

Besi China Die Bonding Production Transfer

42June 2015

74,000 sq. ft. Leshan facility principally manufactu res molds, mold sets and spare parts. 257 employees currently

Transferring DB 2100 SD epoxy die bonding productio n for the Chinese market from Malaysia to Besi China

• Locate production closer to end customer with potential for incremental revenue

• To be completed by year end 2015

• Potential annualized cost savings: € 1.0 million/annum

• Capex requirement: € 0.3 million

• Incremental headcount required: 42 people

Plating Production Transfer from NL to Malaysia

• Transfer underway to move plating production from Drunen, NL to Malaysia facilities by end of 2015

• Intellectual property and engineering to remain in Drunen

• Benefits:

• Increase manufacturing flexibility• Reduce cycle times• Increase revenue potential with direct Asian presence

• No material restructuring costs required

• Potential 5%+ gross margin improvement on plating production in 2016

43June 2015

Further Reduction of European Based Costs

44June 2015

• Total of 574 fixed European headcount at March 31, 2015

• Approx. 10% headcount reduction by year end 2015

Further reduction of European personnel costs

• 4 European facilities currently• Duiven NL 154,000 sq. ft. (leased)• Drunen NL 53,000 sq. ft. (leased)• Cham, CH 83,500 sq. ft. (leased)• Radfeld, AU 125,400 sq. ft.(owned)

Total 415,900 sq. ft.• Reducing footprint of Duiven and Cham facilities by 111,500 sq. ft. (27%) by end of 2016

• Potential annualized cost savings of € 1.5 million, net

Achieve cost savings from facility consolidation

Besi Switzerland Besi Austria

Besi NetherlandsDuiven

Besi NetherlandsMeco Drunen

Materials Cost Reduction Is Also a Key Priority

• Qualify and Select Asian Vendors• 75% of material is now purchased in Asia

Supply Chain Actions

• Redesign products• Increase standardization of systems

• Component parts• Modules

Development Actions

45-50% thru cycle Gross

Margin

• Material costs represent approximately 45% of revenue• Shift to Asia centric supply chain:

• Reduces transport, inventory costs and obsolescence• Improves cycle time and ramping flexibility

• Management Board reviews progress weekly component by component

45June 2015

Asia Supply Chain Transfer Progress

46June 2015

Estimated savings 2014 2015E 2016 - 2017E

Headcount € 0.9 MM € 2.8 MM € 1.0 MM

Materials Cost € 2.7 MM € 1.6 MM € 1.5 MM

Subtotal € 3.6 MM € 4.4 MM € 2.5 MM

2015 Focus 2016 - 2017 Focus

DB Spares & Module Assembly

Completed in 2015

Transfer PlatingNL-MY

Completed in 2015

Transfer DB 2100MY-China

Extend Supply Chain inside ChinaStart transfer DB 2009 and EVO MY-China

Swiss/MY transfer Transfer last remaining modules possible to Asia

WB Spares & Module Assy

Completed in 2015

V. FINANCIAL REVIEW

47June 2015

€ 70.0

€ 94.9

10.0%

18.5%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

65%

70%

75%

80%

85%

90%

95%

€ 0

€ 25

€ 50

€ 75

€ 100

Q1 2014 Q1 2015

Net

mar

gin

%

€m

illio

ns

Revenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate

11.6% 12.9%

1,569 1,680

€ 21.5 MM

€ 25.3 MM

+111

+1.3 points

+17.6%

42.3% 49.0%

+35.6%

+8.5 points

Q1-15/Q1-14 FY 2014/FY 2013

+6.7 points

€ 17.5

€ 254.9

€ 378.8

6.3%

18.8%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

65%

70%

75%

80%

85%

90%

95%

0 €

50 €

100 €

150 €

200 €

250 €

300 €

350 €

400 €

2013 2014

Net

mar

gin

%

€m

illio

ns

Revenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate

15.8% 0.3%

1,458 1,632

€ 82.7 MM

€ 93.8 MM

39.8% 43.8%

+174

-15.5 points

+13.4%

+4.0 points

+48.6%

+12.5 points

€ 71.1

€ 16.1€ 7.0

Revenue Growth and Margin Expansion Yield Increased Profitability

48June 2015

• Cyclical quarterly revenue/order patterns :• Three cycles past 3 years• Short term patterns due to customer caution and increased seasonality

• 2014 year end shows higher base line order levels than prior years

• Gross margins have improved despite cyclicality :• Increased scalability of production model• Shift to higher margin advanced packaging systems

• Lower unit costs due to:• Asian production transfer• More direct shipments• Reduction in European personnel• Favorable USD/euro starting in H2-14

Revenue/Order/Gross Margin Trends

72 65

53

70

116

104

8994.9

83

48 57

111

124

91

81

104.2

40.4%39.2%

40.1%

42.3%43.2%

45.3%

43.8%

49.0%

48.2%

35.0%

40.0%

45.0%

50.0%

55.0%

60.0%

-

20

40

60

80

100

120

140

Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15G

ross

Mar

gin

%

euro

in m

illio

ns

Revenue Orders

Gross Margin Adjusted Gross Margin

49June 2015

Net Income Trends

7.0

3.4

12.2 14.2

(0.5)(2.0)

7.5

3.3

6.5

4.41.4

7.0

22.9

21.5

19.7

17.5

9.0%6.8%

2.7%

10.0%

19.7%20.8%

22.2%

18.5%

-25%

-15%

-5%

5%

15%

25%

35%

(3)

0

3

6

9

12

15

18

21

24

Q2-13(a)

Q3-13 Q4-13(a)

Q1-14 Q2-14 Q3-14 Q4-14(a)

Q1-15(a)

(eur

o in

mill

ions

)

Net Income ex. NR Non Recurring Net Margin

50

• Quarterly net income trends reflect industry and seasonal volatility

• Profit/margin increase aided by revenue growth, through cycle gross margin expansion and opex leverage in business model

• Significant reduction in effective tax rate has also helped

• Net margin of 18.5% in Q1-15, up significantly from 10.0% in Q1-14

(a) Adjusted to exclude:• After tax net restructuring (Q1-15)• Deferred tax benefits (Q4-14)• € 0.5 million and € 2.0 million non recurring charges in Q2-13 and Q4-13, respectively

June 2015

Forex Influence on Recent Quarterly Operating Results

51June 2015

Currency Exposure (2014) Forex Financial Impact (Q4-14 and Q1-15)

RevenueCost and Expenses

Euro 34% 28%

US dollar 65% 4%

Swiss franc - 20%

Malaysianringgit

- 40%

Other 1% 8%

Total 100% 100%

Q1-15 vs Q4-14 Q4-14 vs Q3-14MlnEuro Margin

MlnEuro Margin

Revenue +7.8 +3.8 (USD/EUR)

COGS -3.3 -1.8 (USD/EUR)

-2.3 -0.1(MYR/EURand CHF/EUR)

-5.6 -1.9

Gross Profit 2.2 +2.4% 1.9 +2.2%

Opex -1.0 0 (CHF/EUR)

Net +1.2 +1.9

Liquidity Trends

• Solid liquidity position• € 161.9 million cash at 3/31/15• € 4.29 per share vs. € 29.87 price (as of March 31, 2015)

• Net cash reached € 133.1 million at end of Q1 2015

• Has Been Utilized to Enhance Shareholder Value• € 114 million spent on cash dividends and

share repurchases 2011-2015• Includes May dividend payment

• Strong balance sheet helps support future organic growth and acquisition opportunities

52

81.1 78.5

89.6 91.9 83.8

105.4

135.3

161.6

24.9 22.5 18.6 19.1 21.3 19.3 17.3

28.5

56.2 56.0

71.0 72.8

62.5

86.1

118.0

133.1

0

20

40

60

80

100

120

140

160

180

Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15

(eur

o in

mill

ions

)

Cash Debt Net Cash

52June 2015

Q2-15 Guidance

Revenue Gross Margin* Operating Expenses*

Q1 Q2 Q1 Q2 Q1 Q2

€ 94.9 48.2% € 28.3

Up10-15%

• Underlying business growth continues• Revenue up approximately 10-15% vs. Q1-15 • Gross margins of 46-48%• Opex up 5-7% vs. Q1-15 due primarily to higher forex, R&D and warranty• Sequential Q2-15 and H1-15/H1-14 revenue and net income growth

Up5-7%

*excluding restructuring benefit

48%-

46%

53June 2015

Summary

Leading semi assembly equipment supplier with #1

or #2 positions in fastest growing assembly

segments

Technology leader. Best in class product portfolio

Gaining market share in advanced packaging

Scalability and profitability of business model greatly

enhanced in cyclical industry

Significant upside potential.Advanced packaging

growth, operating initiatives and optimization of Asian

production model

Committed to enhancing shareholder value.

Attractive dividend yield relative to peers

54June 2015

Financial Calendar

55

24-Jun-15 Rabobank “Made in Benelux” Conference, London, United Kingdom

23-Jul-15 2015 Second Quarter Results

12/13-Aug-15 Canaccord Genuity Growth Conference, Boston, USA

9/10-Sep-15 ING Benelux Conference, London, United Kingdom

16/18-Sep-15 Kepler Cheuvreux Autumn Conference, Paris, France

22-Oct-15 2015 Third Quarter Results

11/13-Nov-15 Morgan Stanley European TMT Conference, Barcelona, Spain

June 2015