Advancing Technological Innovation to Enable IoT's Long Tail

Advancing Technological Innovation to Enable IoT’s Long Tail Rajeev Rajan, VP IoT, Automotive, and New Markets

© 2016 GLOBALFOUNDRIES

Level-setting

Smart Manufacturing and IoT – Dual-lens View •  How IIoT can make manufacturing smarter (industrial manufacturing

practices, analytics, inventory management, logistics etc.)

•  How manufacturing needs to become smart to enable IoT adoption

Manufacturing (R)evolution? “Industry 4.0. Today’s manufacturers are taking an ‘outside-in’ approach to digital business and using new systems of intelligence powered by the IoT, Advanced Analytics, and the Cloud – to connect Marketing, Sales, and Service Operations, with intelligent Manufacturing and Supply Chain Operations”

-- Sentiment at Hannover Messe 2016

© 2016 GLOBALFOUNDRIES 2

Talk today focuses on the second lens

•  The Market View and Semiconductor Potential •  The Supply Chain is Evolving towards Faster Time-to-

Market (TTM) and Lower Total-Cost-of-Ownership (TCO)

•  Semiconductor Innovation – A function of Technical and Business Model Innovation

•  Tighter integration at the silicon level including CMOS, memory, connectivity, sensors, packaging etc.

•  SoC’s driving IoT Products, Applications & Solutions Focus

•  Advanced packaging techniques for Smaller, Thinner, Simpler form factors

•  Ecosystem Collaboration

•  GLOBALFOUNDRIES Capabilities © 2016 GLOBALFOUNDRIES 3

Expanding Connectivity

ANALYZE & ACT

COLLECT & AGGREGATE

SENSE & OBSERVE

PREDICTABILITY & RELEVANCE

Wired / Wireless

INTERNET BACKHAUL MARKETS / APPLICATIONS

Mission Critical

IoT Mobile Computing

DATA CENTERS

Compute / Clouds


Semiconductors and Data Networks have Evolved with Computing

PC / Smart Client

Wired

10–100 Kbps

Internet / Gaming Consoles /

e-Commerce

Wired / wireless

100 Kbps–1 Mbps

Mobile

Wireless

10 Mbps–1 Gbps

Corporate Computing / Military / Telecommunications

Connected

25 MHz–10 Kbps

2020

Pervasive à Intelligent

“Things” In, On, Around You

10 Kbps – N Gbps

Sources: Gartner, Industry, Customer/Prospects and GF Internal assessments, © 2016 GLOBALFOUNDRIES

- 1µm – 350nm 350nm – 90nm 90nm – 14nm

1995 2005 1965 1985 1975 2015

14nm & Beyond

IoT Process Technologies = 180 → 55nm, 40nm, 28nm, 22nm, 14nm FinFET

5

Logic

Memory

Communications

Analog (RF, FE)

Sensors

Wearables Consumer Electronics

Industrial Automation

Medical Nascent Verticals

Smart Home

Smart Buildings

Smart Cities

$4–5B

1Excluding is "classic internet devices" such as laptops, smartphones. Also excludes automotive applications. Rough preliminary estimate with indicative split by device type. Integration of simple devices with communication features and memory in SoCs assumed and accounted for in communications category, embedded memory under logic. Source: McKinsey & Company, based on volume forecast by Gartner, iSupply, Strategy Analytics

$12–15B

$7–11B

$10-15B

$5–10B

$3–4B $2–4B

$7–10B

Semiconductor device market value of "Smart Things" in the Internet of Things1 Barriers: • Standardization • Fragmentation • End-to-end solutions • Business Models • Security • Low power

Estimated IoT Semiconductor Value : 2019-2020 ($50B - $75B)

6 © 2016 GLOBALFOUNDRIES

• Efficiency and Effectiveness •  Innovation – Technical and Business • System-centric vs Component-centric •  Interface of Silicon and Software • Functionality wrapped into

full-stack IP (e.g. Connectivity) • Vertical Integration of Value

Design Services

Foundry

Systems Companies

Applications & Solutions

IP

EDA

Networks, Data Center Clouds & Services

Hardware & Software

Silicon

The Supply Chain is Evolving


Time-to-Market (TTM), Total-Cost-of-Ownership (TCO), Optimization – Balancing Innovation

Features & Cost

Value Creation

Value Capture

Time-to-Market Economic Scale

Collaboration

Better yield performance for Leading Edge processes and Agile delivery of Proof points to the industry that can culminate in faster Volume ramps 8 © 2016 GLOBALFOUNDRIES

Technical •  Material & Process •  Device Architecture •  Design-Technology Co-Optimization

INNOVATION Business Model •  Long-term R&D Focus / Investment •  Shared Investments / Learning •  Consolidation and Collaboration

Semiconductor and IoT Innovation to meet the Trends

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Edge node gateway processing Vs. sending all data to cloud

Full integration of IoT Edge-nodes for Applications And Solutions

New Markets defining the next generation of technology needs (Drones, Robotics, Machine Learning…)

Traditional scaling is reaching its limits…Continued advances mean changing the way we think about innovation

BUT Yes, scaling can still drive down cost

It’s exponentially more costly to develop

Atoms don’t scale


Trends à

Tighter Integration at the Silicon Level §  Increasing integration of Diverse Components – NVM, RF,

Mixed signal analog, and sensors integration

§  Tomorrow’s nodes – Completely Integrated and scaled into one small, thin form factor package

§  Powerful, secure, low-power MCUs/Aps

§  NVM to Embedded NVM

§  40nm and 28nm as longer-lived nodes past 2020

§  Strong interest in FD-SOI nodes (e.g. 22FDX™ for optimizing PPA

§  Adapting for specific applications, but strive for high re-use of the technology platform(s)

Source : NXP at FD SOI Forum (April 13, 2016) and GF Internal assessments,


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Building Blocks Package Solutions

Health Image

WLFO WLCSP

Glass Interposer

QFP

HDFO-RF

Stacked- NVM Substrate SiP

Advanced Packaging for Smaller, Thinner, and Simpler IoT Form Factors


It Takes a Balanced Ecosystem

Electronics End Markets, Component Distribution

OSAT IDMs (Pure, Fablite)

Fabless EDA / Design Services

Foundry

Equipment and Material

Suppliers

Collaboration Enhances

Value Capture


Chip Markets / Applications Clouds / Data Centers

Data Information, Outcomes

Mini-System

System-on-Chips (SoCs) for IoT Products / Applications / Solutions


From Chips to Mini-Systems – Elevating Intelligence

Semiconductors Enable Multiple Differentiated Technology Vectors for IoT SoC’

COMPUTE (MCU, MPU, WPU) <100 MHz to ~1 GHz

CONNECTIVITY (RF Tx and Rx) Local area, cellular, wired

MEMORY (Embedded Non-Volatile, External) eFlash, eNVM, SRAM

IP Foundational, Complex, Specialized

SECURITY (Embedded) Certified foundry, IP crypto engines, key vaults, data privacy, Physical Unclonable Function (PUF)

STORAGE Order of magnitude increase

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POWER MANAGEMENT / BATTERY LIFE Energy harvesting, short burst battery usage, solar

PACKAGING Smaller, Thinner, and Simpler form factors SENSORY, LOCATION

Dynamic power, integrated low-power RF, embedded security, location

Source: Industry, Customer/Prospects/Partners, and GF Internal assessments,

Hardware & Software

Silicon


IoT SoC/ Module Reference Design Platform – General View

15 Source: Industry, Customer/Prospects/Partners, and GF Internal assessments,

MEMORY

(ROM, SRAM, eNVM/MRAM)

LTE Cat 1/M

2.4GHz (Wi-Fi, BTLE, Zigbee)

RF CORE/SUBSYSTEM/

NETWORK CORE(S)

(MCU/MPU/APU built on ARM (e.g. Cortex-M4)

ANALOG (ADC, DAC…)

VIDEO

(Codec, Scaling, Camera I/F)

SECURITY (AES, Trust, CRC, PUF…)

GPS

Sensors / MEMS

AUDIO (MP3 Decoder,

Mixer…)

ENERGY SOURCES (Battery…)

SYSTEM

(DMA, PMIC/Power Control, Clock Unit…)

TIMERS

(RTC, Alarm, Watchdog, …)

LOW-POWER INTERFACES

(I2C, USART, SPI)

INTERFACES (GPIO)

MULT I LAYER BUS MATRIX

DISPLAY/HMI

(TFT LCD, MIPI, 2D/3D Graphics…)

OTHER… OTHER…

Optional

Required

Block Legend:

© 2016 GLOBALFOUNDRIES Note : SoC / Module /On-off-chip designs may vary by use-cases

Wired / Wireless

COMMUNICATIONS NETWORKS DEVICES and ENDPOINTS

Mission Critical

IoT Mobile Computing

DATA CENTERS

Compute / Clouds

GLOBALFOUNDRIES Technologies & Solutions Connected Data from Devices + 5G Networks + Data Center Algorithms and Analytics + Smart Applications = Faster Space-Time specific decision-making for Intelligent outcomes and Enhancing value for Consumer & Enterprise

RF SOI SILICON GERMANIUM

MEMS HIGH VOLTAGE

ANALOG / POWER 14nm FinFET ASIC

SILICON PHOTONICS

14à10 à7NM & BEYOND FD-SOI ADV PACKAGING

EMBEDDED MEMORY

GLOBALFOUNDRIES Technologies


Optimized 22FDXTM IoT Platform

q  GLOBALFOUNDRIES 22FDX offering will be the Industry’s first technology platform optimized for IoT applications

q  Ultra-lower power consumption upto 0.4 volt operation

q  Integrated RF for reduced system cost and back-gate feature to reduce RF power up to ~50%

q  State of the art packaging techniques that can reduce BOM and form factor significantly

q  Combination of unique technologies from other partners to bring high levels of Integration, Performance, and Low Power unmatched in the industry

q  Extends customer offerings across multiple IoT and wearable applications

Ultra-thin Buried Oxide Insulator

Fully Depleted Channel for Low Leakage

FD-SOI Planar process similar to bulk

ü  70% lower power than 28HKMG ü  20% smaller die than 28nm bulk planar ü  Lower die cost than 16/14nm FinFET

GLOBALFOUNDRIES 17

22FDX™ – Offers lower overall mask count

Mask Type14NM (11LM)

20NM (9LM)

22FDX (8LM)

28NM (8LM)

193nm wet 35 26 18 15 193nm dry 0 3 1 5 248nm 23 25 20 27 Total 58 54 39 47

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•  50% fewer immersion lithography layers (193nm Wet) than FinFET •  Fewer double patterning layers keeps mask NRE ~50% of 20nm


22FDX™ – Enables System level Integration

22FDX™: Best Power, Performance CPU GPU CPU

Interface I/O

� �

TSV

22FDX™: Multiple Functions Integrated

Interface I/O

DSP

SERDES Modem DAC/ADC

VCO PLL/Filters

RF Antenna Tx/Rx

�

�

LNA DDR/ROM

GP IOs/ ESD

Cost Per Function and Energy Efficiency are the two most important metrics for next wave of Innovations..

Without need for multiple heterogeneous technologies


GLOBALFOUNDRIES Supply Chain and Business Models for IoT Modules

SoC Design Wafer fab IoT Module Packaging Die Level Services and Drop/Ship

Customer OSAT Partner

1. Wafer sell

OSAT Partner



2. Turnkey business model with in-house packaging



3. Turnkey business model with OSAT partner packaging

OSAT Partner


Flexible, Turnkey for one-stop-shop, faster yield feedback, and TTM

Embedded Memory – eMRAM

•  Use for code or data •  4x more dense than SRAM

•  500x faster write than eFlash •  Retains data for years

•  1/3rd the power (typical SOC) •  Eliminates static memory leakage

•  Enables instant wake up •  Scalable: 22FDX and beyond

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eMRAM = Power Efficiency

Ideal memory for: MCUs and IoT SOCs


IoT Example – Remote Security Camera Application

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Optimize Standby and Dynamic Power

GLOBALFOUNDRIES 22FDX™ Delivers: þ  Low static and dynamic power þ  RF integration for reduced BOM cost þ  RBB and FBB for power/perf tradeoffs

Wakes up Image Processor to zoom in and analyze potential threat

Detects motion

Wakes up comms to transmit message

22FDX die

Integrated RF

Wireless Comms

High Performance Application Processor

“Watchdog” Processor

FBB for lowest dynamic power

RBB for lowest leakage


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Ultra Low Power SoC

Wireless Comms

High Performance Application Processor

“Watchdog” Processor

•  High performance, •  Up to 92% lower dynamic power with

forward body-bias

10x lower leakage with reverse body-bias

Integrated RF with

50% lower power

•  Low static and dynamic power •  RF integration for reduced

BOM cost •  RBB and FBB for power vs.

performance tradeoffs

IoT Example – Remote Security Camera Application (cont.)

Ultra Low Power SoCs with FD-SOI Technology


Categorization Low-End Mid-Range High-End

Class ARM Ultra Constrained (Cortex M0+ to M3/M4) ARM Constrained/Mainstream (Cortex M3/M4 to A9 class); Rich Application Use (RAU) / WPU

Ultra Rich node (Cortex-A9+, Intel Atom E3800, Intel Xeon)

Processor 8-16bit Equivalent 16-32bit Equivalent 32-64bit

Speed <25MHz 25-250MHz to ~1 GHz > 1 GHz – 2.4GHz

Memory OTP / MTP: 32KB – 256KB Embedded NVM Flash/MTP: 128KB – 2MB to > 4GB External Flash > 8 GB OS

None / Simple RTOS / Proprietary

Proprietary/ RTOS / Android Wear Mobile OS: Android / Wear / iOS

HLOS: / Windows 10 IoT Enterprise

Connectivity (RF)

Bluetooth® Smart (BLE) / 15.4, Zigbee – typically off-chip

BLE /15.4, Zigbee, Wi-Fi – Integrated Cellular LTE Cat 1 / M – External (optional)

BLE / 15.4, Wi-Fi, USB; LTE Cat 1/ M /NB-IoT à 5G – External

Metal Layers 4-7 8-10

Key Applications

Cap

abili

ty

Complexity

Edge Gateways

Asset Trackers

Smart Clothing

Sources: Gartner, Industry and Customer data points, and GF internal assessments.

Wireless Smart Meters

High-End Wearable Medical Device/

Health Monitor

Health and Fitness Monitors

Health and Fitness Monitors

IIoT Factory Controllers

Asset Trackers Smart

Vending

Home Security

Telematics

GF SoC Platforms 180nm – 90nm 55nm and 40nm , eNVM, RF IP, Security PUF 28nm, 14FF, and below

GF Platform Portfolio to Meet the IoT SoC Requirements 2016 130nm, 55nm, 40nm, 28nm, 22FDX™(FD-SOI), 14FF…

22FDX™ (FD-SOI), eNVM-MRAM, BLE/15.4, Wi-Fi IP 24 © 2016 GLOBALFOUNDRIES

2016 and Beyond: Industry Opportunity

Connectivity continues to be the driver of semiconductor growth in our industry •  IoT: The next wave of growth

A balanced ecosystem is required to sustain innovation • Value created needs to equal value captured

Technology innovation is the core to semiconductor growth • Equally important to have business

model innovation

Leverage a collaborative mindset to create and capture value • GLOBALFOUNDRIES leveraged three

dimensional model, making next-gen consumer products possible

Thank you [email protected]


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Advancing Technological Innovation to Enable IoT's Long Tail