5060 MGC-8 Hardware Guide

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Title page

Alcatel-Lucent Gateway PlatformRelease 8.0.1Hardware Guide for 5060 MGC-8

255-400-209R8.0.1

ISSUE 3

JUNE 2010


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Legal notice

Legal notice

Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective

owners.

The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.

Copyright 2010Alcatel-Lucent. All rights reserved.

Notice

Every effort has been made to ensure that the information in this document was complete and accurate at the time of printing. However, information issubject to change.

Safety

Always observe the Safety Instructions when operating the system.

Ordering information

The ordering number of this document is 255-400-209

Technical support

Please contact your Alcatel-Lucent Services Business Group (SBG) for technical questions about the information in this document.


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Contents

About this document

Purpose ..........................................................................................................................................................................................xiiixiii

Reason for revision ...................................................................................................................................................................xiiixiii

Audience ........................................................................................................................................................................................xivxiv

Part number ..................................................................................................................................................................................xivxiv

Document organization ............................................................................................................................................................xivxiv

Relationship between documents ..........................................................................................................................................

xvxv

Contact information ................................................................................................................................................................xviiixviii

How to comment ..........................................................................................................................................................................xxxx

1 Platform description

Overview .......................................................................................................................................................................................1-11-1

Platform design ...........................................................................................................................................................................1-21-2

2 Hardware components

Overview .......................................................................................................................................................................................2-12-1

Cabinet (NRA244AA) .............................................................................................................................................................2-22-2

Chassis (SAV2AB) ....................................................................................................................................................................2-42-4

OAM server (NBRZAL) .......................................................................................................................................................2-132-13

Hub (NBMASW1) ..................................................................................................................................................................2-142-14

Processor blade (FM016JB or FM016JP) .....................................................................................................................2-172-17

Rear Transition Modules (NASYS or RPCMHDDA) ...............................................................................................2-192-19

Shelf management controller (NBSHMC) .....................................................................................................................2-232-23

Power supply .............................................................................................................................................................................2-262-26

Fillers ...........................................................................................................................................................................................2-292-29

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3 OAM server hardware details

Overview .......................................................................................................................................................................................3-13-1

OAM server module .................................................................................................................................................................3-23-2

Hardware details .........................................................................................................................................................................

3-33-3

Hardware description .............................................................................................................................................................3-113-11

Front panel ports ......................................................................................................................................................................3-123-12

4 Hub hardware

Overview .......................................................................................................................................................................................4-14-1

Hardware details .........................................................................................................................................................................4-24-2

Hardware architecture ..............................................................................................................................................................4-94-9

Hub RTM ....................................................................................................................................................................................4-104-10


5 Processor blade hardware

Overview .......................................................................................................................................................................................5-15-1

Hardware details .........................................................................................................................................................................5-25-2

Hardware architecture ..............................................................................................................................................................5-95-9

Processor blade RTM .............................................................................................................................................................5-105-10


SS7 AMC module ...................................................................................................................................................................5-145-14

6 Cabling and connections

Overview .......................................................................................................................................................................................6-16-1

Hardware connections ..............................................................................................................................................................6-26-2

Wiring for 5060 MGC-8 ports ..............................................................................................................................................

6-36-3

7 Part information

Overview .......................................................................................................................................................................................7-17-1

Chassis system components ...................................................................................................................................................7-27-2

Contents

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CLEI codes ...................................................................................................................................................................................7-47-4

Field Replaceable Units ...........................................................................................................................................................7-57-5

Customer documentation ........................................................................................................................................................7-77-7

Glossary

Index

Contents

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List of tables

1 Reason for reissue .....................................................................................................................................................xiiixiii

2 Manuals and part numbers .......................................................................................................................................xvxv

3 Other documentation ...............................................................................................................................................xviixvii

1-1 Chassis slot description ...........................................................................................................................................1-51-5

1-2 Cabinet configuration components .....................................................................................................................1-61-6

1-3 Module list ...................................................................................................................................................................1-61-6

2-1 Cabinet dimensions ...................................................................................................................................................

2-32-3

2-2 Chassis slots .................................................................................................................................................................2-52-5

2-3 Chassis dimensions ...................................................................................................................................................2-72-7

2-4 Environmental specifications ................................................................................................................................2-72-7

2-5 Chassis power specifications .................................................................................................................................2-72-7

2-6 Functions of physical components ......................................................................................................................2-82-8

2-7 Fan tray dimensions ...............................................................................................................................................2-122-12

2-8 Processor blade dimensions ................................................................................................................................2-132-13

2-9 Hub dimensions .......................................................................................................................................................2-152-15

2-10 Shelf management controller dimensions ......................................................................................................2-252-25

3-1 OAM server module physical specifications ...................................................................................................3-53-5

3-2 OAM server module interfaces ............................................................................................................................3-73-7

3-3 OAM server with AMC - front panel ports ...................................................................................................3-103-10

3-4 Management LEDs for OAM server with AMC .........................................................................................

3-103-10

3-5 X3401 and 3501 pin assignment .......................................................................................................................3-123-12

3-6 X3402 pin assignment ...........................................................................................................................................3-123-12

3-7 X5505 pin assignment ...........................................................................................................................................3-133-13

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3-8 CPU debug connector pins ..................................................................................................................................3-133-13

3-9 IPMC debug connector pins ................................................................................................................................3-143-14

4-1 Hub physical specifications ...................................................................................................................................4-34-3

4-2 Hub I/O interfaces .....................................................................................................................................................

4-54-5

4-3 Hub front panel ports ...............................................................................................................................................4-84-8

4-4 Hub management LEDs ..........................................................................................................................................4-84-8

4-5 Hub port reservations .............................................................................................................................................4-124-12

4-6 Ethernet port X3401 and 3501 pin assignment ............................................................................................4-134-13

4-7 X3402 pin assignment ...........................................................................................................................................4-134-13

4-8 X5505 pin assignment ...........................................................................................................................................4-144-14



5-1 Processor blade physical specifications .............................................................................................................5-35-3

5-2 Processor blade interfaces ......................................................................................................................................5-55-5

5-3 Processor blade front panel ports .........................................................................................................................5-65-6

5-4 Management LEDs for processor blade ............................................................................................................5-75-7

5-5 Processor blade configuration options ...............................................................................................................

5-85-8

5-6 X5101 pin assignment ...........................................................................................................................................5-125-12

5-7 X5505 pin assignment ...........................................................................................................................................5-125-12



5-10 Processor blade front panel ports ......................................................................................................................5-145-14

6-1 Single-chassis port designations ..........................................................................................................................6-36-3

6-2 Cables for single-chassis configuration .............................................................................................................6-36-3

7-1 Chassis system components ...................................................................................................................................7-27-2

7-2 Cabinet system components ..................................................................................................................................7-37-3

7-3 CLEI Codes .................................................................................................................................................................7-47-4

List of tables

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7-4 List of Field Replaceable Units ............................................................................................................................7-57-5

List of tables

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List of figures

1-1 5060 MGC-8/VSG single-chassis configuration ...........................................................................................1-51-5

2-1 Cabinet (NRA244AA) .............................................................................................................................................2-22-2

2-2 ATCA chassis (SAV2AB) photograph ...............................................................................................................2-42-4

2-3 Functional single-chassis configuration ............................................................................................................2-62-6

2-4 Chassis front view .....................................................................................................................................................2-92-9

2-5 Chassis top view ......................................................................................................................................................2-112-11

2-6 Hub front panel ........................................................................................................................................................

2-162-16

2-7 Processor blade front panel .................................................................................................................................2-182-18

2-8 Hub RTM front panel ............................................................................................................................................2-202-20

2-9 Processor blade RTM (RPCMHDDA) ............................................................................................................2-222-22

2-10 Shelf manager front panel ....................................................................................................................................2-242-24

2-11 Power Distribution Unit (SAPDUAA) ............................................................................................................2-272-27

2-12 Alarm module (RALARMAA) ..........................................................................................................................2-282-28

3-1 OAM server architecture overview .....................................................................................................................3-43-4

3-2 OAM server side view and front panel ..............................................................................................................3-53-5

3-3 OAM server front panel ..........................................................................................................................................3-93-9

3-4 CPU and IPMC Debug connector .....................................................................................................................3-133-13

4-1 Hub side view and front panel ..............................................................................................................................4-34-3

4-2 Hub front panel ...........................................................................................................................................................4-74-7

4-3 Hub architecture overview .....................................................................................................................................

4-94-9

4-4 Hub RTM front view ..............................................................................................................................................4-114-11


5-1 Processor Blade (FM016JB or FM016JP) ........................................................................................................5-35-3

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5-2 Processor blade architecture overview ..............................................................................................................5-95-9

5-3 Processor blade RTM front panel ......................................................................................................................5-115-11


List of figures

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About this documentAbout this document

Purpose

TheAlcatel-Lucent Gateway Platform Hardware Guide for the 5060 MGC-8,

(255-400-209) is part of the overall Alcatel-Lucent Gateway Platform switch

documentation set. It is referred to as theHardware Guidethroughout this manual.

TheHardware Guideprovides an overview of the switch and its features. Descriptionsand illustrations of the switch hardware are included, along with system specifications,

site engineering information, interconnect drawings, part numbers, and ordering

information for all hardware.

This section describes the Hardware Guide, how it relates to other manuals within the

switch documentation set, and reasons for reissuing this document. The following topics

are described in this introduction:

Reason for Reissue

Scope and Audience

Hardware Guide Organization

Using the CD-ROM

Relationship Between Manuals

Documentation Set

Reason for revision

This is Issue 1 of the Alcatel-Lucent Gateway Platform 5060 MGC-8/VSG Hardware

Guide.

Table 1 Reason for reissue

Chapter/Section Description

Issue 3

Throughout Changed product name 5060 MGC-8/VSG to 5060

MGC-8

Issue 2

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Table 1 Reason for reissue (continued)

Chapter/Section Description

Throughout Minor edits

All Issue 1

Audience

This manual is intended for personnel who are responsible for or who help to plan for the

installation, ordering, replacing, handling, and provisioning of the switch equipment using

TL1 commands and/or the 1310 OMC-P interface. These personnel must have a thorough

knowledge of telecommunications.

Note:The 1310 OMC-P interface sometimes refers to the modules in the switch as

cards. This document refers to such equipment as I/O module, IOM, or module. When

ordering modules, the name of the module, as listed in Chapter 6, Part Information,

should be used.

Part number

The part number for this guide is255-400-209.

Document organization

This Hardware Guide contains an overview of all hardware supported by and needed to

run the Alcatel-Lucent Gateway Platform switch.

In addition to providing an overview of hardware needed to support the Alcatel-Lucent

Gateway Platform switching system, theHardware Guidealso contains the followinginformation:

A description of the switch manuals andHardware Guideorganization, general

information about the switch documentation, and information for contacting

Alcatel-Lucent technical services.

Physical dimensions and power and wire information about switch hardware.

Rack and physical locations of the front and rear modules, protection slots, LEDs,

push buttons, fan tray, fan filter, rear cables, and power and ground locations.

Building requirements, chassis dimensions, space requirements, grounding

requirements, power requirements, system interfaces, slot assignments, tools and test

equipment, an Installation Planning Checklist, and the switch configuration.

Parts information, which provides a list of part numbers for every switch-related

product which can be ordered.

For information regarding initial engineering, monitoring, and re-engineering for growth

in existing applications, refer to the Alcatel-Lucent Gateway Platform System Capacity,

Monitoring, and Engineering (SCME) Guidelines,(255-400-005).

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Relationship between documents

TheHardware Guidecontains information and many illustrations of the hardware

components that must be provisioned before you can use the switch. Therefore, the

Hardware Guideis mostly independent of all other Alcatel-Lucent Gateway Platform

documentation, although other documentation may be useful during actual installation

and provisioning procedures. Descriptions and illustrations of IOMs, cables, and otherhardware encountered are contained within the Hardware Guide.

While theAlcatel-Lucent Gateway Platform TL1 Commands Reference Guide,

(255-400-xxx) has no direct correlation to theHardware Guide, it does contain the TL1

commands needed to provision the hardware and software for the switch and its

components. The same can be said about the 1310 OMC-P documentation, as it is specific

to provisioning the switch via the 1310 OMC-P interface.

TheAlcatel-Lucent Gateway Platform System Capacity, Monitoring, and Engineering

(SCME) Guidelines,(255-400-xxx) contains information that supports planning for the

number of required modules and the number of required switches in the network. Carefulattention to this document ensures the appropriate system hardware sizing.

Table 2, Manuals and part numbers (p. xv),lists the standard set of Alcatel-Lucent

Gateway Platform documentation, their part numbers, and a brief description. Other

manuals, which are available upon purchase of additional software, are listed inTable 3,

Other documentation (p. xvii).

Table 2 Manuals and part numbers

Product Part

Number Product Description

Alcatel-Lucent Gateway Platform OperationsGuide

255-400-000

Contains the platformprovisioning procedures for the

Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform

Maintenance and Diagnostic Procedures Guide

255-400-

001

Contains procedures for adding

and upgrading modules, and for

diagnosing error messages on

the the Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform Alarms and

Troubleshooting Procedures Guide

255-400-

019

Contains procedures for

troubleshooting and clearing

switch alarms on the

Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform TL1

Commands Reference Guide

255-400-

002

Contains a description of all the

TL1 commands needed to

provision the Alcatel-Lucent

GP platform, functional entities

and services.

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Table 2 Manuals and part numbers (continued)

Product Part


Alcatel-Lucent Gateway Platform Hardware

Guide

255-400-

003

Contains the information

necessary for designing an

installation site including:

hardware specifications;

cabling schematics; and

cabling, floor plan,

environmental and power

requirements.

Alcatel-Lucent Gateway Platform System

Capacity, Monitoring, and Engineering

(SCME) Guidelines

255-400-

005

Contains Alcatel-Lucent GP

engineering rules, system

monitoring information, critical

triggers and measurements,

geographic redundancyinformation, and ethernet

interfacing, IP addressing and

SS7 transport provisioning.

Alcatel-Lucent Gateway Platform Release

Notes

255-400-

006

Contains new features and

feature enhancements, new and

modified TL1 commands,

hardware and software

limitations and other important

release-specific information for

the Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform Feature

Guide

255-400-

012

Contains detailed feature

descriptions for existing and

new features supported by the

Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform Software

Change Procedure Guide

255-400-

013

Contains procedures for

upgrading and downgrading,

and for provisioning for

geographic redundancy on the

Alcatel-Lucent GP.

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Table 3 Other documentation

Product Part


1310 OMC-P for Alcatel-Lucent GP

Management User Guide

255-400-

400

Contains 1310 OMC-P

provisioning referenceinformation.

1310 OMC-P Installation and Upgrade Guide 255-400-

401

Contains installation

information for installing the

1310 OMC-P software on a Sun

workstation.

1310 OMC-P Software Release Notice 255-400-

402


feature enhancements, software



the OMC-P.Alcatel-Lucent Gateway Platform Billing and

Traffic System (BTS) User's Guide

255-400-

403

Contains installation, upgrade,

and applications procedures for

the BTS.

Alcatel-Lucent Gateway Platform BTS

Release Notes

255-400-

404


feature enhancements, software



the BTS.

1310 OMC-P Server, BTS Server, and ATC

Server Security Guidelines

255-400-

417

Contains suggested security

guidelines for systemadministrators using the

OMC-P server, BTS server and

ATC server.

1310 OMC-P Web API User's Guide 255-400-

419

Contains reference information

for the Web API application.

1310 OMC-P for the Alcatel- Lucent GP

Control Platform User Guide for Managing the

5420 Converged Telephony Server (CTS) and

the 5450 IP Session Control (ISC)

255-400-

420

Describes functions available

from the GUI used to provision

and manage the Alcatel-Lucent

CP

1310 OMC-P for the Alcatel-Lucent GPPersonal Communication Manager

255-400-600

Describes functions availablefrom the GUI used to provision

and manage an Alcatel-Lucent

CM system.

1310 OMC-P Advanced Reporting System

User Guide

255-400-

200

Contains ARS provisioning

information.

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Table 3 Other documentation (continued)

Product Part


1310 OMC-P Advanced Reporting System and

Advanced Traffic Collector Installation and

Upgrade Guide

255-400-

201

Contains installation and

upgrade information for the

ARS software.

Contact information

Installation support

On-site installation support is provided during the installation of the initial release and, if

necessary, during an upgrade. An Alcatel-Lucent Installation Technician will be on site

with you to perform the installation on a previously scheduled date.

Note:Most upgrades are done remotely.

The Alcatel-Lucent Installation Technician may arrange for a third-party installation

contractor to help with the installation, if necessary.

The Alcatel-Lucent Installation Technician will verify acceptance of the installation with

you by obtaining your signature on an acceptance form.

Questions about the Alcatel-Lucent installation support should be directed to your

Alcatel-Lucent Services Customer Team.

Technical support

The Services Business Group (SBG) provides customer support for the switch 24 hours a

day, 7 days a week.SBG uses an Action Request (AR) system to assign, document, track, and report all

customer call activity. All calls are assigned an AR number and are fully documented in

the system, no matter what the level of severity.

Calls usually fall into one of several categories:

Calls that can be solved on the telephone at the time of the call

Calls that inquire about returning hardware

Calls that require escalation

Complaints

When a call is first received, it must be determined whether the call is a new call or an

open call. If it is a new call, an AR number is assigned immediately, and the information

entered into the system. If the call is in reference to an open call, you must know the AR

number so that SBG can retrieve the AR information.

Calls That can be Solved Immediately

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After determining whether the call is new or open, the SBG may be able to solve the

problem while you are on the telephone. In this case, the SBG will document the

resolution and close the call. Every effort will be made to resolve the issue on the first

call.

Calls for Returning Hardware

Switch components being returned for repair or replacement must be processed through

the Alcatel-Lucent RMA procedures. A hardware repair is defined as an item returned to

Alcatel-Lucent due to a failure, with the returned item being repaired and returned to you,

the customer. All hardware components and I/O modules are described in the section

Hardware Description.

Calls That Require Escalation

When a call is received and an action request number is assigned, a level of severity is

also determined. Levels of severity are categorized as follows:

Level of Severity Symptom Examples

Minor Problem does not

significantly impair

function of the system

Requests for system service, equipment,

documentation, training, information, or

routine maintenance

Major Conditions that seriously

affect system operation

Short system outages, reduction in

measurement function

Critical Affects service Total system failure, reduction in capacity

or traffic handling capability

If personnel are not immediately available when a call is received, your call will bereturned according to the severity assigned. For instance, a minor call is returned within

eight hours, and a major call within four hours. If the call is critical, you will be placed on

hold until an SBG engineer can be located.

You may, at any time, ask that the issue be escalated to management. The SBG will then

notify the appropriate manager. If required, on-site technical support will be provided

within 24 hours of a customer request.

Complaints

Customers have the ability to submit complaints by entering an action request via the

Alcatel-Lucent CARES Trouble tracking system athttp://www.alcatel-lucent.com/support/(http://www.alcatel-lucent.com/support/). However, if you have an engineering complaint,

you must file form EO-143, in accordance with GR-230-CORE. Engineering complaints

will also be recorded in the AR system, but acknowledgement of form EO-143 will be

made by returning an acknowledgement report, form 79-7020-ECCnfrmtn, by the end of

the working day following receipt of the complaint.

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Regular and engineering complaints will be handled by an assigned department, with the

SBG Manager monitoring the engineering complaint until the issue is resolved.

Closing Action Requests

ARs will only be closed when all deliverables required to resolve the AR, such as

information, documentation, and software, are provided.RMA procedure

You may identify equipment that needs to be repaired or replaced. Alcatel-Lucent is

pleased to offer comprehensive hardware repair and exchange services. For contact

information for your service, product, and location, refer to

http://support.lucent.com/portal/rmaForm.doc.

Using the method of contact shown at the site (either online or by phone) for the different

services will ensure the most timely handling of your request.

How to comment

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1 1Platform description

Overview

Purpose

The 5060 MGC-8/VSG is a hardware and software platform compliant with Advanced

Telecommunications Computing Architecture (ATCA) standards. This chapter providesan overview of the standards and the application of these standards to the 5060

MGC-8/VSG hardware.

Contents

Platform design 1-2

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Platform design

ATCA standards

The 5060 MGC-8/VSG is a standardized platform for the telecommunications industry

based on the Advanced Telecommunication Architecture (ATCA). The 5060 MGC-8/VSGplatform can support multiple applications which are not hardware-dependent. The open

architecture enables high performance computing and telecommunication solutions,

hence offering improved carrier-grade performance, and consequently, better reliability,

manageability and serviceability.

Standard design

Alcatel-Lucent follows the practice of standards-based design which reduces

incompatibility across operating systems, locations, and environments.

The ATCA PICMG 3.0 standard prescribes the mechanical dimensions for plug-in blades,

a printed circuit blade, and a faceplate (Height 8 U and Width 280 mm / 11.032 inches).The blade pitch is 6 hp (1.2 inches, or 30.48 mm). The blades connect to the standard

ATCA backplane connectors and to the rear transition modules (RTMs). The connector

provides the interfaces between the ATCA backplane and the various nodes and fabric

switches.

Design implications

The 5060 MGC-8/VSG is based on the ATCA platform which is characterized by its

ability to support high capacity telecommunications applications.

The benefits of the platform, which are a result of its advanced architecture and design,include:

Power dissipation up to 300W per blade

Higher component density (RAM capacity similar to the rack-mounted server

capacity)

Redundant data-plane which facilitates discrete transport for control plane and user

plane

Bandwidth between slots: 2 GBit/s in compliance with PICMG 3.1

-48 V / 60 V power supply distributed on each blade

Platform description Platform design

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Certification

The 5060 MGC-8/VSG platform has certifications for the entire platform architecture

including specifications for PICMG 3.0, as well as ETSI and EBS Level 3 certifications.

The 5060 MGC-8/VSG platform adheres to the following standards:

PICMG 3.0, EC 001 and EC 002 PICMG 3.1

AMC.0 for the Mezzanine module

AMC.1 for PCI Express

AMC.3 for storage

IPMI

SA Forum OpenHPI

Safety according to PICMG 3.0 (IEC60950, E60950, UL60950)

EMC enables PICMG 3.0 at chassis level

All configurations are certified for EBS Level 3, Earthquake Zone 4.

NOTE:Use of the term EBS implies global physical design environmental and safety

standards, including Telcordia EBS, ETSI, Verizon EBS and TCG.

ATCA hardware elements

The platform hardware is a combination of the chassis, blades, and a single-blade

computer that performs hardware management, platform diagnostics, and switching

control interface services on the platform operating system.

The ATCA base platform offers a consistent set of deliveries which are independent of

middle-ware. The implementation of the ATCA platform can create an ecosystem which

encompasses most of the core applications offered by Alcatel-Lucent, hence enabling

smooth product integration and convergences.

The ATCA platform hardware broadly comprises the following hardware elements

classified on the basis of their functionality:

Processing elements

Storage elements

Switching elements

Implementation rules

The following rules apply to the hardware implementation in the 5060 MGC-8/VSG

chassis:


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Functions

Three blade types and two RTMs fulfull the functions in this release as follows:

Hub function - Hub (NBMASW1)

OAM function - Processor blade (NBRZAL)

Traffic function - Processor blade (FM016JB) SS7 function - Processor blade (FM016JP) + RTM (RPCMHDDA)

Shelf controller

Two Shelf Management Controllers (ShMC) are mandatory per chassis and they must be

installed in slots M16 and M15 respectively.

Fan trays

A top fan tray and bottom fan tray are required for each chassis.

Mechanical parts

The following mechanical parts are mandatory for each chassis: 1- 3U bottom deflector and 1 - 4U deflector

1 - front air filter

1 - rear air filter

1 - front cable tray

1 - rear cable tray

Hub function

The following parts are required to fulfill this function:

2 - Ethernet blades installed in the M07 and M08 slots in the chassis.

2 - Rear Transmission Modules (RTMs) (NASYS) installed in the M67 and M68

slots.

Unused slots

Unused board slots must always be filled by a Front Filler (NBFILL) and unused RTM

slots must be filled by an RTM filler (NAFILL).

Configurations

This release supports both a stand-alone configuration and a 1-chassis configuration in a

cabinet. The stand-alone configuration does not include a PDU or an alarm board. A

cabinet configuration with one chassis does require both a PDU and an alarm board.The single-chassis configuration is supported for the 5060 MGC-8/VSG platform. This

figure shows an example of a single-chassis configuration.


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When a cabinet is being used in the configuration, the following items are required in

addition to the Base Requirements shown inChassis system components (p. 7-2).

Table 1-2 Cabinet configuration components

Part Number Quantity Mnemonic Description

3CM02769AA 1 NRA244AA AL5 Cabinet

3CM03649AA 1 KMPJ1 generic mounting kit

3CM02902AA 1 SAPDUAA PDU

3CM02949AA 1 RALARMAA Alarm board

3CM03235AA 1 MABAFBAA Bottom air deflector

3CM03302AA 1 MABAF4AA Middle air deflector

3CM02588AA 1 MABAFTAA Top air deflector

ModulesThis section provides a list of the 5060 MGC-8/VSG modules.

Table 1-3 Module list

Module Part number Mnemonic

Hub Switch 1GB 3CM02660CA NBMASW1

OAM Server with 1HDD 147G 8GB Memory 3CM02859CL NBRZAL

Processor Blade 16GB 3CM03285JB FMO16JB

Processor Blade 16GB with SS7 3CM03285JP FMO16JP

RTM Synchro & Switching 3CM02570AA NASYS

RTM 8E1/T1 75/120 + 1xHDD 300G 3CM02682AA RPCMHDDA

Shelf Manager Board of ATCA S helf 3CM02418AA NBSHMC


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2 2Hardware components

Overview

Purpose

This chapter provides an overview of the hardware components of the 5060 MGC-8/VSG

platform.

Contents

Cabinet (NRA244AA) 2-2

Chassis (SAV2AB) 2-4

OAM server (NBRZAL) 2-13

Hub (NBMASW1) 2-14

Processor blade (FM016JB or FM016JP) 2-17

Rear Transition Modules (NASYS or RPCMHDDA) 2-19

Shelf management controller (NBSHMC) 2-23

Power supply 2-26

Fillers 2-29

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Cabinet (NRA244AA)

Overview

The configuration consists of one chassis within a cabinet.

This configuration has the following requirements:

Single 44U enclosed cabinet

One ATCA chassis

Optional RTMs used by the Hub cards to expand the number of transport connections.

Six pairs of slots for the node blades. One slot pair for OAM Servers (NBRZAL) and

five slot pairs for traffic processing (NBRZAM, FMO16JB, and FMO16JP).

Cables and other accessories required to support a maximum cabinet configuration

with two shelves.

Figure 2-1 Cabinet (NRA244AA)

Hardware components Cabinet (NRA244AA)

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Components

The ATCA cabinet includes:

One of the following deflectors, depending upon the number of shelves that are being

used. These air deflectors provide air flow circulation and fire enclosure

3U 300W bottom deflector (MABAFBAA)

4U 300W middle deflector (MAMAF4AA)

3U 300W top deflector (MABAFTAA)

3U -48V Power Distribution Unit (SAPDUAA) at the top of the cabinet with an

Alarm card

Cabinet dimensions

The following table shows the dimensions of the 44U cabinet shown inFigure 2-1,

Cabinet (NRA244AA) (p. 2-2).

Table 2-1 Cabinet dimensionsCharacteristic Dimension

Height 600 mm/19.68 inches

Depth 600 mm/19.68 inches

Height 2125 mm/83.66 inches

Weight 138 kg/304.23 lbs for an empty cabinet

Hardware components Cabinet (NRA244AA)

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Chassis (SAV2AB)

Overview

The ATCA chassis (SAV2AB) provides the mechanical and hardware management

interface to PICMG 3.0 blades.This section provides technical details for chassis slots, dimensions, environmental

conditions, and power feeds.

This photograph shows an empty ATCA chassis.

Figure 2-2 ATCA chassis (SAV2AB) photograph

Hardware components Chassis (SAV2AB)

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Functional description

The chassis performs the following functions:

Environmental performance

Blades/customer interfaces

Dust filter management Fan tray management

Hardware management

Power filter interface and distribution

Thermal management

EMC containment

Industrial design management

Chassis slots

Each 5060-MGC chassis has 14 slots to hold OAM processors, Ethernet hubs, andprocessor blades. Each slot has a front side in which a node or hub blade can be installed

and a rear side in which a Rear Transition Module (RTM) can be installed.

Each 5060 MGC-8/VSG chassis contains the following blades:

2 Ethernet hubs for internal communications in front slots 7 and 8.

RTMs for external connectivity to customer networks in rear slots 7 and 8.

Processor blades and AMCs for the OAM server in slots 1 and 2.

Processor blades in the remaining front modules with Hard Disk Drives (HDD) or

RTM modules in the rear for slots 2 through 10. Optionally, AMC SS7 modules can

be located in the front slots to provide TDM connectivity for SS7 links.

Table 2-2 Chassis slots

Number of Slots Description

15 Slots total

1 Slot dedicated as a dual-chassis manager

14 Slots for I/O, working, and protection


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Slot assignments

The single-chassis configuration is supported for the 5060 MGC-8/VSG platform. This

figure shows an overview of proper use of the slots in a single-chassis configuration.

First chassis to be equipped

In a single-chassis configuration, the Processor blades that are installed in slots 1 and 2

will function as the OAM servers. In a multiple chassis configuration, the first chassis to

be configured will have Processor blades in slots 1 and 2 that function as OAM servers.

Subsequent chassis' in the same are not required to have OAM servers in slots 1 and 2.

Figure 2-3 Functional single-chassis configuration

ShMC

ShMC

Fan tray

0201 03 04 05 06 07 1009 11 12 13 1408

ShMC

ShMC

Fan tray

0201 03 04 05 06 07 1009 11 12 13 1408

Fan tray

0201 03 04 05 06 07 1009 11 12 13 1408

LCPOAM

Server

AMC

HDD

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

LCPOAM

Server

AMC

HDD

GE0GE1

GE2GE3

GE4GE5

LCPOAM

Server

AMC

HDD

GE0GE1

GE2GE3

GE4GE5

AMC

HDD

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ACCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0 GE1

GE2 GE3

GE4 GE5

GE0 GE1

GE2 GE3

GE4 GE5

ADCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0GE1

GE2GE3

GE4GE5

GE0GE1

GE2GE3

GE4GE5

ADCM

GE0 GE1

GE2 GE3

GE4 GE5

GE0 GE1

GE2 GE3

GE4 GE5

ACCM

GE0 GE1

GE2 GE3

GE4 GE5

GE0 GE1

GE2 GE3

GE4 GE5

EthernetSwitch

GE0 GE1

GE2 GE3

GE0 GE1

GE2 GE3

EthernetSwitch

GE0GE1

GE2GE3

GE0GE1

GE2GE3

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

AMC

SS7

RTM

(GigE)

RTM

(GigE)


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Chassis dimensions

The following table provides the technical dimensions of the Chassis. The chassis is 11U

and 13U with airflow deflectors.

Table 2-3 Chassis dimensions

MECHANICAL SPECIFICATIONS

Height 489 mm

Width 482 mm

Depth 383.14 mm from module

Weight 75.1 kg fully equipped

26 kg empty except for fan units

Chassis environmental specifications

The ATCA chassis must always be operated in a temperature and humidity controlled

room according to the environmental specifications shown in the following table.

Table 2-4 Environmental specifications

Environmental Conditions Value

Operating temperature +5 to +45 (C)

0C to +55C in degraded

conditions

Relative humidity Up to 85%

Conforms with ANSI T1.304

Power

Two independent and secured DC power sources are required for the chassis. The 5060

MGC-8/VSG chassis is always equipped with two redundant power modules, allowing

the chassis to be fed in uninterrupted redundant mode.

Refer to for power specifications.

Table 2-5 Chassis power specifications

Requirement Input/Output Power

DC power inputs 2x2 redundant accesses

Input voltage -48 V/-60 V, based on duplicated distribution

Note: the current range is from -36 Volts to -72

Volts


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Table 2-5 Chassis power specifications (continued)

Requirement Input/Output Power

Operating Voltage - 48 V DC

Voltage Range -39 V to -60 V DC

Maximum Consumption Configuration 200Wper slot

Power Dissipation Up to 300W per blade

Up to 400W per slot

Functions and physical components

This section describes the function of the main physical components of this configuration.

Table 2-6 Functions of physical components

Function Component Mnemonic

Hub function Hub NBMASW1

OAM function Processor blade NBRZAL

Traffic function Processor blade FMO16JB/FMO16JP

Technical specifications

The chassis is a 19 inch 11U dual-star backplane mechanical chassis consisting of the

following components:

1 - Mechanical chassis with dual star backplane

2 - Front and rear air filters (NDAFF and NDAFR)

Redundant power entry modules (PEM)

Dual fan trays at the top and bottom of the chassis, each with 6 fans

2 - Shelf Management Controller (NBSHMC) blades located on the right side of the

chassis in physical slot 15

14 - Slots for node and hub blades. Each slot has a front side to accommodate a blade

and a rear side to accommodate a rear transition module (RTM)

Push-pull air forced cooling with a capacity of up to 300W per slot

Update channels between even and odd slots

Processor CPU blades; maximum of twelve

2 - Ethernet hubs for internal communication

3 - Backplanes

1 - Backplane to host up to 14 blades

An additional slot to host two chassis manager blades


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Separate top and bottom air deflectors

A large air compression chamber which ensures even thermal performance among the

14 slots

Requirements

The 5060 MGC-8/VSG chassis has been designed to meet the following requirements.

Mechanical requirements

The 5060 MGC-8/VSG chassis supports the Midplane concept which is characterized by:

Rear Transition Module (RTM) for rear I/O

RTM power feeds distribution done by the associated front board

Direct connections between front boards and RTMs

Mandatoary Mechanical parts

Each chassis includes the following mandatory mechanical parts:

1 - 3U Bottom Deflector (MABAFBAA) and one 4U deflector (MABAF4AA) for the

first chassis

1 - Front air filter (NDAFF)

Figure 2-4 Chassis front view

Fan Tray

Fan Tray

N

o

de

H

u

b

H

u

b

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

N

o

de

S

h

M

C

S

hM

C


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1 - Rear air filter (NDAFR)

1 - Front cable tray (KMFT1)

1- Rear cable tray (KMRT2)

Backplane

The 5060 MGC-8/VSG chassis backplane is based on three zones of functionality. Zone 1

provides dual 48V power and chassis management system connections, zone 2 provides

the data transport interfaces, and zone 3 is the RTM face plate for the I/O functions.

Zones 1 and 2 are part of the same printed circuit board while zone 3 is a connection

between the front board and RTMs through on-board connectors.

On zone 2, the data transport interfaces support four separate types of interfaces which

provide connectivity for up to 14 slots along the backplane. These four interfaces are the

Base Interface, Fabric Interface, Update Channel Interface, and the Synchronization

Clock Interface.

Note: The Synchronization Clock Interface is not supported in Release 8.0.1.

The backplane accommodates three types of plug-in modules: Ethernet hubs, Processor

blades, and Shelf controller modules. In addition the backplane provides connections to

the upper fan tray through small transition PCBs, connections for the -48V power supply

inputs for the chassis, and it directly plugs into the lower fan try for cooling purposes.

The following figure shows the backplane in a top view drawing of the chassis.


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Cooling unit

The 5060 MGC-8/VSG chassis uses adaptive, forced air convection cooling. Air is drawn

through the bottom front side of the chassis and exhausted out the top rear side of the

chassis by means of air deflectors separated from the chassis.

The design of the chassis cooling units allows a maximum power dissipation of 300W per

5060 MGC-8/VSG front blade slot.

Deflectors

The chassis is installed with an upper and a lower deflector. The lower deflector acts as anair intake for the blades and RTM, and the upper deflector acts as a rear exhaust. Another

function of the deflectors is to close the fire enclosure. The deflectors are fixed to the

front rack uprights and not to the chassis. In addition, the deflectors are designed to help

mount the chassis into a rack with guide rails that provide guidance.

Note: Racks are not included in Release 8.0.0

Figure 2-5 Chassis top view

01 02 03 04 05 06 07 08 09 10 11 12 13 14

01 02 03 04 05 06 07 08 09 10 11 12 13 14

Physical slot

Physical slot

13 11 09 07 05 03 01 02 04 06 08 10 12 14

13 11 09 07 05 03 01 02 04 06 08 10 12 14

Logical slot

Logical slot

RTM

J

AUCS

1

J

AUCS

2

J

AUCS

3

J

AUCS

4

J

AUCS

5

J

AUCS

6Node

Hub

Node

Node

Node

Node

Node

Node

Node

Node

Node

Node

Node

Hub

RTM

RTM

RTM

RTM

RTM

RTM

RTM

RTM

RTM

RTM

RTM

RTM

RTM

ShMC

BACKPLANE

Rear side

Front side


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Two types of deflectors are used depending on the rack layout:

1U orthogonal 3-sided air intake

2U diagonal deflector 1-sided air intake

Fan tray (NSFANV2)

The cooling unit of the 5060 MGC-8/VSG chassis is made of two field replaceable fantrays, with each fan tray containing six fans. The fan tray draws air from the bottom front

side and pressurizes air to flow through the chassis. Air then exits the chassis through a

dedicated rear upper exhaust. A control for each cooling unit provides fan speed

monitoring and an alarm interface. To ensure balanced air flow in partially populated

systems, filler blades and faceplate assemblies are required to complete the enclosure.

The mechanical design of the chassis tends to create static (not changing over time) and

spatial (changing within space) variations in the cooling performance between slots, as

well as within the depth of a slot. The 5060 MGC-8/VSG chassis is mechanically

designed to provide the same cooling capabilities for each slot.

The cooling unit equipment is made of:

1 - mechanical structure with 2 guides to aid with insertion and 2 locking screws to

lock each module in place

1 - fan control blade with power and signal connectors

No grids are implemented. A mechanical key is used to protect the operator while

manipulating the fan tray.

Fan tray dimensions

The following table provides the technical dimensions of the fan tray.

Table 2-7 Fan tray dimensionsCharacteristic Dimension

Height 600 mm

Depth 600 mm

Height 138 kg

Maximum Consumption 220W

Typical Consumption

without AMC

150W

Weight 4 to 5 Kg


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OAM server (NBRZAL)

Overview

The OAM server (NBRZAL) runs on a pair of processor blades that are dedicated for this

purpose. This single board computer includes the following components: One Dual Core Intel T 7400 processor running at 2.16 GHz with 8 GB of memory

One AMC with 147 GB SAS disk

Six Gigabit Ethernet ports are auto-negotiated and auto-MDIX. Two of these GigE

ports link to the host processor for out-of-band external management.

An optional RPCMHDDA RTM to provide additional disk storage

OAM server function

The OAM server supports the following services:

Hardware monitoring management of the chassis, node cards, and switch cards usingthe shelf manager (ShMC).

ACCM and ADCM growth, OS installation, software installation, upgrades, and

downgrades, and FRU replacement.

Alarming, both visible and audible, to the 1310 OMC-P via the MI on the OAM

server.

Internal IP Address configuration

Dimensions

The following table provides the technical dimensions of the processor blades.

Table 2-8 Processor blade dimensions

Characteristic Dimension

Height 8U/322.25 mm

Depth 280 mm

Pitch 30.48 mm

Input power voltage 36 & 75 VDC (48 VDC nom.)

Power consumption per processor blade with

AMC

190 W max

Ambient temperature between +5 C and +40 C

Weight 2.24 kg (with 1 AMC)

2.056 kg (no AMC)

Common power supply for two AMCs 50 W max

Hardware components OAM server (NBRZAL)

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Hub (NBMASW1)

Overview

Ethernet hubs in the 5060 MGC-8 5060 platform are responsible for internal

communications. Their purpose is to provide a star topology backplane that providesconnectivity to multiple processor blades within the backplane. Each processor blade is

connected through the backplane to the two Hub. Two Ethernet hubs comprise a

single-blade computer in switch-only mode. Slots 7 and 8 are dedicated to the hub blades.

The main functions of the Ethernet hubs are to provide:

Switching capabilities

Accesses to the external Ethernet backbone

Uplink accesses to other racks in a cabinet (not supported in this release).

Synchronization module

The 5060 MGC-8 platform contains two Ethernet hubs for internal communications, eachconsisting of the following hardware:

1 - single blade computer in switch-only mode

RTMs (NASYS) for the hub switches for inter-chassis communications.

Note:The Hub RTMs do not provide Chassis Reference Clock generation anddistribution.

Single blade functions

The single-blade computer includes the following components:

1 - Dual-core Intel T 7400 processor running at 2.16 GHz with 1 GB of memory Dual star Ethernet switching fabric

4 - 1000 Base-T Ethernet links to the base interface on front panel

1 - 10 GE interface connected to the fabric interface on front panel

1 - 10/100/1000 Base-T interface connected to the on-blade CPU

CPU features

The CPU has the following features

1 Dual-core 2.13 GHz chipset, 32/64-bit, 4M L2 cache

Up to 8 GB memory

2 - Gigabit Ethernet ports

USB 2.0 port (bootable)

RS-232 port

Hardware components Hub (NBMASW1)

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Embedded GigE switch

The embedded GigE switch is characterized by

Full GigE connectivity between backplane AMC sites and the CPU

4 - GigE external (front) ports and 2 - GigE ports on the NASYS RTM (1 - 1000

interface connected to each CPU blade slot)

Dimensions

The following table provides the technical dimensions of the Hub.

Table 2-9 Hub dimensions

Characteristic Dimension

Height 8U/322.25 mm

Depth 280 mm

Pitch 30.48 mm

Maximum Consumption 150W(with 1 AMC)

Typical Consumption

without AMC

78W(load 10%)

90W(load 50%)

98W(load 100%)

Weight 2.24 Kg (with 1 AMC)

2.056 Kg (without AMC)


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Diagram of Hub front panel

The following diagram provides an example of the front panel of a hub blade.

Figure 2-6 Hub front panel

FRONT PANEL

3CM02660

AAAD04

NBMASW1

NBAFIM

NBAFIM

GEO GE1

GE2 GE3

UPL0

UPL1

BS0847

UE 22L

1

2

3

C

CI

3CMO2741

AAAB

2 AMC slots

for PCI Express and Storage

interfaces

4 * 1000Base-T Ethernet

links(Base interface)

debug USB port

debug Fast Ethernet port

10GE electrical interface


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Processor blade (FM016JB or FM016JP)

Overview

Up to 12 Processor blades run 5060 MGC-8 services. The minimum requirement is one

single-blade computer with one dual-core Intel T 7400 processor running at 2.16 GHzwith 8 GB of memory, one AMC with 146 GB SAS disk, and two front panel GE links to

the host processor (for out-of-band external management). The hardware variant depends

on the blades function.

5060 MGC-8 services

The processor blade supports the following 5060 MGC-8 services

Management interface

Configuration server

ACCM director

Shared network services

Processor characteristics

Key characteristics of the 1 Merom T 7400 Dual core processor blade are:

32/64-bit operation

L1 cache: 32K I-cache, 32K write-back cache

L2 cache: 4 MB

Up to 8 GB memory

2 - GigE ports to CPU USB 2.0

Boot options: HDD, USB, IDE flash, TFTP

RS-232 console port for debugging, through mini-USB plug

2 - AMC sites

Embedded GigE switch offering full GigE connectivity to backplane

1 - GigE to each AMC slot

2 - 1GigE to CPU

4 - GigE external (front)

2 - GigE on RTM

120Watts power consumption for base blade, plus 20WRTM, 50WAMC and 15W

DIMM.

Hardware components Processor blade (FM016JB or FM016JP)

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Documents

5060 MGC-8 Hardware Guide