2830 ZT WAFER ANALYZERNon-contact determination of layer thicknessand composition

ULTIMATE CAPABILITY FOR MEASURING FILMS THICKNESS AND COMPOSITION

The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer is the successor to Malvern Panalytical’s highly acclaimed PW2830. Designed specifically for the industry, it enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.

The 2830 ZT Wafer Analyzer is equipped with Malvern Panalytical’s advanced 4 kW SST-mAX X-ray tube, featuring groundbreaking ZETA technology which eliminates the effects of X-ray tube aging – by far the largest contributor to instrument drift. As a result, the 2830 ZT attains the highest levels of productivity and sensitivity, with excellent light element performance. What’s more, thanks to ZETA technology, the 2830 ZT maintains these qualities throughout its entire lifetime.

Benefits

Unrivalled productivity• Continuous capability and speed.• Maximized uptime.• Superior light element capability.

Fast and cost-effective multi-layer analysis• Powerful Fundamental Parameter software.• Analysis of stacks up to 16 layers.• Simultaneous measurement of up to 24 elements.• Intuitive operation.

Seamless fab integration• Efficient, compact system design.• From manual to fully automated wafer loading. • Compliance to all relevant standards.

A complete solution• Excellent tool matching.• Complete support.

2830 ZT application examples:

•  Dielectrics: BPSG, PSG, BSG, ASG

• Doped polysilicon

• �Barrier�films�and�stacks: Ta, TaN, WCxNy, TiN, Si3N4

•  Silicides/salicides: TiSix, CoSix, WSix, NiSix

• �Metallization�films�and�stacks: Cu, AlCu, Ti, W, Au, Pt, AuGe, Ag, Sn, etc

• Low-k�dielectrics:�FSG,�SiOF

• �High-k�dielectrics:� HfO2,�HfAlOx, Ta2O5, etc

• �TMR�and�GMR�related�films�and�stacks:� CoFe(B),�AlOx,�Ru,�NiFe,�IrMn,�CrPtMn,�etc

• �PRAM�and�FeRAM�films:� PZT, SBT, BLT, GeSbTe

• �SAW�and�BAW�films�and�stacks: Al, Cu, AlCu, Ti, Ta, Pt

• SiGe

• �Phase�change�materials: GeSbTe,�InSbTe,�SeAgGe,�GeAsT

SUPPORTING THE SEMICONDUCTOR, DATA STORAGE AND SAW DEVICE INDUSTRY - NOW AND IN THE FUTURE

Semiconductor and data storage technology has advanced rapidly over recent years, and the rate of change continues to gather momentum. This places considerable pressure on the metrology techniques used to control production developments and meet ever more rigorous demands.

Deposited thin films and multi-layers continue to decrease in thickness while increasing in complexity. As new technologies emerge at an escalating rate, yield improvement (during process ramp up) must evolve accordingly. Flexible and cost-effective process monitoring has become increasingly critical to obtain optimal process conditions and maximum yield.

X-ray fluorescence (XRF) spectroscopy meets the key requirements of semiconductor and hard disk manufacturers. The technique is inherently suited to thin film analysis, offering exceptional precision and sensitivity for the simultaneous determination of layer thickness and composition. Moreover, XRF is compatible with a broad range of applications, facilitates straightforward stack analysis and is synonymous with high uptime and low running costs.

XRF in surface acoustic wave (SAW) device applications

SAW devices are used in electronic components to provide a number of different functions such as RF filters, oscillators, and transformers. It is widely used in telecom networks, cellular base stations, satellite navigation systems, mobile phones, automotive, and TV set-top boxes.

As smartphones are reaching Gigabit LTE speeds in 5G technology, the number of cellular bands within the phones is also rapidly increasing to provide support (current smartphones already have ~40 cellular bands). Advanced filtering technology provided by these SAW devices is needed to support carrier aggregation across a wide variety of frequency bands while managing interference issues and delivering excellent radio performance.

The thickness control of the thin films in these SAW devices is of prime importance because a very small change in the thickness can already change the operating frequency of the device. In this application space, the 2830 ZT wavelength dispersive X-ray wafer analyzer is an excellent and proven solution to meet the most stringent requirements of top SAW device manufacturers.

The�2830�ZT�is�designed�for�maximum�uptime�and�capability.�It�features�the�latest�X-ray�technology,�including:

• �Zeta�technology,�eliminating�X-ray�tube�aging,�greatly�enhancing�operational�efficiency.

• �4�kW�SST-mAX�tube�for�operation�at�160�mA�current�to give the highest sensitivities and lowest detection limits.

• �FP�Multi�software�allowing�simultaneous�analysis�of�film�thickness�and�composition�of�stacks�up�to�16�layers.

32

UNRIVALLED PRODUCTIVITY

Continuous capability and speed SST-mAX features groundbreaking ZETA technology which eliminates the effects of X-ray tube aging. ‘New tube’ performance is maintained throughout the tube’s lifetime. Together with high sensitivity, ZETA technology ensures that rapid analysis and short measurement times are maintained across the lifetime of the tube. ZETA technology strongly reduces the need for drift correction and recalibration which increases productivity and uptime of the instrument.

Maximized uptimeConventional X-ray tubes suffer tungsten evaporation, which causes deposits on the inside of the tube’s beryllium window. Instrumentation using such tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements. Implementation of the SST-mAX in the 2830 ZT solves this drift problem, thereby maximizing uptime and maintaining instrument precision over time.

The key features to maximizing sensitvity and stability of 2830 ZT for light elements include:

•  4 kW output SST-mAX, operating at a high current of 160 mA.

•  Dedicated high performance channels for light elements in the range from boron to magnesium.

•  Dry (oil-free) pumps maintaining a clean, sub-Pascal vacuum within the measurement chamber.

Superior light element performance

SAVE ON COSTLY DOWNTIME HOURS

50%0 2000 4000 6000 8000 10000 12000

60%

70%

80%

90%

100%

110%

Rh L

-alp

ha in

tens

ity

Hours

SST-mAX

Typical XRFend-windowtube

THE PERIODIC TABLE OF THE ELEMENTS

11

Na22.990

10511.041

9469 0.9711.067

Sodium

55

Cs132.905

304.530.8514.286

298.5 1.87334.981

4.619

Caesium

1

H1.008

0.00009

Hydrogen1

IA R2O/RH

IIA RO/RH2

IIIB R2O3

IVB RO2

VB R2O5

VIB RO3

VIIB R2O7

VIII IB R2O

IIB RO

IIIA R2O3

IVA RO2/RH4

VA R2O5/RH3

VIARO3/RH2

VIIA R2O7/RH

3

Li6.941

0.534

Lithium

19

K39.098

620.43.312

602.4 0.8623.589

Potassium

37

Rb85.47

11.013.3731.694

101.5 1.5314.959

1.752

Rubidium

87

Fr(223)

15.185.11012.029

135.5 –97.46014.768

Francium

4

Be9.012

1110000.109

61000 1.848

Beryllium

12

Mg24.31

634.21.253

7163 1.7381.302

Magnesium

20

Ca40.08

461.63.6900.341

449.3 1.554.0120.345

Calcium

38

Sr87.62

9.314.1401.806

87.3 2.5415.833

1.871

Strontium

56

Ba137.33

271.432.0624.465

266.8 3.536.372

4.827

Barium

88

Ra226

14.087.41912.338

126.6 5.0100.113

15.233

Radium

LA

LA

21

Sc44.96

347.24.0880.395

339.4 2.9894.4600.400

Scandium

39

Y88.906

7.914.931 1.922

75.3 4.46916.735

1.995

Yttrium

22

Ti47.90

263.84.5080.452

259.5 4.544.9310.458

Titanium

40

Zr91.22

6.815.7442.042

65.1 6.5117.665

2.124

Zirconium

23

V50.94

202.44.9490.511

200.7 6.115.4260.519

Vanadium

41

Nb92.91

5.816.5812.166

56.5 8.5718.619

2.257

Niobium

24

Cr52.00

156.75.4110.573

156.8 7.195.9460.583

Chromium

42

Mo95.94

5.017.4412.293

49.2 10.2219.605

2.394

Molybdenum

25

Mn54.94

122.45.8940.637

123.8 7.46.4890.649

Manganese

43

Tc98.91

4.318.3252.424

42.9 11.5020.615

2.536

Technetium

26

Fe55.85

96.56.3980.705

98.7 7.877.0570.718

Iron

44

Ru101.1

3.819.2332.558

37.6 12.4121.653

2.683

Ruthenium

27

Co58.93

76.66.9240.776

79.3 8.97.6480.791

Cobalt

45

Rh102.905

3.320.1652.696

34.3 12.4122.720

2.834

Rhodium

28

Ni58.71

61.37.4710.851

64.2 8.908.2630.869

Nickel

46

Pd106.4

2.921.1212.838

30.0 12.0223.815

2.990

Palladium

29

Cu63.55

49.48.0400.930

52.4 8.968.9040.950

Copper

47

Ag107.87

2.522.1012.984

26.1 10.5024.938

3.150

Silver

30

Zn65.37

40.18.6301.012

43.0 7.139.5701.043

Zinc

48

Cd112.41

2.223.1063.133

23.2 8.6526.091

3.316

Cadmium

49

In114.82

1.9224.1363.286

20.9 7.3127.271

3.487

Indium

50

Sn118.69

1.6725.1913.443

18.7 5.75-7.3128.481

3.662

Tin

51

Sb121.75

1.4726.2713.604

16.7 6.6929.721

3.843

Antimony

72

Hf178.49

52.255.3827.898

55.2 13.3163.222

9.021

Hafnium

73

Ta180.95

47.757.0988.145

50.7 16.6565.212

9.342

Tantalum

74

W183.85

43.658.8568.396

46.6 19.367.233

9.671

Tungsten

75

Re186.2

39.960.6488.651

42.9 20.0269.29810.008

Rhenium

76

Os190.2

36.662.4778.910

39.5 22.5771.40110.354

Osmium

77

Ir192.2

33.664.3399.174

277.1 22.4273.54810.706

Iridium

78

Pt195.09

30.966.2419.441

257.2 21.475.73511.069

Platinum

79

Au196.97

28.468.1779.712

238.9 19.3277.97111.440

Gold

80

Hg200.59

26.270.1549.987

222.0 13.5580.24011.821

Mercury

81

Tl204.37

24.172.16710.267

206.4 11.8582.56212.211

Thallium

82

Pb207.19

22.374.22110.550

192.1 11.3584.92212.612

Lead

83

Bi208.98

20.676.31510.837

179.0 9.74787.32813.021

Bismuth

84

Po(210)

19.078.45211.129

166.8 9.3289.78113.445

Polonium

85

At(210)

17.680.62411.425

155.5 –92.28713.874

Astatine

57

La138.91

241.933.2994.650

238.6 6.1537.795

5.041

Lanthanum

58

Ce140.12

216.134.5664.839

213.8 6.6639.251

5.261

Cerium

59

Pr140.91

193.135.8605.033

191.8 6.6-6.840.741

5.488

Praseodymium

60

Nd144.24

173.137.1825.229

172.6 6.80-7.0042.264

5.721

Neodymium

61

Pm(145)

155.238.5325.432

155.4 7.2243.818

5.960

Promethium

62

Sm150.35

139.639.9115.635

140.4 7.40-7.5245.405

6.204

Samarium

63

Eu151.96

125.641.3205.845

126.9 5.24347.030

6.455

Europium

64

Gd157.25

113.442.7576.056

115.1 7.90048.688

6.712

Gadolinium

65

Tb158.92

102.444.2666.272

104.4 8.22950.374

6.977

Terbium

66

Dy162.50

92.645.7246.494

94.8 8.55652.110

7.246

Dysprosium

67

Ho164.93

83.847.2536.719

86.3 8.79553.868

7.524

Holmium

68

Er167.26

76.048.8136.947

78.7 9.06655.672

7.809

Erbium

69

Tm168.93

69.150.4067.179

71.9 9.32157.506

8.100

70

Yb173.04

62.852.0307.414

65.7 6.54-6.9759.356

8.400

Ytterbium

71

Lu174.97

57.253.6877.654

60.1 9.8461.272

8.708

Lutetium

89

Ac(227)

13.089.77312.650

118.4 10.07102.829

15.710

Actinium

90

Th232.04

12.192.17412.967

110.8 11.72105.591

16.199

Thorium

91

Pa231.04

11.394.62713.288

103.7 15.37108.409

16.699

Protactinium

92

U238.03

10.597.13113.612

97.2

Uranium

52

Te127.60

436.027.3773.769

424.7 6.2430.990

4.029

Tellurium

53

I126.90

386.128.5083.937

376.7 4.9332.289

4.220

Iodine

31

Ga69.74

32.89.2411.098

271.2 5.9-6.110.263

1.125

Gallium

32

Ge72.59

27.09.8741.188

228.1 5.3210.980

1.218

Germanium

33

As74.92

22.310.5301.282

192.5 2.0-5.7311.724

1.317

Arsenic

34

Se78.96

18.611.2071.379

163.2 4.28-4.7912.494

1.419

Selenium

35

Br79.904

15.511.9071.480

138.8 3.1213.289

1.526

Bromine

13

Al26.98

397.51.486

4764 2.6991.557

Aluminium

14

Si28.09

32821.739

3236 2.331.836

Silicon

15

P30.974

22822.013

2238 1.82-2.692.139

Phosphorus

16

S32.064

16142.307

1575 1.96-2.072.464

Sulfur

17

Cl35.453

11592.621

1127 0.00322.815

Chlorine

5

B10.81

660690.183

37111 2.34

Boron

6

C12.011

272340.277

19140 1.8-2.2

Carbon

7

N14.007

123930.392

9925

Nitrogen

8

O16.000

61590.525

5441 0.0014

Oxygen

9

F19.000

32580.677

3158

Fluorine

10

Ne20.179

18100.848

1930

Neon

36

Kr83.80

13.012.6311.586

118.5 0.003714.110

1.636

Krypton

2

He4.003

0.00018

Helium

54

Xe131.30

342.729.6664.109

335.1 0.0058933.619

–

Xenon

86

Rn(222)

16.382.84311.725

145.1 0.009794.85014.313

Radon

93

Np237.05

Neptunium

94

Pu(244)

Plutonium

95

Am(243)

Americium

96

Cm(247)

Curium

97

Bk(247)

Berkelium

98

Cf(251)

Californium

99

Es(252)

Einsteinium

100

Fm(257)

Fermium

101

Md(258)

Mendelevium

102

No(259)

Nobelium

103

Lr(262)

Lawrencium

with X-rays

Measured usingK-lines

Measured usingL-lines

#

Z0

000

0 0

Element

#

Z0

000

0 000

Element

#

Z0

000

0 000

Element

2

3

4

5

6

7

1

2

3

4

5

6

7

21

Sc44.96

347.24.0880.395

339.4 2.9894.4600.400

Scandium

Element symbol

µAl (left) and µCu (center)

of Al & Cu for Sc Kα,Be to Sb: Kα lines,Te to Pu: Lα lines)

Kα [keV]

Lα [keV] Lβ [keV]

Kβ [keV]

Atomic numberAtomic weight

Element name

Density [g/cm3]

0

0.00125 0.00169 0.00090

18.95111.281

17.217

–107.13914.953

– 13.51122.733

19.399

–109.99115.304

– –126.490

19.961

–112.99915.652

– –127.794

20.557

– – – – – – – – – – – – – – –

104

Rf(267)

– – –

Rutherfordium

105

Db(270)

– – –

Dubnium

106

Sg(269)

Seaborgium

107

Bh(270)

Bohrium

108

Hs(270)

Hassium

109

Mt(278)

Meitnerium

110

Ds(281)

Darmstadtium

111 115

Rg Mc(281) (289)

Roentgenium Moscovium

112 116

Cn Lv(285) (293)

Copernicium Livermorium

113 117

Nh Ts(286) (293)

Nihonium Tennessine

114 118

Fl Og(289) (294)

Flerovium Oganesson– – – – – – – – – – – – – – – – –– –– –– –– –– –– –– –– –– –– –– –

18

Ar39.948

842.62.957

817.9 0.001783.190

Argon

9.899.40713.942

91.1 20.25113.725

17.747

9.1101.85714.276

85.4 19.84116.943

18.291

–104.43114.615

– 13.67120.350

18.849

Thulium

Consistent and stable measurement results

The�2830�ZT�is�designed�for�maximum�uptime�and�capability.�It�features�the�latest�X-ray�technology,�including:

A�range�of�critical�features�maximize�reproducibility�and�minimize�measurement�times.�For�example,�the�laser-assisted�wafer�height�positioning�system�guarantees�consistent�and�stable�measurement�results.�This�feature�also�makes�it�possible�for�2830�ZT�to�analyze�films�on�a�large�range�of�substrate�materials�in�addition�to�Si�wafers, including piezo- and pyroelectric, glass and quartz substrates.

Save time on instrument monitor corrections with the ultimate long-term stability of SST-mAX tube. Light elements such as boron and carbon often monitored on a daily basis can now be monitored weekly or bi-monthly, minimizing instrument downtime and thus, saving money.

Zeta technology enables long term stability and limits tube replacements. Save additionally on tube cost and downtime by upgrading to SST-mAX.

11 22.990

Na Mg24.3112

1.041 1.067 1.253 1.302MagnesiumSodium

B C N O F10.81 12.011 14.007 16.000 19.0005

0.183

6

0.277

7

0.392

8

0.525

9

FluorineOxygenNitrogenCarbonBoron

0.677

54

FAST AND COST-EFFECTIVE MULTI-LAYER ANALYSIS

Analysis of stacksFP modeling allows reliable thin film analysis. Malvern Panalytical’s best-in-class algorithms model X-ray fluorescent behavior of the elements to calculate precise layer composition and thickness. This reduces the time and cost involved in setting up thin film and multi-layer analyses. System calibration requires only a minimum number of reference samples to analyze complex stacks of up to 16 layers.

Simultaneous measurement of up to 24 elementsThe 2830 ZT can be fitted with up to 24 fixed measurement channels, from boron onwards. These high performance channels allow for multi-layer analysis according to specific user requirements. Furthermore, as new channels can be added at any time, the 2830 ZT offers powerful flexibility, allowing the user to keep up with the latest technologies.

Powerful Fundamental Parameters

KEEP TRACK OF YOUR STACK

The 2830 ZT utilizes Malvern Panalytical’s proven SuperQ Thin Film software platform. This powerful, easy-to-use thin film data collection and analysis package is renowned for its highly intuitive interface and menu. It enables simple setup of standard measurement protocols and individually customized programs. User-assigned function keys or large on-screen ‘speed buttons’ permit rapid initiation of measurement for single wafers or complete batches.

Uniformity patterns and wafer maps are easily defined with user-friendly spot location selection. Click-and-drag commands allow straightforward comparison with international wafer configuration standards.

Intuitive operation

Malvern Panalytical’s Fundamental�Parameter�(FP)�software�package,�FP�Multi,�is�fully integrated into the SuperQ thin�film�platform�of�the�2830�ZT.�It�enables�the�direct�calculation�of�chemical�composition�and�thickness�of�layered�materials�and is ideal for analyzing both single�layer�thin�films�and�complex�multi-layer�film�stacks.

CoNiFeTaCoFeTaCuNiFe

Malvern�Panalytical’s�SuperQ�software�makes�it�simple�to�set�up�spot�patterns�for�uniformity�measurement�over�the�full�surface�area�of�wafers�up�to�300�mm.

Measurement�programs�are�quickly�selected�via�clearly�labeled�“speed�buttons”�on�the�built-in�touch�screen�monitor.

66 7

SEAMLESS FAB INTEGRATION

Efficient, compact system design With a footprint comparable to that of 200 mm XRF wafer analyzers, the 2830 ZT occupies a minimum amount of valuable cleanroom space. A very narrow face print contributes further to space savings. The 2830 ZT can even be flush-mounted into a cleanroom wall, leaving only the loading port panel apparent within the workspace.

In accordance with normal fab procedures, the 2830 ZT measures wafers in a surface-up orientation. A transfer robot and notch/flat alignment unit position samples on the x-y wafer stage. Vacuum pumps can be installed remotely for convenient maintenance.

The system integrates readily into plant-wide process control and quality assurance networks, using SECS/GEM protocols to communicate with the host computer.

From manual wafer loading to full automation2830 ZT accepts 100 mm to 300 mm wafers, and smaller wafers or fragments can be measured using adaptors. To ensure integration into any fabrication environment, various wafer-handling options are available:

• Manual loading •  Open cassette loading with the robot in the cleanroom

atmosphere•  Single or dual FOUP loading with robot and alignment

unit in an ISO class 1 mini-environment •  Single or dual SMIF loading with robot and alignment

unit in an ISO class 1 mini-environment •  Any combination of SMIF, FOUP and open cassette

loading

Single load port FOUP and SMIF systems can be equipped with an internal reference position which can harbor a cassette with frequently used reference wafers. The reference position accommodates three wafer sizes in a range of 100 to 300 mm.

Compliance to all relevant standards

Malvern�Panalytical’s�PW2830�was�the�first�X-ray�metrology�system�to�comply�with�all�300�mm�standards.�This�led�to�its�rapid�establishment�as�the�system�of�choice�for�automated�wafer�analysis. Now, the 2830 ZTbuilds on this reputation, and is designed to accommodate�all�relevant�industry�norms�and�standards.

Importantly,�the�2830�ZT�is�fully�compliant�with�SECS/GEM�(Semiconductor�Equipment�Communication�Standards/Generic�Equipment�Model),�GEM300,�and�AMHS�(Automatic�Material�Handling�System).�

IMPROVING SAFETY IN SEMICONDUCTOR MANUFACTURINGAs the semiconductor industry expands and gets more complex, the safety requirements in the manufacturing environment becomes even stricter. More and more semiconductor fabs require full compliancy to the SEMI-S2 standard.

WHAT IS THE SEMI-S2 STANDARD? SEMI-S2 is in fact the most well-known standard in semiconductor manufacturing equipment for EHS. It covers 22 specific EHS categories, including regulatory requirements; electrical, mechanical, fire, chemical, radiation, noise, and ergonomics hazards; emergency shutdown, ventilation, and exhaust specifications; hazard warnings and more.

2830 ZT SEMI-S2 COMPLIANCEThe 2830 ZT Wafer Analyzer has been certified as compliant to the latest SEMI-S2 standard. This means that the 2830 ZT instrument can be trusted as being a completely safe instrument, helping you to ensure and improve safety in the semiconductor manufacturing environment.

8

COMPLETING THE SOLUTION

Metrology accuracy, reproducibility and repeatability are essential for accurate results within a fab. However, many organizations operate fabs at multiple locations. With different fabs making the same product, consistency of results is essential. 2830 ZT can be placed at different fab locations and matched to a ‘gold standard’ reference tool using a universal set of reference wafers.

This provides easy multi-production line quality control of thin film deposition and other processes. Excellent tool matching is the result of the high quality optical components, in combination with robust software algorithms.

Malvern Panalytical understands the importance of continuity in production control. The 2830 ZT is based on proven concepts, established throughout the company’s XRF thin film metrology product line.

However, technology is only part of a successful process control solution. To make sure that users maximize the benefit of the 2830 ZT, Malvern Panalytical provides excellent technical, software and application support.

2830 ZT users can take advantage of a large knowledge base when creating new applications, training new users, or solving technical issues. Malvern Panalytical takes great pride in offering outstanding customer service, and values the trust users repeatedly place in the organization. A range of service contracts, including 24/7 coverage in most areas, is available, delivered by the largest X-ray support and service force in the market.

Excellent tool matching Complete support

1110

Grovewood Road, Malvern, Worcestershire, WR14 1XZ, United Kingdom

Tel. +44 1684 892456Fax. +44 1684 892789

Lelyweg 1, 7602 EA Almelo, The Netherlands

Tel. +31 546 534 444Fax. +31 546 534 598

info@malvernpanalytical.comwww.malvernpanalytical.com

MALVERN PANALYTICAL

WHY CHOOSEMALVERN PANALYTICAL? Malvern Panalytical provides the global training,

service and support you need to continuously drive your analytical processes at the highest level. We help you increase the return on your investment with us, and ensure that as your laboratory and analytical needs grow, we are there to support you.

Our worldwide team of specialists adds value to your business processes by ensuring applications expertise, rapid response and maximum instrument uptime.

• Local and remote support

• Full and flexible range of support agreements

• Compliance and validation support

• Onsite or classroom-based training courses

• e-Learning training courses and web seminars

• Sample and application consultancy

We are global leaders in materials characterization, creating superior, customer-focused solutions and services which supply tangible economic impact through chemical, physical and structural analysis.

Our aim is to help you develop better quality products and get them to market faster. Our solutions support excellence in research, and help maximize productivity and process efficiency.

Malvern Panalytical is part of Spectris, the productivity-enhancing instrumentation and controls company.

www.spectris.com

SERVICE & SUPPORT

Dis

clai

mer

: Alth

ough

dili

gent

car

e ha

s be

en u

sed

to e

nsur

e th

at th

e in

form

atio

n in

this

mat

eria

l is

accu

rate

, not

hing

her

ein

can

be c

onst

rued

to im

ply

any

repr

esen

tatio

n or

war

rant

y as

to th

e ac

cura

cy, c

orre

ctne

ss o

r com

plet

enes

s of

this

info

rmat

ion

and

we

shal

l not

be

liabl

e fo

r err

ors

cont

aine

d he

rein

or f

or d

amag

es in

con

nect

ion

with

the

use

of th

is m

ater

ial.

Mal

vern

Pan

alyt

ical

rese

rves

the

right

to c

hang

e th

e co

nten

t in

this

mat

eria

l at a

ny ti

me

with

out n

otic

e.

Copy

right

: © 2

019

Mal

vern

Pan

alyt

ical

. Thi

s pu

blic

atio

n or

any

por

tion

ther

eof m

ay n

ot b

e co

pied

or t

rans

mitt

ed w

ithou

t our

exp

ress

writ

ten

perm

issi

on.

PN12

150

www.malvernpanalytical.com