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IEEE Catalog Number: ISBN:
CFP1589U-POD 978-1-4799-1953-6
2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC 2015)
Kyoto, Japan 14-17 April 2015
TABLE of CONTENTS Global Business Council 10:30-12:40 Tuesday, April 14
Introduction Yasumitsu Orii, IBM Japan -
Innovations across Technology & Business - Heterogeneous Integration & SiP
Integration Schemes for Wearable and IoT Applications
William T. Chen, ASE Group - Thomas Uhrmann, EVGroup -
Latest CMOS Image Sensor Technology Tetsuo Nomoto, Sony
Integrated Sensor Systems and Its Potential for Intelligence
Naotsugu Ueda, Omron Corporation
13:50-15:50 Tuesday, April 14
Intelligent Edge Device Technologies in Medicine Maki Sugimoto, Kobe University -
Future Drive Assist System Using Stereo Vision Keiji Saneyoshi, Tokyo Institute of Technology
Real-World Applications of Wearable Sensing Tsutomu Terada, Kobe University -
IAAC Special Session 16:05-17:50 Tuesday, April 14
Japan Jisso Technology and Business Trend in Japan
USA Approaches for RF Performance Optimization in Wafer Scale 3-D Packaging
Yasumitsu Orii, IBM Japan - Susan C. Trulli, Raytheon -
Europe Status and Trends of Microelectronics and Packaging in Europe
Jens Müller, Ilmenau University of - Technology
China Advanced Packaging and New Industrial Climate in China
Korea 2.5D TSV Interposer - Technology goes into the Integrated Passive Devices
Malaysia Technical Trends & Business Issues of Electronic Packaging in Malaysia
Taiwan 3D Packaging: Present and Future
Zhu Wenhui, Central South University -
Gusung Kim, Kangnam University -
Shaw Fong Wong, Intel Technology -
Shen-Li Fu, I-Shou University
9:45-11:00 Wednesday, April 15WA1: 3DIC Packaging-1
WA1-1 <Session Invited>
WA1-2
WA1-3
Scaling Down of Wireless Sensor Nodes for Ubiquitous Applications
3D IC Process Development for Enabling Chip-on-Chip and Chip on Wafer Multi-Stacking at Assembly
Reliability Studies on Micro- joints for 3D Stacked Chip
Jian Lu, Serizawa Kouichi, Lan Zhang, Hironao Okada, Toshihiro Itoh, Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology / Japan
Robert Daily1, Giovanni Capuz1, Teng Wang1, Pieter Bex1, Herbert Struyf1, Eric Sleeckx1, Caroline Demeurisse1, Alastair Attard2, Walter Eberharter2, Hannes Klingler2, 1Imec / Belgium, 2Besi Austria / Austria
Shinji Tadaki, Toshiya Akamatu, Kazutoshi Yamazaki, Seiki Sakuyama, Fujitsu / Japan
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56
61
WA2: 3DIC Packaging-2 11:15-12:30 Wednesday, April 15
WA2-1
WA2-2
WA2-3
Combined Surface Activated Bonding (SAB) Approach for SiO2 Direct Wafer Bonding in Vacuum
Advantage of Direct Etching Method and Process Integration for TSV Reliability
Evaluation of Plasma Process Damage during TSV Formation and Damage Reduction Method
Ran He1, Masahisa Fujino1, Akira Yamauchi2, Tadatomo Suga1, 1The University of Tokyo, 2Bondtech / Japan
Toshiyuki Sakuishi, Takahiro Murayama, Yasuhiro Morikawa, ULVAC / Japan
Takatoshi Igarashi1, Kazuaki Kojima1, Kazuya Matsumoto1, Noriyuki Fujimori1,2, Tsutomu Nakamura1, 1Olympus, 2Shinshu University / Japan
65
69
74
Keynote Lectures 14:10-15:10 Wednesday, April 15
Cognitive Computing, a Realization of Smart Machines
Advanced Packaging Technologies to Enable System Scaling in Data Centers
Molecular Diagnostics of Cancer Using Next- Generation Sequencing
Norishige Morimoto, IBM Japan -
16:00-17:00 Wednesday, April 15
Jie Xue, Cisco Systems -
17:00-18:00 Wednesday, April 15
Seishi Ogawa, Kyoto University -
9:45-11:00 Wednesday, April 15WB1: Advanced Packaging-1
WB1-1
WB1-2
WB1-3
A Study of Chip-last Embeded FCCSP
Comb-Drive XYZ- Microstage Based on Assembling Technology for Low Temperature Measurement Systems
The Room Temperature Bonding Method of Al2O3 Barrier Layers Deposited Using Atomic Layer Deposition
Shin-Hua Chao1,2, Chih-Ping Hung1, Yishao Lai1, Colin Liu1, Emma Hsieh1, Ding-Bang Luh2, 1ASE Group, 2National Cheng-Kung University / Taiwan
Gaopeng Xue, Masaya Toda, Takahito Ono, Tohoku University / Japan
Takashi Matsumae1, Masahisa Fujino1, 2 2 Kai Zhang , Helmut Baumgart ,
Tadatomo Suga1, 1The University of Tokyo / Japan, 2Old Dominion University / USA
78
83
89
WB2: Interconnection-1 11:15-12:30 Wednesday, April 15
WB2-1
WB2-2
WB2-3
Effect of Silver Alloy Bonding Wire Properties on Bond Strengths and Reliability
Ag Alloy Wire Bonding under Electromigration Test
3D Analysis of Flip Chip Interconnection using FIB-SEM Slice and View
Jun Cao1,2, JunLing Fan1, ZhiQiang Liu1, YueMin Zhang1, 1HeNanPloytechnicUniverstiy, 2HeNan YOUK Electronic Material, 3Jiaozuo University / China
Tzu-Yu Hsu1, Jing-Yao Chang2, Fang- Jun Leu2, Hsiao-Min Chang3, Fan- Yi Ouyang1, 1National Tsing Hua University, 2Industrial Technology Research Institute, 3Win-House Electronic / Taiwan
Mototaka Ito, Jun Kato, Toshihisa Nonaka, Toray Research Center / Japan
93
98
102
WC1: Medical Devices-1 9:45-11:00 Wednesday, April 15
WC1-1 <Session Invited>
WC1-2 <Session Invited>
WC1-3
Optoelectronic Devices for Biomedical Applications
Cavitas Sensors for Bio/Chemical Monitoring: No Wearable, No Implantable Approach
Development of Nanocavity Sealing Process for MEMS Optical Interferometric Biosensor
Jun Ohta, Nara Institute of Science and Technology / Japan
Kohji Mitsubayashi, Tokyo Medical and Dental University / Japan
Kazuhiro Takahashi1,2, Yoshihiro Masuya1, Ryo Ozawa1, Makoto Ishida1, Kazuaki Sawada1,2, 1Toyohashi University of Technology, 2Japan Science and Technology Agency / Japan
-
120
11:15-12:30 Wednesday, April 15WC2: Medical Devices-2
WC2-1
WC2-2
Effect of User’s Posture and Device’s Position on Human Body Communication with Multiple Devices
Efficacy Evaluation of Candle-Like Micro-Needle Electrode for EEG Measurement on Hairy Scalp
Dairoku Muramatsu1, Fukuro Koshiji2, Kohji Koshiji2, Ken Sasaki1, 1The University of Tokyo, 2Tokyo University of Science / Japan
Miyako Arai1, Norihisa Miki1,2, 1Keio University, 2JST RPESTO / Japan
124
128
WD1: Thermal Management-1 9:45-11:00 Wednesday, April 15
WD1-1
WD1-2
WD1-3
Compact Thermal Model for Microprocessor Package Based on One-Dimensional Thermal Network with Average Temperature Nodes
Thermal Properties of Power Si MOSFET by Considering Electron- Phonon Scattering using Monte Carlo Simulation
Effect of Current Heating on Accurate Measurements of AC Shunt Resistors
Koji Nishi1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1AMD Japan, 2Toyama Prefectural University / Japan
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka, Toyama Prefectural University / Japan
Seitaro Kon, Tatsuji Yamada, National Institute of Advanced Industrial Science and Technology / Japan
132
138
144
WD2: Biomimetics 11:15-12:30 Wednesday, April 15
WD2-1
WD2-2
WD2-3
The Influence of Surface Wettability on the Ladybird BeetlesAttachment to Solid Surfaces
Biomimetic Self-Resilience Materials Design for Tactile Devices
Self-Linking Mechanism of Micro Solder Particles Dispersion in Liquidus Polymer
Mari Nakamoto1,2, Chihiro Urata3, Atsushi Hozumi3, Tadatomo Suga2, Naoe Hosoda1,2, 1National Institute for Materials Science, 2The University of Tokyo, 3National Institute of Advanced Industrial Science and Technology / Japan
Kiyokazu Yasuda, Osaka University / Japan
Kiyokazu Yasuda, Mizuki Ishida, Osaka University / Japan
149
153
157
9:45-11:00 Wednesday, April 15WE1: Substrates and Interposers-1
WE1-1
WE1-2
WE1-3
HAST Failure Investigation on Ultra-High Density Lines for 2.1D Packages
Ultra-thin Line Embedded Substrate Manufacturing for 2.1D/2.5D SiP Application
Fine Trace Substrate with 2μm Fine Line for Advanced Package
Hirokazu Noma, Keishi Okamoto, Kazushige Toriyama, Hiroyuki Mori, IBM Japan / Japan
Yu-Hua Chen, Shyh-Lian Cheng, Dyi-Chung Hu, Tzvy-Jang Tseng, Unimicron Technology / Taiwan
Dyi-Chung Hu, Puru Lin, Yu Hua Chen, Unimicron Technology / Taiwan
161
166
170
WE2: Substrates and Interposers-2 11:15-12:30 Wednesday, April 15
WE2-1
WE2-2
WE2-3
Through Cavity Core Device- Embedded Substrate for Ultra- Fine-Pitch Si Bare Chips - fabrication feasibility and residual stress evaluation
Evaluation of Through-Silicon -Via Process using Scanning Laser Beam Induced Current (SLBIC) System
Mechanical Design and Analysis of Direct Plated Copper Film on AlN Substrates for Thermal Reliability in High Power Module Applications
Young-Gun Han1, Osamu Horiuchi1, Shigehiro Hayashi2, Kanta Nogita2, Yoshihisa Katoh1, Hajime Tomokage1,2, 1Fukuoka University 2Research Center for Three Dimensional Semiconductors / Japan
Woon Choi, Takahiro Ishimoto, Hajime Tomokage, Fukuoka University / Japan
C. H. Lin1, P. S. Huang1, M. Y. Tsai1, C. T. Wu2, S. C. Hu2, 1Chang Gung University, 2Chung-Shan Institute of Science and Technology / Taiwan
174
180
185
9:30-10:15 Thursday, April 16Keynote Lectures
Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Becomes a Reality?
Charles E. Bauer, TechLead - Corporation
TA1: Technology Challenges for “Killer Devices” in the IoT World-1 10:25-12:30 Thursday, April 16
TA1-1 <Session Invited>
TA1-2 <Session Invited>
TA1-3 <Session Invited>
TA1-4 <Session Invited>
TA1-5 <Session Invited>
Introduction and Perspective on Future Collaboration of Chip/ Package/System Research Societies
Quantum Computation and Quantum Annealing : Recent Progress and Future Trends
Human Interface Devices for Effective Cognitive Computing Systems
More Moore Landscape for IoT World - ITRS2.0 Requirement
CMOS -MEMS -New Frontier of Multilevel Interconnect Technology-
Yasmitsu Orii, IBM Japan / Japan
Shiro Kawabata, National Institute of Advanced Industrial Science and Technology / Japan
Takeo Yasuda, IBM Japan / Japan
Yuzo Fukuzaki1, Mustafa Badaroglu2, 1Sony, 2Qualcomm Technologies / Japan
Katsuyuki Machida1,2,4 , Toshifumi Konishi1, Daisuke Yamane2,4, Hiroshi Toshiyoshi3,4, Kazuya Masu2,4, 1NTT Advanced Technology, 2Tokyo Institute of Technology, 3The University of Tokyo, 4CREST, JST / Japan
-
-
-
201
TA2: Technology Challenges of “Killer Devices” in the IoT World-2 13:40-15:45 Thursday, April 16
TA2-1 <Session Invited>
TA2-2 <Session Invited>
TA2-3
TA2-4 <Session Invited>
TA2-5
3D Integration Technology and Its Impact on Implantable Biomedical Integrated Devices
Interfacial Reactions wity Low Solder Volume for 3D IC Packaging
Impact of Through-Silicon Via Technology on Energy Consumption of 3D-Integrated Solid-State Drive Systems
Excimer Laser Stepper for Next Generation 2.5D Organic Interposer
Panel Discussion
Tetsu Tanaka, Tohoku University / Japan
C Robert Kao, National Taiwan University / Taiwan
Takahiro Onagi, Chao Sun, Ken Takeuchi, Chuo University / Japan
Habib Hichri, SUSS MicroTec Photonic System / USA
Panel discussion will be held to discuss future collaboration of chip/ package/system research societies.
-
215
-
-
16:25-18:30 Thursday, April 16TA3: iNEMI Session
TA3-1 <Session Invited>
TA3-2 <Session Invited>
TA3-3
TA3-4
Technology Roadmap Overviews and Future Direction through Technology Gaps
MEMS and Sensors for Wearable Electronics: Packaging and Assembly Considerations
Assessment of Reliability Standards for Implantable Medical Devices
Recent Trend of Package WarpageCharacteristic
Bill Bader1, Chuck Richardson1, Masahiro Tsuriya2, 1International Electronics Manufacturing Initiative / USA, 2International Electronics Manufacturing Initiative / Japan
E. Jan Vardaman, TechSearch International / USA
John C. McNulty1, Kevin Knadle2, Hans-Peter Klein3, Torsten Harnisch4, Enrico Dona5, Werner Meskens6, Maaike Op de Beeck7, Jason Coder8, 1Exponent, 2i3 Electronics / USA, 3Dyconex / Switzerland, 4Biotronik / Germany, 5MED EL / Austria, 6Cochlear, 7imec / Belgium, 8National Institute of Standards and Technology / USA
Wei Keat Loh1, Ron Kulterman2, Tim Purdie3, Haley Fu4, Masahiro Tsuriya4, 1Intel / Malaysia, 2Flextronics, 3Akrometrix / USA, 4International Electronics Manufacturing Initiative / China, Japan
219
233
TB1: Material and Process-1 10:25-12:30 Thursday, April 16
TB1-1
TB1-2
TB1-3
TB1-4
TB1-5
Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding at Low Temperature and Atmospheric Pressure
Development of a Curable Conductive Copper Paste in Air
The Application of Cu-Ag Submicron Composite Particles in Microelectronic Bonding
Conduction Path Development in Electrically Conductive Adhesives Composed of an Epoxy-based Binder
Thermal Conductivity of Epoxy Composites with Controlled High Loading of Ceramic Particles
Akitsu Shigetou1, Jun Mizuno2, Shuichi Shoji2, 1National Institute for Materials Science, 2Waseda University / Japan
Masashi Kajita, Tomoyuki Takahashi, Toshiyuki Sato, Namics / Japan
Ching-Huan Hsiao1, Jia-Shin Wu1, Chi-Hang Tsai2 , Shih-Yun Chen2, Jenn-Ming Song1, 1National Chung Hsing University, 2National Taiwan University of Science and Technology / Taiwan
Yoshiaki Sakaniwa, Masaki Iida, Yasunori Tada, Masahiro Inoue, Gunma University / Japan
Ying-Nan Chan, Shu-Chen Huang, Hsun-Tien Li, Industrial Technology Research Institute / Taiwan
239
243
248
252
258
13:40-15:45 Thursday, April 16TB2: Korea Session-1
TB2-1 <Session Invited>
TB2-2 <Session Invited>
TB2-3 <Session Invited>
TB2-4 <Session Invited>
TB2-5 <Session Invited>
Interfacial Adhesion and Reliability Issues in Printed Ag Film on Polyimide Systems
Mechanical Reliability of AdvancedThin Films
Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics
Prognostics of Solder Joint Reliability Based on Impedance Analysis and Particle Filtering
Effects of Complexing Reagents on Electrotroless Nickel-Iron Alloy Plating for Diffusion Barrier of UBM
Young-Bae Park, Byung-Hyun Bae, Hyeon-Chul Lee, Min-Su Jeong, Kirak Son, Gyu-Tae Park, Andong National University / Korea
Taek-Soo Kim, KAIST / Korea
Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Jin Ho Lee, ETRI / Korea
Daeil Kwon, Ulsan National Institute of Science and Technology / Korea
Ja-Kyung Koo, Jae-Ho Lee, Hongik University / Korea
300
TB3: Korea Session-2 16:25-18:30 Thursday, April 16
TB3-1 <Session Invited>
TB3-2 <Session Invited>
TB3-3 <Session Invited>
TB3-4 <Session Invited>
TB3-5 <Session Invited>
Analyses on PBGA Reliability under Vibrations
Surface Design using Functional Gradient Nanostructure
Preparation and Characterization of Organic Light Emitting Devices Using Hybrid Encapsulation Materials - properties of OLED using hybrid encapuslaton materials
Interconnection Process for Stretchable Electronic Packaging of Wearable Devices
Foldable Metal-grid Transparent Electrode using Electrohydrodynamic (EHD) Jet Printing
Yeong K. Kim, Inha University / Korea
Sohee Kim, Doo-In Kim, Myung Yung Jeong, Pusan National University / Korea
Ho Jung Chang, Byung Min Park, Sang Hee Lee, Yang Geun Jo, Ji Mook Kim, Jae Jin Jung, Jaeho Pyee, Dankook University / Korea
Jung-Yeol Choi, Dae-Woong Park, Tae Sung Oh, Hongik University / Korea
Kyoungtae Eun1, Young Seok Ahn1, Junghoon Lee1, Min- Woo Chon2, Doyoung Byun3, Sung-Hoon Choa1, 1Seoul National University of Science and Technology, 2Kookmin University, 3SungKyunKwan University / Korea
314
-
10:25-12:30 Thursday, April 16TC1: Printed Electronics-1
TC1-1 <Session Invited> 50min.
TC1-2 <Session Invited> 50min.
TC1-3 <Session Invited>
Nano-Rheology Printing: a Printing Method for Oxide Devices with High Precision
Sub-micron Printing Technology using Seamless Roller Mold (SRM)
Ultrathin and Ultraflexible Electronics Will Hack Our Way Beyond Wearable
Tatsuya Shimoda, Japan Advanced Institute of Science and Technology / Japan
Masayuki Abe, Asahi Kasei / Japan
Ichiro Amimori1,2, Masao Nakajima1,2, Yuta Aikawa1,2, Naoji Matsuhisa1,2, Hanbit Jin1,2, Hiroaki Sakamoto1,2, Sunghoon Lee1,2, Sungwon Lee1,2, Tomoyuki Yokota1,2, Tsuyoshi Sekitani2,3, Hiroshi Onodera1, Takao Someya1,2, 1The University of Tokyo, 2JST ERATO, 3Osaka University / Japan
-
TC2: Printed Electronics-2 13:40-15:45 Thursday, April 16
TC2-1 <Session Invited> 50min.
TC2-2 <Session Invited>
TC2-3 <Session Invited>
TC2-4 <Session Invited>
Future Scaling of Electronics through Printing
The 3D Inkjet Printing System for the 3D Micro Circuit Module Manufacturing
Design Software for 3D Micro Circuit Module Manufacturing by 3D Inkjet Printing System
Automatic Dispensing System Capable of Line-width 5µm
Steven E, Ready, Gregory Whiting, Ng Tse Nga, Veres Janos, Palo Alto Research Center / USA
Masatoshi Fujita, FUJI Machine MFG. / Japan
Koji Yamamoto, YDC / Japan
Yoshiyuki Kato, Masanori Maruno, NIHON DENSHI SEIKI / Japan
-
TC3: Printed Electronics-3 16:25-18:30 Thursday, April 16
TC3-1 <Session Invited>
TC3-2
TC3-3
Materials, Processes and Designs for Flexible Electronics
Room Temperature Direct Bonding and Debonding of Polyimide Film on Glass Wafer using Si Intermediate Layer
Fine-pitch Copper Wiring Formed in a Platingless Process Using Ultra-fine Inkjet and Oxygen Pump
Manabu Yoshdia, National Institute of Advanced Industrial Science and Technology / Japan
Kai Takeuchi, Masahisa Fujino, Tadatomo Suga, Mari Koizumi, Takao Someya, the University of Tokyo / Japan
Naoki Shirakawa1, Kouichi Kajihara2, Yukiyasu Kashiwagi3, Kazuhiro Murata4, 1National Institute of Advanced Industrial Science and Technology, 2IOX, 3Osaka Municipal Technical Research Institute, 4SIJTechnology / Japan
369
373
10:25-12:30 Thursday, April 16TD1: Thermal Management-2
TD1-1
TD1-2
TD1-3
TD1-4
TD1-5
Experimental Study for Method to Measure Terminal Part Temperature of Micro- Electronic Devices Using Infrared Thermograph and Image Processing
Measurement of Surface Roughness Dependence of Thermal Contact Resistance under Low Pressure Condition
Mission Profile Driven Component Design for Adjusting Product Lifetime on System Level
Variations of Temperature Sensitivity Measurements of Several Packages under Different Environments
Thermal Imaging Characterization for High Frequency and High Power Devices
Koichi Hirasawa1, Yoshinori Aruga1, Yasushi Ohhashi1, Toshio Tomimura2, 1KOA, 2KumamotoUniversity / Japan
Kuniya Azuma, Tomoyuki Hatakeyama, Shinji Nakagawa, Toyama Prefectural University / Japan
Attila Szel1, Zoltan Sarkany1, Marton Bein1, Robin Bornoff2, Andras Vass- Varnai1, Marta Rencz1, 1Mentor Graphics / Hungary, 2Mentor Graphics / UK
Tomoaki Hara, Wasanthamala Badalawa, Yafei Luo, Mentor Graphics Japan / Japan
Kazuaki Yazawa1,2, Dustin Kendig1, Ali Shakouri2, 1Microsanj, 2Purdue University / USA
377
381
385
390
395
TD2: N-MEMS-2 13:40-15:45 Thursday, April 16
TD2-1
TD2-2
TD2-3 <Session Invited>
TD2-4
TD2-5
Development of a Cylindrical Tactile Sensor with a Tooth-Like Mechanism
Pen-shaped Pressure Sensor for Endoscopic Palpation
Piezoelectric Touch Sensors Based on Soft Packaged PZT- MEMS Devices
Miniature Stiffness Tunable Device with Magnetorheological Fluid
Development of Mountable Pulse- Type Hardware Neuron Model Integrated Circuit on MEMS Microrobot
Nurul Adni Ahmad Ridzuan1, Norihisa Miki1,2, 1Keio University, 2JST PRESTO / Japan
Takuro Nakadegawa1, Hiroki Ishizuka1, Norihisa Miki1,2, 1Keio University, 2JST PRESTO / Japan
Takeshi Kobayashi, Seiichi Takamatsu, Yasuhiro Suzuki, Natsumi Makimoto, Toshihiro Itoh, National Institute of Advanced Industrial Science and Technology / Japan
Hiroki Ishizuka, Takuro Nakadegawa, Norihisa Miki, Keio University / Japan
Minami Takato, Yuka Naito, Kazuaki Maezumi, Yuki Ishihara, Yuki Okane, Hirozumi Oku, Masaki Tatani, Ken Saito, Fumio Uchikoba, Nihon University / Japan
401
405
-
409
413
16:25-18:30 Thursday, April 16TD3: N-MEMS-3
TD3-1
TD3-2
TD3-3
TD3-4
TD3-5
Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partial-filling Ultraviolet Nanoimprint Lithography
Transfer Properties of Moth-eye Structure Film by RTR UV-NIL
Light Trapping of Organic Solar Cells by Nanotextured Surfaces
Application of Gold Nanoparticle Self-Assemblies to Unclonable Anti- Counterfeiting Technology
Fabrication and Evaluation of Dihedral Corner Reflector Array for Floating Image Manufactured by Synchrotron Radiation
Nurhafizah Binti Abu Talip[a]Yusof1,2, Tatsuya Hayashi1, Jun Taniguchi1, Shin Hiwasa3, 1Tokyo University of Science / Japan, 2Universiti Malaysia Pahang / Malaysia, 3Autex / Japan
Tomoya Uchida1, Masatoshi Moro1, Shin Hiwasa2, Jun Taniguchi1, 1Tokyo University of Science, 2Autex / Japan
Shigeru Kubota1, Kensaku Kanomata1, Bashir Ahmmad1, Jun Mizuno2, Fumihiko Hirose1, 1Yamagata University, 2Waseda University / Japan
Takao Fukuoka1, Akinobu Yamaguchi1, Ryohei Hara1, Takeshi Matsumoto1, Yuichi Utsumi1, Yasushige Mori2, 1University of Hyogo, 2Doshisha University / Japan
Tomohisa Yamane1, Satoshi Maekawa2, Yuichi Utsumi1, Ikuo Okada3, Akinobu Yamaguchi1, 1University of Hyogo, 2Parity Innovations, 3Nagoya University / Japan
418
422
428
432
436
TE1: N-MEMS-1 10:25-12:30 Thursday, April 16
TE1-1 <Session Invited>
TE1-2
TE1-3
TE1-4 <Session Invited>
TE1-5
Low/Room Temperature Wafer Bonding Technologies for Three- Dimensional Integration
Fabrication of a Hermetic Sealing Device Using Low Temperature Intrinsic-Silicon/Glass Bonding
Influence of Air Exposure Time on Bonding Strength in Au-Au Surface Activated Wafer Bonding
Room-Temperature Bonding for Hermetic Sealing Using Electroplated Au Seal Rings with Ultra-Smooth Surface
New MEMS Sensor Process by TSV Technology for Smaller Packaging
Masaya Kawano, EV Group Japan / Japan
Kazuya Nomura1, Jun Mizuno1, Akiko Okada1, Shuichi Shoji1, Toshinori Ogashiwa2, 1Waseda University, 2Tanaka Kikinzoku Kogyo / Japan
Ken Okumura1, Eiji Higurashi1, Tadatomo Suga1, Kei Hagiwara2, 1The University of Tokyo, 2NHK Science and Technology Research Laboratories / Japan
Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi, National Institute of Advanced Industrial Science and Technology / Japan
Ikuo Hirama, STMicroelectronics / Japan
440
444
448
452
456
13:40-15:45 Thursday, April 16TE2: Interconnection-2
TE2-1
TE2-2
TE2-3
TE2-4
TE2-5
Process Parameters for Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding
A Low Temperature Cu-Cu Direct Bonding Method with VUV and HCOOH Treatment for 3D Integration
Cu-Cu Direct Bonding Technology Using Ultrasonic Vibration for Flip- chip Interconnection
Improved Low Temperature Gold- Gold Bonding Using Nanoporous Powder Bump Using Vacuum Ultraviolet Irradiation Pre-treatment
Effects of Ion Species for the Surface Activated Bonding of GaAs Wafers on the Characteristics of the Bonded Interfaces
Naoya Matsuoka, Masahisa Fujino, Masatake Akaike, Tadatomo Suga, The University of Tokyo / Japan
Taiji Sakai, Nobuhiro Imaizumi, Seiki Sakuyama, Fujitsu Laboratories / Japan
Yoshiyuki Arai1, Masatsugu Nimura1, Hajime Tomokage2, 1Toray Engineering, 2Fukuoka University / Japan
Tatsushi Kaneda1, Jun Mizuno1, Akiko Okada1, Kaori Matsunaga2, Shuichi Shoji1, Mikiko Saito1, Hiroshi Nishikawa2, 1Waseda University, 2Osaka University / Japan
Genki Kono, Masahisa Fujino, Daiji Yamashita, Kentaroh Watanabe, Masakazu Sugiyama, Yoshiaki Nakano, Tadatomo Suga, The University of Tokyo / Japan
460
464
468
473
478
TE3: Interconnection-3 16:25-18:30 Thursday, April 16
TE3-1
TE3-2
TE3-3
TE3-4
TE3-5
Nano-Function Paste for Power Semiconductors
Effect of Sn Orientation on Cu Diffusion for Pb-Free Solders under a Temperature Gradient
Silver Paste Pressureless Sintering on Bare Copper Substrates for Large Area Chip Bonding in High Power Electronic Packaging
Direct Transfer of Graphehe onto Transparent Substrates with Self- Assembly Monolayer
Internal Patterning of the Glass Backlight Module for LCD Panel by Laser
Hiroaki Ikeda1,2, Shigenobu Sekine1, Ryuji Kimura1, Koichi Shimokawa1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1, Makoto Nagata2, 1Napra, 2Kobe University / Japan
Fan-Yi Ouyang, Wei-Neng Hsu, Yi-Shan Yang, National Tsing Hua University / Taiwan
Su-Yan Zhao1, Xin Li1, Yun-Hui Mei1, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Tech / USA
Masahisa Fujino, Kentaro Abe, Tadatomo Suga, The University of Tokyo / Japan
Shih-Jeh Wu, Hsiang-Chen Hsu, Pin- Chieh Wang, Shen-Li Fu, I-Shou University / Taiwan
482
486
491
495
499
9:30-10:45 Friday, April 17FA1: Taiwan Session-1
FA1-1 <Session Invited>
FA1-2
FA1-3
FOWLP and Bio CSP Development Development of Simulation- Approach for 3D Chip Stacking with Fine-Pitch Array-Type Microbumps
Fabrication of Arrays of (100) Cu Under-bump-metallization for 3D IC Packaging
James Lin, Powertech Technology / Taiwan
Chang-Chun Lee, Tzai-Liang Tzeng, Pei-Chen Huan, Chung Yuan Christian University / Taiwan
Wei-lan Chiu1, Chia-Ling Lu1, Han- Wen Lin1, Chien-Min Liu1, Yi-Sa Huang1, Tien-Lin Lu1, Tao-Chi Liu1, Hsiang-Yao Hsiao1, Chih Chen1, Jui- Chao Kuo2, King-Ning Tu3, 1National Chiao Tung University, 2National Cheng Kung University / Taiwan, 3University of California at Los Angeles / USA
514
518
FA2: Taiwan Session-2 11:00-12:15 Friday, April 17
FA2-1
FA2-2
FA2-3
Low-Temperature and Low Pressure Copper-to-Copper Direct Bonding Enabled by Creep on Highly (111)-Oriented Cu Surfaces
Mechanical and Electrical Properties Investigation of Micro- size Single Metal-coated Polymer Particle
On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias
Chih-Han Tseng1, Chien-Min Liu1, Han-wen Lin1, Yi-Cheng Chu1, Chih Chen1, Dian- Rong Lyu1, Kuan-Neng Chen1, King-Ning Tu2, 1National Chiao Tung University / Taiwan, 2University of California at Los Angeles / USA
Che-Hao Shih, Kai-Chi Chen, Hsun- Tien Li, Industrial Technology Research Institute / Taiwan
Hsuan-Chi Hu1, Hsien-Chie Cheng2, Tzu-Chin Huang1, Wen- Hwa Chen1, Shen-Tsai Wu3, Wei-Chung Lo3, 1National Tsing Hua University, 2Feng Chia University, 3Industrial Technology Research Institute / Taiwan
523
527
532
13:25-15:05 Friday, April 17FA3: Power Electronics Integration-1
FA3-1 <Session Invited>
FA3-2
FA3-3
FA3-4
Opportunities in Packaging and Integration for Wide-Bandgap Power Electronics
Wafer Bonding of SiC-SiC and SiC- Si by Modified Surface Activated Bonding Method
Utilization of Zn Alloy for the Manufacture of Automotive Power Device Modules
Heat Resistant Bi-Ag-X Solders for Power IC Die Attachment
Khai Doan The Ngo, Virginia Polytechnic Institute and State University / USA
Fengwen Mu1, Masahisa Fujino1, Tadatomo Suga1, Yoshikazu Takahashi2, Haruo Nakazawa2, Kennichi Iguchi2, 1The University of Tokyo, 2Fuji Electric / Japan
Kuo-Shu Kao, Su-Ching Chung, Chia- Wen Fan, Jing-Yao Chang, and Tao- Chih Chang, Industrial Technology Research Institute / Taiwan
Jenn-Ming Song, Zhang-Hong Chang, National Chung Hsing University / Taiwan
542
546
550
FA4: Power Electronics Integration-2 15:20-17:00 Friday, April 17
FA4-1 <Session Invited>
FA4-2
FA4-3
Silver Sintering for Power Electronics Integration
Relationship between Transient Thermal Impedance and Shear Strength of Pressureless Sintered Silver as Die Attachment for Power Devices
Effect of Heating Rate on Bonding Strength of Pressure-free Sintered Nanosilver Joint
Cyril Buttay1, Bruno Allard1, Raphaël Riva2, 1Université de Lyon, 2IRT Saint Exupéry / France
Meiyun Wang1, Yunhui Mei1, Xin Li1, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Polytechnic Institute and State University / USA
Kewei Xiao1, Guangyin Lei2, Khai D.T. Ngo1, Guo-Quan Lu1, 1Virginia Polytechnic Institute and State University, 2Ford Motor / USA
554
559
565
FB1: Advanced Packaging-2 9:30-10:45 Friday, April 17
FB1-1
FB1-2
FB1-3
Copper-filled Anodized Aluminum Oxide -a potential material for low temperature bonding for 3D packaging
High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-on- Package (PoP)
The Model Optimized of Mini Packaging -for quantum dots photodetector readout
Kosuke Yamashita, Yoshinori Hotta, Shunji Kurooka, Hirofumi Abe, Shiro Tan, FUJIFILM / Japan
Rey Co, Rajesh Katkar, Ashok S Prabhu, Wael Zohni, Invensas / USA
H. D. Lu, B. Y. Chen, F. M. Guo, East China Normal University / China
571
575
581
11:00-12:15 Friday, April 17FB2: Materials and Processes-2
FB2-1
FB2-2
FB2-3
Massive Spalling in Pb-Free Solder on Co-Based Surface Finishes
Effect of Silver Content and Vacuum Reflow Soldering on Thermal Fatigue Life of Sn-Ag-Cu Solder
Nanotwinned Cu Thin Film with Different Twin Boundary Orientations Deposited by Unbalanced Magnetron Sputtering
Chun-Hao Huang1, Yi-Ling Tsai1, Yu Ting Chang2, Albert T. Wu1, 1National Central University, 2Taiwan Uyemura / Taiwan
Mitsuharu Yamabe, Toshiba / Japan
Hsin-Yuan Chen, Kai Hung Yang, Fan-Yi Ouyang, National Tsing Hua University / Taiwan
586
590
596
FB3: Thermal Management-3 13:25-15:05 Friday, April 17
FB3-1
FB3-2
FB3-3
FB3-4
Wettability and Evaporation Enhancement for Heat Transport Devices by High Performance Oxide Layer
Cooling Performance of Impinging Jet from Piezoelectric Micro Blower Mounted in Narrow Flow Passage
An Initial Investigation of The Thermal-Fluid Characterization of a Visualized Visualized Loop Thermosyphon
Seeking an Energy-Efficient Modular Data Center: Impact of Pressure Loss on the Server Fan Power
Kazuhisa Yuki1, Katsuki Fukushima1, Akihiro Takemura2, Koichi Suzuki1, 1Tokyo University of Science- Yamaguchi, 2Tsuyama National College of Technology / Japan
Takashi Fukue1, Koichi Hirose1, Hirotoshi Terao2, 1Iwate University, 2ALPS Electronic / Japan
Yinfeng Wang, Yuezhao Zhu, Yu Qian, Haijun Chen, Li Yang, Nanjing Tech University / China
Masanori Sato, Arihiro Matsunaga, Masaki Chiba, Akira, Shoujiguchi, Minoru Yoshikawa, NEC / Japan
601
605
611
617
FB4: Materials and Processes-3 15:20-17:00 Friday, April 17
FB4-1
FB4-2
FB4-3
FB4-4
Examining the Required Properties of Build-up Dielectric Materials for Next Generation IC Package Substrates
Advanced Plating Photoresist Development for Semiconductor Packages
Development of Lift-off Photoresists with Unique Bottom Profile
Modeling of Positional Plasma Characteristics by Inserting Body Tube of Optical Emission Spectroscopy for Plasma Assisted Atomic Layer Deposition System
Hidenobu Deguchi, Tatsushi Hayashi, Teruhisa Tanaka, Toshiaki Tanaka, Kazutaka Shirahase, Sekisui Chemical / Japan
Hirokazu Sakakibara, Hisanori Akimaru, Akito Hiro, Keiichi Sato, Koichi Fujiwara, Kenji Okamoto, Shiro Kusumoto, JSR / Japan
Hirokazu Ito, Kouichi Hasegawa, Tomohiro Matsuki, Shiro Kusumoto, JSR / Japan
In Joong Kim, Yong Hyeon Shin, Ilgu Yun, Yonsei University / Korea
623
628
633
638
9:30-10:45 Friday, April 17FC1: Optoelectronics-1
FC1-1
FC1-2
FC1-3
The Study of Thermal Cycling Performance of Enacpasulant Material in SMD LEDs Application
Higher Polarization Crosstalk of 38.5 dB and Low PDL with Silane Modified Highly Moisture Resistant Adhesives in Assembling Optical Devices
Reflection Optical Notch Filtering Behavior of Cavity- Resonator- Integrated Guided- Mode Resonance Mirror
Chih-Hao Lin, Kai-Chi Chen, Shu- Chen Huang, Hsun-Tien Li, Industrial Technology Research Institute / Taiwan
Seiko Mitachi1, Hirokazu Kageyama2, Kazushi Kimura2, Ryo Nagase3, 1Tokyo University of Technology, 2The Yokohama Rubber, 3Chiba Institute of Technology / Japan
Masahiro Nakata1, Tomohiro Kondo1, Kenji Kintaka2, Junichi Inoue1, Shogo Ura1, 1Kyoto Institute of Technology, 2National Institute of Advanced Industrial Science and Technology / Japan
642
652
FC2: Optoelectronics-2 11:00-12:15 Friday, April 17
FC2-1
FC2-2
FC2-3
Small-footprint 128-Gb/s DP- QPSK Silicon Optical Modulator in Ceramic-based Metal Package with Low Optical Coupling Loss
Opto-Electronic Hybrid Integrated Chip Packaging Technology for Silicon Photonic Platform Using Gold-Stud Bump Bonding
Influence of Atmospheric- Pressure Plasma Treatment on Surface and Electrical Properties of Photodiode Chips
Hiroki Ishihara1, Yasuhiro Mashiko1, Kazuhiro Goi1, Kensuke Ogawa1, Tsung-Yang Liow2, Xiaoguaog Tu2, Guo-Qiang Lo2, Dim-Lee Kwong2, 1Fujikura / Japan, 2A*STAR / Singapore
Mistuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masashi Nogawa, Koji Yamada, Tsuyoshi Yamamoto, NTT / Japan
So Ikeda, Eiji Higurashi, Tadatomo Suga, The University of Tokyo / Japan
656
660
666
FC3: Optoelectronics-3 13:25-15:05 Friday, April 17
FC3-1 <Session Invited>
FC3-2
FC3-3 <Session Invited>
FC3-4
Flip Chip, CSP or WL-PKG, the Near Future of LED Device
A Measure Against the Latest Problem of LED Package
Flip Chip LED COB Bonding Process with Low-Temperature- Curable Conductive Paste
Determination of the Junction Temperature of Gallium Nitride (GaN)-based High Power LED under Thermal with Current Loading Condition
Tetsuya Onishi, Grand Joint Technology / Hong Kong
Hirofumi Torigoe, Yoshiteru Miyawaki, SANYU REC / Japan
H. Kashitani, A.Uchida, Ohashi Engineering / Japan
Feng-Mao Hsu, Yen-Fu Su, Kuo-Ning Chiang, National Tsing Hua University / Taiwan
678
691
15:20-17:00 Friday, April 17FC4: RF
FC4-1
FC4-2
FC4-3
FC4-4 <Session Invited>
Impedance Balance Control for Reduction of Common Mode Noise in Full Bridge Converter
Suppression of Mode-Conversion by DNG Material Placed on Differential-Paired Lines with Bend Discontinuities
Development of Less than 100μm Thick Sheet for Noise Attenuation by Electromagnetic Induction
Development of Battery-less Integral Type Wireless Current Sensor Node
Masaaki Maeda, Tohlu Matsushima, Takashi Hisakado, Osami Wada, Kyoto University / Japan
Yoshiki Kayano1, Hiroshi Inoue2, 1Akita University, 2The Open University of Japan / Japan
Kishio Hidaka1, Toru Nihei2, Noriji Tashiro2, Atsushi Hujita2, 1Yamagata University, 2Hitachi Chemical / Japan
Hironao Okada, Toshihiro Itoh, National Institute of Advanced Industrial Science and Technology / Japan
695
700
704
FD1: DMR*-Electrical-1 9:30-10:45 Friday, April 17
FD1-1
FD1-2
FD1-3
Improved Delay-Matching Bus Routing by using Multi-layers
Method for Automatic Compensation of the Loading Effect for High-Precision Buffer Amplifiers
A Testable Design for Electrical Interconnect Tests of 3D ICs
Yang Tian, Takahiro Watanabe, Waseda University / Japan
Seitaro Kon, Tatsuji Yamada, National Institute of Advanced Industrial Science and Technology / Japan
Akihiro Odoriba1, Shoichi Umezu1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, Fara Ashikin Binti Ali2, Shyue-Kung Lu3, 1Tokushima University / Japan, 2Universiti Teknikal Malaysia Melaka / Malaysia, 3National Taiwan University of Science and Technology / Taiwan
708
714
718
FD2: DMR*-Electrical-2 11:00-12:15 Friday, April 17
FD2-1
FD2-2
Optimum Characteristic and Structural Design of PWB Radiation Detector Considering Gas Amplification Reaction
Practical Optimization Flow using aNew System Design Methodology
Kohei Ota, Motonori Oono, Tomohisa Motomura, Dai Nippon Printing / Japan
Ken Kawamura1, Hidenori Murata1, Yoshiharu Iwata1, Ryohei Satoh1, Takeshi Sakamoto2, Kazuya Okamoto1, 1Osaka University, 2GLOBALASSIST/ Japan
723
728
* DMR: Design Modeling and Reliability
13:25-15:05 Friday, April 17FD3: DMR*-Electrical-3
FD3-1
FD3-2
FD3-3
FD3-4
On-Die Intrinsic Capacitance Extraction Methodology -an alternative approach in power integrity modeling by leveraging silicon intrinsic capacitance
Characterization of On Die Capacitance and Silicon Measurement Correlation
MIM Capacitance Efficiency Study for High Speed I/O Power Integrity Network Design -MIM and MIMless high speed I/O performance characterization
Silicon Level Circuit Implementation for System-On- Chip Power Integrity Improvement
Fern Nee Tan, Intel Microelectronics / Malaysia
Li Chuang Quek, Ming Dak Chai, Heng Chuan Shu, Intel Microelectronics / Malaysia
Fern Nee Tan, Intel Microelectronics / Malaysia
Chee Hong Aw, Li Chuang Quek, Heng Chuan Shu, Intel Microelectronics / Malaysia
739
743
748
FD4: DMR*-Electrical-4 15:20-17:00 Friday, April 17
FD4-1
FD4-2
FD4-3
FD4-4
Efficient Method for Predictive Modeling of Irregular Shaped Power Distribution Network
Fundamental Phenomena of Signal Transmission in GHz Region - verification by experimental basis supported by simulation
The Study of Suppression Method for Power Radiation between GND Planes from Signal Via in MultiLayer Board
Interposer Design and Measurement with Various Capacitors for Reducing Total System PDN Impedance
Afef Bouchaala1,2, Lionel Courau1, Olivier Bonnaud1, Philippe Galy, 1STMicroelectronics, 2IETR / France
Yutaka Akiyama, Chihiro Ueda, Kanji Otsuka, Meisei University / Japan
Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi, Mitsubishi Electric / Japan
D. Tanaka1, K. Mihara1, N. Kobayashi1, Y. Hiyama1, S. Kiyoshige2, W. Ichimura2, T. Yamaguchi2, T. Sudo2, 1Murata Manufacturing, 2Shibaura Institute of Technology / Japan
752
757
761
767
FE1: DMR*-Mechanical-1 9:30-10:45 Friday, April 17
FE1-1
FE1-2
Warpage Modeling Technique of Organic Interposer Considering Deformation by Insulator Material Shrinkage
Estimation Method of Cracking Probability of Stacked Overhang Die during Wire Bonding
Keishi Okamoto, Sayuri Kohara, Hirokazu Noma, Kazushige Toriyama and Hiroyuki Mori, IBM Japan / Japan
Kanako Sawada1, Hideo Aoki1, Eigo Matsuura1, Hideko Mukaida1, Fumiyoshi Minami2, 1Toshiba, 2Osaka University / Japan
771
776
* DMR: Design Modeling and Reliability
11:00-12:15 Friday, April 17FE2: DMR*-Mechanical-2
FE2-1
FE2-2
FE2-3
Advancement in Modeling Vapor Pressure Induced Stresses in Electronic Packaging
Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian and Equilibrium Mesh Smoothing Algorithm
High Reliability Packaging Technologies for 175deg.C Continuous Operation in IGBT Module
Loh Wei Keat, Lee Yung Hsiang, Ong Kang Eu, Chin Ian, Leong Jenn Seong, Intel Technology / Malaysia
Che-Chia Yang, Chia-Chi Tsia, Yen-Fu Su, Kuo- Ning Chiang, National Tsing Hua University / Taiwan
T. Saito, Y. Nishimura, F. Momose, A. Hirao, A. Morozumi, Y. Tamai, E. Mochizuki and Y. Takahashi, Fuji Electric / Japan
781
787
791
FE3: Interconnection-5 13:25-15:05 Friday, April 17
FE3-1
FE3-2
FE3-3
FE3-4
Evaluation of Residual Stress Caused by Flip-Chip Bonding Process using Piezo-Resistor Embedded Test Element Group Chips
Effects of Internal Stress of Electroless Ni Plating on Solder Joining Strength
The Effects of Ag Content in the Solder on Electromigration Behavior
The Beneficial Effect of Zn Additions on the Microstructure of SnCu and SnCuNi Solder Joints to Cu Substrates
Toshio Enami, Kyosuke Nanami, Osamu Horiuchi, Young-Gun Han, Hajime Tomokage, Fukuoka University / Japan
Katsumi Miyama, Kanou Yoshida, Shigeru Saitou, Toshiyuki Takashima, Hokkaido University of Science / Japan
Ying-Ta Chiu, Yu-Hsiu Shao, Ping- Feng Yang, Advanced Semiconductor Engineering / Taiwan
Wayne Ng1, Guang Zeng2, Takatoshi Nishimura1, Keith Sweatman1, Stuart D. McDonald2, Kazuhiro Nogita2, 1Nihon Superior / Japan, 2University of Queensland / Australia
795
800
804
809
* DMR: Design Modeling and Reliability
Poster Session
P01
P02
P03
P04
P05
P06
P07
P08
P09
P10
Embedded Planar Power Inductor Technology for Package-level DC Power Grid
Stress and Strain Analysis using Multi-Physics Solver for Power Device Heat Dissipation Structures under Thermal Cycling Test
Heat Dissipation Characterization and Application of SiC Power Devices by Transient Thermal Measurement
Synthesis and Characterization of Polydopamine Modified Carbon Nanotube (CNT)/ Polydimethylsiloxane (PDMS) Composites
Effect of Au Nanoporous Structure on Bonding Strength
Cu/BCB Hybrid Bonding with TSV for 3D Integration by using Fly Cutting Technology
In Situ Observations of Micromechanical Behaviours of Intermetallic Compounds for Structural Applications in 3D IC Micro Joints
Effect of Ag Concentration on Ni/ Sn-xAg/Ni Micro Joints under Space Confinement
Effect of Adherend Surface Morphology on Adhesive Strength
Low Temperature Au-Au Surface- Activated Bonding Using Nitrogen Atmospheric-Pressure Plasma Treatment for Optical Microsystems
Yuta Kondo1, Yuichiro Yazaki1, Makoto Sonehara1, Toshiro Sato1, Tetsuro Watanabe2, Yuto Seino2, Nobuhiro Matsushita2, Tomoharu Fujii3, Kazutaka Kobayashi3, Hiroshi Shimizu3, Yuki Yanagisawa4, Teruki Someya4, Hiroshi Fuketa4, Makoto Takamiya4, Takayasu Sakurai4, 1Shinshu University, 2Tokyo Institute of Technology, 3SHINKO Electric Industries, 4The University of Tokyo / Japan
Takahiro Asai1, Masaaki Aoki1, Akihiro Mochizuki2, Takamitsu Honjo2, Hitoshi Kida2, Goro Yoshinari2, Nobuhiko Nakano1, 1Keio University, 2Alent Japan / Japan
Ryo Endoh, Junichi Watanabe, Ryuichi Sugie, Takashi Yamamoto, Toray Research Center / Japan
Chih-Feng Wang1, Pei-Kang Huang1, Pei-Rung Hung1, Chan-Chih Hsu1, Sheng-Rui Jian1, Ping-Feng Yang2, Min-Hua Chung2, 1I-Shou University, 2Advanced Semiconductor Engineering / Taiwan
Kaori Matsunaga1, Min-Su Kim1, Hiroshi Nishikawa1, Mikiko Saito2, Jun Mizuno2, 1Osaka University, 2Waseda University / Japan
Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang-Hung Chang, Huan-Chun Fu, Chia-Wei Chiang, Chao-Kai Hsu, Wen-Wei Shen, Wei-Chung Lo, Industrial Technology Research Institute / Taiwan
Jen-Jui Yu, Jui-Yang Wu, Li-Jen Yu, C. Robert Kao, National Taiwan University / Taiwan
Jen-Jui Yu, Jui-Yang Wu, Sean Yang, C. Robert Kao, National Taiwan University / Taiwan
Yoshio Oozeki, Hiroaki Furuichi, Rika Nomura, Satoshi Arai, Hitachi / Japan
Seiya Matsuoka1, Michitaka Yamamoto1, Eiji Higurashi1, Tadatomo Suga1, Renshi Sawada2, 1The University of Tokyo, 2Kyusyu University / Japan
814
818
822
826
830
834
838
842
846
850
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
CSP LED Validation through Optical Simulations for High Irradiance UV LED Module
Surface Morphology and Optical Properties of TiO2-Carbon Nano- fiber Prepared by Electrospinning
Nano Fluorescent Fiber Prepared by Electrospinning
Fabrication of SERS Active Noble Metallic Nanostructure by Synchrotron Radiation Induced Photochemical Reaction
A Novel MEMS-Based Lab- on-a-Tube Technology and Its Application
Improvement of Surface Propertieson Microfluidic Devices by Diamond-Like Carbone Coatings
A Study of High-Density Differential Transmission Line of the Package Board Based on Crosstalk Reduction
Novel Impedance Controllable Testing Socket for High Speed/ Frequency Packages
Embedded Band-pass Filter Design in Packaging Substrate
Optimum Conifiguraiton of SI/ PI Co-Simulation using Electro- Magnetic Simulator
Hao-Xiang Lin, Chin-Chang Hsu, Cheng-Chun Liao, Chung-Min Chang, Chih-Peng Hsu, Advanced Optoelectronic Technology / Taiwan
Hsiao-Chung Chu, Cho-Liang Chung, Chih-Hao Hsu, Sheng-Li Fu, I-Shou University / Taiwan
Yu-Min Chen, Cho-Liang Chung*, Wei Chen, Yu-Hsuan Lin, Sheng-Li Fu, I-Shou University / Taiwan
Takeshi Matsumoto1, Ikuo Okada2, Ikuya Sakurai2, Yuichi Utsumi1, Akinobu Yamaguchi1, 1University of Hyogo, 2Nagoya University / Japan
Yi Zhang, Toshihiro Itoh, Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology / Japan
Yuta Murayama1, Keisuke Shiba1, Yasuharu Ohgoe1, Jun Mizuno2, Shuichi Shoji2, Kazuhide Ozeki3, Keisuke Sato1, Ali Alanazi4, Kenji Hirakuri1, 1Tokyo Denki University, 2Waseda University, 3Ibaraki University / Japan, 4King Saud University / Saudi Arabia
Takashi Kuwahara1, Yoshihiro Akeboshi1, Seiichi Saito2, 1Mitsubishi Electric, 2Salesian Polytechnic / Japan
Kuan-Yi Cheng1, Sung-Mao Wu1, Lung-Shu Huang1, Chen-Chang Chen2, Yen-Tang Cheng2, 1National University of Kaohsiung, 2Ministry of Economic Affairs / Taiwan
Bo You Chen1, Sung Mao Wu1, Ming Shan Lin1, Tzu-Wen Kung2, 1Nation University of Kaohsiung, 2Ministry of Economic Affairs / Taiwan
Mitsuharu Umekawa, Keysight Technologies Japan / Japan
854
858
862
866
870
874
878
882
886
890