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IEEE Catalog Number: ISBN:
CFP1489U-POD 978-1-4799-3367-9
2014 International Conference on Electronics Packaging (ICEP 2014)
Toyama, Japan 23-25 April 2014
TABLE of CONTENTS
WA1: Automotive 16:45-18:00 Wednesday, 23WA1-1 Direct Impingement Cooling of
LED by Piezo FanRandeep Singh, Ahmad Jalilvand, Kazuhiko Goto, Koichi Mashiko, Yuji Saito, Masataka Mochizuki, Fujikura / Japan
1
WA1-2 <Session Invited>
A Novel Direct Water and Double-Sided Cooled Power Module for HEV/EV Inverter
Takeshi Tokuyama1, Kinya Nakatsu1, Atsuo Nishihara1, Koji Sasaki1, Ryuichi Saito2, 1Hitachi, 2Hitachi Automotive Systems / Japan
6
WA1-3 Lead-Free Solders for Solar and Electric Vehicles
world solar challenge 2013 in “Arrow1”
Kazuhiro Nogita1,2, James Kennedy1,3, John Amsler1, Matthew Greaves1, Cameron Tuesley1, Takatoshi Nishimura4, 1TeamArrow Solar Car Team, 2The University of Queensland, 3Tritium / Australia, 4Nihon Superior / Japan
10
WB1: Materials and Processes-1 16:45-18:00 Wednesday, 23WB1-1 Effect of Surface Damage on
Strength of Silicon Wafer for Solar Cells
Daisuke Echizenya1,2, Katsuhiko Sasaki2, 1Mitsubishi Electric, 2Hokkaido University / Japan
14
WB1-2 <Session Invited>
Eco-Fabrication of Nano-metal Related Materials by Ultrasound Solid-liquid Reaction
Yamato Hayashi, Tohoku University / Japan
N/A
WB1-3 High Productivity Sputtering System for Seed Layer of Printed Circuit Board
Tetsushi Fujinaga, ULVAC / Japan 26
WC1: Advanced Packaging-1 16:45-18:00 Wednesday, 23WC1-1 Newly Developed Ultra Thin Fan-
Out Wafer Level Package for PoP Usage
Haruo Shimamoto2, Kyoko Soga1, Katsuya Takemura1, Hideyoshi Yanagisawa1, Satoshi Asai1, Kazunori Kondo1, Michihiro Sugo1, Hideto Kato1, Yoshio Matsuda2, 1Shin-Etsu Chemical, 2Wave Technology / Japan
30
WC1-2 Wafer Level Package by Using Post Dicing Process
Noriyuki Fujimori1,2, Takatoshi Igarashi1, Takahiro Shimohata1, Takuro Suyama1, Kazuhiro Yoshida1, Yusuke Nakagawa1, Tsutomu Nakamura1, Toshiro Sato2, 1Olympus, 2Shinshu University / Japan
34
WC1-3 Process Integration for Backside Illuminated Image Sensor Stacked with Analog-to-Digital Conversion Chip
H. H. Chang, C. H. Chien, Y. C. Lee, S. M. Lee, J. C. Wang, Y. W. Huang, C. J. Zhan, Z. C. Hsiao, P. J. Tzeng, C. H. Lee, T. S. Chen, C. T. Ko, W. C. Lo, M. J. Kao, Industrial Technology Research Institute / Taiwan
39
WD1: Substrates and Interposers 16:45-18:00 Wednesday, 23WD1-1 Ultrathin 4-Layer Flexible Printed
Circuits (FPC) Fabricated by Molecular Bonding Technology
Fong-Ru Lin1, Daigo Suzuki1, Akihiko Happoya1, Manabu Miyawaki2, Kouichi Kamiyama2, Syuukichi Takii2, Takahiro Kudo3, Kunio Mori3, 1Toshiba, 2Meiko Electronics, 3Sulfur Chemical Institute / Japan
44
WD1-2 Advanced Vertical Interconnect Technology with High Density Interconnect and Conductive Paste
Tsuyoshi Tsunoda1, Ryouhei Kasai1, Shozo Yuki1, Naoki Ota1, Keisuke Sawada1, Yuichi Yamamoto1, Yoshitaka Fukuoka2, Shuji Sagara1, 1Dai Nippon Printing, 2Weisti / Japan
50
WD1-3 Electrical Assessment of Chip to Chip Connection for Ultra High Density Organic Interposer
Keishi Okamoto, Hiroyuki Mori, Yasumitsu Orii, IBM Research –Tokyo / Japan
55
WE1: Thermal Management-1 16:45-18:00 Wednesday, 23WE1-1 The Effect of Thermal Conductivity
of Board to Laser Condition in Laser Soldering -the case of paste solder
Dai Imai, Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka, Toyama Prefectural University / Japan
60
WE1-2 Basic Study on Flow and Heat Transfer Performance of Pulsating Air Flow for Application to Electronics Cooling
Mutsuki Kichima, Takashi Fukue, Koichi Hirose, Iwate University / Japan
64
WE1-3 Evaluation of Cooling Performance of a Piezoelectric Micro Blower in Narrow Flow Passage
Takashi Fukue1, Yoshiki Matsuura1, Koichi Hirose1, Hirotoshi Terao2, 1Iwate University, 2ALPS Electronic / Japan
69
TA1: 3DIC Packaging-1 9:00-10:40 Thursday, 24TA1-1 A New Temporary Bonding
Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
Hideto Hashiguchi, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi, Tohoku University / Japan
74
TA1-2 Effects of Ar Plasma and Ar Fast Atom Bombardment (FAB) Treatments on Cu/Polymer Hybrid Surface for Wafer Bonding
Ran He, Tadatomo Suga, The University of Tokyo / Japan
78
TA1-3 Process Integration of 3D Stacking for Backside Illuminated Image Sensor
Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang-Hung Chang, Huan-Chun Fu, Chao-Kai Hsu, Shu-Man Li, Wen-Li Tsai, Wen-Wei Shen, Jen-Chun Wang, Yu-Min Lin, Wei-Chung Lo, Industrial Technology Research Institute / Taiwan
82
TA1-4 Novel 3-Dimensional Package Structure with Micro-Pins and Electronic Components
Nau Negishi, Mikio Nakamura, Takanori Sekido, Tsutomu Nakamura, Yu Kondo, Olympus / Japan
86
TA2: Taiwan Session 12:50-14:30 Thursday, 24TA2-1 <Session Invited>
Advanced 3D Technology Update in Taiwan
Shen-Li Fu, I-Shou University / Taiwan
No Paper
TA2-2 <Session Invited>
Heterogeous 3D Systems Integration
CP Hung, ASE / Taiwan No Paper
TA2-3 Electromigration and Thermomigration of Pb-Free Microbumps in Three-Dimensional Integrated Circuits Packaging
Fan-Yi Ouyang, Wei-Cheng Jhu, Hao Hsu, Tsung-Han Yang, National Tsing Hua University / Taiwan
90
TA2-4 Characteristics of 600 V / 450 A IGBT Power Module Assembled by Ag Sintering Technology
Jing-Yao Chang, Su-Yu Fun, Fang-Jun Leu, Kuo-Shu Kao, Chih-Ming Tzeng, Wei-Kuo Han, Tao-Chih Chang, Industrial Technology Research Institute / Taiwan
96
TA3: Korea Session 15:00-16:40 Thursday, 24TA3-1 Manufacture of Copper Substarte
for LED Package and its Characteristics
Byung-Wook Ahn, Don-Hyun Choi, Seung-Boo Jung, Sungkyunkwan University / Korea
N/A
TA3-2 Optimization of Levelers Concentration to Minimize the Contamination in Copper Via Filling
Ja-Kyung Koo1, Tai Hong Yim2, Jae-Ho Lee1, 1Hongik University, 2KITECH / Korea
N/A
TA3-3 Properties of Polymer Solar Cells with Au Nanoparticle Doped Hole Transport Layer
Byung Min Park, Gi Ppeum Kim, Seung Ho Kim, Ho Jung Chang, Dankook University / Korea
N/A
TA3-4 Measurement and Comparison with Simulation for the Warpage Characteristics of Package-on-Packages Processed with Thin Dies and Thin Substrates
Dong-Myung Jung1, Jung-Yeol Choi1, Dong-Hyun Park1, L. Fabiano2, C. Moraes2, E. Rhod2, W. Hasenkamp2, Tae Sung Oh1, 1Hongik University / Korea, 2Unisinos University / Brazil
N/A
TA4: 3DIC Packaging-2 16:50-18:30 Thursday, 24TA4-1 Thermal Stresses around Void in
Through Silicon Via in 3D SiPTakahiro Kinoshita1, Tomoya Sugiura1, Takashi Kawakami1, Keiji Matsumoto2, Sayuri Kohara2, Yasumitsu Orii2, 1Toyama Prefectural University, 2IBM Japan / Japan
105
TA4-2 Thermal Stresses of TSV and Si Chip in 3D SiP under Device
Tomoya Sugiura1, Takahiro Kinoshita1, Takashi Kawakami1, Keiji Matsumoto2, Sayuri Kohara2, Yasumitsu Orii2, 1Toyama Prefectural University, 2IBM Japan / Japan
109
TA4-3 Virtical and Horizontal Location Design of Program Voltage Generator for 3D-Integrated ReRAM/NAND Flash Hybrid SSD
Tomoya Ishii, Koh Johguchi, Ken Takeuchi, Chuo University / Japan
113
TA4-4 Accurate Resistance Measuring Method for High Density Post-Bond TSVs in 3D-SIC with Electrical Probes
Shuichi Kameyama1,2, Masayuki Baba1, Yoshinobu Higami2, Hiroshi Takahashi2, 1Fujitsu, 2Ehime University / Japan
117
TB1: Materials and Processes-2 9:00-10:40 Thursday, 24TB1-1 Flip Chip Assembly with Wafer
Level NCFYuta Kobayashi, Toshihisa Nonaka, Toray Industries / Japan
122
TB1-2 Novel Low Temperature Curable Photo-Sensitive Insulator
Tomohiko Sakurai, Hikaru Mizuno, Kenji Okamoto, Katsumi Inomata, JSR / Japan
126
TB1-3 Development of Fine Pitch Negative Tone Resist for Electro-Plating
Hisanori Akimaru, Hidefumi Ishikawa, Hirokazu Sakakibara, Shingo Naruse, Kenji Okamoto, Katsumi Inomata, JSR / Japan
131
TB2: Materials and Processes-3 12:50-14:30 Thursday, 24TB2-1 Tin Pest in Lead-Free Solders?
- fundamental studies on the effect of impurities on phase transformation kinetics
Guang Zeng1, Stuart McDonald1, Keith Sweatman1,2, Kazuhiro Nogita1, 1The University of Queensland / Australia, 2Nihon Superior / Japan
135
TB2-2 Phase Transformations of Alloyed and Core-Shell Metallic Nanoparticles for Interconnect Applications
Jenn-Ming Song, National Chung Hsing University / Taiwan
140
TB2-3 Effect of Isothermal Aging on the Growth Behavior of Cu/Al Intermetallic Compounds
Omid Mokhtari1, Min-Su Kim1, Hiroshi Nishikawa1, Fumiyoshi Kawashiro2, Satoshi Itou2, Takehiko Maeda2, Tetsuya Hirose2, Takaki Eto2, 1Osaka University, 2Renesas Electronics / Japan
144
TB2-4 Effect of Nickel Addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
Abd Malek Zetty Akhtar, Kahar Hardinna Wirda, Idris Siti Rabiatull Aisha, Ishak Mahadzir, Universiti Malaysia Pahang / Malaysia
N/A
TB3: Materials and Processes-4 15:00-16:40 Thursday, 24TB3-1 New Interconnection Alloy Metal
for High Bonding Strength - nano composite particles synthesized by nanomized method
Shigenobu Sekine1, Ryuji Kimura1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1, Uichi Itoh2, Manabu Yoshida2, Hideo Tokuhisa2, 1Napra, 2National Institute of Advanced Industrial Science and Technology / Japan
152
TB3-2 Constitutive Behavior and Anand Model of Novel Lead-Free Solder Sn-Zn-Bi-In-P
Jian-Chun Liu, Hong-Jiao Yu, Gong Zhang, Zheng-Hong Wang, Ju-Sheng Ma, Tsinghua University / China
156
TB3-3 Effect of Gold and Copper on Microstructural Evolution and Mechanical Durability of SAC305 Solder Joints
Subhasis Mukherjee1, Abhijit Dasgupta1, Julie Silk2, Lay-ling Ong3, 1University of Maryland, 2Agilent / USA, 3Agilent / Malaysia
162
TB3-4 Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High Reliable Electronic/Electric Materials
Song-Zhu S. Kure-Chu, Tohru Ogasawara, Hitoshi Yashiro, Rongbin Ye, Takuya Hosokai, Michimasa Uchidate, Eiichi Suzuki, Tomoyuki Naito, Iwate University / Japan
168
TB4: Materials and Processes-5 16:50-18:30 Thursday, 24TB4-1 Evaluation of Embedded
BaTiO3/Epoxy as Dielectrics
Maobai Lai, Shuhui Yu, Wenhu Yang, Rong Sun, Chinese Academy of Sciences / China
N/A
TB4-2 Effect of Chemical Factors on the Evolution of Electrical Conductivity during Curing in Ag-Loaded Conductive Adhesives Composed of an Epoxy-Based Binder - a new understanding of electrically conductive adhesives
Yoshiaki Sakaniwa, Yasunori Tada, Masahiro Inoue, Gunma University / Japan
176
TB4-3 Ultrasonic Bonding Method for Thin Film Capacitor Module
Atsunori Hattori, Hirotaka Hatano, Hirotaka Ogawa, Noda Screen / Japan
181
TC1: iNEMI Session 9:00-10:40 Thursday, 24TC1-1 <Session Invited>
Develop Environmentally Sustainable Electronics
Bill Bader, International Electronics Manufacturing Initiative / USA
N/A
TC1-2 iNEMI Packaging Technology Roadmap Highlights
Bill Bottoms1, Masahiro Tsuriya2, Chuck Richardson2, 1Third Millennium Test Solutions, 2International Electronics Manufacturing Initiative / USA
188
TC1-3 High-Voltage DC–DC Power Module Development
Izuru Narita1, Rick Fishbune1, Randhir Malik1, David Mohr2, Harish Chandra3, Mark Schaffer4, Haley Fu4, 1International Business Machines, 2Hewlett-Packard, 3Cisco Systems, 4International Electronics Manufacturing Initiative / USA
193
TC1-4 Creep Corrosion Test in Flowers of Sulfur Chamber
Haley Fu1, Prabjit Singh2, Jing Zhang2, 1International Electronics Manufacturing Initiatives, 2IBM / Japan
197
TC2: Advanced Packaging-2 12:50-14:30 Thursday, 24TC2-1 Processing and Characterization
of Circuit Metallization on a Stretchable Polymer Substrate for Stretchable Electronic Packaging
Jung-Yeol Choi, Dae-Woong Park, Woo-Joon Kim, Tae Sung Oh, Hongik University / Korea
N/A
TC2-2 Flip Chip Process on a Stretchable Polymer Substrate for Stretchable Electronic Packaging
Jung-Yeol Choi, Woo-Joon Kim, Dae-Woong Park, Tae Sung Oh, Hongik University / Korea
N/A
TC2-3 Room Temperature Bonding Method for Polymer Films by Surface Activated Bonding Method Using Al Intermediate Layer
Takashi Matsumae, Masahisa Fujino, Tadatomo Suga, The University of Tokyo / Japan
204
TC2-4 Cutting Thin Glass by a Fiber Picosecond IR Laser
Hsiang-Chen Hsu1, Pei-Chieh Chin1, Shih-Jeh Wu1, Winphyr Lin2, 1I-Shou University, 2ENR Tech. / Taiwan
No Paper
TC3: Advanced Packaging-3 15:00-16:40 Thursday, 24TC3-1 A 1020-Lead, 240 Micron
Pitch, 14 x 14mm Package-On-Package (PoP) and Manufacturing Infrastructure
Rajesh Katkar, Rey Co, Wael Zohni, Invensas / USA
208
TC3-2 Reliability Characterization of 2.5D Multi-Chip Module on Board under Drop Impact
Tzu-Hsuan Cheng1, Hsien-Chie Cheng2, Wen-Hwa Chen1, Hsin-Yi Huang3, Tao-Chih Chang3, 1National Tsing Hua University, 2Feng Chia University, 3Industrial Technology Research Institute / Taiwan
215
TC3-3 A Frequency Enhanced Single Package Multi-Die Memory System Using an In-Package Flyby
Zhuowen Sun, Kevin Chen, Kyongmo Bang, Invensas / USA
219
TC3-4on Three Dimensional Molded Substrate Technology
T. Leneke, S. Majcherek, S. Hirsch, M.-P. Schmidt, B. Schmidt, Otto-von-Guericke-University Magdeburg / Germany
223
TC4: DMR-Electrical-1 16:50-18:30 Thursday, 24TC4-1 A Built-in Supply Current Test
Circuit for Pin Opens in Assembled PCBs
Shoichi Umezu, Masaki Hashizume, Hiroyuki Yotsuyanagi, University of Tokushima / Japan
227
TC4-2 Pin Open Detection of BGA IC by Supply Current Testing
Akira Ono1, Hiroyuki Yotsuyanagi2, Masaki Hashizume2, 1Kagawa National College of Technology, 2University of Tokushima / Japan
231
TC4-3 Electrical Test Method of Open Defects at Data Buses in 3D SRAM IC
Yudai Shiraishi1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, Tetsuo Tada2, Shyue-Kung Lu3, 1University of Tokushima, 2Tokushima Bunri University, 3National Taiwan University of Science and Technology / Japan
235
TC4-4 Method for Back-Annotating Per-Transistor Power Values onto 3DIC Layouts to Enable Detailed Thermal Analysis
Samson Melamed1, Fumito Imura1, Masahiro Aoyagi1, Hiroshi Nakagawa1, Katsuya Kikuchi1, Michiya Hagimoto2, Yukoh Matsumoto2, 1National Institute of Advanced Industrial Science and Technology, 2TOPS Systems / Japan
239
TD1: Printed Electronics-1 9:00-10:40 Thursday, 24TD1-1 <Session Invited> (50min.)
Imperceptible Organic Electronic Systems for Bio-Medical Applications
Tsuyoshi Sekitani, The University of Tokyo / Japan
N/A
TD1-2 <Session Invited>
Automated Manufacturing Line of All-Printed TFT Array Flexible Film
Shinichi Nishi1,2, Toshihide Kamata1,3, 1Japan Advanced Printed Electronics Technology Research Association, 2KonicaMinolta, 3The National Institute of Advanced Industrial Science and Technology / Japan
252
TD1-3 <Session Invited>
Silver Nanoink Sintarable at Low Temperature -conductive ink for printed electronics
Toshitsugu Terakawa, Hiroyoshi Koduma, Yuki Iguchi, Kazuki Okamoto, Daicel / Japan
256
TD2: Printed Electronics-2 12:50-14:30 Thursday, 24TD2-1 <Session Invited>
Ambient Conductive Metal Nanoink Masayuki Kanehara, Okayama University/Colloidal Ink / Japan
N/A
TD2-2 <Session Invited>
Fine Electrode Pattern Formation by Screen-Offset Printing Technique
Ken-ichi Nomura1, Hirobumi Ushijima1, Kazuro Nagase2, Hiroaki Ikedo2, Ryosuke Mitsui3, Seiya Takahashi3, Shin-ichiro Nakajima3, Shiro Iwata4, 1National Institute of Advanced Industrial Science and Technology, 2Mino Group, 3Japan Aviation Electronics Industry, 4Shimane Institute for Industrial Technology / Japan
275
TD2-3 <Session Invited>
Reverse Offset Printing and Specialized Inks for Organic TFTs
Masayoshi Koutake, Yoshinori Katayama, DIC / Japan
279
TD2-4 <Session Invited>
Low Temperature Photonic Sintering for Printed Electronics
Saad Ahmed, Xenon / Japan N/A
TD3: Printed Electronics-3 15:00-16:40 Thursday, 24TD3-1 <Session Invited>
Ag Nanowire Film Produced by Photonic Curing
Hideki Ohata, Yasunao Miyamura, Eri Nakazawa, Hiroshi Uchida, Showa Denko / Japan
N/A
TD3-2 <Session Invited>
Study on an Interconnect Technology toward Flexible Printed Electronics
Ryosuke Mitsui1, Seiya Takahashi1, Shin-ichiro Nakajima1, Ken-ichi Nomura2, Hirobumi Ushijima2, 1Japan Aviation Electronics, 2National Institute of Advanced Industrial Science and Technology / Japan
303
TD3-3 <Session Invited>
Printed E-Textiles as Human-Machine Interfaces for Biological Signal Monitoring
Masahiro Inoue1, Yasunori Tada1, Yosuke Itabashi1, Kakeru Kaga1, Tomohiro Tokumaru2, 1Gunma University, 2Biosginal / Japan
N/A
TD3-4 Relationship Between Shrinkage and Conductivity Properties of Cured Isotropic Conductive Adhesives
Shigeru Kohinata1, Yoshihiko Shiraki1, Masahiro Inoue2, Keisuke Uenishi1, 1Osaka University, 2Gunma University / Japan
316
TD4: Printed Electronics-4 16:50-18:30 Thursday, 24TD4-1 Inkjet Printed Wireless Biosensors
on Stretchable SubstrateHannu Sillanpaa, Eerik Halonen, Toni Liimatta, Matti Mantysalo, Tampere University of Technology / Finland
322
TD4-2 Multilayer Ceramic Coil for Wireless Power Transfer System by Photo Resist Film Process
Minami Takato, Tatsuya Nishi, Masato Kaneko, Junichi Tanida, Syogo Tada, Ken Saito, Fumio Uchikoba, Nihon University / Japan
326
TE1: Power Devices 9:00-10:40 Thursday, 24TE1-1 Thermoelectric Energy Harvesting
Characteristics of Thin Film Devices Processed with Flip Chip Bonding Process
Kwang-Jae Shin, Jae-Hwan Kim, Jung-Yeol Choi, Tae Sung Oh, Hongik University / Korea
N/A
TE1-2 Risk of PV Fire Caused by Solder Bond Failure - Ag dissolution into solder in the interconnection between Ag electrode and Cu ribbon
Uichi Itoh1, Manabu Yoshida1, Hideo Tokuhisa1, Kohichi Takeuchi2, Yasuyuki Takemura2, 1National Institute of Advanced Industrial Science and Technology, 2International Test & Engineering Services / Japan
N/A
TE1-3 Comperative Analysis of the Process Window of Aluminum and Copper Wire Bonding for Power Electronics Applications
Christopher Kaestle, Joerg Franke, Friedrich-Alexander-University of Erlangen-Nuremberg / Germany
335
TE1-4 Direct Bonding of SiC by the Surface Activated Bonding Method
Tadatomo Suga1, Fenwen Mu1, Masahisa Fujino1, Yoshikazu Takahashi2, Haruo Nakazawa2, Kennichi Iguchi2, 1The University of Tokyo, 2Fuji Electric / Japan
341
TE2: Medical Devices 12:50-14:30 Thursday, 24TE2-1 Effects of Ar Fast Atom Beam
and Ar Plasma Irradiations on the Biocompatibility of Polymeric Materials
Mari Nakamoto, Masahisa Fujino, Tadatomo Suga, The University of Tokyo / Japan
345
TE2-2 Human Body Communication in Vehicle -Transmission Characteristics between Forearm and the Steering Wheel
Fukuro Koshiji1,2, Takashi Matsumoto1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan
349
TE2-3 <Session Invited>
Microsystems for Minimally Invasive Medicine and Healthcare
Yoichi Haga, Tadao Matsunaga, Tohoku University / Japan
353
TE2-4 <Session Invited>
CMOS Image Sensor Technologies for Biomedical Applications
Jun Ohta, Nara Institute of Science and Technology / Japan
N/A
TE3: N-MEMS-1 15:00-16:40 Thursday, 24TE3-1<Session Invited>
Plastic Molded Package Technology for MEMS Sensor - evolution of MEMS sensor package
Atsushi Oouchi, STMicroelectronics / Japan
371
TE3-2 Miniaturized Polarization Sensors Integrated with Wire-grid Polarizers
So Ikeda1, Eiji Higurashi1, Tadatomo Suga1, Toshiaki Oguchi2, 1The University of Tokyo, 2NSK / Japan
376
TE3-3 Room-Temperature Bonding Using Au Compliant Rim with Ultrasonic Assist and Its Application to Hermetic Sealing
Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano, Kyushu University / Japan
No Paper
TE3-4 Room Temperature Wafer Scale Bonding of Electroplated Au Patterns Processed by Surface Planarization
Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi, National Institute of Advanced Industrial Science and Technology / Japan
380
TE4: N-MEMS-2 16:50-18:30 Thursday, 24TE4-1 Electromagnetic Induction Type
Micro Generator Combined with MEMS Air Turbine and Multilayer Ceramic Magnetic Circuit
Yuji Yokozeki, Masato Kaneko, Tatsuya Nishi, Hiroaki Endo, Kazuki Hoshi, Naohiro Yoshida, Kento Hosoya, Ryo Saito, Minami Takato, Ken Saito, Fumio Uchikoba, Nihon University / Japan
384
TE4-2 Impact-Type MEMS Microrobot Controlled by Bare Chip IC of Hardware Neuron
Masaki Tatani, Kazuaki Maezumi, Minami Takato, Shinpei Yamasaki, Hiroki Obara, Yuka Naito, Kei Iwata, Yuki Okane, Yuki Isihara, Tomohiro Hidaka, Yohei Asano, Hirozumi Oku, Ken Saito, Fumio Uchikoba, Nihon University / Japan
388
TE4-3 A Bio-Inspired Cylindrical Tactile Sensor for Multidirectional Pressure Detection
Nurul Adni Ahmad Ridzuan1, Norihisa Miki1,2, 1Keio University, 2JST PRESTO / Japan
394
TE4-4 Characterization of Tactile Display for Stiffness Distribution Using Magneto-Rheological Fluid
Hiroki Ishizuka1, Nicolo Lorenzoni2, Norihisa Miki1,3, 1Keio University / Japan, 2Politecnico di Milano / Italy, 3JST PREST / Japan
400
FA1: Thermal Management-2 9:00-10:40 Friday, 25FA1-1 <Session Invited>
Thermal Management of Dense Electronic Packaging by Heat Pipe and Piezo Fan Based Cooling Solutions
Singh Randeep, Fujikura / Japan N/A
FA1-2 Cooling Technology of On-Vehicle Inverters with Functional Nano-porous Foam Layer - enhancement of wettability and boiling heat transfer toward inverter cooling
Kazuhisa Yuki1, Tessai Sugiura2, Koichi Suzuki1, 1Tokyo University of Science-Yamaguchi, 2Tohoku University / Japan
420
FA1-3 Integrated Vapor Chamber Heat Spreader for High Power Processors
Thanh-Long Phan, Yuji Saito, Masataka Mochizuki, Fujikura / Japan
424
FA1-4 Effect of Thermal Properties of Interposer Material on Thermal Performance of 2.5D Package
Takashi Hisada, Yasuharu Yamada, IBM Japan / Japan
429
FA2: More-than-Moore 2.0 - Is 2D really saturating? Will 3D really be coming?- 12:50-17:30 Friday, 25
FA2-1 <Session Invited> (50min.)
Progress and Benchmarking of CMOS-Device Technologies
Hitoshi Wakabayashi, Tokyo Institute of Technology / Japan
434
FA2-2 <Session Invited>
BEOL Device Technologies for Munehiro Tada, Low-power Electronics Association & Project / Japan
N/A
FA2-3 <Session Invited>
Challenges of Design and Packaging for 3D Stacking with Logic and DRAM Dies
Kazuki Fukuoka1, Koji Nii1,2, Takao Nomura1, Ryo Mori1, Toshihiko Ochiai1, Koji Takayanagi1, Kentaro Mori1, Tsuyoshi Kida1, Sadayuki Morita1, 1Renesas Electronics, 2Kanazawa University / Japan
448
FA2-4 <Session Invited>
The New Cognitive Computing Era by 3D Integration
Yasumitsu Orii, IBM Research Tokyo / Japan
N/A
FA2-5 A Novel 3D IC Assembly Process for Ultra-Thin Chip Stacking
Yu-Min Lin1, Chau-Jie Zhan1, Zhi-Cheng Hsiao1, Huan-Chun Fu1, Ren-Shin Cheng1, Yu-Wei Huang1, Shin-Yi Huang1, Su-Mei Chen1, Chia-Wen Fan1, Chun-Hsien Chien1, Cheng-Ta Ko1, Yu-Huan Guo2, Chang-Chun Lee2, Yoshihiro Tsutsumi3, Junsoo Woo3, Yoshikazu Suzuki3, Yusuke Sato3, Chien-Ting Liu3, Chih-Heng Chao3, 1Industrial Technology Research Institute, 2Chung Yuan Christian University / Taiwan, 3DISCO / Japan
470
FA2-6 Cu-Cu Wafer Bonding: An Enabling Technology for Three-Dimensional Integration
Bernhard Rebhan1, Thomas Plach1, Sajjad Tollabimazraehno2, Viorel Dragoi1, Masaya Kawano1, 1EV Group, 2Johannes Kepler University / Austria
475
FA2-7 High-Performance Cooling System with Multi-Channel Electro-Osmotic Flow Pumps for High-Power 3D-ICs
H. Kudo1, T. Yonekawa1, S. Yoshimi1, Y. Oguri2, A. Tsukune3, Y. S. Kim3, H. Kitada3, K. Fjimoto1, I. Kinefuchi2, Y. Matsumoto2, T. Ohba3, 1Dai Nippon Printing, 2The University of Tokyo, 3Tokyo Institute of Technology / Japan
480
Panel Discussion No Paper
FB1: DMR-Electrical-2 9:00-10:40 Friday, 25FB1-1 Locally Shielded Differential-Paired
Lines with Bend Discontinuities for SI and EMI Performances
Yoshiki Kayano1, Masashi Ohkoshi1, Takuya Watabe1, Hiroshi Inoue2, 1Akita University, 2The Open University of Japan / Japan
484
FB1-2 Electrical Characteristics of Build-Up Substrates Using New Via Structures
Tomoyuki Akahoshi1, Daisuke Mizutani1, Motoaki Tani1, Kenichirou Abe2, Syunji Baba3, Masateru Koide3, 1Fujitsu Laboratories, 2Fujitsu Interconnect Technologies, 3Fujitsu Advanced Technologies / Japan
490
FB1-3 A Multiband Antenna with Fan-Shaped Monopole and Folded Element of 800 MHz, 2.0 GHz and UWB for 4G Smartphones
Yusuke Akiyama1, Fukuro Koshiji1,2, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan
494
FB2: DMR-Mechanical 12:50-14:55 Friday, 25FB2-1 Investigation of Solder Creep
Behavior on Wafer Level CSP under Thermal Cycling Loading
Kai-Chiang Wu, Kuo-Ning Chiang, National Tsing Hua University / Taiwan
498
FB2-2 Solder Crack Simulation Using SPH Particle Method with Sub-Modeling Technique
Chihiro Uchibori1, Seiki Sakuyama1, Yuzuru Sakai2, Thyon Su-I2, Takayuki Watanabe2, Nobuki Yamagata3, 1Fujitsu Laboratories, 2Yokohama National University, 3Advanced Creative Technology / Japan
502
FB2-3 Stress Variation Analysis during Hiroshi Yamaguchi, Toshiaki Enomoto, Toshiyuki Sato, Namics / Japan
507
FB2-4 Reliability Improvements in Electronic Systems by Combining Condition Monitoring Approaches
Kathleen Jerchel2, Michael Krüger1, Andreas Middendorf1, Nils F. Nissen2, Klaus-Dieter Lang1, 1Technische Universität Berlin, 2Fraunhofer Institute for Reliability and Microintegration / Germany
511
FB2-5 Fatigue Strength of Through Hole in Printed Circuit Board
Shogo Iwade1, Takahiro Kinoshita1, Takashi Kawakami1, Hideki Mizushina2, Hiroshi Iinaga2, 1Toyama Prefectural University, 2Oki Printed Circuits / Japan
517
FB3: Materials and Processes-6 15:25-17:30 Friday, 25FB3-1 Effect of Joining Conditions on the
Joint Strength of Ag Nanoporous Bonding
Min-Su Kim, Hiroshi Nishikawa, Osaka University / Japan
521
FB3-2 Development of Low-Temperature Sintered Nano-Silver Pastes Using MO Technology and Resin Reinforcing Technology
Noritsuka Mizumura, Koji Sasaki, Namics / Japan
526
FB3-3 A Diffusion-Viscous Analysis of Pressure-Aided Drying of Nanosilver Bond-line for Low-Temperature Chip Joining
Kewei Xiao1, Khai D.T. Ngo1, Guo-Quan Lu1,2, 1Virginia Tech / USA, 2Tianjin University / China
532
FB3-4 Measurements of Electrical Resistance and Temperature Distribution during Current Assisted Sintering of Nanosilver Die-Attach Material
Guo-Quan Lu1,2, Wanli Li1, Yunhui Mei1, Xin Li1, 1Tianjin University / China, 2Virginia Tech / USA
538
FC1: Advanced Packaging-4 9:00-10:40 Friday, 25FC1-1 Characterization of Micro Bump
Formed by Injection Molded Solder (IMS) Technology
Toyohiro Aoki, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii, IBM Research – Tokyo / Japan
544
FC1-2 Packaging of High-Temperature Planar Power Modules Interconnected by Low-Temperature Sintering of Nanosilver Paste
D. Berry1, L. Jiang1, Yunhui Mei2, S. Luo3, K. Ngo1, G-Q. Lu1,2, 1Virginia Tech / USA, 2Tianjin University, Tianjin / China, 3NBE Technologies / USA
549
FC1-3 High-Speed Gold Laser-Plating on Nickel-Plated Copper Leadframe Toward Flip-Chip Packaging
Takahisa Sagawa1, Mamoru Mita2, Kazuhiko Yamasaki1, Katsuhiro Maekawa1,2, 1Ibaraki University, 2M & M Research Laboratory / Japan
555
FC1-4 Package on Package DDR Power Integrity Design
Heng Chuan Shu, Li Chuang Quek, Intel Microelectronics (M) / Malaysia
559
FC2: Thermal Management-3 12:50-14:55 Friday, 25FC2-1 Development of 1kW DMFC
System with Waste Heat Recovery Yuki Morimatsu, Zhen Guo, Masakazu Ohashi, Fujikura / Japan
563
FC2-2 Calculation of Temperature Distribution of Power Si MOSFET with Electro-Thermal Analysis - the effect of boundary condition
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka, Toyama Prefectural University / Japan
567
FC2-3 Molecular Modelling Approach to Screen Novel Thermal Management Materials
Abhijit Chatterjee, Accelrys / Japan 572
FC2-4 Thermal Management of Embedded Device Package
Yukari Imaizumi, Toru Suda, Shigenori Sawachi, Akio Katsumata, Yoichi Hiruta, J-Devices / Japan
577
FC2-5 Thermal Modeling of Electronic Components for Thermal Simulation of Electronic Equipment
Katsuhiro Koizumi1, Tomoyuki Hatakeyama2, Fukue Takashi3, Masaru Ishizuka2, 1Cosel, 2Toyama Prefectural University, 3Iwate University / Japan
581
FC3: Thermal Management-4 15:25-17:30 Friday, 25FC3-1 One-Dimensional Thermal Network
Expression of Tablet Device with Slate Style Chassis
Koji Nishi1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1AMD Japan, 2Toyama Prefectural University / Japan
585
FC3-2 Simulation Based Method to Eliminate the Effect of Electrical Transients from Thermal Transient Measurements
Andras Vass-Varnai, Zoltan Sarkany, Attila Szel, Marta Rencz, Mentor Graphics / Hungary
591
FC3-3 Thermal Transient Test Based Thermal Structure Function Analysis of IGBT package.
Yafei Luo1,3, Yasushi Kajita2, Tomoyuki Hatakeyama3, Shinji Nakagawa3, Masaru Ishizuka3, 1Mentor Graphics, 2Nagoya Municipal Industrial Research Institute, 3Toyama Prefectural University / Japan
596
FD1: Interconnection-1 9:00-10:40 Friday, 25FD1-1 Fine-Pitch Solder Joining for High
Density InterconnectionKuniaki Sueoka, Sayuri Kohara, Akihiro Horibe, Fumiaki Yamada, Hiroyuki Mori, Yasumitu Orii, IBM Research –Tokyo / Japan
600
FD1-2 Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration
Masaki Ohyama1, Jun Mizuno1, Shuichi Shoji1, Masatsugu Nimura1, 2, Toshihisa Nonaka3, Yoichi Shinba3, Akitsu Shigetou4, 1Waseda University, 2Toray Engineering, 3Toray Industries, 4National Institute for Material Science / Japan
604
FD1-3 The Fine Pitch Cu-Pillar Bump Interconnect Technology Utilizing NCP Resin, Achieving the High Quality and Reliability
Yoshikazu Shimote, Toshihiro Iwasaki, Masaki Watanabe, Shinji Baba, Michitaka Kimura, Renesas Electronics / Japan
608
FD1-4 Effects of Bump Height and UBM Structure on the Reliability
Micro Bump Interconnections
Yu-Wei Huang1, Chau-Jie Zhan1, Lin Yu-Min1, Jing-Ye Juang1, Shin-Yi Huang1, Su-Mei Chen1, Chia-Wen Fan1, Ren-Shin Cheng1, Shu-Han Chao2, C. K. Lin2, Jie-An Lin2, Chih Chen2, 1Industrial Technology Research Institute, 2National Chiao Tung University / Taiwan
612
FD2: Interconnection-2 12:50-14:55 Friday, 25FD2-1 Nanoscale Bondability between
Cu-Al Intermetallic Compound for Cu Wirebonding
Hsiang-Chen Hsu1, Jih-Hsin Chien1, Jian-Siang Huang1, Li-Ming Chu2, Shen-Li Fu1, 1I-Shou University, 2Southern Taiwan University of Science and Technology / Taiwan
618
FD2-2 Effect of Pd Thickness on Bonding Reliability in Pd Coated Copper Wire
Jun Cao1,2, JunLing Fan3, ZhiQiang Liu1, YueMin Zhang1, 1HeNan Ploytechnic Universtiy, 2HeNan YOUK Electronic Material, 3Jiaozuo University / China
623
FD2-3 Reliability Evaluation of Bonding between Cu Wire and Al Pad
Yuji Ishida, Nobuhiko Ota, Shinji Yamashita, Yaskawa Electric / Japan
630
FD2-4 The Growth of Ag3Sn Intermetallic Compound under a Temperature Gradient
YuPing Su, FanYi Ouyang, National Tsing Hua University / Taiwan
634
FD2-5 Phase Evolution and Nanomechanical Properties of Intermetallic Compounds in Solid-Liquid Interdiffusion Bonding
Jenn-Ming Song1, Wei-Chih Lu2, 1National Chung Hsing University, 2National Dong Hwa University / Taiwan
640
FD3: Interconnection-3 15:25-17:30 Friday, 25FD3-1 Formic Acid Treatment with Pt
Catalyst for Cu Direct Bonding at Low Temperature
Tadatomo Suga, Masakate Akaike, Naoya Matsuoka, The University of Tokyo / Japan
644
FD3-2 Plasma Assisted Bonding of Copper and Silver Substrates
Masahisa Fujino, Kentaro Abe, Tadatomo Suga, The University of Tokyo / Japan
648
FD3-3 Room-Temperature Direct Bonding of Graphene Films by Means of Vacuum Ultraviolet (VUV) / Vapor-Assisted Method
Ajayan Mano1,2, Akitsu Shigetou1, Jun Mizuno2, Shuichi Shoji2, 1National Institute for Materials Science, 2Waseda University / Japan
652
FD3-4 Evaluation of Ultrasonic Vibration Energy for Copper-To-Copper Bonding by Flip-Chip Bonding Technology
Yoshiyuki Arai1,2, Yoshinori Miyamoto1, Masatsugu Nimura1, Hajime Tomokage2, 1Toray Engineering, 2Fukuoka University / Japan
658
FE1: Optoelectronics-1 9:00-10:40 Friday, 25FE1-1 Flip Chip LED Packaging Study &
Technology TrendTetsuya Onishi, Grand Joint Technology / Hong Kong
N/A
FE1-2 Lens Forming by Stack Dispensing for LED Wafer Level Packaging
Rong Zhang, S. W. Ricky Lee, Jeffery C. C. Lo, Hong Kong University of Science and Technology / Hong Kong
670
FE1-3 Dispensed Dome Lens Validation through Optical Simulations for High Irradiance UV LED Module
Cheng-Chun Liao, Hao-Xiang Lin, Chien-Lin Chang Chien, Chung-Min Chang, Chih-Peng Hsu, Advanced Optoelectronic Technology / Taiwan
676
FE1-4 Effect of Die-Attach Material on Thermal Performance of Chip-on-Board Packaging of 10W High Power LED Arrays
Xin Li, Tianjin University / China No Paper
FE2: Optoelectronics-2 12:50-14:55 Friday, 25FE2-1 High-ON/OFF-Contrast 10-Gb/s
Silicon Mach-Zehnder Modulator in High-Speed Low-Loss Package
Hiroki Ishihara1, Kenji Oda1, Teijiro Ori1, Kazuhiro Goi1, Kensuke Ogawa1, Taung-Yang Liow2, Xiaoguang Tu2, Guo-Qiang Lo2, Dim-Lee Kwong2, 1Fujikura / Japan, 2A*STAR / Singapore
680
FE2-2 Multi-Channel and High-Density Hybrid Integrated Light Source by Thermal Management for Low Power Consumption for Ultra-High Bandwidth Optical Interconnection
Takanori Shimizu1,2, Makoto Okano1,3, Hiroyuki Takahashi1,2, Nobuaki Hatori1,2, Masashige Ishizaka1,2, Tsuyoshi Yamamoto1,2, Masahiko Mori1,3, Tsuyoshi Horikawa1,3, Yutaka Urino1,2, Takahiro Nakamura1,2, Yashuhiko Arakawa1,4, 1Institute of Photonics-Electronics Convergence System Technology, 2Photonics Electronics Technology Research Association, 3National Institute of Advanced Industrial Science and Technology, 4The University of Tokyo / Japan
684
FE2-3 High-Density Wiring of Polymer Optical Waveguides Fabricated Using a Microdispenser
Daisuke Suganuma, Takaaki Ishigure, Keio University / Japan
689
FE2-4 Optimal Cavity Length in Cavity-Resonator-Integrated Guided-Mode Resonance Filter
Junichi Inoue1, Tomohiro Kondo1, Kenji Kintaka2, Kenzo Nishio1, Yasuhiro Awatsuji1, Shogo Ura1, 1Kyoto Institute of Technology, 2National Institute of Advanced Industrial Science and Technology / Japan
694
FE2-5 A Varifocal Lens Using an Electrooptic KTa1-xNbxO3 Crystal with a Microsecond Order Response Time
Tadayuki Imai, Takahiro Inagaki, Jun Miyazu, Souhan Kawamura, Junya Kobayashi, Nippon Telegraph and Telephone / Japan
698
FE3: Optoelectronics-3 15:25-17:30 Friday, 25FE3-1 Nanomaterials for Silicon
Nanophotonic Packaging - spin-on nanomaterials for optical packaging
Yoichi Taira, Kuniaki Sueoka, Hidetoshi Numata, IBM Research - Tokyo / Japan
703
FE3-2 Organic-Inorganic Hybrid Material for Optical Interconnects and Application to Optical Coupling Method
Hideyuki Nawata, Kentaro Ohmori, Nissan Chemical Industries / Japan
707
FE3-3Optical Adhesives for Silicon Photonics
Seiko Mitachi1, Arisa Hagiwara1, Norio Murata1, Hirokazu Kageyama2, Kazushi Kimura2, 1Tokyo University of Technology, 2The Yokohama Rubber / Japan
712
FE3-4 Low-Temperature GaAs/SiC Wafer Bonding with Au Thin Film for High-Power Semiconductor Lasers
Ken Okumura1, Eiji Higurashi1, Tadatomo Suga1, Kei Hagiwara2, 1The University of Tokyo, 2NHK Science and Technology Research Laboratories / Japan
716
FE3-5 Surface Activated Ge/GaAs Wafer Bonding for Multi-Junction Solar Cells
Genki Kono, Masahisa Fujino, Daiji Yamashita, Kentaroh Watanabe, Masakazu Sugiyama, Yoshiaki Nakano, Tadatomo Suga, The University of Tokyo / Japan
720
Poster Session
P01 Analysis of Temperature Distribution in Stacked IC with a Thermal Simulation and a Specially Designed Test Structure
Keita Yamada1, Toshihiro Matsuda1, Hideyuki Iwata1, Tomoyuki Hatakeyama1, Masaru Ishizuka1, Takashi Ohzone2, 1Toyama Prefectural University, 2Dawn Enterprise / Japan
724
P02Routing by Using Multi-Layers
Yang Tian, Ran Zhang, Takahiro Watanabe, Waseda University / Japan
728
P03 Proposal of the Application of the Delamination Test to Semiconductor Package Design
Ryuichi Kusama1, Takeshi Ishikawa1, Qiang Yu2, Kyohei Yamashita2, Tomohiko Takeda2, 1DENSO, 2Yokohama National University / Japan
732
P04 Behavior Analysis Method for Product Design Support - a study on modeling of behavior and functions
Eiji Morinaga, Hidefumi Wakamatsu, Eiji Arai, Hijiri Abiru, Osaka University / Japan
736
P05Mechanism in Human Body Communication between Head-Mounted Wearable Devices
Dairoku Muramatsu, Yoshiaki Yokoyama, Ken Sasaki, The University of Tokyo / Japan
740
P07 Electromagnetic Field Analysis of Human Body Communication between Wearable and Stationary Devices Including the Earth Ground
Misaki Kurosu1, Fukuro Koshiji1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan
744
P09 Hemocompatibility of DLC Coating for Blood Analysis Devices
Keisuke Shiba1, Yasuharu Ohgoe1, Kenji Hirakuri1, Jun Mizuno2, Shuichi Shoji2, Kazuhide Ozeki3, Keisuke Sato4, Naoki Fukata4, Ali Alanazi5, 1Tokyo Denki University, 2Waseda University, 3Ibaraki University, 4International Center of Materials Nanoarchitectonics / Japan, 5King Saud University / Saudi Arabia
748
P10 Effect of Filler Morphology on Fatigue Properties of Stretchable Wires Printed with Ag Pastes.
Yosuke Itabashi, Masahiro Inoue, Yasunori Tada, Gunma University / Japan
752
P11 Flexible and Capacitive Tactile Sensor Sheet
Masanori Mizushima1, Shigeo Takagi1, Hiromichi Itano1, Tsutomu Obata2, Takashi Kasahara3, Shuichi Shoji3, Jun Mizuno3, 1Oga, 2Toyama Industrial Technology Center, 3Waseda University / Japan
756
P12 Leadfree Solder Joint Non- Uniformity Study on SMT
Anocha Sriyarunya, Jiraporn Tondtan, SPANSION(THAILAND) / Thailand
760
P13 Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux
Akiyoshi Ishiyama1, Ikuo Shohji1, Tatsuya Ganbe2, Hirohiko Watanabe2, 1Gunma University, 2Fuji Electric / Japan
766
P14Compounds on Tensile Strength of Lead-Free Solder
Masaya Iwasaki, Akira Yamauchi, Masashi Kurose, Gunma National College of Technology / Japan
770
P16 Effect of Coupling Agent on
Copper
Hironao Mitsugi, Ikuo Shohji, Shinji Koyama, Shinya Kitagoh, Gunma University / Japan
774
P17 Effect of Fiber Direction and Temperature on Mechanical Properties of Short Fiber-Reinforced PPS
Ryogo Takahashi1, Ikuo Shohji1, Yuki Seki2, Satoshi Maruyama2, 1Gunma University, 2Yamada Manufacturing / Japan
778
P18 Preparation of Aligned Conjugated Polymer Fibers by Electrospinning
Hsiao-Chung Chu, Cho-Liang Chung, Yu-Hsuan Lin, Chun-Yang Pan, Sheng-Li Fu, I-Shou University / Taiwan
782
P19 Surface Morphology and Applications of TiO2Prepared by Electrospinning
Wei Chen, Cho-Liang Chung, Chih-Hao Hsu, Yi-Shiang Chen, Sheng-Li Fu, I-Shou University / Taiwan
787
P20 The Study of Spatial Radiation Variation for Dome-Type LED Package Achieved by Dispensing
Chien-Lin Chang Chien1, How-Wen Chen1, Yu-Wei Tsai1, Chung-Min Chang1, Chih-Peng Hsu1, Ming-Chuen Yip2, 1Advanced Optoelectronic Technology, 2National Tsing Hua University / Taiwan
791
P22 Robust Lensed Fibers with High Focusing Power Even in Fluid
Kazuo Shiraishi1, Masaru Horiuchi1, Hidehiko Yoda1, Chen S. Tsai2,3, 1Utsunomiya University / Japan, 2University of California / USA, 3National Taiwan University / Taiwan
795
P23 A Viable Spot-Size Converter for Coupling between a Single-Mode Fiber and a Silicon-Wire Waveguide
Kazuo Shiraishi1, Ryutaro Takasaki1, Hidehiko Yoda1, Hideya Oshikiri1, Chen S. Tsai2,3, 1Utsunomiya University / Japan, 2University of California / USA, 3National Taiwan University / Taiwan
799
P25 Study on Bent Type of UWB Antenna Built in Electronic Equipment Housing
Daisuke Momose, Takahiko Yamamoto, Kouji Koshiji, Tokyo University of Science / Japan
803
P26 A Flexible Broadband Antenna with Fan-Shaped and Trapezoidal Elements Formed on Printed Circuit Board for Ultra-Wideband Radio
Kazuya Hiraguri1, Fukuro Koshiji1,2, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan
807
P27 Comparison of Wireless Power Transmission Characteristics Using Circular-Coil Array and Elliptical Coil as a Transmission Coil
Kohei Horigome1, Fukuro Koshiji1,2, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan
811
Keynote Lectures 13:25-14:25 Wednesday, 23
Development of Autonomous Driving Technologies and its Future
Ryota Shirato, Nissan Motor Company N/A
14:35-15:35 Wednesday, 23
Hybrid Memory Cube : Your New Standard for Memory Performance
Scott Graham, Micron Technology, Inc.
N/A
15:35-16:35 Wednesday, 23
Introducing the Latest 3D Printing Technology and Applications
Nave Rachman, Stratasys Asia Paci c & Japan
N/A
10:50-11:50 Thursday, 24
Implementation of High-Volume Genomic
Technologies: Towards Integrative Medical Sciences for Preventive Medicine
Osamu Ohara, Kazusa DNA Research Institute; RIKEN Center for Integrative Medical Sciences
N/A
10:50-11:50 Friday, 25
Gen-3 Embedded Cooling: Completing the Inward Migration of Thermal Packaging
Avram Bar-Cohen, DARPA-MTO N/A
